CN115612422B - Preparation method of high-strength adhesive tape - Google Patents
Preparation method of high-strength adhesive tape Download PDFInfo
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- CN115612422B CN115612422B CN202211196486.1A CN202211196486A CN115612422B CN 115612422 B CN115612422 B CN 115612422B CN 202211196486 A CN202211196486 A CN 202211196486A CN 115612422 B CN115612422 B CN 115612422B
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- Prior art keywords
- glue
- conductive
- parts
- adhesive
- glass fiber
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 47
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 239000003292 glue Substances 0.000 claims abstract description 73
- 239000003365 glass fiber Substances 0.000 claims abstract description 57
- 239000012790 adhesive layer Substances 0.000 claims abstract description 43
- 230000001070 adhesive effect Effects 0.000 claims abstract description 34
- 239000000853 adhesive Substances 0.000 claims abstract description 33
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- VPASWAQPISSKJP-UHFFFAOYSA-N ethyl prop-2-enoate;isocyanic acid Chemical compound N=C=O.CCOC(=O)C=C VPASWAQPISSKJP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 238000002156 mixing Methods 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000005096 rolling process Methods 0.000 claims abstract description 11
- 238000010008 shearing Methods 0.000 claims abstract description 11
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 20
- 239000002174 Styrene-butadiene Substances 0.000 claims description 20
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 20
- 239000004816 latex Substances 0.000 claims description 20
- 229920000126 latex Polymers 0.000 claims description 20
- 238000003756 stirring Methods 0.000 claims description 20
- 239000011115 styrene butadiene Substances 0.000 claims description 20
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 20
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical group [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 14
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 13
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 13
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 7
- 239000003995 emulsifying agent Substances 0.000 claims description 7
- 239000003999 initiator Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 2
- -1 isocyanato ethyl Chemical group 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 5
- 238000005452 bending Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 238000005457 optimization Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000002245 particle Substances 0.000 description 5
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- WELLGRANCAVMDP-UHFFFAOYSA-N isocyanatoethane;prop-2-enoic acid Chemical compound CCN=C=O.OC(=O)C=C WELLGRANCAVMDP-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
Abstract
The invention discloses a preparation method of a high-strength adhesive tape, which comprises the following steps of S1) mixing glue with a conductive medium to prepare adhesive glue, and coating the adhesive glue on a release film to form an adhesive glue layer; s2) implanting conductive glass fibers on the adhesive layer through a flocking machine; s3) attaching a conductive substrate on the adhesive layer implanted with the conductive glass fiber to prepare a high-strength adhesive tape; s4) rolling, shearing and packaging the high-strength adhesive tape. According to the invention, the conductive glass fiber is implanted on the adhesive layer, then the conductive substrate is attached to the adhesive layer, the conductive medium is connected with the conductive substrate through the conductive glass fiber, so that better conductivity can be realized, a better shielding effect is achieved, and meanwhile, the isocyanate ethyl acrylate, the epoxy resin and the conductive glass fiber are added into the glue, so that the stripping force after the adhesive layer acts can be improved, and high-strength bonding is realized.
Description
Technical Field
The invention relates to the technical field of adhesive tape processing, in particular to a preparation method of a high-strength adhesive tape.
Background
The adhesive tape forms are various, and conductive adhesive tapes are widely used in the electronic product industry. As the requirements of people on the communication quality of electronic products are higher, a large number of conductive shielding tapes are increasingly used.
The conventional conductive adhesive tape is formed by mixing conductive powder with pressure-sensitive adhesive water, coating the mixture on release paper, and then laminating a metal foil for winding. The conductive adhesive tape is easy to have the following problems: 1. the bonding strength of the pressure-sensitive adhesive layer is small, so that the bonding is not firm, and 2, the conduction effect of the pressure-sensitive adhesive water and the metal foil is limited, so that the conductivity and the shielding effect are relatively poor.
In summary, conventional conductive tapes exhibit the disadvantage of being relatively weak in terms of both adhesive properties and shielding properties.
Disclosure of Invention
The invention aims to provide a preparation method of a high-strength adhesive tape, which can improve the conductivity and shielding performance of the adhesive tape and improve the bonding effect of the adhesive tape.
In order to achieve the above purpose, the invention adopts the following technical scheme: a preparation method of a high-strength adhesive tape comprises the following steps:
s1) mixing glue with a conductive medium to prepare adhesive glue, and coating the adhesive glue on a release film to form an adhesive glue layer;
s2) the conductive glass fiber is planted on the adhesive layer through a flocking machine, and the action principle is as follows: the conductive glass fiber can be output into the spray head by means of the flocking machine, when the spray head is close to the adhesive layer, the conductive glass fiber is planted into the surface of the adhesive layer from the spray head under the action of a high-voltage electric field and is vertically planted on the adhesive layer, and the conductive glass fiber can extend into the adhesive layer because the adhesive layer is not cured at the moment, so that a conductive body is formed together with the adhesive layer with a conductive effect; in this step, the conductive glass fiber may be cut to a desired length, either before implantation or after implantation;
s3) attaching a conductive substrate on the adhesive layer implanted with the conductive glass fiber to prepare a high-strength adhesive tape;
s4) rolling, shearing and packaging the high-strength adhesive tape.
As further optimization, the glue in the step S1 comprises the following components in parts by weight: 30-50 parts of styrene-butadiene latex, 1-3 parts of methyl methacrylate, 0.5-1 part of an initiator, 5-10 parts of an emulsifier, 20-30 parts of epoxy resin and 10-15 parts of isocyanate ethyl acrylate, so that the matching of the epoxy resin and the isocyanate ethyl acrylate is realized, and as one end of the isocyanate ethyl acrylate is provided with a double bond, free radical polymerization is realized, and one end is provided with isocyanate, the bonding capacity can be increased, and the bonding effect is improved;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and an emulsifier into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding an initiator;
s103) adding epoxy resin and isocyanate ethyl acrylate, and stirring uniformly to obtain the glue.
As a further optimization, the emulsifier is one or more of sodium dodecyl sulfonate, sodium dodecyl benzene sulfonate and sodium didodecyl phenyl ether disulfonate.
As a further optimization, the initiator is ammonium persulfate or potassium persulfate.
As a further optimization, the conductive medium in S1 is conductive glass fiber, and/or conductive particles.
As a further optimization, the conductive medium in S1 is one or more of metal particles, carbon black and graphene.
As a further optimization, the conductive glass fiber is made of glass fiber by electroless nickel plating.
As a further optimization, the release film is a PET release film.
As a further optimization, the conductive substrate is aluminum foil, copper foil or conductive foam.
Compared with the prior art, the invention has the beneficial effects that:
1. the conductive glass fiber is implanted on the adhesive layer, then the conductive substrate is attached to the adhesive layer, and the conductive glass fiber is used for realizing the connection between the conductive medium and the conductive substrate, so that better conductivity and better shielding effect can be realized;
2. the adhesive is added with the isocyanate ethyl acrylate, the epoxy resin and the conductive glass fiber, so that the stripping force after the action of the adhesive layer can be improved, and high-strength bonding is realized.
Drawings
FIG. 1 is a block diagram of one embodiment of a high strength tape of the present invention.
Fig. 2 is a block diagram of another embodiment of the high strength tape of the present invention.
Detailed Description
The following are specific embodiments of the present invention, and the technical solutions of the present invention are further described with reference to the accompanying drawings, but the present invention is not limited to these embodiments.
Example 1
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue 32 with conductive glass fibers 311 to prepare adhesive, and coating the adhesive on a release film 40 to form an adhesive layer 30;
s2) implanting the conductive glass fiber 20 on the adhesive layer 30 through a flocking machine;
s3) attaching an aluminum foil 10 on the adhesive layer implanted with the conductive glass fiber to prepare a high-strength adhesive tape, wherein the structure of the high-strength adhesive tape is shown in figure 1;
s4) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 42 parts of styrene-butadiene latex, 1.5 parts of methyl methacrylate, 0.5 part of potassium persulfate, 8 parts of sodium dodecyl sulfate, 27 parts of epoxy resin and 13 parts of isocyanatoethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl sulfonate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding potassium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and stirring uniformly to obtain the glue.
Example 2
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue with conductive glass fibers to prepare adhesive glue, and coating the adhesive glue on a release film to form an adhesive glue layer;
s2) implanting conductive glass fibers on the adhesive layer through a flocking machine;
s3) attaching conductive foam on the adhesive layer implanted with the conductive glass fiber to prepare a high-strength adhesive tape;
s4) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 36 parts of styrene-butadiene latex, 2 parts of methyl methacrylate, 0.5 part of potassium persulfate, 5 parts of sodium dodecyl benzene sulfonate, 22 parts of epoxy resin and 12 parts of isocyanato ethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl benzene sulfonate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding potassium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and stirring uniformly to obtain the glue.
Example 3
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue 32 with carbon black 312 to prepare adhesive, and coating the adhesive on a release film 40 to form an adhesive layer 30;
s2) implanting the conductive glass fiber 20 on the adhesive layer 30 through a flocking machine;
s3) attaching an aluminum foil 10 on the adhesive layer implanted with the conductive glass fiber to prepare a high-strength adhesive tape, wherein the structure of the high-strength adhesive tape is shown in figure 2;
s4) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 46 parts of styrene-butadiene latex, 2.5 parts of methyl methacrylate, 1 part of ammonium persulfate, 8 parts of sodium dodecyl benzene sulfonate, 24 parts of epoxy resin and 14 parts of isocyanatoethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl benzene sulfonate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding ammonium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and stirring uniformly to obtain the glue.
Example 4
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue with metal copper particles to prepare adhesive glue, and coating the adhesive glue on a release film to form an adhesive glue layer;
s2) implanting conductive glass fibers on the adhesive layer through a flocking machine;
s3) attaching copper foil on the adhesive layer implanted with the conductive glass fiber to prepare a high-strength adhesive tape;
s4) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 31 parts of styrene-butadiene latex, 2.5 parts of methyl methacrylate, 0.5 part of ammonium persulfate, 7 parts of sodium dodecyl benzene sulfonate, 29 parts of epoxy resin and 12 parts of isocyanate ethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl benzene sulfonate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding ammonium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and stirring uniformly to obtain the glue.
Example 5
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue and graphene to prepare adhesive glue, and coating the adhesive glue on a release film to form an adhesive glue layer;
s2) implanting conductive glass fibers on the adhesive layer through a flocking machine;
s3) attaching copper foil on the adhesive layer implanted with the conductive glass fiber to prepare a high-strength adhesive tape;
s4) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 38 parts of styrene-butadiene latex, 1 part of methyl methacrylate, 1 part of potassium persulfate, 6 parts of sodium dodecyl sulfate, 27 parts of epoxy resin and 12 parts of isocyanatoethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl sulfonate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding potassium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and stirring uniformly to obtain the glue.
Comparative example 1
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue with conductive glass fibers to prepare adhesive glue, and coating the adhesive glue on a release film to form an adhesive glue layer;
s2) attaching aluminum foil to the adhesive layer to prepare a high-strength adhesive tape;
s3) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 41 parts of styrene-butadiene latex, 2 parts of methyl methacrylate, 0.5 part of potassium persulfate, 6 parts of sodium dodecyl benzene sulfonate, 26 parts of epoxy resin and 13 parts of isocyanate ethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl benzene sulfonate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding potassium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and stirring uniformly to obtain the glue.
Comparative example 2
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue with carbon black to prepare adhesive glue, and coating the adhesive glue on a release film to form an adhesive glue layer;
s2) attaching aluminum foil to the adhesive layer to prepare a high-strength adhesive tape;
s3) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 40 parts of styrene-butadiene latex, 1 part of methyl methacrylate, 1 part of potassium persulfate, 7 parts of sodium dodecyl benzene sulfonate, 21 parts of epoxy resin and 12 parts of isocyanatoethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl benzene sulfonate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding potassium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and stirring uniformly to obtain the glue.
Comparative example 3
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue with conductive glass fibers to prepare adhesive glue, and coating the adhesive glue on a release film to form an adhesive glue layer;
s2) implanting conductive glass fibers on the adhesive layer through a flocking machine;
s3) attaching aluminum foil to the adhesive layer implanted with the conductive glass fiber to prepare a high-strength adhesive tape;
s4) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 41 parts of styrene-butadiene latex, 2 parts of methyl methacrylate, 1 part of ammonium persulfate, 6 parts of sodium dodecyl benzene sulfonate and 25 parts of epoxy resin;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and an emulsifier into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding an initiator;
s103) adding epoxy resin, and stirring uniformly to obtain the glue.
Test results
The tapes prepared in examples 1 to 5 and comparative examples 1 to 3 were cut into sheets of the same specifications (thickness, size), wherein the thicknesses of the respective layers were also the same, and the vertical resistance was measured according to ASTM F390 standard, the peel strength (adhesive layer bonding to plastic plate) was measured according to GB2792-81 standard, and specific test values are shown in the following table,
as can be seen from examples 1 and 2, and comparing with example 3/4/5, when the conductive medium is conductive glass fiber, rather than conventional conductive particles, the conductive medium has smaller vertical resistance, thereby realizing better conductive performance and better shielding effect, because the conductive glass fiber is conductive glass fiber when connecting the adhesive layer and the conductive substrate, and the conductive medium in the adhesive layer is conductive glass fiber, and has better conductive performance under the same conductive material; compared with comparative example 1 (conductive glass fiber is not added in a flocking mode, but conductive glass fiber is used as a conductive medium), and comparative example 2 (conductive glass fiber is not added in a flocking mode, and other conductive particles are used as a conductive medium), the conductive glass fiber 20 is implanted, so that the bridge is provided with the conductive glass fiber, the conductive performance can be better realized, and the shielding effect is improved compared with the conventional method of directly attaching a conductive substrate and a conductive adhesive layer.
In addition, as can be seen from examples 1 to 5 and comparative example 3 (without adding ethyl isocyanate acrylate to the glue, but with adding conductive glass fibers), the adhesive force after the adhesive layer is applied can be improved by the combination system of the ethyl isocyanate acrylate and the epoxy resin; moreover, as can be seen from examples 1 to 5, when the glue is conductive glass fiber instead of common conductive particles, the conductive glass fiber has better adhesiveness, because the conductive glass fiber can be better dispersed in the glue system, has better compatibility and affinity with resin, can be more uniformly dispersed in the glue system of the resin, avoids forming bulges due to concentration at a certain place, and can also realize the uniformity of conductivity.
When the conductive base material is attached to the adhesive layer, the conductive base material acts on the conductive glass fiber, and the conductive glass fiber is bent, so that the acting area of the conductive glass fiber and the conductive base material can be further increased, and the conductive glass fiber is beneficial to improving the conductivity; meanwhile, the bent conductive glass fiber can further limit the movement of the conductive substrate compared with the adhesive layer, so that the combination effect of the conductive substrate and the adhesive layer is improved.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (6)
1. The preparation method of the high-strength adhesive tape is characterized by comprising the following steps of:
s1) mixing glue with a conductive medium to prepare adhesive glue, and coating the adhesive glue on a release film to form an adhesive glue layer, wherein the conductive medium is conductive glass fiber;
s2) implanting conductive glass fibers on the adhesive layer through a flocking machine;
s3) attaching a conductive substrate on the adhesive layer implanted with the conductive glass fibers to prepare a high-strength adhesive tape, wherein the conductive glass fibers implanted on the adhesive layer are in a bending state and are abutted with the conductive substrate;
s4) rolling, shearing and packaging the high-strength adhesive tape;
wherein, the glue in S1 comprises the following components in parts by weight: 30-50 parts of styrene-butadiene latex, 1-3 parts of methyl methacrylate, 0.5-1 part of initiator, 5-10 parts of emulsifier, 20-30 parts of epoxy resin and 10-15 parts of isocyanato ethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and an emulsifier into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding an initiator;
s103) adding epoxy resin and isocyanate ethyl acrylate, and stirring uniformly to obtain the glue.
2. The method of claim 1, wherein the emulsifier is one or more of sodium dodecyl sulfate, sodium dodecyl benzene sulfonate, and sodium didodecyl phenyl ether disulfonate.
3. The method for preparing a high strength adhesive tape according to claim 1 or 2, wherein the initiator is ammonium persulfate or potassium persulfate.
4. The method of claim 1, wherein the conductive glass fiber is made of glass fiber by electroless nickel plating.
5. The method of claim 1, wherein the release film is a PET release film.
6. The method of claim 1, wherein the conductive substrate is aluminum foil, copper foil, or conductive foam.
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| KR19990084381A (en) * | 1998-05-06 | 1999-12-06 | 이용인 | Conductive Adhesive Tape |
| CN107151537A (en) * | 2017-04-26 | 2017-09-12 | 江苏斯瑞达新材料科技有限公司 | A kind of preparation method of flame retardant type shielding tape |
| CN107312492A (en) * | 2017-06-30 | 2017-11-03 | 张家港康得新光电材料有限公司 | A kind of double solidification adhesives and adhesive tape |
| CN109306629A (en) * | 2018-09-21 | 2019-02-05 | 嘉善博华绒业有限公司 | Antistatic flocked carpet production technology |
| CN109762483A (en) * | 2018-12-25 | 2019-05-17 | 苏州义铠轩电子科技有限公司 | Vertical conduction is pyrolyzed adhesive tape and preparation method thereof |
| CN110760035A (en) * | 2019-10-30 | 2020-02-07 | 上海保立佳新材料有限公司 | Self-thickening association type acrylate emulsion and preparation method thereof |
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2022
- 2022-09-29 CN CN202211196486.1A patent/CN115612422B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990084381A (en) * | 1998-05-06 | 1999-12-06 | 이용인 | Conductive Adhesive Tape |
| CN107151537A (en) * | 2017-04-26 | 2017-09-12 | 江苏斯瑞达新材料科技有限公司 | A kind of preparation method of flame retardant type shielding tape |
| CN107312492A (en) * | 2017-06-30 | 2017-11-03 | 张家港康得新光电材料有限公司 | A kind of double solidification adhesives and adhesive tape |
| CN109306629A (en) * | 2018-09-21 | 2019-02-05 | 嘉善博华绒业有限公司 | Antistatic flocked carpet production technology |
| CN109762483A (en) * | 2018-12-25 | 2019-05-17 | 苏州义铠轩电子科技有限公司 | Vertical conduction is pyrolyzed adhesive tape and preparation method thereof |
| CN110760035A (en) * | 2019-10-30 | 2020-02-07 | 上海保立佳新材料有限公司 | Self-thickening association type acrylate emulsion and preparation method thereof |
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