CN104936376A - Printed circuit board copper hole positioning plate and processing method thereof - Google Patents
Printed circuit board copper hole positioning plate and processing method thereof Download PDFInfo
- Publication number
- CN104936376A CN104936376A CN201510301228.9A CN201510301228A CN104936376A CN 104936376 A CN104936376 A CN 104936376A CN 201510301228 A CN201510301228 A CN 201510301228A CN 104936376 A CN104936376 A CN 104936376A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- printed wiring
- copper
- printed circuit
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Abstract
The invention belongs to a printed circuit board copper hole positioning plate and a processing method thereof. The printed circuit board copper hole positioning plate comprises a plurality of printed circuit boards (2), three corners of each printed circuit board (2) is provided with a copper hole (1) with the diameter being 3.0mm. The printed circuit board copper hole positioning plate is characterized in that the plurality of printed circuit boards (2) are uniformly adhered to a backing plate (7); copper-free connecting position holes (6) are arranged at four corners of the backing plate (7) and between the corners of the printed circuit boards (2), and one corner of the printed circuit board (2) is provided with a fool-proof hole (8); and each printed circuit board (2) is adhered with a piece of dust sticking paper (5). According to the invention, a problem that only copper hole positioning exists in the printed circuit board, and a defect of damages of the copper holes is improved; and the production efficiency of printed circuit board with a small size is improved, phenolic aldehyde backing plates are saved, and the cost is reduced.
Description
Technical field
The invention belongs to the processing method of electric circuit board, particularly a kind of printed wiring board has copper hole location-plate and processing method thereof.
Background technology
At present in printed wiring board manufacturing process, 2-4 is generally needed to select in set to locate without copper location hole, to meet the technical requirement of user to printed wiring board.Four diameters can only be processed at four angles place with regard to existing printed wiring board and have copper location hole at 2.5mm.The defect of this printed wiring board does not have the plate without copper location hole, this mode cannot be selected to locate processing, can only select the plate of copper location hole, so just easily produces the damage of location hole; In addition when the printed wiring board of manufacture order size < 50 × 50mm, because typesetting is too much, shop bolt uses too much, easily causes production efficiency to decline; Simultaneously phenolic aldehyde backing plate due to pin intensive, useful life reduces by more than 50%.
Summary of the invention
The object of the invention is to overcome above-mentioned technical deficiency, provide a kind of and made by adjustment gong band, in upper berth, plate face blue dust sticky paper, improve shaping production efficiency, the printed wiring board saving phenolic aldehyde backing plate has copper hole location-plate and processing method thereof.
The technical scheme that technical solution problem of the present invention adopts is: a kind of printed wiring board has copper hole location-plate and processing method thereof, printed wiring board has copper hole locating lines plate, comprise multiple printed wiring board, being provided with diameter at three angles place of printed wiring board is that 3.0mm has copper hole; It is characterized in that multiple printed wiring board is bonded on backing plate equably; Between four angles place and the angle of each printed wiring board of backing plate, be provided with the connection bit hole without copper, be provided with fool proof hole at the angle place of printed wiring board; In each printed wiring board glued on top dust sticky paper.
Described printed wiring board has the processing method of copper hole location-plate to take following steps: a. is bonded with polylith printed wiring board equably on backing plate; B. process at four angles place of printed wiring board the location hole and a fool proof hole that three diameters are 3.0mm; Its edges of boards groove gong falls by the connection bit c. carrying out retaining when gong band makes four angles place of printed wiring board; D. in track wiring board glued on top dust sticky paper, gong is except the connection bit without copper on printed wiring board.
The invention has the beneficial effects as follows: this invention solves in printed wiring board only copper hole orientation problem, improved hole, copper hole and damaged defect; Improve the little printed wiring board production efficiency of size, save phenolic aldehyde backing plate, reduce cost.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, illustrate with embodiment.
Fig. 1 is the front view that printed wiring board has copper hole location-plate;
Fig. 2 is without the front view adhering to dust sticky paper in Fig. 1.
In figure: 1-has copper hole; 2-printed wiring board; 3-retains connection bit; The half of groove of 4-; 5-adheres to dust sticky paper; 6-connection bit hole; 7-phenolic aldehyde backing plate; 8-fool proof hole.
Embodiment
Embodiment, with reference to accompanying drawing, a kind of printed wiring board has copper hole location-plate and processing method thereof, and printed wiring board has copper hole locating lines plate, comprises four printed wiring boards 2, and being provided with diameter at three angles place of printed wiring board 2 is that 3.0mm has copper hole 1; It is characterized in that four printed wiring boards 2 are bonded on backing plate 7 equably; Between four angles place and the angle of each printed wiring board 2 of backing plate 7, be provided with the connection bit hole 6 without copper, be provided with fool proof hole 8 at the angle place of printed wiring board 2; In each printed wiring board 2 glued on top dust sticky paper 5.
Described printed wiring board has the processing method of copper hole location-plate to take following steps: a. is bonded with polylith printed wiring board 2 equably on backing plate 7; B. the location hole 1 that three diameters are 3.0mm and a fool proof hole 8 is processed at four angles place of printed wiring board 2; Its edges of boards groove 4 gong falls by the connection bit 6 c. carrying out retaining when gong band makes four angles place of printed wiring board 2; D. in track wiring board 2 glued on top dust sticky paper 5, gong is except the connection bit 6 without copper on printed wiring board 2.
When not boning adhesion dust sticky paper 5, being provided with between four angles of phenolic aldehyde backing plate 8 and the angle of each printed wiring board 2 and retaining connection bit 3, connection bit hole 6 will be processed on reservation connection bit 3 after bonding adheres to dust sticky paper 5.
When this printed wiring board has copper hole location-plate to use, the phenolic aldehyde backing plate 7 between each printed wiring board 2 is cut off, becomes single plate and use.
Claims (2)
1. printed wiring board has copper hole location-plate and a processing method thereof, and printed wiring board has copper hole locating lines plate, comprises multiple printed wiring board (2), and being provided with diameter at three angles place of printed wiring board (2) is that 3.0mm has copper hole (1); It is characterized in that multiple printed wiring board (2) is bonded on backing plate (7) equably; Between four angles place of backing plate (7) and the angle of each printed wiring board (2), be provided with the connection bit hole (6) without copper, be provided with fool proof hole (8) at the angle place of printed wiring board (2); In each printed wiring board (2) glued on top dust sticky paper (5).
2. printed wiring board according to claim 1 has copper hole location-plate and processing method thereof, it is characterized in that described printed wiring board has the processing method of copper hole location-plate to take following steps: a. is bonded with polylith printed wiring board (2) equably on backing plate (7); B. the location hole (1) that three diameters are 3.0mm and a fool proof hole (8) is processed at four angles place of printed wiring board (2); Its edges of boards groove (4) gong falls without the connection bit (6) of copper by four angles place c. carrying out retaining when gong band makes printed wiring board (2); D. in track wiring board (2) glued on top dust sticky paper (5), gong is except the upper connection bit (6) without copper of printed wiring board (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510301228.9A CN104936376A (en) | 2015-06-05 | 2015-06-05 | Printed circuit board copper hole positioning plate and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510301228.9A CN104936376A (en) | 2015-06-05 | 2015-06-05 | Printed circuit board copper hole positioning plate and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104936376A true CN104936376A (en) | 2015-09-23 |
Family
ID=54123252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510301228.9A Pending CN104936376A (en) | 2015-06-05 | 2015-06-05 | Printed circuit board copper hole positioning plate and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104936376A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105458628A (en) * | 2015-12-14 | 2016-04-06 | 谢兴龙 | Hole-drilling and automatic-adhesive-tape-wrapping production method of circuit board |
| CN106231802A (en) * | 2016-09-06 | 2016-12-14 | 江门崇达电路技术有限公司 | A kind of manufacture method of metallized semi groove |
| CN109561591A (en) * | 2018-12-17 | 2019-04-02 | 四川英创力电子科技股份有限公司 | A method of promoting LED lamp panel formed precision |
| CN115811838A (en) * | 2023-02-08 | 2023-03-17 | 四川英创力电子科技股份有限公司 | Forming method and forming die for PCB |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020179331A1 (en) * | 2001-05-31 | 2002-12-05 | International Business Machines Corporation | Printed wiring board interposer sub-assembly and method |
| CN101711094A (en) * | 2009-11-03 | 2010-05-19 | 深圳崇达多层线路板有限公司 | Preparation method of flexible and hard combined circuit board and flexible and hard combined circuit board |
| CN102242738A (en) * | 2011-05-05 | 2011-11-16 | 中山市硕俪电子有限公司 | Siphon type airflow control device and method |
| CN204320906U (en) * | 2014-11-18 | 2015-05-13 | 简玉苍 | The die-cut precision die of a kind of overlength backlight aluminum base circuit board |
| CN204968214U (en) * | 2015-06-05 | 2016-01-13 | 大连崇达电路有限公司 | Printed wiring board has copper hole locating plate |
-
2015
- 2015-06-05 CN CN201510301228.9A patent/CN104936376A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020179331A1 (en) * | 2001-05-31 | 2002-12-05 | International Business Machines Corporation | Printed wiring board interposer sub-assembly and method |
| CN101711094A (en) * | 2009-11-03 | 2010-05-19 | 深圳崇达多层线路板有限公司 | Preparation method of flexible and hard combined circuit board and flexible and hard combined circuit board |
| CN102242738A (en) * | 2011-05-05 | 2011-11-16 | 中山市硕俪电子有限公司 | Siphon type airflow control device and method |
| CN204320906U (en) * | 2014-11-18 | 2015-05-13 | 简玉苍 | The die-cut precision die of a kind of overlength backlight aluminum base circuit board |
| CN204968214U (en) * | 2015-06-05 | 2016-01-13 | 大连崇达电路有限公司 | Printed wiring board has copper hole locating plate |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105458628A (en) * | 2015-12-14 | 2016-04-06 | 谢兴龙 | Hole-drilling and automatic-adhesive-tape-wrapping production method of circuit board |
| CN106231802A (en) * | 2016-09-06 | 2016-12-14 | 江门崇达电路技术有限公司 | A kind of manufacture method of metallized semi groove |
| CN106231802B (en) * | 2016-09-06 | 2019-05-03 | 江门崇达电路技术有限公司 | A kind of production method of metallized semi slot |
| CN109561591A (en) * | 2018-12-17 | 2019-04-02 | 四川英创力电子科技股份有限公司 | A method of promoting LED lamp panel formed precision |
| CN115811838A (en) * | 2023-02-08 | 2023-03-17 | 四川英创力电子科技股份有限公司 | Forming method and forming die for PCB |
| CN115811838B (en) * | 2023-02-08 | 2023-06-27 | 四川英创力电子科技股份有限公司 | Forming method and forming die of PCB |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150923 |