JPWO2021241332A5 - - Google Patents
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- Publication number
- JPWO2021241332A5 JPWO2021241332A5 JP2022526917A JP2022526917A JPWO2021241332A5 JP WO2021241332 A5 JPWO2021241332 A5 JP WO2021241332A5 JP 2022526917 A JP2022526917 A JP 2022526917A JP 2022526917 A JP2022526917 A JP 2022526917A JP WO2021241332 A5 JPWO2021241332 A5 JP WO2021241332A5
- Authority
- JP
- Japan
- Prior art keywords
- metal body
- region
- optical waveguide
- package according
- waveguide package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 42
- 239000002184 metal Substances 0.000 claims description 42
- 230000003287 optical effect Effects 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 7
- 238000005253 cladding Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 2
- 239000000919 ceramic Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020094753 | 2020-05-29 | ||
| JP2020094753 | 2020-05-29 | ||
| PCT/JP2021/018825 WO2021241332A1 (ja) | 2020-05-29 | 2021-05-18 | 光導波路パッケージおよび発光装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021241332A1 JPWO2021241332A1 (https=) | 2021-12-02 |
| JPWO2021241332A5 true JPWO2021241332A5 (https=) | 2023-02-14 |
| JP7431958B2 JP7431958B2 (ja) | 2024-02-15 |
Family
ID=78744541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022526917A Active JP7431958B2 (ja) | 2020-05-29 | 2021-05-18 | 光導波路パッケージおよび発光装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230213699A1 (https=) |
| EP (1) | EP4160705A4 (https=) |
| JP (1) | JP7431958B2 (https=) |
| CN (1) | CN115668669A (https=) |
| WO (1) | WO2021241332A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117369059A (zh) * | 2022-06-30 | 2024-01-09 | 成都旭创科技有限公司 | 用于光通讯的光器件和光模块 |
| DE102024110364A1 (de) * | 2024-04-12 | 2025-10-16 | Ams-Osram International Gmbh | Optoelektronische anordnung und verfahren zum formen eines von einer halbleiterlaservorrichtung einer optoelektronischen anordnung emittierten laserlichts |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5521992A (en) * | 1994-08-01 | 1996-05-28 | Motorola, Inc. | Molded optical interconnect |
| JPH0961651A (ja) * | 1995-06-14 | 1997-03-07 | Nippon Telegr & Teleph Corp <Ntt> | ハイブリッド光集積回路 |
| JPH10308555A (ja) * | 1997-05-01 | 1998-11-17 | Nippon Telegr & Teleph Corp <Ntt> | ハイブリッド導波形光回路とその製造方法 |
| JP3728147B2 (ja) * | 1999-07-16 | 2005-12-21 | キヤノン株式会社 | 光電気混載配線基板 |
| US6789956B2 (en) * | 2001-12-19 | 2004-09-14 | Matsushita Electric Industrial Co., Ltd. | Optical module |
| US8052337B2 (en) * | 2005-12-28 | 2011-11-08 | Omron Corporation | Optical module |
| JP4579868B2 (ja) * | 2006-06-08 | 2010-11-10 | 日本電信電話株式会社 | 光集積回路 |
| JP5549104B2 (ja) * | 2008-05-29 | 2014-07-16 | 株式会社リコー | 発光装置、光走査装置及び画像形成装置 |
| JP5679117B2 (ja) * | 2011-03-09 | 2015-03-04 | セイコーエプソン株式会社 | 発光装置、照射装置、およびプロジェクター |
| US9057850B2 (en) * | 2011-03-24 | 2015-06-16 | Centera Photonics Inc. | Optoelectronic module |
| CN103250240B (zh) * | 2011-05-31 | 2016-01-06 | 京瓷株式会社 | 元件收纳用封装、半导体装置用部件以及半导体装置 |
| JP6437875B2 (ja) * | 2015-04-21 | 2018-12-12 | 新光電気工業株式会社 | 光導波路装置及びその製造方法 |
| JPWO2017099022A1 (ja) * | 2015-12-10 | 2018-08-09 | 京セラ株式会社 | センサ用基板およびセンサ装置 |
| EP3499559B1 (en) * | 2016-08-10 | 2023-11-22 | Kyocera Corporation | Package for mounting electrical element, array package and electrical device |
| US10795079B2 (en) * | 2018-01-25 | 2020-10-06 | Poet Technologies, Inc. | Methods for optical dielectric waveguide subassembly structure |
| DE102018102961B4 (de) * | 2018-02-09 | 2025-05-08 | Msg Lithoglas Gmbh | Bauteilanordnung, Package und Package-Anordnung sowie Verfahren zum Herstellen |
-
2021
- 2021-05-18 US US17/927,656 patent/US20230213699A1/en active Pending
- 2021-05-18 EP EP21812397.4A patent/EP4160705A4/en active Pending
- 2021-05-18 CN CN202180036723.5A patent/CN115668669A/zh active Pending
- 2021-05-18 JP JP2022526917A patent/JP7431958B2/ja active Active
- 2021-05-18 WO PCT/JP2021/018825 patent/WO2021241332A1/ja not_active Ceased
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