CN115811833A - Manufacturing method of high-density laminated circuit board - Google Patents

Abstract

The invention belongs to the technical field of PCBs (printed circuit boards), and provides a manufacturing method of a high-density laminated circuit board, which comprises the following steps: s1, setting a target on an inner-layer daughter board; the number of the targets is the same as the number of the lamination times, the number of the lamination times is N, the number of each group of targets is N, and the targets are respectively provided with numbers 1, 2,. N; s2, manufacturing an alignment target; the alignment target can be manufactured in three ways: shooting the target of the inner-layer daughter board by an X-ray target shooting machine to form a target hole as an alignment target; 2. performing laser ablation to obtain an inner-layer daughter board target as an alignment target; 3. installing an X-ray on a laser drilling machine and a graph exposure machine, and identifying an inner layer daughter board target as an alignment target; s3, laser drilling; the copper surface of the outer daughter board is browned by a brownification line, and laser drilling is carried out by adopting a direct copper drilling process; and S4, hole metallization and pattern transfer. Compared with the manufacturing method of the high-density build-up circuit board in the prior art, the invention can effectively improve the interlayer blind hole alignment precision and shorten the processing flow.

Description

Manufacturing method of high-density laminated circuit board

Technical Field

The invention belongs to the technical field of PCBs, and particularly relates to a manufacturing method of a high-density laminated circuit board.

Background

With the vigorous development and due deserve of new technologies such as 5G + ABC + IoT, the printed circuit board for carrying and connecting electronic components is evolving towards high density, high precision, high integration, small aperture, thin wires, small space, multilayering, high speed, high frequency, high reliability, low cost, light weight and thin shape. The high-density laminated circuit board has come into production and can well meet the industrial development trend.

The high-density laminated circuit board has the characteristics of high density, high precision and high integration degree, so that the high-density laminated circuit board has extremely high requirements on alignment precision. The precision of the build-up circuit board generally includes three types, i.e., a blind via and a blind via, a blind via and an outer adjacent layer pattern, and a blind via and an inner adjacent layer pattern. Factors influencing the precision mainly comprise mechanical drilling precision (65 mu m), laser blind hole precision (25 mu m), X-ray target drilling precision (20 mu m) and figure transfer precision (20 mu m). Different target designs and processing methods are affected by the four factors, and the types and times are different, and the expressed alignment precision is also different. The alignment precision can be effectively improved by generally avoiding the influence of factors with poor precision and reducing the influence times of various factors.

In the prior art, there are three common target design and processing methods:

scheme 1:

the first step is as follows: manufacturing a graph and a first target on an inner-layer core plate, performing first lamination and lamination to form a first outer-layer daughter board, and drilling the first target by using an X-ray target shooting machine to form a first alignment hole;

the second step is that: and aligning by using the first alignment hole, and transferring the outer-layer daughter board by using a pattern to be used as a blind hole window and a second target. Drilling a second target by using an X-ray target drilling machine to drill a second alignment hole;

the third step: and aligning by using the second alignment hole, performing laser drilling to form a blind hole, and then performing hole metallization.

The fourth step: and aligning by using the first aligning hole again, and transferring the patterns to manufacture a first outer-layer daughter board pattern and a third target. Performing second lamination and pressing to form a second outer daughter board, and drilling a third target by using an X-ray target shooting machine to form a third alignment hole;

the fifth step: repeating the second step to the fourth step until an outer layer pattern is manufactured;

and a sixth step: and (5) conventionally manufacturing the subsequent flow.

The factors influencing the alignment precision in the scheme 1 are as follows: (1) upper and lower blind holes: 2 times of laser blind hole precision, 2 times of X-ray target drilling precision and 2 times of pattern transfer precision; (2) supposing that N times of lamination pressing is carried out, the first daughter board blind hole and the outer layer blind hole: 2 times of laser blind hole precision + (N + 1) times of X-ray target drilling precision + (N + 1) times of pattern transfer precision; (3) blind hole and outer adjacent level figure: 1 laser blind hole precision, 1X-ray target drilling precision and 2 pattern transfer precisions; (4) blind hole and inner adjacent layer pattern: 1 laser blind hole precision + 1X-ray target drilling precision +2 pattern transfer precision.

The scheme 1 is suitable for the first-order and second-order HDI boards, and the alignment precision is worse along with the increase of lamination and lamination times. The second step of the pattern transfer and target shooting process affects the alignment precision and increases the cost.

Scheme 2:

the first step is as follows: manufacturing a graph and a first target on an inner-layer core plate, performing first lamination and lamination to form a first outer-layer daughter board, and drilling the first target by using an X-ray target shooting machine to form a first alignment hole;

the second step: and (4) reducing the copper of the first sub-board surface to 6-10um by brown oxidation, performing laser drilling by using a first alignment hole alignment and direct copper drilling process, and ablating a second alignment target. Subsequently, hole metallization is carried out;

the third step: and aligning the targets by using the second aligning holes, and transferring the patterns to manufacture a first outer-layer daughter board pattern and a third target. Performing second lamination and pressing to form a second outer daughter board, and drilling a third target by using an X-ray target shooting machine to form a third alignment hole;

the fourth step: repeating the second step to the third step until an outer layer pattern is manufactured;

the fifth step: and (5) conventionally manufacturing the subsequent flow.

Scheme 2 the factors influencing the alignment accuracy are as follows: (1) upper and lower blind holes: 2 times of laser blind hole precision, 1 time of X-ray target drilling precision and 1 time of pattern transfer precision; (2) assuming that lamination pressing is performed for N times, the blind holes of the first sub-board and the blind holes of the outer layer: (N + 1) times of laser blind hole precision + N times of X-ray target drilling precision + N times of pattern transfer precision; (3) blind hole and outer adjacent level pattern: 1 laser blind hole precision and 1 pattern transfer precision; (4) blind hole and inner adjacent layer pattern: 1 laser blind hole precision + 1X-ray target drilling precision +1 pattern transfer precision.

The scheme 2 is the same as the scheme 1, is suitable for the first-order and second-order HDI boards, and the alignment precision is poorer along with the increase of lamination and pressing times. But the blind hole windowing process is cancelled, so that the cost is saved compared with the scheme 1.

Scheme 3:

the first step is as follows: manufacturing a graph, a first group of targets and blind hole targets on an inner-layer core plate, carrying out first lamination and lamination to form a first outer-layer daughter board, and then drilling the first target in the first group of targets by using an X-ray target shooter to form a first alignment hole;

the second step is that: and reducing the copper of the first sub-plate surface to 6-10um by brown oxidation. And (4) aligning by using the first alignment hole, ablating the position of the blind hole target to leak the blind hole target, and then performing laser drilling by aligning the blind hole target. Subsequently, hole metallization is carried out;

the third step: and aligning by using the first aligning hole target, and transferring the pattern to manufacture a first outer-layer daughter board pattern. Performing second lamination and pressing to form a second outer daughter board, and then drilling a first group of targets and a second target by using an X-ray target shooting machine to form a second alignment hole;

the fourth step: repeating the second step to the third step until an outer layer pattern is manufactured;

the fifth step: and (5) conventionally manufacturing the subsequent flow.

Scheme 3 the influence factors on the alignment precision are as follows: (1) upper and lower blind holes: 2 times of laser blind hole precision; (2) supposing that N times of lamination pressing is carried out, the first daughter board blind hole and the outer layer blind hole: 2 times of laser blind hole precision; (3) blind hole and outer adjacent level pattern: 1 laser blind hole precision + 1X-ray target drilling precision +1 pattern transfer precision; (4) blind hole and inner adjacent layer pattern: 1 laser blind hole precision + 1X-ray target drilling precision +1 pattern transfer precision.

Compared with the scheme 2, the theoretical alignment precision is obviously improved in the scheme 3, and the alignment precision is not worse and worse along with the increase of lamination pressing times. In actual operation, however, parameters of the blind hole target to be ablated need to be carefully controlled, otherwise, the blind hole target is easily damaged by mistake, and the precision is abnormal. In the process of stacking the blind hole target, the target is deformed due to repeated hole metallization, electroplating nodulation or liquid medicine residue, and the alignment precision of the target is also influenced. To expose the blind hole target, scheme 3 adds an ablation procedure, increasing cost. The blind hole target is lower than the surface of the board, the machine table is relatively difficult to grab the blind hole target, and even part of the machine table needs to be modified to grab the blind hole target.

In summary, the common target design scheme will have worse alignment precision between different layers as the lamination pressing times increase. Even the conventional ablation target scheme is subject to the process image of electroplating and the like, and the precision is difficult to control.

In the prior art, a method for processing a high-density build-up circuit board includes:

the first scheme comprises the following steps: cutting material → machine drilling buried hole and tool hole → hole metallization → making inner core plate graph and a group of targets → pressing outer daughter board → X-ray drilling image alignment hole → outer daughter board making blind hole windowing → X-ray drilling blind hole alignment hole → laser blind hole processing → hole metallization → making outer daughter board graph and target → pressing outer daughter board.

However, the blind holes in different layers and the patterns in the process have different targets, the alignment accuracy of the blind holes between the layers is insufficient, and the process is long.

Scheme two is as follows: cutting → drilling holes and tool holes by machine drill → hole metallization → manufacturing inner core layer graph and a group of targets → pressing outer daughter board → X-ray drilling blind hole alignment hole → browning copper reduction of 6-10um → laser blind hole processing → hole metallization → manufacturing outer daughter board graph and targets → pressing outer daughter board.

However, the blind holes in different layers and the patterns in the process have different targets, and the alignment accuracy of the blind holes between layers is insufficient.

The third scheme is as follows: cutting material → machine drilling buried hole and tool hole → hole metallization → making inner core plate graph and a group of blind hole targets → pressing outer daughter board → X-ray drilling graph alignment hole → outer daughter board blind hole target windowing → browning copper reduction of 6-10um → laser ablation inner blind hole target → laser blind hole processing → hole metallization → making outer daughter board graph → pressing outer daughter board.

However, the process increases the outer layer sub-board blind hole target windowing process, and is longer.

Disclosure of Invention

In view of the above, the present invention provides a method for manufacturing a high-density build-up circuit board. Compared with the manufacturing method of the high-density build-up circuit board in the prior art, the invention can effectively improve the interlayer blind hole alignment precision and shorten the processing flow.

The technical scheme of the invention is as follows:

a manufacturing method of a high-density laminated circuit board is characterized by comprising the following steps:

s1, setting a target on an inner-layer daughter board; the number of the targets is the same as the number of the lamination times, the number of the lamination times is N, the number of each group of targets is N, and the targets are respectively provided with numbers 1, 2,. N; taking a ten-layer plate in the prior art as an example, the lamination times are 4, 4 targets are arranged in each group, and the numbers on the targets are 1, 2, 3 and 4 respectively. In particular, the target of the present invention can be designed according to actual needs.

S2, manufacturing an alignment target; the alignment target can be manufactured in three ways: shooting the target of the inner-layer daughter board by an X-ray target shooting machine to form a target hole as an alignment target; 2. laser ablation is carried out to obtain an inner layer daughter board target as an alignment target; 3. installing an X-ray on a laser drilling machine and a graph exposure machine, and identifying an inner layer daughter board target as an alignment target;

s3, laser drilling; the copper surface of the outer-layer daughter board is browned by passing a brownification line, and laser drilling is carried out by adopting a direct copper drilling process; and S4, hole metallization and pattern transfer.

Further, in the step S2, the inner daughter board is laminated and pressed for the first time to form a first outer daughter board, and a target with the number of "1" of the inner daughter board is manufactured to form a first alignment target; and repeating the steps, laminating and pressing for the Nth time to form an Nth outer daughter board, and manufacturing a target with the number of the N-th inner daughter board to form an Nth alignment target.

In the invention, the grabbing mode of the alignment hole point position comprises one of the following modes:

mode a. Drill target hole alignment: and drilling a target hole in the corresponding inner-layer daughter board target by using an X-ray target drilling machine, and grabbing the target hole as a contraposition point by using a laser drilling machine and a graph exposure machine.

Mode b. Ablation out target alignment: exposing the corresponding inner daughter board target through laser ablation, and grabbing the target as a contraposition point by a laser drilling machine and a graph exposure machine;

and C, installing an X-ray to directly grab the target for alignment: and transforming a laser drilling machine and a graph exposure machine, and additionally installing X-ray equipment on the laser drilling machine and the graph exposure machine to enable the laser drilling machine and the graph exposure machine to directly grab the corresponding inner-layer daughter board targets for alignment.

Further, in the step S3, the browning line is moved to brown the copper surface of the first outer-layer daughter board, the direct copper drilling process is adopted to perform laser drilling, the first alignment target is used as the alignment target, and similarly, the nth alignment target is used as the nth outer-layer daughter board laser drilling alignment target.

Further, in step S3, a positioning alignment hole is set at the alignment hole position for the laser drilling data to grab the hole for alignment during the operation of the machine.

Further, the diameter of the positioning and aligning hole is 2-4mm.

Further, in step S4, the outer layer daughter board and the outer layer hole metallization and pattern process adopting the alignment target manufacturing modes 1 and 2 are preferably prepared by using a semi-additive method or an additive method, and the outer layer daughter board and the outer layer hole metallization and pattern process adopting the alignment target manufacturing mode 3 are not limited. . In the invention, the semi-additive method or additive method process is adopted for electroplating, after the pattern is exposed, the target hole drilled by the X-ray and the shape of the target exposed by laser ablation are not influenced by electroplating and electroplating nodulation, so that the accuracy abnormity caused by the electroplating is avoided, and the counterpoint grabbing mode of directly grabbing the target counterpoint by additionally installing the X-ray is not influenced by hole metallization and pattern transfer process images.

Further, the semi-additive or additive preparation method comprises the following steps: copper deposition, film pressing, exposure, development, electroplating, film stripping and copper stripping.

Furthermore, in the exposure process, the first alignment target is used as the alignment target for the exposure of the first outer layer daughter board pattern, and so on, and the nth alignment target is used as the alignment target for the exposure of the nth outer layer daughter board pattern.

Furthermore, except the pattern exposure of the inner layer sub-board, the corresponding areas of the target group areas of all other layers and the whole copper sets of the pattern data are copper-free areas.

Furthermore, on the figure data of all outer daughter boards, set up the target to the target position for the use of figure exposure counterpoint.

Further, the diameter of the target hole is 2-4mm.

The invention also provides a processing method of the high-density laminated circuit board, which is characterized by comprising the following steps of:

A. manufacturing an inner-layer sub-board; the method specifically comprises the following steps: cutting a core plate/conventionally manufacturing a multilayer plate, drilling and burying holes and tool holes by a machine, metallizing the holes, patterning an inner-layer daughter board and arranging a target;

B. manufacturing an outer layer daughter board; the manufacturing method comprises the steps of;

C. making an outer layer pattern through a post-process; the preparation can be carried out by the person skilled in the art by means of the known techniques.

Through a large number of creative tests, on the basis of the prior art, different bit grabbing modes and different influence factors on precision are found, and the creative tests are as follows:

1. the influence factors of the alignment precision of the target hole alignment mode of the X-ray target drilling machine are as follows: upper and lower blind holes: 2 times of laser blind hole precision and 2 times of X-ray target drilling precision; supposing that N times of lamination pressing is carried out, the first daughter board blind hole and the outer layer blind hole: 2 times of laser blind hole precision and 2 times of X-ray target drilling precision; blind hole and outer adjacent level figure: 1 laser blind hole precision and 1 pattern transfer precision; blind holes and inner adjacent level patterns: 1 laser blind hole precision + 2X-ray target drilling precisions +1 pattern transfer precision.

2. The factors influencing the alignment precision of the ablation target alignment mode are as follows: upper and lower blind holes: 2 times of laser blind hole precision; assuming that lamination pressing is performed for N times, the blind holes of the first sub-board and the blind holes of the outer layer: 2 times of laser blind hole precision; blind hole and outer adjacent level figure: 1 laser blind hole precision and 1 pattern transfer precision; blind hole and inner adjacent layer pattern: 1 laser blind hole precision +1 pattern transfer precision.

3. The influence factors of the alignment precision of the alignment mode of directly grabbing the target by additionally arranging the X-ray are as follows: upper and lower blind holes: 2 times of laser blind hole precision; assuming that lamination pressing is performed for N times, the blind holes of the first sub-board and the blind holes of the outer layer: 2 times of laser blind hole precision; blind hole and outer adjacent level pattern: 1 laser blind hole precision and 1 pattern transfer precision; blind holes and inner adjacent level patterns: 1 laser blind hole precision +1 pattern transfer precision.

Compared with the scheme 2 in the prior art, the technical scheme of the invention obviously improves the theoretical alignment precision, and the alignment precision is not worse along with the increase of lamination pressing times, and no additional flow is added. Compared with the scheme 3 in the prior art, the theoretical alignment precision is good and bad respectively. The scheme saves the process of ablating the blind hole target, avoids the risk of influencing the alignment accuracy due to the fact that the target is accidentally ablated, adopts an MSAP (multiple access point) or SAP (super absorbent polymer) process, and electroplating is carried out after pattern exposure, so that the influence of the exposure alignment accuracy due to the fact that electroplating nodules change hole shapes is avoided. Based on the prior art, the inventor can obtain unexpected technical effects compared with the prior art by a great deal of creative work.

In addition, the technical scheme of the invention adopts the target holes, so that the problem of abnormal quality caused by residual liquid medicine is avoided, the laser drilling and exposure are easy to identify, and the target holes can be matched with all common machines and have wide application range.

In the invention, the inner-layer daughter board refers to a core board or a multilayer board before first lamination and lamination; the outer daughter board is a laminated board after lamination and pressing; the outer layer plate refers to a laminated plate before an outer layer pattern is manufactured.

The invention has the beneficial effects that:

1. all outer daughter board alignment targets are from the inner daughter board, the same target is adopted for the graph and the laser drilling at the same level, the accuracy abnormity caused by the conversion of the alignment targets in the conventional high-density laminated circuit board manufacturing method is avoided, and the alignment accuracy is superior to that in the conventional method.

2. Two counterpoint snatching modes of drilling target hole counterpoint and ablation target counterpoint are used, and the outer layer daughter board is made by using MSAP or SAP process, so that the phenomenon that copper plating and electroplating nodules change the shape of the target hole and further influence the counterpoint accuracy is avoided. The target grabbing mode of directly grabbing the target for alignment by X-ray is additionally arranged, the target is always positioned inside the plate after lamination and lamination, the influence of a manufacturing process is avoided, and the alignment precision is higher.

3. Compared with the conventional manufacturing method of the high-density laminated circuit board, the different target grabbing modes reduce the processes of blind hole windowing and the like, wherein the target grabbing mode of directly grabbing the target for alignment by adding the X-ray further reduces the processes of drilling the target hole, laser ablation of the target and the like of the X-ray target shooter, and the manufacturing time and the manufacturing cost are reduced.

Drawings

Fig. 1 is a process flow chart of the method for processing a high-density build-up circuit board according to the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

A manufacturing method of a high-density laminated circuit board is characterized by comprising the following steps:

s1, setting a target on an inner-layer daughter board; the number of the targets is the same as the number of the lamination times, the number of the lamination times is N, the number of each group of targets is N, and the targets are respectively provided with numbers 1, 2,. N;

s2, shooting by a shooting machine; laminating and pressing the inner-layer daughter board to form an outer-layer daughter board, and forming a positioning hole by using a target shooting target of an X-ray target shooting machine;

s3, laser drilling; the copper surface of the outer-layer daughter board is browned by passing a brownification line, and laser drilling is carried out by adopting a direct copper drilling process; and S4, hole metallization and pattern transfer.

Further, in the step S2, the inner-layer sub-board is laminated and pressed for the first time to form a first outer-layer sub-board, and an X-ray target machine is used for shooting a target with the number of 1 to form a first alignment hole; and in the same way, the Nth lamination is pressed to form an Nth outer-layer daughter board, and an X-ray target machine is used for shooting a target with the number of N to form an Nth alignment hole.

Further, in the step S3, the brown oxidation line is moved to brown the copper surface of the first outer-layer daughter board, the direct copper drilling process is adopted to carry out laser drilling, the first aligning hole is used as the aligning hole, and the Nth aligning hole is used as the laser drilling aligning hole of the Nth outer-layer daughter board in the same way.

Furthermore, in step S3, a positioning hole is set at the position of the alignment hole for the laser drilling data to grab the hole for alignment during the operation of the machine.

Further, the diameter of the positioning and aligning hole is 3.2mm.

Further, in step S4, the outer sub-board and the hole metallization and patterning process of the outer sub-board are prepared by using a semi-additive process (MSAP).

Further, the semi-additive preparation method comprises the following steps: copper deposition, film pressing, exposure, development, electroplating, film stripping and copper stripping.

Furthermore, in the exposure process, the first alignment hole is used as the alignment hole in the exposure of the first outer layer daughter board pattern, and so on, and the nth alignment hole is used as the alignment hole in the exposure of the nth outer layer daughter board pattern.

Furthermore, except the pattern exposure of the inner layer sub-board, the corresponding areas of the target group areas of all other layers and the whole copper sets of the pattern data are copper-free areas.

Furthermore, on the figure data of all outer layers of daughter boards, the alignment hole position sets up the target hole for the use of figure exposure alignment.

Further, the diameter of the target hole is 3.2mm.

Example 2

A method for manufacturing a high-density build-up circuit board is characterized by comprising the following steps:

s1, arranging a target on an inner-layer daughter board; the number of the targets is the same as the number of the lamination times, the number of the lamination times is N, the number of each group of targets is N, and the targets are respectively provided with numbers 1, 2,. N;

s2, shooting by a shooting machine; laminating and pressing the inner-layer daughter board to form an outer-layer daughter board, and forming a positioning hole by using a target shooting target of an X-ray target shooting machine;

s3, laser drilling; the copper surface of the outer daughter board is browned by a brownification line, and laser drilling is carried out by adopting a direct copper drilling process; and S4, hole metallization and pattern transfer.

Further, in step S2, the inner daughter board is laminated and pressed for the first time to form a first outer daughter board, and a target with the number "1" is printed by using an X-ray target printing machine to form a first alignment hole; and in the same way, the Nth lamination is pressed to form an Nth outer-layer daughter board, and an X-ray target machine is used for shooting a target with the number of N to form an Nth alignment hole.

Further, in the step S3, the browning line is moved to brown the copper surface of the first outer-layer daughter board, laser drilling is carried out by adopting a direct copper drilling process, the first aligning hole is used as the aligning hole, and the Nth aligning hole is used as the laser drilling aligning hole of the Nth outer-layer daughter board in the same manner.

Furthermore, in step S3, a positioning hole is set at the position of the alignment hole for the laser drilling data to grab the hole for alignment during the operation of the machine.

Further, the diameter of the positioning and aligning hole is 2.5mm.

Further, in step S4, the outer daughter board and the hole metallization and patterning process of the outer layer are prepared by using a semi-additive method.

Further, the semi-additive preparation method comprises the following steps: copper deposition, film pressing, exposure, development, electroplating, film stripping and copper stripping.

Furthermore, in the exposure process, the first alignment hole is used as the alignment hole for exposing the first outer layer daughter board pattern, and so on, and the nth alignment hole is used as the alignment hole for exposing the nth outer layer daughter board pattern.

Furthermore, except the pattern exposure of the inner layer sub-board, the corresponding areas of the target group areas of all other layers and the whole copper sets of the pattern data are copper-free areas.

Furthermore, on the figure data of all outer layers of daughter boards, the alignment hole position sets up the target hole for the use of figure exposure alignment.

Further, the diameter of the target hole is 2.5mm.

Example 3

A manufacturing method of a high-density laminated circuit board is characterized by comprising the following steps:

s1, setting a target on an inner-layer daughter board; the number of the targets is the same as the number of the lamination times, the number of the lamination times is N, the number of each group of targets is N, and the targets are respectively provided with numbers 1, 2,. N;

s2, shooting by a shooting machine; laminating and laminating the inner-layer daughter boards to form an outer-layer daughter board, and forming a registration hole by using a target shooting target of an X-ray target shooting machine;

s3, laser drilling; the copper surface of the outer daughter board is browned by a brownification line, and laser drilling is carried out by adopting a direct copper drilling process; and S4, hole metallization and pattern transfer.

Further, in the step S2, the inner-layer sub-board is laminated and pressed for the first time to form a first outer-layer sub-board, and an X-ray target machine is used for shooting a target with the number of 1 to form a first alignment hole; and in the same way, the Nth lamination is pressed to form an Nth outer-layer daughter board, and an X-ray target machine is used for shooting a target with the number of N to form an Nth alignment hole.

Further, in the step S3, the browning line is moved to brown the copper surface of the first outer-layer daughter board, laser drilling is carried out by adopting a direct copper drilling process, the first aligning hole is used as the aligning hole, and the Nth aligning hole is used as the laser drilling aligning hole of the Nth outer-layer daughter board in the same manner.

Further, in step S3, a positioning alignment hole is set at the alignment hole position for the laser drilling data to grab the hole for alignment during the operation of the machine.

Further, the diameter of the positioning and aligning hole is 3.6mm.

Further, in step S4, the outer daughter board and the hole metallization and patterning process of the outer layer are prepared using an additive process (SAP).

Further, the additive preparation method comprises the following steps: copper deposition, film pressing, exposure, development, electroplating, film stripping and copper stripping.

Furthermore, in the exposure process, the first alignment hole is used as the alignment hole for exposing the first outer layer daughter board pattern, and so on, and the nth alignment hole is used as the alignment hole for exposing the nth outer layer daughter board pattern.

Furthermore, except the pattern exposure of the inner layer sub-board, the corresponding areas of the target group areas of all other layers and the whole copper sets of the pattern data are copper-free areas.

Furthermore, on the figure data of all outer layers of daughter boards, the alignment hole position sets up the target hole for the use of figure exposure alignment.

Further, the diameter of the target hole is 3.6mm.

Example 4

A manufacturing method of a high-density laminated circuit board is characterized by comprising the following steps:

the method comprises the following steps: manufacturing an inner layer daughter board and a graph target;

and a group of graphic targets are respectively arranged at four corners of the inner-layer sub-plate, and the diameter of each target is 3.2mm. The number of the targets is the same as the number of the lamination times, the number of the lamination times is N, the number of each group of targets is N, and the targets are respectively provided with numbers 1, 2 and. Taking ten plates as an example, if the lamination times are 4, 4 targets are set in each group, and the numbers on the targets are 1, 2, 3 and 4 respectively.

Step two: punching a target hole by an X-ray target shooting machine;

and drilling a target hole in the corresponding inner-layer daughter board target by using an X-ray target drilling machine, and grabbing the target hole as a contraposition point by using a laser drilling machine and a graph exposure machine. And the first outer daughter board after the first lamination and lamination adopts the inner daughter board target with the digital identifier of '1' as the alignment point, and the rest is done by analogy, and the Nth outer daughter board after the Nth lamination and lamination selects the inner daughter board target with the digital identifier of 'N' as the alignment point.

Step three: brown copper surface;

and after the target hole is drilled, the plate is led to the brown copper surface by the brown wire so as to facilitate the laser drilling machine to puncture the surface copper layer.

Step four: laser drilling;

and D, performing laser drilling by adopting a direct copper drilling process, and taking the target hole generated in the step two as a counterpoint point. A hole with the diameter of 3.2mm is arranged at the position of the corresponding inner daughter board alignment target by laser drilling data, so that the alignment point can be conveniently grabbed during the operation of the machine table.

Step five: hole metallization and pattern transfer;

(1) preferentially adopting MSAP or SAP process flow to manufacture;

(2) the pattern exposure method comprises the following steps:

and the pattern exposure takes the target hole generated in the second step as a contraposition point. And in the areas of the target groups of the inner daughter boards corresponding to all the outer daughter boards, all the pattern data are equal to the large set of copper to form copper-free areas. Meanwhile, a circular graphic target with the diameter of 3.2mm is set at the corresponding position of the alignment target of the inner daughter board, so that the alignment point can be conveniently grabbed during the operation of the machine.

Example 5

A method for manufacturing a high-density build-up circuit board is characterized by comprising the following steps:

the method comprises the following steps: manufacturing an inner layer daughter board and a graph target;

four corners of the inner subplate are respectively provided with a group of graphic targets, and the diameter of each target is 3.2mm. The number of the targets is the same as the number of the lamination times, the number of the lamination times is N, the number of each group of targets is N, and the targets are respectively provided with numbers 1, 2 and. Taking ten plates as an example, if the lamination times are 4, 4 targets are set in each group, and the numbers on the targets are 1, 2, 3 and 4 respectively.

Step two: punching a common target hole by an X-ray target shooting machine;

and punching a common target hole by using an X-ray target shooting machine so as to carry out alignment when a laser ablation target is carried out. The common target hole is a positioning hole milled after pressing, and no special description is given here.

Step three: brown copper surface;

and after the target hole is drilled, the plate is led to the brown copper surface by the brown oxidation line, so that the laser drilling machine can conveniently puncture the surface copper layer.

Step four: ablating out the target;

and (3) performing laser ablation by using a laser drilling machine and adopting a direct copper beating process to ablate surface copper and the dielectric layer and expose the target with the digital identification of the inner layer sub-plate, and grabbing the target hole as a docking point by using the laser drilling machine and the image exposure machine. And the first outer daughter board after the first lamination and lamination adopts the inner daughter board target with the digital identifier of '1' as the alignment point, and the rest is done by analogy, and the Nth outer daughter board after the Nth lamination and lamination selects the inner daughter board target with the digital identifier of 'N' as the alignment point.

Step five: laser drilling;

and D, performing laser drilling by adopting a direct copper drilling process, and taking the target hole generated in the step four as a contraposition point. A hole with the diameter of 3.2mm is arranged at the position of the corresponding inner daughter board alignment target by laser drilling data, so that the alignment point can be conveniently grabbed during the operation of the machine table.

Step six: hole metallization and pattern transfer

(1) Preferentially adopting MSAP or SAP process flow to manufacture;

(2) the pattern exposure method comprises the following steps:

and (4) pattern exposure taking the target hole generated in the fourth step as a contraposition point. And in the areas of the target groups of the inner daughter boards corresponding to all the outer daughter boards, all the pattern data are equal to the large set of copper to form copper-free areas. Meanwhile, a circular graphic target with the diameter of 3.2mm is set at the corresponding position of the alignment target of the inner daughter board, so that the alignment point can be conveniently grabbed during the operation of the machine.

Example 6

A manufacturing method of a high-density laminated circuit board is characterized by comprising the following steps:

the method comprises the following steps: manufacturing an inner layer daughter board and a graph target;

and a group of graphic targets are respectively arranged at four corners of the inner-layer sub-plate, and the diameter of each target is 3.2mm. The number of the targets is the same as the number of the lamination times, the number of the lamination times is N, the number of each group of targets is N, and the targets are respectively provided with numbers 1, 2 and. Taking ten-layer plates as an example, the number of lamination is 4, and each group is provided with 4 targets, and the numbers on the targets are 1, 2, 3 and 4 respectively.

Step two: brown copper surface;

and after the target hole is drilled, the plate is led to the brown copper surface by the brown oxidation line, so that the laser drilling machine can conveniently puncture the surface copper layer.

Step three: laser drilling;

and (4) performing laser drilling by adopting a direct copper drilling process. The X-ray equipment is additionally arranged on a laser drilling machine, the positions of four corner targets of the inner-layer daughter board can be read to serve as positioning points, the inner-layer daughter board target with the number mark of 1 is adopted as a positioning point for the first-time laminated and pressed outer-layer daughter board, the process is repeated, and the inner-layer daughter board target with the number mark of N is selected as a positioning point for the Nth-time laminated and pressed outer-layer daughter board. A hole with the diameter of 3.2mm is arranged at the position of the corresponding inner daughter board alignment target by laser drilling data, so that the alignment point can be conveniently grabbed during the operation of the machine table.

Step four: hole metallization and pattern transfer;

(1) the process flow of the subtractive method and the process flow of the MSAP or SAP can be made.

(2) The pattern exposure method comprises the following steps:

the X-ray equipment is additionally arranged on the graph exposure machine, the positions of four corner targets of the inner-layer daughter board can be read to serve as positioning points, the inner-layer daughter board target with the number mark of '1' is adopted as a positioning point for the first-time laminated and pressed outer-layer daughter board, and the rest is repeated, and the inner-layer daughter board target with the number mark of 'N' is selected as a positioning point for the Nth-time laminated and pressed outer-layer daughter board. Meanwhile, a circular graphic target with the diameter of 3.2mm is set at the corresponding position of the alignment target of the inner daughter board, so that the alignment point can be conveniently grabbed during the operation of the machine.

Example 7

A processing method of a high-density laminated circuit board is characterized by comprising the following steps:

A. manufacturing an inner-layer sub-board; the method specifically comprises the following steps: cutting a core board, conventionally manufacturing a multilayer board, drilling and embedding holes and tool holes by a machine, metallizing the holes, drawing an inner-layer daughter board and arranging a target;

B. manufacturing an outer-layer sub-board; the method according to any one of embodiments 1 to 3;

C. and (5) making an outer layer graph through a post-process.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein

Within the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art.

Claims (10)

1. A manufacturing method of a high-density laminated circuit board is characterized by comprising the following steps:

s1, arranging a target on an inner-layer daughter board; the number of the targets is the same as the number of lamination times, the number of the lamination times is N, the number of each group of targets is N, and the targets are respectively provided with numbers 1, 2,. N;

s2, manufacturing an alignment target; the alignment target can be manufactured in three ways: 1, shooting an inner-layer daughter board target by an X-ray shooting machine to form a target hole as an alignment target; 2. performing laser ablation to obtain an inner-layer daughter board target as an alignment target; 3. installing an X-ray on a laser drilling machine and a graph exposure machine, and identifying an inner layer daughter board target as an alignment target;

s3, laser drilling; the copper surface of the outer-layer daughter board is browned by passing a brownification line, and laser drilling is carried out by adopting a direct copper drilling process; and S4, hole metallization and pattern transfer.

2. The method of claim 1, wherein the step of forming the multilayer printed circuit board includes the step of forming a multilayer printed circuit board,

in the step S2, the inner layer daughter board is laminated and pressed for the first time to form a first outer layer daughter board, and a target with the number of 1 of the inner layer daughter board is manufactured to form a first alignment target; and repeating the steps, laminating and pressing for the Nth time to form an Nth outer daughter board, and manufacturing a target with the number of the N-th inner daughter board to form an Nth alignment target.

3. The method of claim 1, wherein in step S3, the browning line is taken to brown the copper surface of the first outer daughter board, a direct copper drilling process is adopted to perform laser drilling, the first alignment target is used as the alignment target, and similarly, the nth alignment target is used as the alignment hole of the laser drilling of the nth outer daughter board.

4. The method as claimed in claim 3, wherein in step S3, the laser drilling data sets a positioning hole at the target position for grabbing holes for alignment.

5. The method of claim 4, wherein the positioning holes have a diameter of 2-4mm.

6. The method according to claim 1, wherein in step S4, the outer daughter board and the outer hole metallization and patterning process using alignment target fabrication methods 1 and 2 are preferably prepared by a semi-additive method or an additive method, and the outer daughter board and the outer hole metallization and patterning process using alignment target fabrication method 3 are not limited;

the semi-addition method or the addition method comprises the following steps: copper deposition, film pressing, exposure, development, electroplating, film stripping and copper stripping.

7. The method for manufacturing a high-density build-up circuit board according to claim 6, wherein in the exposure process, the first outer layer daughter board pattern exposure uses the first alignment target as an alignment target, and so on, and the Nth outer layer daughter board pattern exposure uses the Nth alignment target as an alignment target.

8. The method of claim 7, wherein except for the pattern exposure of the inner daughter board, the pattern data of all the regions corresponding to the target group of all the layers are all equivalent to the copper-free region.

9. The method for manufacturing a high-density build-up circuit board according to claim 8, wherein targets are set for alignment target positions on the pattern data of all the outer daughter boards for pattern exposure alignment; the diameter of the target is 2-4mm.

10. A processing method of a high-density laminated circuit board is characterized by comprising the following steps:

A. manufacturing an inner-layer sub-board; the method specifically comprises the following steps: cutting a core plate/conventionally manufacturing a multilayer plate, drilling and burying holes and tool holes by a machine, metallizing the holes, patterning an inner-layer daughter board and arranging a target;

B. manufacturing an outer layer daughter board; comprising the method of manufacture of any one of claims 1-9;

C. and manufacturing an outer layer pattern later process.

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