CN115889281B - 基板处理装置以及基板处理方法 - Google Patents

基板处理装置以及基板处理方法

Info

Publication number
CN115889281B
CN115889281B CN202210159690.XA CN202210159690A CN115889281B CN 115889281 B CN115889281 B CN 115889281B CN 202210159690 A CN202210159690 A CN 202210159690A CN 115889281 B CN115889281 B CN 115889281B
Authority
CN
China
Prior art keywords
cleaning liquid
nozzle
substrate
gas
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210159690.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN115889281A (zh
Inventor
犬饲美成子
寺山正敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Kioxia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kioxia Corp filed Critical Kioxia Corp
Publication of CN115889281A publication Critical patent/CN115889281A/zh
Application granted granted Critical
Publication of CN115889281B publication Critical patent/CN115889281B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
CN202210159690.XA 2021-09-22 2022-02-22 基板处理装置以及基板处理方法 Active CN115889281B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-154588 2021-09-22
JP2021154588A JP7781577B2 (ja) 2021-09-22 2021-09-22 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
CN115889281A CN115889281A (zh) 2023-04-04
CN115889281B true CN115889281B (zh) 2026-07-24

Family

ID=85571568

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210159690.XA Active CN115889281B (zh) 2021-09-22 2022-02-22 基板处理装置以及基板处理方法

Country Status (4)

Country Link
US (2) US11833550B2 (enExample)
JP (1) JP7781577B2 (enExample)
CN (1) CN115889281B (enExample)
TW (3) TWI912175B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115605981B (zh) * 2020-05-15 2026-06-26 株式会社荏原制作所 清洗装置及清洗方法
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法
JP7241955B1 (ja) * 2022-12-20 2023-03-17 アーベーベー・シュバイツ・アーゲー 塗装機
US20250085053A1 (en) * 2023-08-24 2025-03-13 Tokyo Electron Limited Flow stability control in drying liquid between plates

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006137202A1 (ja) * 2005-06-23 2006-12-28 Tokyo Electron Limited 基板処理方法および基板処理装置
WO2021020136A1 (ja) * 2019-07-26 2021-02-04 東京エレクトロン株式会社 基板処理装置、及び基板処理方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3322853B2 (ja) 1999-08-10 2002-09-09 株式会社プレテック 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法
JP2004335542A (ja) * 2003-04-30 2004-11-25 Toshiba Corp 基板洗浄方法及び基板乾燥方法
JP4324527B2 (ja) 2004-09-09 2009-09-02 東京エレクトロン株式会社 基板洗浄方法及び現像装置
JP5151629B2 (ja) * 2008-04-03 2013-02-27 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、現像方法、現像装置及び記憶媒体
JP5538102B2 (ja) * 2010-07-07 2014-07-02 株式会社Ｓｏｋｕｄｏ 基板洗浄方法および基板洗浄装置
JP6117041B2 (ja) * 2013-07-19 2017-04-19 東京エレクトロン株式会社 液処理方法、液処理装置および記憶媒体
CN104425321B (zh) * 2013-08-30 2017-09-29 细美事有限公司 基板处理装置以及方法、包括该装置的基板处理系统
JP5995881B2 (ja) * 2014-01-09 2016-09-21 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、及びコンピュータ読み取り可能な記録媒体
JP5994804B2 (ja) * 2014-03-17 2016-09-21 東京エレクトロン株式会社 基板洗浄方法
JP6386769B2 (ja) 2014-04-16 2018-09-05 株式会社荏原製作所 基板乾燥装置、制御プログラム、及び基板乾燥方法
JP6588819B2 (ja) * 2015-12-24 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6817748B2 (ja) * 2016-08-24 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6938248B2 (ja) * 2017-07-04 2021-09-22 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP2020141052A (ja) * 2019-02-28 2020-09-03 株式会社荏原製作所 基板処理装置、半導体製造装置、および基板処理方法
JP7194645B2 (ja) * 2019-05-31 2022-12-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7341825B2 (ja) * 2019-09-27 2023-09-11 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006137202A1 (ja) * 2005-06-23 2006-12-28 Tokyo Electron Limited 基板処理方法および基板処理装置
WO2021020136A1 (ja) * 2019-07-26 2021-02-04 東京エレクトロン株式会社 基板処理装置、及び基板処理方法

Also Published As

Publication number Publication date
US12172194B2 (en) 2024-12-24
TW202443757A (zh) 2024-11-01
TWI893895B (zh) 2025-08-11
US11833550B2 (en) 2023-12-05
JP2023045958A (ja) 2023-04-03
US20230090997A1 (en) 2023-03-23
TWI850623B (zh) 2024-08-01
US20240058847A1 (en) 2024-02-22
TW202529232A (zh) 2025-07-16
TW202314899A (zh) 2023-04-01
JP7781577B2 (ja) 2025-12-08
CN115889281A (zh) 2023-04-04
TWI912175B (zh) 2026-01-11

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