CN115707731A - 可发泡交联的热塑性材料、连接器及其制备方法 - Google Patents
可发泡交联的热塑性材料、连接器及其制备方法 Download PDFInfo
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- CN115707731A CN115707731A CN202110949256.7A CN202110949256A CN115707731A CN 115707731 A CN115707731 A CN 115707731A CN 202110949256 A CN202110949256 A CN 202110949256A CN 115707731 A CN115707731 A CN 115707731A
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- thermoplastic material
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- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
公开了可发泡交联的热塑性材料、连接器及其制备方法。可发泡交联的热塑性材料包含:基体聚合物;交联剂;和发泡剂,其中基体聚合物为聚乙烯(PE)、乙烯‑乙酸乙烯共聚物(EVA)和聚丙烯(PP)中的任一种或两种以上的混合物;交联剂与基体聚合物的重量比为1‑5:100;且发泡剂与基体聚合物的重量比为1‑5:100,所述热塑性材料的交联发泡温度等于或高于所述基体聚合物的熔点。本发明的热塑性材料可以在预成型后原位交联并发泡。
Description
技术领域
本公开涉及电子器件技术领域,尤其涉及用于连接器产品的密封材料及其应用。
背景技术
连接器产品通常包括端子和塑料壳体。塑料壳体起支撑,绝缘,密封等作用。连接器产品在使用时要面对严苛的环境,而产品的密封性能决定了在严苛环境下对产品的保护能力。越来越严苛的密封要求对产品的密封结构提出了更高的挑战。
目前连接器产品中的密封常用密封圈,灌胶,嵌件注塑等方案。但是,随着连接器产品的结构越来越复杂,对产品的密封要求越来越高,常规的密封圈、嵌件注塑等难以满足这样的需求,而灌胶工艺相对复杂,操作不方便。因此,需要一种密封性更强、工艺较简单的密封方案。
发明内容
本公开主要针对使用密封圈的密封连接或灌胶不方便的连接器的密封问题,提出了一种可原位发泡和交联的密封材料,由该密封材料制成的预制件(预成型件)或粘结层可以在高温处理时发泡和交联,达到更好的粘结和密封效果。
本公开的一个方面涉及一种可发泡交联的热塑性材料,所述热塑性材料包含:基体聚合物;交联剂;和发泡剂,其中所述基体聚合物为聚乙烯(PE)、乙烯-乙酸乙烯共聚物(EVA)和聚丙烯(PP)中的任一种或两种以上的混合物;所述交联剂与所述基体聚合物的重量比为1-5:100;所述发泡剂与所述基体聚合物的重量比为1-5:100,且所述可发泡交联材料的交联发泡温度(即发生交联并发泡时的温度)等于或高于所述基体聚合物的熔点。
本发明的热塑性材料可在预成型后原位交联并发泡。
在某些实施方案中,基体聚合物为PE和EVA的混合物,两者的混合比例以重量计为1:9至9:1。
在某些实施方案中,PE选自低密度聚乙烯(LDPE)或超低密度聚乙烯(ULDPE)。
在某些实施方案中,交联剂选自交联剂选自过氧化物交联剂(自由基引发剂)和烯丙基交联剂。
在某些实施方案中,交联剂选自过氧化二异丙苯(Di-cumyl peroxide,DCP)和三烯丙基异氰脲酸酯(Tri-allyl isocyanurate,TAIC)。
在某些实施方案中,发泡剂选自化学发泡剂。
在某些实施方案中,发泡剂为无机发泡剂或有机发泡剂,所述无机发泡剂包括碳酸氢钠,所述有机发泡剂包括:偶氮化合物、氨基脲类化合物、亚硝基化合物。
在某些实施方案中,热塑性材料的交联发泡温度为170℃以上。
本公开的热塑性材料的交联温度和发泡温度可以不同,以两者中高的一方作为交联发泡温度,例如,交联温度可以为170℃,发泡温度可以为160℃,则热塑性材料的交联发泡温度为170℃。优选交联温度和发泡温度尽可能接近。
在某些实施方案中,基体聚合物的熔点在150℃以下。
在某些实施方案中,热塑性材料为通过将各组分在低于交联发泡温度的温度下共混造粒形成的颗粒形式。
在某些实施方案中,热塑性材料为将该材料在低于交联发泡温度的温度下注塑或挤出而成的预制件形式。
在某些实施方案中,预制件为密封圈、密封管或密封片的形式。
本公开的另一方面涉及一种连接器,所述连接器包括壳体和位于壳体内的需要密封的区域,所述区域中填充有上述的热塑性材料或其原位交联并发泡产物。
在某些实施方案中,连接器的需要密封的区域为结构复杂的规则或不规则区域。
本公开的再一方面涉及一种制备连接器的方法,包括:在连接器的组装过程中,将上述的热塑性材料置于连接器的需要密封的区域内;在组装完成后,进行加热处理,使所述热塑性材料熔融,然后发泡、交联,以填充密封区域的空隙。
在某些实施方案中,所述加热处理的温度超过170℃(例如180℃-240℃)。
本公开还涉及另一种制备连接器的方法,包括:
将上述的热塑性材料注塑在端子表面上,形成一层粘结层;
将形成有粘结层的端子置于模具中,进行连接器塑料壳体材料的注塑,同时使所述粘结层发泡并交联,
任选地,在注塑后进行后-热处理,使粘结层进一步交联、发泡。
在某些实施方案中,所述热塑性材料的注塑为在不超过150℃下的嵌件注塑。
在某些实施方案中,所述塑料壳体材料选自聚对苯二甲酸丁二醇酯(PBT)、尼龙6(PA6)尼龙66(PA66)和热塑性聚氨酯(TPU)。
本公开提出了一种可原位发泡和交联的热塑性密封材料,该材料可以预制件或粘结层形式应用于需要密封的部位,再经高温处理,发泡充满密封粘结部位空间,同时交联使结构固定,这样可以达到更强的粘结和密封。
附图说明
图1为本公开实施例1中可发泡交联的热塑性材料在共混造粒前后的照片;
图2显示了本公开实施例1的可发泡交联的热塑性材料在填充连接器的空隙后发泡交联的情况。
具体实施方式
下面对本公开的一些具体实施方式进行描述。
应当理解,在不脱离本公开的范围或精神的情况下,本领域技术人员能够根据本公开的教导设想其他各种实施方案并能够对其进行修改。因此,以下的具体实施方式不具有限制性意义。
除非另外指明,否则说明书和权利要求中使用的表示特征尺寸、数量和物理特性的所有数字均应该理解为在所有情况下均是由术语“约”来修饰的。因此,除非有相反的说明,否则说明书和所附权利要求书中列出的数值参数均是近似值,本领域的技术人员能够利用本文所公开的教导内容寻求获得的所需特性,适当改变这些近似值。用端点表示的数值范围的使用包括该范围内的所有数字以及该范围内的任何范围,例如,1至5包括1、1.1、1.3、1.5、2、2.5、2.75、3、3.5、3.80、4和5等等。
1.可发泡交联材料及其制备方法
以下描述本公开的可发泡交联的热塑性材料的各个组成成分。
(1)基体聚合物
本公开中,可发泡交联的热塑性材料的基体聚合物选自熔点较低的可发泡材料。通常,基体聚合物的熔点低于发泡和交联温度,以便能够在不发泡和交联的情况下进行预成型。例如,基体聚合物的熔点可以为170℃以下,160℃以下,150℃以下,140℃以下,130℃以下,或者120℃以下。
低熔点的基体聚合物可以选自聚乙烯(PE)、乙烯-乙酸乙烯共聚物(EVA)和聚丙烯(PP)中的任一种或两种以上的混合物。其中,PE可以是低密度聚乙烯(LDPE)或超低密度聚乙烯(ULDPE)。
在某些实施方式中,可以采用两者材料的混合物作为基体聚合物。两者材料中至少一种、优选两种都是低熔点材料。例如,可以采用PE和EVA的混合物作为基体聚合物,两者的混合比例(重量比例)可以为1:9至9:1。
(2)交联剂
本公开中,选用交联温度等于或高于基体聚合物熔点的交联剂。交联剂的种类可以根据基体聚合物而选择,其可以是自由基引发剂类型、烯键式交联剂类型等。对于PE、EVA、PP等基体聚合物,可以选择过氧化物交联剂和烯丙基交联剂,例如过氧化二异丙苯(Di-cumyl peroxide,DCP)和三烯丙基异氰脲酸酯(Tri-allyl isocyanurate,TAIC)。
交联剂与基体聚合物的比例可以适当选择,例如重量比为1-5:100,或者2-4:100。
(3)发泡剂
本公开中,发泡剂是使基体聚合物发泡,例如在熔融状态下发泡的化合物。为了便于基体聚合物在不发泡的情况下预成型等,发泡剂的发泡温度一般高于基体聚合物的熔点。
本公开的发泡剂可以是化学发泡剂,其在高温下分解产生气体,并在聚合物组分中形成细孔。分解温度较高的化学发泡剂是适宜的,例如,可以选择碳酸氢钠发泡剂或偶氮类发泡剂(例如偶氮甲酰胺)、氨基脲类发泡剂、亚硝基化合物等。可以根据所用的基体聚合物适当选择发泡剂的具体种类,以获得在170℃以上、180℃以上或190℃以上发泡的材料。
发泡剂与基体聚合物的比例可以适当选择,从达到充分发泡且不显著影响基体聚合物的预成型的目的来看,发泡剂与基体聚合物的重量比可以为1-5:100,或者2-4:100。
(4)可发泡交联的热塑性材料的制备方法
本公开的可发泡交联的热塑性材料可以通过将各个组分彼此混合而得。为了使各组分混合均匀且便于运输、储存,可以将可发泡交联材料制成颗粒形式,即通过将各组分共混造粒而形成颗粒。
共混造粒在低于热塑性材料的交联发泡温度下进行,例如在120-130℃进行。
2.预制件及其制备方法
本公开的可发泡交联的热塑性材料的一个显著优点在于:可以根据其具体应用预成型为所需形状,此时交联剂和发泡剂都不反应,然后,在填充或适配特定应用部位/区域后,经高温处理,进行发泡交联,从而既提高密封填充性,又提高粘结性。
因此,本公开的可发泡交联的热塑性材料可以预成型以形成预制件。例如,通过将热塑性材料注塑或挤出,形成特定形状的预制件,其中交联剂和发泡剂处于非活性状态(即,热塑性材料未发生可观察到的发泡交联)。
根据具体应用,预制件可以具有各种形状。例如,对于用于连接器产品的密封件,预制件可以为密封圈、密封管或密封片的形式。
3、连接器及其制备方法
本公开还涉及可发泡交联的热塑性材料以及预制件的应用,尤其是在连接器密封中的应用。因此,本公开还提供一种连接器,所述连接器包括需要密封的区域/空隙,所述区域/空隙被本公开的可发泡交联的热塑性材料或其原位交联并发泡产物填充。
即,本公开的连接器包括端子和塑料壳体,以及用于密封的密封件,其中所述密封件由本公开的可发泡交联的热塑性材料或预制件经原位交联并发泡而形成。
作为制备本公开的连接器的方法,可以采取以下两种方案之一。
方案一:在连接器的组装过程中,将本公开的可发泡交联的热塑性材料或预制件置于连接器的需要密封的区域内;在组装完成后,进行加热处理,使所述热塑性材料或预制件熔融,然后交联并发泡,以填充密封区域的空隙。
上述实施方案中,加热处理的温度可以超过170℃(例如180℃-240℃),时间可以为1-10分钟。
方案二包括:将本公开的可发泡交联的热塑性材料(例如颗粒形状)注塑在端子表面上,形成一层粘结层;将形成有粘结层的端子置于模具中,进行连接器塑料壳体材料的注塑,同时使所述粘结层发泡并交联,任选地,在注塑后进行后-热处理,使粘结层进一步交联、发泡。
在上述实施方案中,热塑性材料的注塑可以为在不超过150℃下的嵌件注塑。
在二次注塑形成连接器塑料壳体时,可以适当选择塑料壳体材料,例如聚对苯二甲酸丁二醇酯(PBT)、尼龙6(PA6)尼龙66(PA66)和热塑性聚氨酯(TPU)等,以使二次注塑温度与热塑性材料或预制件的交联发泡温度相匹配,通常高于交联发泡温度。例如对于PBT,二次注塑温度为260℃,对于PA66,二次注塑温度为275℃。
根据上述具体实施方案,本公开的可发泡交联的热塑性材料或其预制件和连接器可以具有以下优点中的至少一项:
(1)由于粘结材料配方中既含有发泡剂,又含有交联剂,能够在高温时发泡填充金属端子与塑料壳体之间的缝隙,又可发生交联使发泡保持,提高粘结材料与密封面的粘结力;
(2)本公开中的材料,可以预成型为密封圈,密封管等。相比现有的常规密封圈没有粘结力方案,本方案仅需一个高温处理可以同时实现密封填缝和增加粘结力,使密封更牢靠;
(3)本公开的材料和方案可通过低压注塑实现在端子和壳体之间形成一层密封和粘结层。通过塑料壳体注塑时的高温就可实现发泡和交联,提高嵌件注塑产品的密封性。本公开的材料应用工艺简单;
(4)本公开的材料在温度170℃以上会发生发泡和交联反应,因此适用于工程塑料,如PBT,PA6,PA66等材料的注塑。
实施例
以下通过实施例更详细地描述本公开,这些实施例仅是示例性的,而不应理解为对本公开范围的限制。
实施例1–可发泡交联材料的制备
将LDPE及EVA按1:1重量比例混合形成基体聚合物,添加交联剂DCP和发泡剂(20%的NaHCO3与LDPE组成的母粒),交联剂和发泡剂与基体聚合物的重量比分别为2:100和3:100。采用挤出机,将上述混合物在120-130℃下进行共混造粒。图1示出了共混造粒前后的可发泡交联材料的照片。
实施例2–模拟应用实例
取图2所示的连接器端子,在其空隙中填充实施例1获得的可发泡交联材料的颗粒(未填满),然后加热至200℃,如图2右侧所示,可发泡交联材料经历发泡交联,完全填满连接器端子的空隙,甚至膨胀出该空隙。由该图上侧的局部放大图可以看出,在初始填充状态,可发泡交联材料仍处于颗粒状态,未发泡交联(左上图),而高温加热后,发生发泡交联。这样,可以达到更强的粘结和密封。
应当理解,上述具体实施方案仅是为了说明本公开,而非限制本公开的范围。本领域技术人员可以在不脱离本公开的精神的前提下进行各种修改和变更。本公开的范围由后附的具体实施方式书限定。
Claims (20)
1.一种可发泡交联的热塑性材料,所述热塑性材料包含:
基体聚合物;
交联剂;和
发泡剂,
其中,
所述基体聚合物为聚乙烯(PE)、乙烯-乙酸乙烯共聚物(EVA)和聚丙烯(PP)中的任一种或两种以上的混合物;
所述交联剂与所述基体聚合物的重量比为1-5:100;
所述发泡剂与所述基体聚合物的重量比为1-5:100;且
所述热塑性材料的交联发泡温度等于或高于所述基体聚合物的熔点。
2.根据权利要求1所述的热塑性材料,其中,所述基体聚合物为PE和EVA的混合物,两者的混合比例以重量计为1:9至9:1。
3.根据权利要求1所述的热塑性材料,其中,所述PE选自低密度聚乙烯(LDPE)或超低密度聚乙烯(ULDPE)。
4.根据权利要求1所述的热塑性材料,其中,所述交联剂选自过氧化物交联剂和烯丙基交联剂。
5.根据权利要求4所述的热塑性材料,其中,所述交联剂选自过氧化二异丙苯(Di-cumyl peroxide,DCP)和三烯丙基异氰脲酸酯(Tri-allyl isocyanurate,TAIC)。
6.根据权利要求1所述的热塑性材料,其中,所述发泡剂为化学发泡剂。
7.根据权利要求6所述的热塑性材料,其中,所述发泡剂为无机发泡剂或有机发泡剂,所述无机发泡剂包括碳酸氢钠,所述有机发泡剂包括:偶氮化合物、氨基脲类化合物、亚硝基化合物。
8.根据权利要求1所述的热塑性材料,其中,所述热塑性材料的交联发泡温度为170℃以上。
9.根据权利要求1所述的热塑性材料,其中,所述热塑性材料为颗粒形式。
10.根据权利要求9所述的热塑性材料,其中所述颗粒通过将各组分在低于交联发泡温度的温度下共混造粒形成。
11.根据权利要求1所述的热塑性材料,其中,所述热塑性材料为预制件形式。
12.根据权利要求11所述的热塑性材料,其中,所述预制件为密封圈、密封管或密封片的形式。
13.根据权利要求11所述的热塑性材料,其中所述预制件由所述可发泡交联材料在低于交联发泡温度的温度下注塑或挤出而成。
14.一种连接器,所述连接器包括壳体和位于壳体内的需要密封的区域,所述区域中填充有根据权利要求1-13中任一项所述的热塑性材料或其原位交联并发泡的产物。
15.根据权利要求14所述的连接器,其中所述需要密封的区域为结构复杂的规则或不规则区域。
16.一种制备连接器的方法,包括:
在连接器的组装过程中,将根据权利要求1-13中任一项所述的热塑性材料置于连接器的需要密封的区域内;
在组装完成后,进行加热处理,使所述热塑性材料熔融,然后交联并发泡,以填充密封区域的空隙。
17.根据权利要求16所述的方法,其中所述加热处理的温度超过170℃。
18.一种制备连接器的方法,包括:
将根据权利要求1-10中任一项所述的热塑性材料注塑在端子表面上,形成一层粘结层;
将形成有粘结层的端子置于模具中,进行连接器塑料壳体材料的注塑,同时使所述粘结层发泡并交联,
任选地,在注塑后进行后-热处理,使粘结层进一步交联、发泡。
19.根据权利要求18所述的方法,其中所述热塑性材料的注塑为在不超过150℃下的嵌件注塑。
20.根据权利要求18所述的方法,其中所述塑料壳体材料选自聚对苯二甲酸丁二醇酯(PBT)、尼龙6(PA6)尼龙66(PA66)和热塑性聚氨酯(TPU)。
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