CN113140160A - Display module - Google Patents
Display module Download PDFInfo
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- CN113140160A CN113140160A CN202110455061.7A CN202110455061A CN113140160A CN 113140160 A CN113140160 A CN 113140160A CN 202110455061 A CN202110455061 A CN 202110455061A CN 113140160 A CN113140160 A CN 113140160A
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- Prior art keywords
- heat conduction
- heat
- display module
- block
- display panel
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
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- Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the application discloses a display module, which comprises a display panel, a back plate and a heat dissipation plate, wherein the back plate and the heat dissipation plate are arranged on one side of the display panel, and a polaroid, an optical adhesive and a cover plate are arranged on the other side of the display panel; in a partial area, the second heat conduction block is arranged on one side, far away from the display panel, of the heat conduction layer, so that the heat conduction layer in the area is used as a contact surface through the second heat conduction block made of rigid materials, and the heat dissipation plate in the area is not easy to deform due to extrusion.
Description
Technical Field
The application relates to the technical field of display module assembly heat dissipation, concretely relates to display module assembly.
Background
The heating panel that current static state product of buckling used is the composite construction of copper foil and thin cotton, and this structure heat dissipation is better but the copper foil warp easily when receiving the extrusion, will see the impression in the polaroid face when the bubble cotton can not absorb the copper foil deformation completely, influences product appearance.
Therefore, the existing heat dissipation plate has the technical problem that marks are easy to generate under extrusion.
Disclosure of Invention
The embodiment of the application provides a display module assembly, can alleviate the technical problem that current heating panel exists and produces the impression easily under the extrusion.
The embodiment of the application provides a display module assembly, include:
a display panel;
the back plate and the heat dissipation plate are arranged on one side of the display panel;
the display module, the optical cement and the cover plate are arranged on the other side of the display panel;
the heat dissipation plate comprises a heat conduction layer, the heat conduction layer comprises a first heat conduction block and a second heat conduction block, the first heat conduction block is made of flexible materials, the second heat conduction block is made of rigid materials, and in at least partial area, one side, far away from the display panel, of the heat conduction layer is set as the second heat conduction block.
Optionally, in some embodiments of the present application, the first heat conduction block and the second heat conduction block are disposed at an interval.
Optionally, in some embodiments of the application, the heat dissipation plate further includes a heat conduction strip, the heat conduction strip is made of a heat conduction material, the heat conduction material has a higher heat conductivity than the rigid material, and the heat conduction strip is disposed on a side surface of the second heat conduction block away from the display panel.
Optionally, in some embodiments of the present application, the thermally conductive material is different from the flexible material, and the thermally conductive material has a thermal conductivity greater than that of the flexible material.
Optionally, in some embodiments of the present application, a groove is disposed on a side surface of the second heat conduction block away from the display panel, and the heat conduction strip is disposed in the groove.
Optionally, in some embodiments of the present application, the whole surface of the second heat conduction block is disposed on a side surface of the first heat conduction block away from the display panel.
Optionally, in some embodiments of the present application, a plurality of the first heat conduction blocks are disposed at intervals on a side surface of the second heat conduction block close to the display panel.
Optionally, in some embodiments of the present application, a thickness of a film layer of the first heat conduction block is greater than a thickness of a film layer of the second heat conduction block.
Optionally, in some embodiments of the present application, the display module includes at least one bending area, and in the bending area, the heat conductive layer is made of the flexible material.
Optionally, in some embodiments of the present application, the flexible material is copper and the rigid material is stainless steel.
The display module comprises a display panel, a back plate and a heat dissipation plate, wherein the back plate and the heat dissipation plate are arranged on one side of the display panel, and a polaroid, an optical adhesive and a cover plate are arranged on the other side of the display panel; in some regions, one side of the heat conduction layer, which is far away from the display panel, is provided with the second heat conduction block, so that the heat conduction layer in the region is used as a contact surface through the second heat conduction block which is provided with a rigid material, the heat conduction layer is not easy to deform due to extrusion in the region, and the technical problem that an existing heat dissipation plate is easy to generate marks under extrusion is solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a display module provided in an embodiment of the present application;
fig. 2 is a first schematic top view of a heat dissipation plate according to an embodiment of the present application;
fig. 3 is a second schematic top view of a heat dissipation plate according to an embodiment of the present application;
fig. 4 is a first schematic cross-sectional view of a heat dissipation plate according to an embodiment of the present application;
fig. 5 is a schematic cross-sectional view of a heat dissipation plate according to an embodiment of the present application;
fig. 6 is a schematic cross-sectional view of a heat dissipation plate according to an embodiment of the present application;
fig. 7 is a schematic cross-sectional view of a fourth heat dissipation plate according to an embodiment of the present application;
fig. 8 is a schematic cross-sectional view of a heat dissipation plate according to an embodiment of the present application;
fig. 9 is a sixth schematic cross-sectional view of a heat dissipation plate according to an embodiment of the present application.
Description of reference numerals:
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
The embodiment of the application provides a display module. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
As shown in fig. 1, a display module 1 provided in this embodiment of the present application includes a display panel 10, a back plate 20 disposed on one side of the display panel 10, a heat dissipation plate 30, and a polarizer 40, an optical adhesive 50, and a cover plate 60 disposed on the other side of the display panel 10, wherein the heat dissipation plate 30 includes a heat conduction layer 303, the heat conduction layer 303 includes a first heat conduction block 3001 and a second heat conduction block 3002, the first heat conduction block 3001 is a flexible material, the second heat conduction block 3002 is a rigid material, and in at least a partial region, one side of the heat conduction layer 303 away from the display panel 10 is disposed as the second heat conduction block 3002.
In this embodiment, in a partial region, by providing the second heat conduction block 3002 on the side of the heat conduction layer 303 away from the display panel 10, and by providing the second heat conduction block 3002 made of a rigid material as a contact surface for the heat conduction layer 303 in this region, the heat conduction layer 303 is not easily deformed by compression in this region, and the technical problem that the conventional heat dissipation plate 30 is easily marked by compression is solved.
The heat dissipation plate 30 includes an adhesive layer 301, a buffer film 302, and the heat conduction layer 303 disposed on a surface of the buffer film 302 away from the display panel 10, where the buffer film 302 may be made of foam.
The rigid material is a material with higher hardness, and compared with the flexible material, the rigid material is difficult to deform due to extrusion of an external force.
When the display module 1 has a bending region, the heat conduction layer 303 is made of a flexible material in the bending region.
The rigid material can be stainless steel, glass and the like, and the flexible material can be a metal material such as copper, silver and the like.
In one embodiment, the rigid material and the flexible material may also be a composite material.
Wherein, for example, the flexible material can also be an alloy material.
In one embodiment, as shown in fig. 1, the first thermal conductive block 3001 and the second thermal conductive block 3002 are spaced apart.
As shown in fig. 2, when any two opposite sides of the display module 1 are provided with a bending region, in the bending region, the heat conducting layer 303 is made of a flexible material, and in the other non-bending regions, the heat conducting layer 303 is made of a rigid material.
In the non-bending region, a heat conducting strip 3003 may be disposed on the second heat conducting block 3002.
In this embodiment, the display module 1 is suitable for a display device or a terminal of which two opposite sides need to be bent or curved, the heat conduction layer 303 of the bending area is made of a flexible material, and the non-bending area is made of a rigid material, so that the anti-extrusion capability of the heat conduction layer 303 is enhanced, and the bending performance of the bending area is not affected.
In one embodiment, as shown in fig. 3, when the four sides of the display module 1 are provided with bending regions, the heat conduction layer 303 is made of a flexible material in the bending regions, and the first heat conduction blocks 3001 of the bending regions are disposed around the second heat conduction blocks 3002 of the non-bending regions.
In the non-bending region, the second heat conduction block 3002 is disposed on a side of the first heat conduction block 3001 away from the display panel 10.
The second heat conduction block 3002 may be disposed on the whole surface, or disposed on the first heat conduction block 3001 at intervals.
In the non-bending region, a heat conducting strip 3003 may be disposed on the second heat conducting block 3002.
In this embodiment, the display module 1 is suitable for a display device or a terminal whose four sides are required to be bent or curved, the bending areas of the four sides are made of flexible materials to enhance the bending performance, at least the contact surface of the heat conduction layer 303 is made of rigid materials in the area which is not required to be bent, and the anti-extrusion capability of the heat dissipation plate 30 is enhanced by improving the heat conduction layer 303.
In an embodiment, as shown in fig. 2, 3, and 4, the heat dissipation plate 30 further includes a heat conduction bar 3003, the heat conduction bar 3003 is made of a heat conduction material, the heat conduction material has a higher heat conduction than the rigid material, and the heat conduction bar 3003 is disposed on a side surface of the second heat conduction block 3002 away from the display panel 10.
The distances between adjacent heat conducting strips 3003 may be equal.
The cross-sectional area and the width of the heat conducting strip 3003 may be the same.
In the non-bending region, the heat conduction strips 3003 may be arranged in an array on the second heat conduction block 3002.
In this embodiment, through set up heat conduction strip 3003 in non-bending area, can strengthen heat dissipation plate 30's heat-sinking capability, compensated because of the heat-sinking capability that sets up rigid material in non-bending area and lead to reduces, avoided the not enough technical problem of display module assembly 1's heat-sinking capability, with regular setting or setting of heat conduction strip 3003 to a plurality of heat conduction strips 3003 that shape, size are the same simultaneously, simplified the processing procedure, the cost is reduced.
In one embodiment, the thermally conductive material is different from the flexible material, and the thermally conductive material has a thermal conductivity greater than that of the flexible material.
Wherein the flexible material may be copper.
Wherein, the flexible material can also be an alloy material.
In this embodiment, the heat conducting strip 3003 made of the heat conducting material with the heat conducting property greater than that of the flexible material is utilized, and the heat conducting strip 3003 is arranged on the surface of the rigid material, so that the uniformity of the temperature in the plane can be optimized, and the heat dissipation in the display module 1 is accelerated.
In one embodiment, the thermally conductive material is the same as the flexible material.
In this embodiment, the heat conductive material and the flexible material may be both copper, which facilitates preparation and formation of the heat conductive strip 3003 and the first heat conductive block 3001, and reduces complexity of the process.
In one embodiment, as shown in fig. 5, a side surface of the second thermal conductive block 3002 away from the display panel 10 is provided with a groove 70, and the thermal conductive strip 3003 is disposed in the groove 70.
Wherein the depth of the groove 70 is greater than the height of the thermal conductive strip 3003.
Wherein the shape of the heat conductive strip 3003 is the same as the shape of the groove 70.
The heat conducting strip 3003 is engaged with the groove 70, and the size of the heat conducting strip 3003 is about the same as the size of the groove 70.
In this embodiment, by providing the groove 70 on the surface of the second heat conduction block 3002 away from the display panel 10, the heat conduction strip 3003 can be disposed in the groove 70, that is, the heat conduction strip 3003 is embedded in the second heat conduction block 3002, so that the heat conductivity of the rigid material region of the heat conduction layer 303 is enhanced without increasing the thickness of the film layer of the display module 1.
In one embodiment, as shown in fig. 6 and 7, the second thermal conductive block 3002 is disposed on the surface of the first thermal conductive block 3001 away from the display panel 10.
As shown in fig. 6, when the display module 1 has no bending area, the whole surface of the second heat conduction block 3002 is disposed on the first heat conduction block 3001.
As shown in fig. 7, when the display module 1 has a bent area, the heat conduction layer 303 is disposed as a first heat conduction block 3001 in the bent area, the heat conduction layer 303 is disposed in a stacked manner in a non-bent area, and the whole second heat conduction block 3002 is disposed on the first heat conduction block 3001.
In this embodiment, the area where the second heat conduction block 3002 is disposed is as large as possible, and the second heat conduction block 3002 is disposed on the contact surface of the heat dissipation plate 30, so that deformation caused by pressing can be relieved more, and the second heat conduction block 3002 is not disposed only in the area where bending is needed, thereby increasing the rigidity and the anti-pressing capability of the heat conduction layer 303 in the heat dissipation plate 30 to the maximum extent.
In one embodiment, as shown in fig. 8 and 9, a plurality of first thermal conductive blocks 3001 are disposed at intervals on a side surface of the second thermal conductive block 3002 close to the display panel 10.
As shown in fig. 8, when the display module 1 has no bending area, the second heat conduction block 3002 is disposed in any area, so that more anti-squeezing capabilities are increased.
As shown in fig. 9, when the display module 1 has a bent area, the heat conduction layer 303 is disposed as a first heat conduction block 3001 in the bent area, the heat conduction layer 303 is disposed in a stacked manner in a non-bent area, and a plurality of first heat conduction blocks 3001 are disposed at intervals on a side surface of the second heat conduction block 3002 close to the display panel 10.
In this embodiment, the first heat conduction blocks 3001 are disposed at an interval on one side of the second heat conduction block 3002 close to the display panel 10, so that the contact area between the first heat conduction block 3001 and the second heat conduction block 3002 is increased, the bonding force between the first heat conduction block 3001 and the second heat conduction block 3002 is increased, and the technical problem of film peeling in the heat conduction layer 303 is avoided.
In one embodiment, the first thermal block 3001 has a greater film thickness than the second thermal block 3002.
In this embodiment, the first heat conduction block 3001 is mainly used for dissipating heat, the second heat conduction block 3002 is mainly used for enhancing the anti-extrusion capability of the heat conduction layer 303, the thickness of the second heat conduction block 3002 is determined according to the anti-extrusion strength required in practice, and the thickness of the film layer of the second heat conduction block 3002 is set to be smaller than the thickness of the film layer of the first heat conduction block 3001, so that the high heat conductivity of the heat conduction layer 303 can be maintained as much as possible under the condition of enhancing the anti-extrusion capability.
In one embodiment, the display module 1 includes at least one bending region, and the heat conduction layer 303 is made of the flexible material in the bending region.
In one embodiment, the flexible material is copper and the rigid material is stainless steel.
The display module provided by the embodiment comprises a display panel, a back plate and a heat dissipation plate which are arranged on one side of the display panel, and a polarizer, an optical adhesive and a cover plate which are arranged on the other side of the display panel, wherein the heat dissipation plate comprises a heat conduction layer, the heat conduction layer comprises a first heat conduction block and a second heat conduction block, the first heat conduction block is made of a flexible material, the second heat conduction block is made of a rigid material, and the second heat conduction block is arranged on one side, away from the display panel, of the heat conduction layer in at least partial area; in some regions, one side of the heat conduction layer, which is far away from the display panel, is provided with the second heat conduction block, so that the heat conduction layer in the region is used as a contact surface through the second heat conduction block which is provided with a rigid material, the heat conduction layer is not easy to deform due to extrusion in the region, and the technical problem that an existing heat dissipation plate is easy to generate marks under extrusion is solved.
The display module provided by the embodiment of the present application is described in detail above, and a specific example is applied to explain the principle and the implementation manner of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A display module, comprising:
a display panel;
the back plate and the heat dissipation plate are arranged on one side of the display panel;
the display module, the optical cement and the cover plate are arranged on the other side of the display panel;
the heat dissipation plate comprises a heat conduction layer, the heat conduction layer comprises a first heat conduction block and a second heat conduction block, the first heat conduction block is made of flexible materials, the second heat conduction block is made of rigid materials, and in at least partial area, one side, far away from the display panel, of the heat conduction layer is set as the second heat conduction block.
2. The display module according to claim 1, wherein the first heat conduction block and the second heat conduction block are disposed at an interval.
3. The display module according to claim 2, wherein the heat dissipation plate further comprises a heat conduction strip, the heat conduction strip is made of a heat conduction material, the heat conduction material has a higher thermal conductivity than the rigid material, and the heat conduction strip is disposed on a side surface of the second heat conduction block away from the display panel.
4. The display module of claim 3, wherein the thermally conductive material is different from the flexible material, and wherein the thermally conductive material has a thermal conductivity greater than the flexible material.
5. The display module according to claim 3, wherein a surface of the second heat conduction block on a side away from the display panel is provided with a groove, and the heat conduction strip is disposed in the groove.
6. The display module according to claim 1, wherein the second thermal conductive block is disposed on a side surface of the first thermal conductive block away from the display panel.
7. The display module of claim 1, wherein the first heat-conducting blocks are disposed at intervals on a side surface of the second heat-conducting block close to the display panel.
8. The display module according to claim 6 or 7, wherein the first thermal conductive block has a film thickness greater than a film thickness of the second thermal conductive block.
9. The display module according to claim 1, wherein the display module comprises at least one bending region, and the heat conductive layer is made of the flexible material in the bending region.
10. The display module of claim 1, wherein the flexible material is copper and the rigid material is stainless steel.
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| CN202110455061.7A CN113140160B (en) | 2021-04-26 | 2021-04-26 | Display module |
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| CN202110455061.7A CN113140160B (en) | 2021-04-26 | 2021-04-26 | Display module |
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| CN113140160B CN113140160B (en) | 2022-07-12 |
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| CN113140160B (en) | 2022-07-12 |
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