CN115868022A - 一种封装结构及其制造方法、器件结构 - Google Patents
一种封装结构及其制造方法、器件结构 Download PDFInfo
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- CN115868022A CN115868022A CN202080102938.8A CN202080102938A CN115868022A CN 115868022 A CN115868022 A CN 115868022A CN 202080102938 A CN202080102938 A CN 202080102938A CN 115868022 A CN115868022 A CN 115868022A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
本申请公开了一种封装结构及其制造方法、器件结构，其中，半导体封装结构包括第一芯片、第二芯片、基板和导电填充物，其中，第一芯片和第二芯片固定于基板上，第一芯片朝向第二芯片一侧的上表面形成有第一接地焊盘，基板接地，导电填充物覆盖第一接地焊盘以及第一芯片的至少一侧侧壁，以电连接第一接地焊盘和基板。由于导电填充物同时具有导电和粘结的作用，成本较低，操作方便，同时第一接地焊盘和基板之间通过导电填充物连接，无需形成贯穿第一芯片的硅通孔即可实现芯片的接地，简化了工艺，降低了成本，而导电填充物所需要的横向面积较小，从而实现小尺寸的封装结构。
Description
PCT国内申请，说明书已公开。
Claims (28)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/106118 WO2022021291A1 (zh) | 2020-07-31 | 2020-07-31 | 一种封装结构及其制造方法、器件结构 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115868022A true CN115868022A (zh) | 2023-03-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080102938.8A Pending CN115868022A (zh) | 2020-07-31 | 2020-07-31 | 一种封装结构及其制造方法、器件结构 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115868022A (zh) |
| WO (1) | WO2022021291A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114242654B (zh) * | 2022-02-23 | 2022-05-13 | 威海嘉瑞光电科技股份有限公司 | 一种无引线磁性封装结构及其制造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090115045A1 (en) * | 2007-11-02 | 2009-05-07 | Phoenix Precision Technology Corporation | Stacked package module and method for fabricating the same |
| CN104332452B (zh) * | 2014-08-20 | 2017-04-19 | 深圳市汇顶科技股份有限公司 | 芯片封装模组 |
| CN108447776A (zh) * | 2018-05-07 | 2018-08-24 | 宜确半导体（苏州）有限公司 | 半导体装置及其制造方法、集成阵列装置 |
| CN110098130B (zh) * | 2019-03-13 | 2021-11-23 | 通富微电子股份有限公司 | 一种系统级封装方法及封装器件 |
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2020
- 2020-07-31 CN CN202080102938.8A patent/CN115868022A/zh active Pending
- 2020-07-31 WO PCT/CN2020/106118 patent/WO2022021291A1/zh active Application Filing
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| Publication number | Publication date |
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| WO2022021291A1 (zh) | 2022-02-03 |
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