CN115668669A - 光波导封装件以及发光装置 - Google Patents

光波导封装件以及发光装置 Download PDF

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Publication number
CN115668669A
CN115668669A CN202180036723.5A CN202180036723A CN115668669A CN 115668669 A CN115668669 A CN 115668669A CN 202180036723 A CN202180036723 A CN 202180036723A CN 115668669 A CN115668669 A CN 115668669A
Authority
CN
China
Prior art keywords
metal body
region
optical waveguide
waveguide package
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180036723.5A
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English (en)
Chinese (zh)
Inventor
板仓祥哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN115668669A publication Critical patent/CN115668669A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/125—Bends, branchings or intersections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133—Functions
    • G02B2006/1215—Splitter
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)
CN202180036723.5A 2020-05-29 2021-05-18 光波导封装件以及发光装置 Pending CN115668669A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020094753 2020-05-29
JP2020-094753 2020-05-29
PCT/JP2021/018825 WO2021241332A1 (ja) 2020-05-29 2021-05-18 光導波路パッケージおよび発光装置

Publications (1)

Publication Number Publication Date
CN115668669A true CN115668669A (zh) 2023-01-31

Family

ID=78744541

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180036723.5A Pending CN115668669A (zh) 2020-05-29 2021-05-18 光波导封装件以及发光装置

Country Status (5)

Country Link
US (1) US20230213699A1 (https=)
EP (1) EP4160705A4 (https=)
JP (1) JP7431958B2 (https=)
CN (1) CN115668669A (https=)
WO (1) WO2021241332A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117369059A (zh) * 2022-06-30 2024-01-09 成都旭创科技有限公司 用于光通讯的光器件和光模块
DE102024110364A1 (de) * 2024-04-12 2025-10-16 Ams-Osram International Gmbh Optoelektronische anordnung und verfahren zum formen eines von einer halbleiterlaservorrichtung einer optoelektronischen anordnung emittierten laserlichts

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101351733A (zh) * 2005-12-28 2009-01-21 欧姆龙株式会社 光模块
CN102683510A (zh) * 2011-03-09 2012-09-19 精工爱普生株式会社 发光装置以及投影仪
CN103250240A (zh) * 2011-05-31 2013-08-14 京瓷株式会社 元件收纳用封装、半导体装置用部件以及半导体装置
US20160313517A1 (en) * 2015-04-21 2016-10-27 Shinko Electric Industries Co., Ltd. Optical waveguide device and method of manufacturing the same
CN108140689A (zh) * 2015-12-10 2018-06-08 京瓷株式会社 传感器用基板以及传感器装置

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
US5521992A (en) * 1994-08-01 1996-05-28 Motorola, Inc. Molded optical interconnect
JPH0961651A (ja) * 1995-06-14 1997-03-07 Nippon Telegr & Teleph Corp <Ntt> ハイブリッド光集積回路
JPH10308555A (ja) * 1997-05-01 1998-11-17 Nippon Telegr & Teleph Corp <Ntt> ハイブリッド導波形光回路とその製造方法
JP3728147B2 (ja) * 1999-07-16 2005-12-21 キヤノン株式会社 光電気混載配線基板
US6789956B2 (en) * 2001-12-19 2004-09-14 Matsushita Electric Industrial Co., Ltd. Optical module
JP4579868B2 (ja) * 2006-06-08 2010-11-10 日本電信電話株式会社 光集積回路
JP5549104B2 (ja) * 2008-05-29 2014-07-16 株式会社リコー 発光装置、光走査装置及び画像形成装置
US9057850B2 (en) * 2011-03-24 2015-06-16 Centera Photonics Inc. Optoelectronic module
EP3499559B1 (en) * 2016-08-10 2023-11-22 Kyocera Corporation Package for mounting electrical element, array package and electrical device
US10795079B2 (en) * 2018-01-25 2020-10-06 Poet Technologies, Inc. Methods for optical dielectric waveguide subassembly structure
DE102018102961B4 (de) * 2018-02-09 2025-05-08 Msg Lithoglas Gmbh Bauteilanordnung, Package und Package-Anordnung sowie Verfahren zum Herstellen

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101351733A (zh) * 2005-12-28 2009-01-21 欧姆龙株式会社 光模块
CN102683510A (zh) * 2011-03-09 2012-09-19 精工爱普生株式会社 发光装置以及投影仪
CN103250240A (zh) * 2011-05-31 2013-08-14 京瓷株式会社 元件收纳用封装、半导体装置用部件以及半导体装置
US20160313517A1 (en) * 2015-04-21 2016-10-27 Shinko Electric Industries Co., Ltd. Optical waveguide device and method of manufacturing the same
CN108140689A (zh) * 2015-12-10 2018-06-08 京瓷株式会社 传感器用基板以及传感器装置

Also Published As

Publication number Publication date
US20230213699A1 (en) 2023-07-06
EP4160705A4 (en) 2024-07-10
EP4160705A1 (en) 2023-04-05
JPWO2021241332A1 (https=) 2021-12-02
JP7431958B2 (ja) 2024-02-15
WO2021241332A1 (ja) 2021-12-02

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