JP7431958B2 - 光導波路パッケージおよび発光装置 - Google Patents

光導波路パッケージおよび発光装置 Download PDF

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Publication number
JP7431958B2
JP7431958B2 JP2022526917A JP2022526917A JP7431958B2 JP 7431958 B2 JP7431958 B2 JP 7431958B2 JP 2022526917 A JP2022526917 A JP 2022526917A JP 2022526917 A JP2022526917 A JP 2022526917A JP 7431958 B2 JP7431958 B2 JP 7431958B2
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JP
Japan
Prior art keywords
metal body
element mounting
region
optical waveguide
light emitting
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JP2022526917A
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English (en)
Japanese (ja)
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JPWO2021241332A5 (https=
JPWO2021241332A1 (https=
Inventor
祥哲 板倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
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Publication date
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Publication of JPWO2021241332A5 publication Critical patent/JPWO2021241332A5/ja
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/125—Bends, branchings or intersections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133—Functions
    • G02B2006/1215—Splitter
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2022526917A 2020-05-29 2021-05-18 光導波路パッケージおよび発光装置 Active JP7431958B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020094753 2020-05-29
JP2020094753 2020-05-29
PCT/JP2021/018825 WO2021241332A1 (ja) 2020-05-29 2021-05-18 光導波路パッケージおよび発光装置

Publications (3)

Publication Number Publication Date
JPWO2021241332A1 JPWO2021241332A1 (https=) 2021-12-02
JPWO2021241332A5 JPWO2021241332A5 (https=) 2023-02-14
JP7431958B2 true JP7431958B2 (ja) 2024-02-15

Family

ID=78744541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022526917A Active JP7431958B2 (ja) 2020-05-29 2021-05-18 光導波路パッケージおよび発光装置

Country Status (5)

Country Link
US (1) US20230213699A1 (https=)
EP (1) EP4160705A4 (https=)
JP (1) JP7431958B2 (https=)
CN (1) CN115668669A (https=)
WO (1) WO2021241332A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117369059A (zh) * 2022-06-30 2024-01-09 成都旭创科技有限公司 用于光通讯的光器件和光模块
DE102024110364A1 (de) * 2024-04-12 2025-10-16 Ams-Osram International Gmbh Optoelektronische anordnung und verfahren zum formen eines von einer halbleiterlaservorrichtung einer optoelektronischen anordnung emittierten laserlichts

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007328201A (ja) 2006-06-08 2007-12-20 Nippon Telegr & Teleph Corp <Ntt> 光集積回路
JP2010010660A (ja) 2008-05-29 2010-01-14 Ricoh Co Ltd 発光装置、光走査装置及び画像形成装置
WO2019154465A1 (de) 2018-02-09 2019-08-15 Msg Lithoglas Gmbh Bauteilanordnung, package und package-anordnung sowie verfahren zum herstellen
JP2019195097A (ja) 2016-08-10 2019-11-07 京セラ株式会社 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5521992A (en) * 1994-08-01 1996-05-28 Motorola, Inc. Molded optical interconnect
JPH0961651A (ja) * 1995-06-14 1997-03-07 Nippon Telegr & Teleph Corp <Ntt> ハイブリッド光集積回路
JPH10308555A (ja) * 1997-05-01 1998-11-17 Nippon Telegr & Teleph Corp <Ntt> ハイブリッド導波形光回路とその製造方法
JP3728147B2 (ja) * 1999-07-16 2005-12-21 キヤノン株式会社 光電気混載配線基板
US6789956B2 (en) * 2001-12-19 2004-09-14 Matsushita Electric Industrial Co., Ltd. Optical module
US8052337B2 (en) * 2005-12-28 2011-11-08 Omron Corporation Optical module
JP5679117B2 (ja) * 2011-03-09 2015-03-04 セイコーエプソン株式会社 発光装置、照射装置、およびプロジェクター
US9057850B2 (en) * 2011-03-24 2015-06-16 Centera Photonics Inc. Optoelectronic module
CN103250240B (zh) * 2011-05-31 2016-01-06 京瓷株式会社 元件收纳用封装、半导体装置用部件以及半导体装置
JP6437875B2 (ja) * 2015-04-21 2018-12-12 新光電気工業株式会社 光導波路装置及びその製造方法
JPWO2017099022A1 (ja) * 2015-12-10 2018-08-09 京セラ株式会社 センサ用基板およびセンサ装置
US10795079B2 (en) * 2018-01-25 2020-10-06 Poet Technologies, Inc. Methods for optical dielectric waveguide subassembly structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007328201A (ja) 2006-06-08 2007-12-20 Nippon Telegr & Teleph Corp <Ntt> 光集積回路
JP2010010660A (ja) 2008-05-29 2010-01-14 Ricoh Co Ltd 発光装置、光走査装置及び画像形成装置
JP2019195097A (ja) 2016-08-10 2019-11-07 京セラ株式会社 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置
WO2019154465A1 (de) 2018-02-09 2019-08-15 Msg Lithoglas Gmbh Bauteilanordnung, package und package-anordnung sowie verfahren zum herstellen

Also Published As

Publication number Publication date
US20230213699A1 (en) 2023-07-06
EP4160705A4 (en) 2024-07-10
EP4160705A1 (en) 2023-04-05
JPWO2021241332A1 (https=) 2021-12-02
CN115668669A (zh) 2023-01-31
WO2021241332A1 (ja) 2021-12-02

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