CN115669272A - 显示基板、显示面板和显示装置 - Google Patents
显示基板、显示面板和显示装置 Download PDFInfo
- Publication number
- CN115669272A CN115669272A CN202080003427.0A CN202080003427A CN115669272A CN 115669272 A CN115669272 A CN 115669272A CN 202080003427 A CN202080003427 A CN 202080003427A CN 115669272 A CN115669272 A CN 115669272A
- Authority
- CN
- China
- Prior art keywords
- layer
- electrode
- insulating layer
- substrate
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 278
- 239000010410 layer Substances 0.000 claims description 564
- 239000000463 material Substances 0.000 claims description 51
- 229920000642 polymer Polymers 0.000 claims description 45
- 238000005538 encapsulation Methods 0.000 claims description 41
- 239000011241 protective layer Substances 0.000 claims description 27
- 239000011147 inorganic material Substances 0.000 claims description 22
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 claims description 20
- 229910010272 inorganic material Inorganic materials 0.000 claims description 20
- 239000011368 organic material Substances 0.000 claims description 20
- -1 acryl Chemical group 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 11
- 229910004205 SiNX Inorganic materials 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 8
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 6
- 239000002346 layers by function Substances 0.000 claims description 6
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 claims description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 150000001408 amides Chemical class 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 5
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 5
- 229920002223 polystyrene Polymers 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 230000001154 acute effect Effects 0.000 claims description 4
- 239000002041 carbon nanotube Substances 0.000 claims description 4
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920000193 polymethacrylate Polymers 0.000 claims description 3
- 238000000034 method Methods 0.000 description 63
- 239000011521 glass Substances 0.000 description 30
- 238000004519 manufacturing process Methods 0.000 description 19
- 238000010586 diagram Methods 0.000 description 18
- 238000000151 deposition Methods 0.000 description 13
- 238000005530 etching Methods 0.000 description 13
- 230000008021 deposition Effects 0.000 description 12
- 238000000059 patterning Methods 0.000 description 12
- 238000001312 dry etching Methods 0.000 description 11
- 239000011229 interlayer Substances 0.000 description 11
- 238000011161 development Methods 0.000 description 9
- 125000006850 spacer group Chemical group 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 230000009194 climbing Effects 0.000 description 8
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 150000008378 aryl ethers Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
本公开实施例提供一种显示基板，包括基底，设置于所述基底上的显示单元、连接单元和镂空单元，所述显示单元、所述连接单元和所述镂空单元彼此邻接；所述显示单元包括第一绝缘部和导电部；所述连接单元包括第二绝缘部和导电连接部，所述第二绝缘部设置于所述导电连接部的背离所述基底的一侧；所述导电连接部与所述基底相接触，所述导电连接部由所述基底上的所述连接单元所在区域延伸至所述显示单元所在区域，并通过开设在所述第一绝缘部中的过孔与所述导电部电连接；所述第二绝缘部的可拉伸性能优于所述第一绝缘部。
Description
PCT国内申请，说明书已公开。
Claims (23)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/137560 WO2022126585A1 (zh) | 2020-12-18 | 2020-12-18 | 显示基板、显示面板和显示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115669272A true CN115669272A (zh) | 2023-01-31 |
Family
ID=82059924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080003427.0A Pending CN115669272A (zh) | 2020-12-18 | 2020-12-18 | 显示基板、显示面板和显示装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20230363202A1 (zh) |
| CN (1) | CN115669272A (zh) |
| WO (1) | WO2022126585A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115207247B (zh) * | 2022-07-15 | 2024-01-19 | 武汉华星光电半导体显示技术有限公司 | 显示面板以及显示装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102631257B1 (ko) * | 2016-11-18 | 2024-01-31 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| KR102664207B1 (ko) * | 2018-10-08 | 2024-05-07 | 엘지디스플레이 주식회사 | 스트레쳐블 표시 장치 및 그 제조 방법 |
| CN109686758A (zh) * | 2018-12-04 | 2019-04-26 | 武汉华星光电半导体显示技术有限公司 | 一种柔性显示面板及其制备方法 |
| CN110416266B (zh) * | 2019-07-29 | 2022-07-22 | 京东方科技集团股份有限公司 | 显示基板及包含其的显示面板 |
-
2020
- 2020-12-18 US US17/613,998 patent/US20230363202A1/en active Pending
- 2020-12-18 CN CN202080003427.0A patent/CN115669272A/zh active Pending
- 2020-12-18 WO PCT/CN2020/137560 patent/WO2022126585A1/zh active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| US20230363202A1 (en) | 2023-11-09 |
| WO2022126585A1 (zh) | 2022-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110416434B (zh) | 显示基板及其制备方法、显示装置 | |
| KR102480110B1 (ko) | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 | |
| US11372451B2 (en) | Display substrate, display device and method of forming display substrate | |
| TWI716948B (zh) | 可拉伸顯示面板和包含其之可拉伸顯示裝置 | |
| US10514137B2 (en) | Joining structure of light emitting units | |
| CN107221550B (zh) | 显示装置 | |
| CN110494985B (zh) | 可拉伸显示面板、可拉伸显示设备和制造可拉伸显示面板的方法 | |
| CN110504386B (zh) | 一种显示基板及其制备方法、显示装置 | |
| US20220271258A1 (en) | Display substrate, display apparatus, and method of fabricating display substrate | |
| CN113838994B (zh) | 显示面板、柔性显示屏和电子设备及显示面板的制备方法 | |
| CN111710691B (zh) | 柔性Micro-LED显示面板及其制作方法 | |
| CN110112175A (zh) | 显示设备及其制造方法 | |
| KR20150005264A (ko) | 유기 발광 표시 장치 및 그 제조 방법 | |
| CN102496683A (zh) | 可挠式有机发光装置及其制作方法 | |
| CN110504294A (zh) | 显示装置、可拉伸显示面板及其制造方法 | |
| CN113724590A (zh) | 可拉伸显示面板 | |
| KR20190118221A (ko) | 유기 발광 표시 장치 | |
| CN115669272A (zh) | 显示基板、显示面板和显示装置 | |
| CN111933671B (zh) | 一种显示基板及其制作方法、显示面板 | |
| CN112885975A (zh) | 显示基板及其制备方法以及显示装置 | |
| KR20140109153A (ko) | 유기전계 발광 표시 장치 및 이의 제조 방법 | |
| CN217767406U (zh) | 显示面板和电子设备 | |
| CN113745247A (zh) | 显示面板 | |
| CN112103319A (zh) | 显示面板、显示装置及显示面板的制造方法 | |
| CN112310327A (zh) | 显示面板和显示装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |