JPH02202973A - Adhesive composition for flexible printed circuit board - Google Patents
Adhesive composition for flexible printed circuit boardInfo
- Publication number
- JPH02202973A JPH02202973A JP2543589A JP2543589A JPH02202973A JP H02202973 A JPH02202973 A JP H02202973A JP 2543589 A JP2543589 A JP 2543589A JP 2543589 A JP2543589 A JP 2543589A JP H02202973 A JPH02202973 A JP H02202973A
- Authority
- JP
- Japan
- Prior art keywords
- group
- epoxy
- acrylic elastomer
- epoxy resin
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims description 40
- 230000001070 adhesive effect Effects 0.000 title claims description 40
- 239000000203 mixture Substances 0.000 title claims description 24
- 229920000800 acrylic rubber Polymers 0.000 claims abstract description 43
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 43
- 239000003822 epoxy resin Substances 0.000 claims abstract description 31
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 31
- 125000000524 functional group Chemical group 0.000 claims abstract description 30
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 25
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- 239000002245 particle Substances 0.000 claims abstract description 17
- 239000004593 Epoxy Substances 0.000 claims description 7
- -1 Droxyl group Chemical group 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 125000003368 amide group Chemical group 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 abstract description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 abstract description 3
- 238000013329 compounding Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 9
- 238000005476 soldering Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- WROUWQQRXUBECT-UHFFFAOYSA-M 2-ethylacrylate Chemical compound CCC(=C)C([O-])=O WROUWQQRXUBECT-UHFFFAOYSA-M 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 241000512259 Ascophyllum nodosum Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- QDYTUZCWBJRHKK-UHFFFAOYSA-N imidazole-4-methanol Chemical compound OCC1=CNC=N1 QDYTUZCWBJRHKK-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、フレキシブル印刷配線板と部品実装用補強板
との接着等に使用するフレキシブル印刷配線板用接着剤
組成物に関し、より詳しくは短時間で接着が可能でかつ
ポットライフが長いフレキシブル印刷配線板用接着剤組
成物に関する。Detailed Description of the Invention <Industrial Application Field> The present invention relates to an adhesive composition for flexible printed wiring boards used for adhesion between flexible printed wiring boards and reinforcing plates for component mounting, and more specifically, The present invention relates to an adhesive composition for flexible printed wiring boards that can be bonded in a short period of time and has a long pot life.
〈従来の技術と発明が解決しようとする問題点〉フレキ
シブル印刷配線板は、可撓性に富み薄層であることから
、通常の電線や硬質プリント配線板に比べて、小型軽量
化、配線レイアウトの単純化、配線作業の簡素化、回路
特性および信頼性の向上等が可能であり、このため電子
卓上計算機、電話機、カメラの内部配線、さらに自動車
の配線パネル等に広く使用されている。<Problems to be solved by conventional technology and the invention> Flexible printed wiring boards are highly flexible and have a thin layer, so compared to ordinary electric wires and rigid printed wiring boards, flexible printed wiring boards are smaller and lighter, and can be used for wiring layouts. It is possible to simplify the wiring process, simplify the wiring work, and improve circuit characteristics and reliability. Therefore, it is widely used for the internal wiring of electronic desktop calculators, telephones, and cameras, as well as the wiring panels of automobiles.
特に、近年は、フレキシブル印刷配線板の高性能化が進
められており、種々の部品が実装されている。In particular, in recent years, the performance of flexible printed wiring boards has been improved, and various parts have been mounted on them.
部品を実装する場合には、実装部分および端子部分の補
強を図り信頼性を維持させるために、第１図に示すよう
に、フレキシブル印刷配線板（１）の裏面に接着剤（２
）によって補強板（３）（当板）を接着するのが通常で
ある。補強板（３）としては、紙フエノール、ガラスエ
ポキシ等が使用される。また、接着は、接着剤としてア
クリル樹脂系の感圧接着剤を使用して接着するか、ある
いは熱硬化性のエポキシ樹脂系接着剤を使用して高温高
圧下で接着するなどの方法が採用される。When mounting components, in order to reinforce the mounting parts and terminal parts and maintain reliability, adhesive (2.
) is usually used to bond the reinforcing plate (3) (backing plate). Paper phenol, glass epoxy, etc. are used as the reinforcing plate (3). In addition, methods of adhesion are used, such as using an acrylic resin-based pressure-sensitive adhesive as the adhesive, or using a thermosetting epoxy resin adhesive under high temperature and high pressure. Ru.
しかしながら、前者の接着方法は簡便である反面、接着
力、はんだ耐熱性、流れ出し性などに劣り、後者の方法
は熱板プレス等の設備を必要とするため設備費がかかる
という問題があった。また、後者の場合、硬化剤に芳香
族ポリアミンやカチオン重合タイプの硬化剤（三フッ化
ホウ素−アミン錯体、三フッ化ホウ素−エーテル錯体等
）を使用していたため、高温高圧でのプ１／スに長時間
を要するという欠点があり、作業性が悪かった。However, while the former bonding method is simple, it is inferior in adhesion strength, solder heat resistance, flow-out property, etc., and the latter method requires equipment such as a hot plate press, resulting in high equipment costs. In addition, in the latter case, aromatic polyamines and cationic polymerization type curing agents (boron trifluoride-amine complexes, boron trifluoride-ether complexes, etc.) were used as curing agents; The disadvantage was that it took a long time to complete the process, and the workability was poor.
本発明は、以上の事情に鑑みてなされたものであって、
接着強度、はんだ耐熱性等の諸特性にすぐれ、速硬化性
であり、しかもポットライフの長いフレキシブル印刷配
線板用接着剤組成物を提供することを目的とする。The present invention has been made in view of the above circumstances, and
The object of the present invention is to provide an adhesive composition for a flexible printed wiring board that has excellent properties such as adhesive strength and soldering heat resistance, is fast curing, and has a long pot life.
く問題点を解決するための手段および作用〉本発明のフ
レキシブル印刷配線板用接着剤組成物は、官能基を有す
るアクリルエラストマー成分を１０％（重量％、以下同
じ）以下の割合で含むアクリルエラストマーと、１分子
中に２個以上のエポキシ基を有するエポキシ樹脂と、粒
径が３０μｍ以下である粉末状の硬化剤とを含み、前記
アクリルエラストマーの官能基／エポキシ樹脂のエポキ
シ基の当量比が１／１〜１／２０であることを特徴とす
るものである。Means and Effects for Solving the Problems> The adhesive composition for flexible printed wiring boards of the present invention is an acrylic elastomer containing an acrylic elastomer component having a functional group in a proportion of 10% (wt%, same hereinafter) or less. , an epoxy resin having two or more epoxy groups in one molecule, and a powdered curing agent having a particle size of 30 μm or less, and the equivalent ratio of the functional groups of the acrylic elastomer/the epoxy groups of the epoxy resin is It is characterized by being 1/1 to 1/20.
本発明における官能基を有するアクリルエラストマー成
分としては、例えばエポキシ基、カルボキシル基、ヒド
ロキシル基、アミド基、メチロール基等の官能基を有す
るアクリル系化合物があげられ、具体的にはグリシジル
メタクリレート、グリシジルアクリレート等のエポキシ
基を有する化合物、アクリル酸、メタクリル酸等のカル
ボキシル基を有する化合物、２−ヒドロキシエチルアク
リ１／−ト、２−ヒドロキシエチルメタクリレート等の
ヒドロキシル基を有する化合物、Ｎ−メチロールアクリ
ルアミド等のアミド基およびメチロール基を有する化合
物があげられる。本発明におけるアクリルエラストマー
は、これらのアクリルエラストマー成分を官能基を有さ
ない他のアクリルエラストマー成分（例えばアクリル酸
エステル、アクリロニトリル等）と共重合させて得られ
る。Examples of the acrylic elastomer component having a functional group in the present invention include acrylic compounds having a functional group such as an epoxy group, a carboxyl group, a hydroxyl group, an amide group, and a methylol group, and specifically, glycidyl methacrylate, glycidyl acrylate, etc. Compounds having an epoxy group such as acrylic acid, compounds having a carboxyl group such as methacrylic acid, compounds having a hydroxyl group such as 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, N-methylol acrylamide, etc. Examples include compounds having an amide group and a methylol group. The acrylic elastomer in the present invention is obtained by copolymerizing these acrylic elastomer components with other acrylic elastomer components (for example, acrylic ester, acrylonitrile, etc.) that do not have a functional group.
ここで、官能基を有するアクリルエラストマー成分のア
クリルエラストマー中の含有量は１０％以下であるのが
好ましく、官能基を有するアクリルエラストマー成分が
１０％を超えるときはポットライフが短くなり、好まし
くない。Here, the content of the acrylic elastomer component having a functional group in the acrylic elastomer is preferably 10% or less, and when the content of the acrylic elastomer component having a functional group exceeds 10%, the pot life becomes short, which is not preferable.
また、前記エポキシ樹脂としてはビスフェノール型エポ
キシ樹脂、ノボラック型エポキシ樹脂等があげられる。Further, examples of the epoxy resin include bisphenol type epoxy resin, novolac type epoxy resin, and the like.
アクリルエラストマーの官能基／エポキシ樹脂のエポキ
シ基の当量比は１／１〜１／２０であるのが好ましく、
当量比がこの範囲をはずれるとき、すなわちエポキシ基
の当量が１未満または２０を超えるときは、いずれも接
着力やはんだ耐熱性に劣るようになる。The equivalent ratio of the functional group of the acrylic elastomer/the epoxy group of the epoxy resin is preferably 1/1 to 1/20,
When the equivalent ratio is out of this range, that is, when the equivalent weight of the epoxy group is less than 1 or more than 20, the adhesive strength and soldering heat resistance will be poor.
前記硬化剤としては、例えばジシアンジアミドおよびそ
の誘導体、イミダゾール類、三フッ化ホウ素−アミン・
コンブ１／ツクス（錯体）、有機酸ヒドラジド等の潜在
性硬化剤があげられる。かかる潜在性硬化剤を使用する
ことにより、ポットライフが長くなる一方、硬化時には
加熱加圧により速やかに硬化させることができる。Examples of the curing agent include dicyandiamide and its derivatives, imidazoles, boron trifluoride-amine,
Examples include latent curing agents such as kelp 1/tux (complex) and organic acid hydrazide. By using such a latent curing agent, the pot life becomes longer, and at the time of curing, it can be rapidly cured by heating and pressurizing.
これらの硬化剤は粒径が３０μｍ以下、より好ましくは
３〜１５μｍの粉末状で使用される。すなわち、硬化剤
の粒径の大小は反応接触面積に関係するため、粒径が前
記範囲よりも大なるときは硬化時間が長くなり、また粒
径があまりに小さすぎるとポットライフが短くなるとい
う問題が生じる。These curing agents are used in powder form with a particle size of 30 μm or less, more preferably 3 to 15 μm. In other words, the particle size of the curing agent is related to the reaction contact area, so if the particle size is larger than the above range, the curing time will be longer, and if the particle size is too small, the pot life will be shortened. occurs.
硬化剤は、上記アクリルエラストマーとエポキシ樹脂と
を所定の割合で混合したとき、過剰エポキシ当量に相当
するエポキシ固形量に対して１〜１０ｐｈｒ添加される
。ここで、過剰エポキシ当量とは、アクリルエラストマ
ーの官能基がエポキシ基以外のとき、（エポキシ基の当
量−アクリルエラストマーの官能基の当量）であり、ア
クリルエラストマーの官能基がエポキシ基のとき、（エ
ポキシ基の当量＋アクリルエラストマーの官能基の当量
）である。硬化剤の添加量がこれよりも大なるときはポ
ットライフが短くなり、またこれよりも小なるときはエ
ポキシ樹脂の硬化が不十分であるために、接着力、はん
だ耐熱性が劣るようになる。The curing agent is added in an amount of 1 to 10 phr based on the amount of epoxy solids corresponding to the excess epoxy equivalent when the acrylic elastomer and epoxy resin are mixed in a predetermined ratio. Here, the excess epoxy equivalent is (equivalent of epoxy group - equivalent of functional group of acrylic elastomer) when the functional group of the acrylic elastomer is other than an epoxy group, and when the functional group of the acrylic elastomer is an epoxy group, ( (equivalent of epoxy group + equivalent of functional group of acrylic elastomer). If the amount of curing agent added is larger than this, the pot life will be shortened, and if it is smaller than this, the epoxy resin will not be sufficiently cured, resulting in poor adhesive strength and soldering heat resistance. .
〈実施例〉
以下、実施例および比較例をあげて本発明の接着剤組成
物をより詳細に説明する。なお、以下の説明で部とある
のは重量部を意味している。<Examples> Hereinafter, the adhesive composition of the present invention will be explained in more detail with reference to Examples and Comparative Examples. In addition, in the following description, parts mean parts by weight.
実施例１
ブチルアクリレート／２−ヒドロキシエチルアクリレー
ト鴫９０／１０の共重合体からなるアクリルエラストマ
ー（濃度２０％）２００部、ビスフェノール型エポキシ
樹脂（油化シェル化学製の商品名エピコート８２８）３
０部および粒径２０μｍの２−フェニル−４−メチル−
５−ヒドロキシメチルイミダゾール５部を混合して接着
剤組成物を得た。このときのアクリルエラストマーの官
能基／エポキシ樹脂のエポキシ基の当量比は１／１．４
である。Example 1 200 parts of an acrylic elastomer (concentration 20%) consisting of a 90/10 copolymer of butyl acrylate/2-hydroxyethyl acrylate, 3 parts of a bisphenol-type epoxy resin (trade name Epicoat 828 manufactured by Yuka Shell Chemical Co., Ltd.)
2-phenyl-4-methyl- with 0 parts and particle size 20 μm
An adhesive composition was obtained by mixing 5 parts of 5-hydroxymethylimidazole. At this time, the equivalent ratio of functional groups of acrylic elastomer/epoxy groups of epoxy resin is 1/1.4
It is.
実施例２
エチルアクリレート／Ｎ−メチロールアクリルアミド−
９７／３の共重合体からなるアクリルエラストマー（濃
度２０％）２５０部、ビスフェノール型エポキシ樹脂（
大日本インキ製の商品名エビクロン８３０）５０部およ
び粒径２５μｍのジシアンジアミド４．５部を混合して
接着剤組成物を得た。このときのアクリルエラストマー
の官能基／エポキシ樹脂のエポキシ基の当量比は１／１
８である。Example 2 Ethyl acrylate/N-methylolacrylamide
250 parts of acrylic elastomer (concentration 20%) consisting of 97/3 copolymer, bisphenol type epoxy resin (
An adhesive composition was obtained by mixing 50 parts of Evicron 830 (trade name, manufactured by Dainippon Ink) and 4.5 parts of dicyandiamide having a particle size of 25 μm. At this time, the equivalent ratio of functional groups of acrylic elastomer/epoxy groups of epoxy resin is 1/1.
It is 8.
実施例３
エチルアクリレート／グリシジルメタクリレート／メタ
クリル酸−９４／４／２の共重合体からなるアクリルエ
ラストマー（ａ度２０％）３００部、ノボラック型エポ
キシ樹脂（ダウケミカル社製の商品名ＤＥＮ４３１）４
０部および粒径３０μｍの４，４″−メチレン−ビス（
２−エチル−５−メチルイミダゾール）５部を混合して
接着剤組成物を得た。このときのアクリルエラストマー
の官能基／エポキシ樹脂のエポキシ基の当量比は１／１
８である。Example 3 300 parts of an acrylic elastomer (20% a degree) consisting of a copolymer of ethyl acrylate/glycidyl methacrylate/methacrylic acid-94/4/2, novolac type epoxy resin (trade name DEN431 manufactured by Dow Chemical Company) 4
4,4″-methylene-bis(
2-ethyl-5-methylimidazole) were mixed to obtain an adhesive composition. At this time, the equivalent ratio of functional groups of acrylic elastomer/epoxy groups of epoxy resin is 1/1.
It is 8.
実施例４
エチルアクリレート／ブチルアクリレート／アクリロニ
トリル／２−ヒドロキシエチルメタクリレート／メタク
リル酸−２０／６０／１５／２．５／２．５の共重合体
からなるアクリルエラストマー（濃度２０％）５００部
、ノボラック型エポキシ樹脂（油化シェル化学製の商品
名エピコート１５４）５０部および粒径１８〜３０μｍ
の２．４−ジアミノ−６（２′−メチルイミダゾリル−
（１） −１エチル−８−メリアジン・イソシアタル酸
付加物５部を混合して接着剤組成物を得た。Example 4 500 parts of acrylic elastomer (concentration 20%) consisting of a copolymer of ethyl acrylate/butyl acrylate/acrylonitrile/2-hydroxyethyl methacrylate/methacrylic acid-20/60/15/2.5/2.5, novolac 50 parts of type epoxy resin (trade name Epicoat 154 manufactured by Yuka Shell Chemical Co., Ltd.) and particle size 18 to 30 μm
2,4-diamino-6(2'-methylimidazolyl-
(1) An adhesive composition was obtained by mixing 5 parts of -1-ethyl-8-meliazine/isocyataric acid adduct.
このときのアクリルエラストマーの官能基／エポキシ樹
脂のエポキシ基の当量比は１／コ１である。At this time, the equivalent ratio of functional groups of the acrylic elastomer to epoxy groups of the epoxy resin was 1/co1.
比較例１
粒径が１５０〜３５０μｍの硬化剤を使用したほかは実
施例１と同様にして接着剤組成物を得た。Comparative Example 1 An adhesive composition was obtained in the same manner as in Example 1 except that a curing agent having a particle size of 150 to 350 μm was used.
比較例２
エポキシ樹脂の添加量を３ｐｈ ｒとしたほかは実施例
４と同様にして接着剤組成物を得た。このときのアクリ
ルエラストマーの官能基／エポキシ樹脂のエポキシ基の
当量比は１１０．５である。Comparative Example 2 An adhesive composition was obtained in the same manner as in Example 4, except that the amount of epoxy resin added was 3 phr. At this time, the equivalent ratio of the functional groups of the acrylic elastomer to the epoxy groups of the epoxy resin was 110.5.
比較例３
アクリルエラストマー（濃度２０％）の添加量を４００
部としたほかは実施例１と同様にしてアクリルエラスト
マーの官能基／エポキシ樹脂のエポキシ基の当量比が１
１０．７である接着剤組成物を得た。Comparative Example 3 The amount of acrylic elastomer (concentration 20%) added was 400%.
The equivalent ratio of the functional group of the acrylic elastomer/the epoxy group of the epoxy resin was 1.
An adhesive composition having a rating of 10.7 was obtained.
比較例４
エポキシ樹脂の添加量を６０部としたほかは実施例３と
同様にしてアクリルエラストマーの官能基／エポキシ樹
脂の当量比が１／２７である接着剤組成物を得た。Comparative Example 4 An adhesive composition having an equivalent ratio of acrylic elastomer functional group/epoxy resin of 1/27 was obtained in the same manner as in Example 3, except that the amount of epoxy resin added was 60 parts.
試験
各実施例および比較例で得た接着剤組成物を、フレキシ
ブル印刷配線板の基板として用いられるポリイミド基板
の表面（光沢面）に厚さ３０μｍとなるように塗布し、
１００℃で１０分間加熱してＢステージ状態とした。つ
いで、この塗布面に厚さ０．８ｉｍの紙フエノール板を
重ね合わせ、プレスにて１６０℃、１０−４で１０分間
加熱加圧して接着した。The adhesive composition obtained in each test example and comparative example was applied to a thickness of 30 μm on the surface (glossy surface) of a polyimide substrate used as a substrate for a flexible printed wiring board.
It was heated at 100° C. for 10 minutes to bring it into a B-stage state. Next, a paper phenol plate having a thickness of 0.8 mm was superimposed on this coated surface, and the plate was bonded by heating and pressing at 160 DEG C. and 10@-4 for 10 minutes using a press.
なお、別の手法として、接着剤組成物を離型フィルムに
塗布後、Ｂステージ化し、さらにポリイミド基板へ転写
し、紙フエノール板と貼り合わせてもよい。As another method, the adhesive composition may be applied to a release film, then B-staged, further transferred to a polyimide substrate, and bonded to a paper phenol board.
このようにして得られた各試験片および接着剤組成物に
ついて、硬化度、はんだ耐熱性、接着強度、ポットライ
フおよび流れ出し性をそれぞれ評価した。その結果を次
長に示す。For each test piece and adhesive composition thus obtained, the degree of curing, soldering heat resistance, adhesive strength, pot life, and flow-out property were evaluated. The results will be presented to the deputy director.
なお、硬化度は、接着剤組成物の硬化速度を評価するも
のであって、１６０℃で１０分間加熱して硬化させたと
きのゲル分率で求めた。The degree of curing is used to evaluate the curing speed of the adhesive composition, and was determined by the gel fraction when the adhesive composition was cured by heating at 160° C. for 10 minutes.
はんだ耐熱性は２６０℃でのふくれ発生時間により評価
した。Solder heat resistance was evaluated by the blistering time at 260°C.
接着強度は銅箔引っ張りによる１８０”剥離により評価
した。Adhesive strength was evaluated by 180'' peeling by pulling the copper foil.
ポットライフは初期接着力の半減寿命により評価した。Pot life was evaluated based on the half-life of initial adhesive strength.
流れ出し性は直径が３ＩＩｍの孔からの流れ出し量によ
り評価した。The outflow property was evaluated by the amount of outflow from a hole having a diameter of 3 II m.
（以下余白）
表から明らかなように、比較例１では硬化剤の粒径が大
きいために、硬化度（速硬化性）、はんだ耐熱性、接着
強度およびポットライフのいずれにも劣っている。また
、比較例２では、アクリルエラストマー中での官能基当
量／エポキシ当量の比率が１１０．５であるため、はん
だ耐熱性および接着強度に劣っている。さらに、比較例
３．４からアクリルエラストマーの官能基／エポキシ樹
脂のエポキシ基の当量比が実施例よりも大きい場合また
は小さい場合のいずれの場合にも、はんだ耐熱性および
接着強度が劣っていることがわかる。(The following is a blank space) As is clear from the table, in Comparative Example 1, since the particle size of the curing agent is large, the curing degree (fast curing property), soldering heat resistance, adhesive strength, and pot life are all inferior. Furthermore, in Comparative Example 2, the ratio of functional group equivalent/epoxy equivalent in the acrylic elastomer was 110.5, so the soldering heat resistance and adhesive strength were poor. Furthermore, Comparative Example 3.4 shows that the solder heat resistance and adhesive strength are inferior in both cases where the equivalent ratio of the functional groups of the acrylic elastomer to the epoxy groups of the epoxy resin is larger or smaller than in the example. I understand.
これに対して、実施例１〜４では、官能基を有するアク
リルエラストマー成分を１０％（重量％、以下同じ）以
下の割合で含むアクリルエラストマーを使用し、このア
クリルエラストマーの官能基／エポキシ樹脂のエポキシ
基の当量比を１／１〜１／２０とし、しかも粒径が３０
μｍ以下である粉末状の硬化剤を使用したことにより、
得られる接着組成物は硬化度（速硬化性）、はんだ耐熱
性、接着強度、ポットライフおよび流れ出し性のいずれ
にもすぐれ、配線板に要求される性能を満たしているこ
とがわかる。On the other hand, in Examples 1 to 4, an acrylic elastomer containing an acrylic elastomer component having a functional group at a ratio of 10% (weight %, the same applies hereinafter) or less was used, and the ratio of the functional group of this acrylic elastomer/epoxy resin was The equivalent ratio of epoxy groups is 1/1 to 1/20, and the particle size is 30
By using a powder hardening agent with a particle size of less than μm,
It can be seen that the obtained adhesive composition has excellent curing degree (fast curing property), soldering heat resistance, adhesive strength, pot life, and flowability, and satisfies the performance required for wiring boards.
〈発明の効果〉
本発明によれば、官能基を有するアクリルエラストマー
成分を１０％以下で含有するアクリルエラストマーを使
用し、このアクリルエラストマーの官能基／エポキシ樹
脂のエポキシ基の当量比を１／１〜１／２０とし、かつ
硬化剤として粒径が３０μｍ以下の粉末状物を使用した
ため、速硬化性、はんだ耐熱性、接着強度、ポットライ
フ等の特性にすぐれ、フレキシブル印刷配線板と部品実
装用補強板との接着に適した接着剤組成物を提供するこ
とができるという効果がある。<Effects of the Invention> According to the present invention, an acrylic elastomer containing 10% or less of an acrylic elastomer component having a functional group is used, and the equivalent ratio of the functional group of the acrylic elastomer/the epoxy group of the epoxy resin is set to 1/1. ~1/20 and uses a powdered material with a particle size of 30 μm or less as a hardening agent, so it has excellent properties such as fast curing, soldering heat resistance, adhesive strength, and pot life, and is suitable for flexible printed wiring boards and component mounting. This has the effect of being able to provide an adhesive composition suitable for adhesion to reinforcing plates.
第１図はフレキシブル印刷配線板の補強部分の断面図で
ある。
（１）・・・フレキシブル印刷配線板、（′２Ｊ・・・
接着剤、Ｃ３）・・・補強板
（１）・・・フレキシブル印刷配線板
（２）・・・接着剤
（３）・・・補強板FIG. 1 is a sectional view of a reinforced portion of a flexible printed wiring board. (1)...Flexible printed wiring board, ('2J...
Adhesive, C3)...Reinforcement plate (1)...Flexible printed wiring board (2)...Adhesive (3)...Reinforcement plate
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2543589A JPH02202973A (en) | 1989-02-02 | 1989-02-02 | Adhesive composition for flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2543589A JPH02202973A (en) | 1989-02-02 | 1989-02-02 | Adhesive composition for flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02202973A true JPH02202973A (en) | 1990-08-13 |
Family
ID=12165908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2543589A Pending JPH02202973A (en) | 1989-02-02 | 1989-02-02 | Adhesive composition for flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02202973A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012073672A1 (en) * | 2010-11-29 | 2012-06-07 | ソニーケミカル＆インフォメーションデバイス株式会社 | Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| WO2012073703A1 (en) * | 2010-12-01 | 2012-06-07 | ソニーケミカル＆インフォメーションデバイス株式会社 | Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| JP2012184288A (en) * | 2011-03-03 | 2012-09-27 | Hitachi Chemical Co Ltd | Adhesive for circuit connection, adhesive sheet for circuit connection, and method for producing semiconductor device |
| JP2020083998A (en) * | 2018-11-22 | 2020-06-04 | 三菱ケミカル株式会社 | Adhesive layer, adhesive sheet and laminate |
| JP2021011520A (en) * | 2019-07-04 | 2021-02-04 | 三菱ケミカル株式会社 | Adhesive layer, adhesive sheet, and laminate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63304076A (en) * | 1987-06-04 | 1988-12-12 | Toagosei Chem Ind Co Ltd | One-pack type adhesive composition |
-
1989
- 1989-02-02 JP JP2543589A patent/JPH02202973A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63304076A (en) * | 1987-06-04 | 1988-12-12 | Toagosei Chem Ind Co Ltd | One-pack type adhesive composition |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012073672A1 (en) * | 2010-11-29 | 2012-06-07 | ソニーケミカル＆インフォメーションデバイス株式会社 | Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| JP2012116870A (en) * | 2010-11-29 | 2012-06-21 | Sony Chemical & Information Device Corp | Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| WO2012073703A1 (en) * | 2010-12-01 | 2012-06-07 | ソニーケミカル＆インフォメーションデバイス株式会社 | Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| JP2012116957A (en) * | 2010-12-01 | 2012-06-21 | Sony Chemical & Information Device Corp | Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| US9365754B2 (en) | 2010-12-01 | 2016-06-14 | Dexerials Corporation | Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| JP2012184288A (en) * | 2011-03-03 | 2012-09-27 | Hitachi Chemical Co Ltd | Adhesive for circuit connection, adhesive sheet for circuit connection, and method for producing semiconductor device |
| JP2020083998A (en) * | 2018-11-22 | 2020-06-04 | 三菱ケミカル株式会社 | Adhesive layer, adhesive sheet and laminate |
| JP2021011520A (en) * | 2019-07-04 | 2021-02-04 | 三菱ケミカル株式会社 | Adhesive layer, adhesive sheet, and laminate |
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