CN115811838A - Forming method and forming die for PCB - Google Patents
Forming method and forming die for PCB Download PDFInfo
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- CN115811838A CN115811838A CN202310078355.1A CN202310078355A CN115811838A CN 115811838 A CN115811838 A CN 115811838A CN 202310078355 A CN202310078355 A CN 202310078355A CN 115811838 A CN115811838 A CN 115811838A
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Abstract
The invention discloses a forming method and a forming die of a PCB, wherein the method comprises the following steps: cutting, namely processing a first cover plate and a second cover plate which correspond to each other in size according to the size of the PNL of the PCB; a forming step, namely adding the first cover plate and the second cover plate on the surface of the PCB twice respectively, and processing and forming the PCB according to first routing data and second routing data respectively; and after the gongs of the first gong belt material and the gong stroke of the second gong belt material are mutually superposed, a plurality of frames with the same size as the SET or PCS required by delivery can be formed. The cover plate can be repeatedly used, when the cover plate is taken down and covered, the cover plate is integrated according to the size of the PNL instead of the cover plate is taken down and covered according to the size of the SET or PCS, the operation is convenient, the time is saved, and the production efficiency is obviously improved.
Description
Technical Field
The invention belongs to the technical field of electronic element production, and particularly relates to a forming method and a forming die for a PCB.
Background
With the development of electronic products towards thinning, integration and multi-functionalization, not only the requirements for the manufacturing process of electronic component assemblies are higher and higher, but also the requirements for the appearance of electronic component assemblies are also stricter, in particular, the gold surface or the tin surface of the PCB subjected to surface treatment is more and more strict, i.e. during molding, a cover plate is often required to be added on the PCB to be molded, as a protective layer, to be molded and produced together with the PCB, so as to prevent the gold surface or the tin surface from being scratched by the grinding brush of the pressure pins of the molding machine, and whether the PCB or the cover plate used as an auxiliary cover plate is produced according to the delivery size of the PCB, but when the PNL size of the produced PCB is larger and the delivery size (SET or PCS size) is smaller, each PCB is divided into several or tens of SETs or PCS after molding, if the SET or PCS is smaller in size, the number of the divisions is larger, and in subsequent processing, the PCB divided into small sizes needs to be covered on the PCB again, i.e. the current production efficiency is lower.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a method for forming a PCB, which is convenient to operate, saves time and improves the production efficiency of the PCB by rounding up the cover plate according to the size of a PNL when the cover plate is taken down and covered.
The purpose of the invention is realized by the following technical scheme:
a forming method of a PCB board comprises the following steps:
cutting, namely processing a first cover plate and a second cover plate which correspond to each other in size according to the size of the PNL of the PCB;
a forming step, namely adding the first cover plate and the second cover plate on the surface of the PCB twice respectively, and processing and forming the PCB according to first routing data and second routing data respectively;
and after the routing of the first routing data and the routing of the second routing data are mutually overlapped, a plurality of frames with the same size as the SET or PCS required by delivery can be formed.
In one embodiment, the routing of the first routing information is perpendicular to the routing of the second routing information, and the routing of the first routing information and the routing of the second routing information extend in parallel.
In one embodiment, the gong runs within the first gong band profile or the second gong band profile extend in a horizontal direction.
In one embodiment, the first positioning holes of the first routing data and the second routing data are arranged in a common hole.
In one embodiment, in the cutting step, if the first cover plate and the second cover plate are light plates, cutting is performed using a core plate, and the first cover plate and the second cover plate are etched into a pad plate after the cutting is completed.
In one embodiment, after the cutting step, a drilling step is further included,
and installing the first cover plate and the second cover plate on a drilling machine table, fixing by using masking tape, adjusting the processing range, and processing a second positioning hole required by PCB forming, wherein the second positioning hole corresponds to the first positioning hole in the first routing data and the second routing data.
In one embodiment, the forming step further comprises:
drilling a third positioning hole corresponding to the first positioning hole on a machine table of the milling machine;
arranging the PCB on a machine table of the milling machine, aligning the second positioning hole with the third positioning hole and inserting a pin;
adding the first cover plate on the surface of the PCB, and processing according to the first routing data;
and taking down the first cover plate, adding the second cover plate on the surface of the PCB, and processing according to the second routing data.
The invention also provides a forming die of the PCB, which comprises a first cover plate and a second cover plate, wherein the sizes of the first cover plate and the second cover plate correspond to the size of the PNL of the PCB, and the screw routes processed on the first cover plate and the second cover plate can form a plurality of frames with the size consistent with the SET or PCS required by delivery after being overlapped.
The invention has the beneficial effects that:
the cover plate can be repeatedly used, when the cover plate is taken down and covered, the cover plate is integrated according to the size of the PNL instead of taking down and covering the cover plate according to the size of the SET or PCS, the operation is convenient, the time is saved, and the production efficiency is obviously improved.
Drawings
The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:
FIG. 1 shows a schematic flow diagram of the present invention;
FIG. 2 shows a PNL dimension schematic of a PCB of the present invention;
FIG. 3 shows a SET dimension schematic of a PCB of the present invention;
FIG. 4 shows a PCS schematic of a PCB of the present invention;
FIG. 5 is a schematic view showing the structure of a first cover plate according to the present invention;
FIG. 6 is a schematic view showing the structure of a second cover plate according to the present invention;
in the drawings, like parts are provided with like reference numerals. The drawings are not to scale.
Reference numerals:
the structure comprises the following components, by weight, 1-the PNL size of a PCB, 2-the SET size of the PCB, 3-the PCS size of the PCB, 4-a second positioning hole, 5-a third positioning hole, 6-a first cover plate and 7-a second cover plate.
Detailed Description
The invention will be further explained with reference to the drawings.
Example 1
The invention provides a method for forming a PCB (printed circuit board), which comprises the following steps as shown in figure 1:
s100, cutting, namely processing a first cover plate and a second cover plate which correspond to each other in size according to the size of the PNL of the PCB;
step S200, forming, namely adding a first cover plate and a second cover plate on the surface of the PCB for two times respectively, and processing and forming the PCB according to the first routing data and the second routing data respectively;
in step S200, the routing of the first routing data and the second routing data are overlapped to form a plurality of frames having the same SET or PCS size as the one required for delivery.
It should be noted that, because electronic products are developed toward thinning, integration and multi-functionalization, when a PCB is molded, a cover plate is often added on the PCB to be molded as a protective layer, and the cover plate is molded with the PCB to prevent the gold surface or the tin surface from being scratched by the grinding of pressure pins of the molding machine, and when the PCB is molded, the cover plate is produced according to the delivery size of the PCB, and when the PNL size of the produced PCB is large and the delivery size (SET or PCS size) is small, each PCB is divided into several or tens of SETs or PCS after molding, if the size of the SET or PCS is small, the number of the divided covers is large, and in subsequent processing, the cover plates divided into small sizes need to be covered on the PCB to be molded one by one, so that the production efficiency is low;
as shown in fig. 2, 3 and 4, the PNL size 1 of the PCB has the SET size 2 of a plurality of PCBs, and the SET size 2 of the PCB has the PCS size 3 of a plurality of PCBs, i.e. the PCB is divided into several or tens of SETs or PCS after being formed.
Example 2
The invention provides a forming method of a PCB, which comprises the following steps:
a100, cutting, namely processing a first cover plate and a second cover plate which correspond to each other in size according to the size of the PNL of the PCB;
step A200, drilling, namely processing second positioning holes on the first cover plate and the second cover plate, wherein the positions of the second positioning holes correspond to the positions of the first positioning holes in the milling belt data;
step A300, copper deposition;
step A400, resistance welding, and surface treatment is carried out after resistance welding;
step A500, forming, namely adding a first cover plate and a second cover plate on the surface of the PCB for two times respectively, and processing and forming the PCB according to the first routing data and the second routing data respectively;
in step a500, the routing of the first routing data and the second routing data are overlapped to form a plurality of frames with the same size as SET or PCS required for delivery;
and A600, testing the formed PCB and completing packaging.
Example 3
The same contents as those in the previous embodiment are not described in detail in this embodiment;
the invention provides a forming method of a PCB, which comprises the following steps:
b100, cutting, namely processing a first cover plate and a second cover plate which correspond to each other in size according to the size of the PNL of the PCB;
specifically, in step B100, the number of the first cover plate and the second cover plate is determined according to the processing spindle of the milling machine, and is generally 6 axes, when the first cover plate and the second cover plate are the backing plates, no other processing is needed, if the first cover plate and the second cover plate are the light plates, the core plate is used during cutting, and the light plates are etched after cutting;
step B200, drilling, namely processing second positioning holes on the first cover plate and the second cover plate, wherein the positions of the second positioning holes correspond to the positions of the first positioning holes in the milling tape data;
specifically, in step B200, the first cover plate and the second cover plate are placed on the drilling machine table in the middle, and are fixed by the masking tape, the processing range is adjusted, and a second positioning hole required in the PCB board forming process is processed;
the drilling belt of the second positioning hole is manufactured according to the position of the first positioning hole in the forming milling belt;
step B500, forming, namely adding a first cover plate and a second cover plate on the surface of the PCB for two times respectively, and processing and forming the PCB according to the first routing data and the second routing data respectively;
in step B500, the routing of the first routing data and the second routing data are overlapped to form a plurality of frames having the same SET or PCS size as the one required for delivery;
specifically, in step B500, the suffix of the first gong and band data is rou1, the suffix of the second gong and band data is rou2, and the rou1 and the rou2 share one set of positioning holes;
step B500 specifically includes;
b501, calling first gong belt data or second gong belt data, and drilling a third positioning hole corresponding to the first positioning hole on a gong machine table for forming a PCB;
step B502, placing the PCB on the table top of the milling machine after the third positioning hole is drilled, aligning the second positioning hole with the third positioning hole and inserting a pin;
step B503, adding a cover plate on the surface of the PCB plate, and processing according to first gong-and-bang data, namely the rou1 file;
step B504, after the first gong and bang data is processed, taking down the cover plate, and marking the cover plate as a first cover plate;
step B505, adding a cover plate on the surface of the PCB again, and processing according to second gong-band data, namely the rou2 file;
step B506, after the second milling belt data are processed, taking down the cover plate, and marking the cover plate as a second cover plate;
and step B507, taking down the molded PCB, namely the size of the PCB is the delivery size.
Further, as shown in fig. 2, 3 and 4, a third positioning hole 5 is formed in the PCB and corresponds to the position of the second positioning hole 4, as shown in fig. 5 and 6, the first cover plate processed by the first routing data is shown in fig. 5, the second cover plate processed by the second routing data is shown in fig. 6, the routing on the first cover plate 6 is perpendicular to the routing on the second cover plate 7, and the routing on the first cover plate 6 and the routing on the second cover plate 7 respectively keep parallel extension, wherein the routing on the second cover plate 7 extends along the horizontal direction, the routing on the first cover plate 6 overlaps with the routing on the second cover plate 7 to form a SET or PCS size required for delivery, and the cover plate keeps an integral size (PNL size) during forming, so that the time for removing the cover plate and the time for adding the cover plate again are very short, thereby improving the working efficiency.
Example 4
The invention provides a PCB (printed circuit board) forming die which comprises a first cover plate 6 and a second cover plate 7, wherein the sizes of the first cover plate 6 and the second cover plate 7 correspond to the size of a PNL (portable network bus) of a PCB, and a plurality of frames with the size consistent with the SET or PCS (personal communications system) required by delivery can be formed after routing processes processed on the first cover plate 6 and the second cover plate 7 are overlapped.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "bottom", "top", "front", "back", "inner", "outer", "left", "right", and the like, are used in the orientations and positional relationships indicated in the drawings, which are based on the orientations and positional relationships indicated in the drawings, and are used for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.
Claims (8)
1. A forming method of a PCB board is characterized by comprising the following steps:
cutting, namely processing a first cover plate and a second cover plate which correspond to each other in size according to the size of the PNL of the PCB;
a forming step, namely adding the first cover plate and the second cover plate on the surface of the PCB twice respectively, and processing and forming the PCB according to first routing data and second routing data respectively;
and after the gongs of the first gong belt material and the gong stroke of the second gong belt material are mutually superposed, a plurality of frames with the same size as the SET or PCS required by delivery can be formed.
2. The method of claim 1, wherein the routing of the first routing information is perpendicular to the routing of the second routing information, and the routing of the first routing information and the routing of the second routing information extend in parallel.
3. The method of claim 2, wherein the routing in the first routing information or the second routing information extends in a horizontal direction.
4. The method as claimed in claim 1, wherein the first positioning holes of the first routing information and the second routing information are disposed in a common hole.
5. The method as claimed in any one of claims 1 to 4, wherein in the cutting step, if the first cover plate and the second cover plate are light plates, core plates are used for cutting, and the first cover plate and the second cover plate are etched into pads after the cutting is completed.
6. The method for forming a PCB board of claim 4,
after the cutting step, a drilling step is also included,
and installing the first cover plate and the second cover plate on a drilling machine table, fixing by using masking tape, adjusting the processing range, and processing a second positioning hole required by PCB forming, wherein the second positioning hole corresponds to the first positioning hole in the first routing data and the second routing data.
7. The method of claim 6, wherein the step of molding further comprises:
drilling a third positioning hole corresponding to the first positioning hole on a machine table of the milling machine;
arranging the PCB on a machine table of the milling machine, aligning the second positioning hole with the third positioning hole and inserting a pin;
adding the first cover plate on the surface of the PCB, and processing according to the first routing data;
and taking down the first cover plate, adding the second cover plate on the surface of the PCB, and processing according to the second routing data.
8. The utility model provides a forming die of PCB board, characterized in that, includes first apron and second apron, first apron with the size of second apron all with the PNL size of PCB board corresponds, just first apron with gong journey that the processing was gone up to the second apron can form a plurality ofly and the required SET of delivery or the unanimous framework of PCS size after overlapping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310078355.1A CN115811838B (en) | 2023-02-08 | 2023-02-08 | Forming method and forming die of PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310078355.1A CN115811838B (en) | 2023-02-08 | 2023-02-08 | Forming method and forming die of PCB |
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| CN115811838A true CN115811838A (en) | 2023-03-17 |
| CN115811838B CN115811838B (en) | 2023-06-27 |
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Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140355218A1 (en) * | 2011-05-11 | 2014-12-04 | Vlt, Inc. | Panel-Molded Electronic Assemblies |
| CN104703396A (en) * | 2015-03-02 | 2015-06-10 | 西安金百泽电路科技有限公司 | Small circuit board forming method without inner orientation |
| CN104936376A (en) * | 2015-06-05 | 2015-09-23 | 大连崇达电路有限公司 | Printed circuit board copper hole positioning plate and processing method thereof |
| CN205071479U (en) * | 2015-10-20 | 2016-03-02 | 同扬光电（江苏）有限公司 | A lamination jig for inciting somebody to action equidistant low paper that adheres of multi -disc circuit board is typeset |
| CN105960095A (en) * | 2016-05-31 | 2016-09-21 | 广东欧珀移动通信有限公司 | Circuit board splice board |
| CN206977814U (en) * | 2017-06-28 | 2018-02-06 | 上海汇博精工电子科技有限公司 | A kind of pcb board cuts tool |
| CN108668446A (en) * | 2018-06-29 | 2018-10-16 | 奥士康精密电路（惠州）有限公司 | A kind of pcb board half bore gong plate processing structure and machining method |
| CN110177434A (en) * | 2019-02-20 | 2019-08-27 | 淳华科技(昆山)有限公司 | Flexible circuit board takes off lid equipment |
| CN110944454A (en) * | 2019-12-19 | 2020-03-31 | 黄石星河电路有限公司 | Circuit board production process |
| CN110996531A (en) * | 2020-01-02 | 2020-04-10 | 深圳市景旺电子股份有限公司 | Processing and manufacturing method for PCB molding |
| CN111093329A (en) * | 2019-12-27 | 2020-05-01 | 智恩电子(大亚湾)有限公司 | Small-size stepped PCB forming method |
| CN111954382A (en) * | 2020-09-07 | 2020-11-17 | 胜宏科技（惠州）股份有限公司 | Circuit board PAD and hole-to-edge size control method |
| CN113038715A (en) * | 2021-03-12 | 2021-06-25 | 江西旭昇电子有限公司 | One-time routing forming method for printed circuit board |
| CN113613415A (en) * | 2021-10-11 | 2021-11-05 | 四川英创力电子科技股份有限公司 | Printed circuit board and non-metallized step groove processing technology thereof |
| CN216217798U (en) * | 2021-11-01 | 2022-04-05 | 宁波特一电子有限公司 | Circuit board is cut apart and is assembled pressfitting tool frock with connector |
| CN114364128A (en) * | 2021-12-14 | 2022-04-15 | 鹤山市中富兴业电路有限公司 | Board milling method and board milling machine for PCB |
| CN115135041A (en) * | 2022-06-10 | 2022-09-30 | 厦门恒富达电子科技有限公司 | Process for improving forming efficiency of circuit board |
| CN115334754A (en) * | 2022-08-15 | 2022-11-11 | 中山芯承半导体有限公司 | Processing and forming method of circuit board without inner positioning hole |
-
2023
- 2023-02-08 CN CN202310078355.1A patent/CN115811838B/en active Active
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140355218A1 (en) * | 2011-05-11 | 2014-12-04 | Vlt, Inc. | Panel-Molded Electronic Assemblies |
| CN104703396A (en) * | 2015-03-02 | 2015-06-10 | 西安金百泽电路科技有限公司 | Small circuit board forming method without inner orientation |
| CN104936376A (en) * | 2015-06-05 | 2015-09-23 | 大连崇达电路有限公司 | Printed circuit board copper hole positioning plate and processing method thereof |
| CN205071479U (en) * | 2015-10-20 | 2016-03-02 | 同扬光电（江苏）有限公司 | A lamination jig for inciting somebody to action equidistant low paper that adheres of multi -disc circuit board is typeset |
| CN105960095A (en) * | 2016-05-31 | 2016-09-21 | 广东欧珀移动通信有限公司 | Circuit board splice board |
| CN206977814U (en) * | 2017-06-28 | 2018-02-06 | 上海汇博精工电子科技有限公司 | A kind of pcb board cuts tool |
| CN108668446A (en) * | 2018-06-29 | 2018-10-16 | 奥士康精密电路（惠州）有限公司 | A kind of pcb board half bore gong plate processing structure and machining method |
| CN110177434A (en) * | 2019-02-20 | 2019-08-27 | 淳华科技(昆山)有限公司 | Flexible circuit board takes off lid equipment |
| CN110944454A (en) * | 2019-12-19 | 2020-03-31 | 黄石星河电路有限公司 | Circuit board production process |
| CN111093329A (en) * | 2019-12-27 | 2020-05-01 | 智恩电子(大亚湾)有限公司 | Small-size stepped PCB forming method |
| CN110996531A (en) * | 2020-01-02 | 2020-04-10 | 深圳市景旺电子股份有限公司 | Processing and manufacturing method for PCB molding |
| CN111954382A (en) * | 2020-09-07 | 2020-11-17 | 胜宏科技（惠州）股份有限公司 | Circuit board PAD and hole-to-edge size control method |
| CN113038715A (en) * | 2021-03-12 | 2021-06-25 | 江西旭昇电子有限公司 | One-time routing forming method for printed circuit board |
| CN113613415A (en) * | 2021-10-11 | 2021-11-05 | 四川英创力电子科技股份有限公司 | Printed circuit board and non-metallized step groove processing technology thereof |
| CN216217798U (en) * | 2021-11-01 | 2022-04-05 | 宁波特一电子有限公司 | Circuit board is cut apart and is assembled pressfitting tool frock with connector |
| CN114364128A (en) * | 2021-12-14 | 2022-04-15 | 鹤山市中富兴业电路有限公司 | Board milling method and board milling machine for PCB |
| CN115135041A (en) * | 2022-06-10 | 2022-09-30 | 厦门恒富达电子科技有限公司 | Process for improving forming efficiency of circuit board |
| CN115334754A (en) * | 2022-08-15 | 2022-11-11 | 中山芯承半导体有限公司 | Processing and forming method of circuit board without inner positioning hole |
Non-Patent Citations (2)
| Title |
|---|
| 唐殿军;王阳烨;陈春;: "无内定位的小尺寸板外型尺寸精度改善研究" * |
| 张仁军;杨海军;牟玉贵;胡志强;: "半孔孔口铜断裂分析及改善" * |
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| CN115811838B (en) | 2023-06-27 |
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