JP2724619B2 - Acrylic adhesive composition - Google Patents
Acrylic adhesive compositionInfo
- Publication number
- JP2724619B2 JP2724619B2 JP1169001A JP16900189A JP2724619B2 JP 2724619 B2 JP2724619 B2 JP 2724619B2 JP 1169001 A JP1169001 A JP 1169001A JP 16900189 A JP16900189 A JP 16900189A JP 2724619 B2 JP2724619 B2 JP 2724619B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- adhesive
- resin
- acrylic
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ 本発明はアクリル系接着剤組成物に関するものであ
り、特に高度の接着強度を有し、柔軟性、耐熱性および
耐溶剤性に優れたアクリル系接着剤組成物に関する。Description: TECHNICAL FIELD The present invention relates to an acrylic adhesive composition, and particularly to an acrylic having a high adhesive strength and excellent flexibility, heat resistance and solvent resistance. The present invention relates to a system-based adhesive composition.
＜従来の技術＞ 接着剤は電気機器、土木・建築材等にも広く用いられ
ているが特に近年、電子計算機、通信機器、計測・制御
機器、カメラ、時計、カーエレクトロニクス、各種OA機
器、家電製品、航空機計器、医療機器などの電気機器に
接着剤が多用されている。ところで近年の電子機器の高
密度化、配線の高精度化にともない、その信頼性を高め
るためより高度の接着強度、電気特性、耐熱性、耐溶剤
性および柔軟性を有する接着剤が求められるようになっ
た。また、生産性を向上するためにより低温、短時間で
接着できる接着剤が求められている。<Conventional technology> Adhesives are widely used in electrical equipment, civil engineering and construction materials, but in recent years, in particular, electronic computers, communication equipment, measurement and control equipment, cameras, watches, car electronics, various OA equipment, home appliances 2. Description of the Related Art Adhesives are frequently used in products, electrical instruments such as aircraft instruments and medical equipment. By the way, with the recent increase in the density of electronic devices and the increase in the precision of wiring, an adhesive having higher bonding strength, electrical properties, heat resistance, solvent resistance and flexibility has been required to enhance its reliability. Became. Further, there is a demand for an adhesive that can be bonded at a lower temperature and in a shorter time in order to improve productivity.
＜発明の課題＞ しかしながら、これらの要求特性の中で特に接着性／
耐熱性／柔軟性を同時に満足せしめる接着剤を求めるこ
とは極めて困難であった。例えば、接着剤として広く使
用されているエポキシ樹脂組成物の場合、すぐれた柔軟
性を得るためには可塑剤や可撓性エポキシ樹脂の併用が
必要であるが、この場合、接着性、耐熱性などの特性は
低下する。<Problems of the Invention> However, among these required characteristics, in particular, adhesiveness /
It has been extremely difficult to find an adhesive that satisfies both heat resistance and flexibility. For example, in the case of an epoxy resin composition widely used as an adhesive, it is necessary to use a plasticizer or a flexible epoxy resin in combination in order to obtain excellent flexibility. And other properties are degraded.
これらの問題を解決するため、アクリル樹脂及びフェ
ノール樹脂又はメラミン樹脂からなる接着剤が提案され
ている。又、特定のアクリル樹脂及びエポキシ樹脂から
なる接着剤が提案されている（特開昭62−174283号）。In order to solve these problems, an adhesive made of an acrylic resin and a phenol resin or a melamine resin has been proposed. Further, an adhesive comprising a specific acrylic resin and an epoxy resin has been proposed (JP-A-62-174283).
しかし、これらの接着剤では、より高度の接着性を得
るためには高温かつ長時間の加工（プレス時間）が必要
である。However, these adhesives require high-temperature and long-time processing (press time) in order to obtain higher adhesiveness.
＜課題の解決手段＞ 本発明者らは以上の諸問題を解決すべく鋭意検討を行
った結果、特殊のアクリル樹脂、エポキシ樹脂とメラミ
ン樹脂を併用してなる組成物がこれらの諸特性を満足せ
しめることを見出し、本発明に到達した。即ち、本発明
は、（ａ）10〜50重量％のアクリロニトリル若しくは、
メタクリロニトリルまたはそれらの混合物、（ｂ）45〜
85重量％のエチルアクリレート、ブチルアクリレート若
しくは２−エチルヘキシルアクリレートまたはそれらの
混合物、および（ｃ）２〜10重量％のアクリル酸、メタ
クリル酸若しくは、イタコン酸またはそれらの混合物の
共重合体であるアクリル樹脂（Ａ）75〜97重量％とエポ
キシ樹脂（Ｂ）２〜15重量％及びメラミン樹脂（Ｃ）１
〜10重量％からなる、ポリイミドフィルムと金属箔との
接着用アクリル系接着剤組成物である。<Means for Solving the Problems> The present inventors have conducted intensive studies to solve the above problems, and as a result, a composition using a special acrylic resin, an epoxy resin and a melamine resin in combination satisfies these characteristics. The present inventors have found that the present invention has led to the present invention. That is, the present invention relates to (a) 10 to 50% by weight of acrylonitrile or
Methacrylonitrile or a mixture thereof, (b) 45-
Acrylic resin which is a copolymer of 85% by weight of ethyl acrylate, butyl acrylate or 2-ethylhexyl acrylate or a mixture thereof, and (c) 2 to 10% by weight of acrylic acid, methacrylic acid or itaconic acid or a mixture thereof (A) 75 to 97% by weight, epoxy resin (B) 2 to 15% by weight and melamine resin (C) 1
An acrylic adhesive composition for bonding a polyimide film and a metal foil, comprising up to 10% by weight.
本発明に使用されるアクリル樹脂（Ａ）は（ａ）10〜
50重量％のアクリロニトリル若しくはメタクリロニトリ
ルまたはそれらの混合物、（ｂ）45〜85重量％のエチル
アクリレート、ブチルアクリレート若しくは２−エチル
ヘキシルアクリレートまたはそれらの混合物及び（ｃ）
２〜10重量のアクリル酸、メタクリル酸若しくはイタコ
ン酸またはそれらの混合物を含有する共重合体である。
これは通常のラジカル重合処方により、乳化重合、懸濁
重合、あるいは溶液重合などの方法によって合成するこ
とができる。また、本発明に用いられるエポキシ樹脂
は、架橋結合性を有する多官能エポキシ化合物であり、
好ましくは常温においては固体性状を示すものである。
このエポキシ樹脂は、基本骨格としてビスフェノールＡ
型、フェノールまたはクレゾールノボラック型、ジアミ
ノジフェニルメタン型などから誘導されたものはすべて
用いられるが、経済性、作業性などを考慮して、ビスフ
ェノールＡ型エポキシ樹脂でエポキシ当量が180〜2000
のものを使用するのが一般的である。The acrylic resin (A) used in the present invention is (a) 10-
50% by weight of acrylonitrile or methacrylonitrile or mixtures thereof, (b) 45-85% by weight of ethyl acrylate, butyl acrylate or 2-ethylhexyl acrylate or mixtures thereof and (c)
A copolymer containing 2 to 10% by weight of acrylic acid, methacrylic acid or itaconic acid or a mixture thereof.
This can be synthesized by an ordinary radical polymerization recipe, a method such as emulsion polymerization, suspension polymerization, or solution polymerization. The epoxy resin used in the present invention is a polyfunctional epoxy compound having cross-linking properties,
Preferably, it shows a solid property at normal temperature.
This epoxy resin has bisphenol A as its basic skeleton.
All types derived from the type, phenol or cresol novolac type, diaminodiphenylmethane type, etc. are used, but in consideration of economy, workability, etc., the epoxy equivalent of bisphenol A type epoxy resin is 180 to 2000.
It is common to use
また、本発明に使用されるメラミン樹脂は、市販のメ
ラミン樹脂で、メチル化メラミン樹脂、ブチル化メラミ
ン樹脂、メチル−ブチル化混合エーテル型メラミン樹脂
等すべて用いられるが、好ましくは常温において固体性
状を示すメチル化メラミン樹脂である。The melamine resin used in the present invention is a commercially available melamine resin, methylated melamine resin, butylated melamine resin, methyl-butylated mixed ether type melamine resin and the like are all used, but preferably have a solid state at room temperature. It is a methylated melamine resin shown.
又好ましくは、架橋結合性を有するメラミン化合物で
ある。Also preferred are melamine compounds having cross-linking properties.
これらの樹脂の配合比率はアクリル樹脂75〜97重量
％、エポキシ樹脂が２〜15重量％、メラミン樹脂１〜10
重量％である。メラミン樹脂が１重量％より少ない場合
は接着強度で劣りかつ短時間の加工（プレス）では高度
な接着性は得られず、10重量％より多い場合は耐熱性お
よび柔軟性で劣る。The mixing ratio of these resins is 75 to 97% by weight of acrylic resin, 2 to 15% by weight of epoxy resin, 1 to 10% of melamine resin.
% By weight. When the amount of the melamine resin is less than 1% by weight, the adhesive strength is poor, and a high degree of adhesiveness cannot be obtained by short-time processing (pressing). When the amount is more than 10% by weight, the heat resistance and the flexibility are inferior.
又、エポキシ樹脂が２重量％より少ない場合は、接着
強度で劣り、15重量％より多い場合は、耐熱性および柔
軟性で劣る。When the epoxy resin is less than 2% by weight, the adhesive strength is poor, and when it is more than 15% by weight, heat resistance and flexibility are poor.
また耐熱性を向上する手段として必要に応じて硬化促
進剤を用いてもよい。硬化促進剤としては、２−エチル
−４−メチルイミダゾールや２−フェニル−４−メチル
イミダゾールなどのイミダゾール類およびその誘導体、
２−エチルイミダゾリンなどのイミダゾリン類、ジメチ
ルベンジルアミンなどの三級アミン類などが一般的に用
いられるがこれらに限られるものではない。As a means for improving heat resistance, a curing accelerator may be used as necessary. Examples of the curing accelerator include imidazoles such as 2-ethyl-4-methylimidazole and 2-phenyl-4-methylimidazole and derivatives thereof,
Imidazolines such as 2-ethylimidazoline and tertiary amines such as dimethylbenzylamine are generally used, but not limited thereto.
接着剤組成物の形態としては、フィルム状、水分散状
あるいは溶液状などいずれでもよい。一般的な製造方法
としては、前記モノマー組成のアクリル共重合体を乳化
重合によって合成し、この乳化物に所定のエポキシ樹脂
及びメラミン樹脂を添加混合してからアルカリ増粘処方
によって希望する粘度に調整すれば、水分散型の接着剤
となる。また溶液型は、乳化重合によって得られたエマ
ルジョンを塩析によって固型物としてポリマーを分離
し、乾燥してからメチルエチルケトンまたはメチルイソ
ブチルケトンなどに代表される良溶剤中で所定のエポキ
シ樹脂及びメラミン樹脂と混合溶解せしめて好ましい濃
度と粘度を有する溶液に調整すればよい。更に、フィル
ム状接着剤の場合は、上記組成のメチルエチルケトンま
たはメチルイソブチルケトン等の溶液を一般的なキャス
ト法によって離型紙などの上に引き乾燥して得られる。The form of the adhesive composition may be any of a film form, an aqueous dispersion form, and a solution form. As a general production method, an acrylic copolymer having the above-mentioned monomer composition is synthesized by emulsion polymerization, a predetermined epoxy resin and a melamine resin are added to this emulsion, mixed and adjusted to a desired viscosity by an alkali thickening formulation. Then, a water-dispersed adhesive can be obtained. In the solution type, the emulsion obtained by emulsion polymerization is separated into solids by salting out, the polymer is separated, dried, and then dried in a good solvent represented by methyl ethyl ketone or methyl isobutyl ketone in a predetermined epoxy resin and melamine resin. May be mixed and dissolved to adjust the solution to have a preferred concentration and viscosity. Further, in the case of a film adhesive, it is obtained by drawing a solution of the above composition such as methyl ethyl ketone or methyl isobutyl ketone onto release paper or the like by a general casting method and drying.
この際のフィルム厚は樹脂濃度との関係から自由に調
整しながら作成できる。At this time, the film thickness can be prepared while freely adjusting the relationship with the resin concentration.
貼合は、接着剤がフィルムの場合は加熱圧着によって
行なわれ、水分散型あるいは溶液型は一旦被着体上に塗
布し、水あるいは溶剤を十分に蒸発乾燥させてから、同
様の加熱圧着によって実施される。接着条件としては通
常の熱プレス法によって10〜60kg/cm2の圧力下、130〜2
00℃、３〜60分間の加熱圧着が好ましい。When the adhesive is a film, the bonding is performed by thermocompression, and the water dispersion type or solution type is applied to the adherend once, and the water or solvent is sufficiently evaporated and dried. Will be implemented. The bonding conditions are 130 to 2 under a pressure of 10 to 60 kg / cm2 by a normal hot press method.
Thermocompression bonding at 00 ° C. for 3 to 60 minutes is preferred.
＜効 果＞ 本発明の接着剤組成物はすぐれた接着性、耐熱性、お
よび柔軟性を有するものであり、とくにフレキシブル印
刷回路基板（以下FPCとする）、シートコイル、テープ
キャリア等におけるポリイミドフィルムと銅箔等の金属
箔との接着において、すぐれた効果を発揮する。また、
FPCの補強に使用するガラスエポキシ板、金属板、耐熱
性熱可塑性樹脂とFPCや銅張りフレキシブル板（以下FCL
とする）との接着においても、すぐれた効果を発揮す
る。<Effects> The adhesive composition of the present invention has excellent adhesiveness, heat resistance, and flexibility, and particularly polyimide films for flexible printed circuit boards (hereinafter, referred to as FPC), sheet coils, tape carriers, and the like. It has an excellent effect on bonding between the metal foil and a metal foil such as a copper foil. Also,
Glass epoxy plate, metal plate, heat-resistant thermoplastic resin and FPC or copper-clad flexible plate (FCL)
) Also exhibits an excellent effect.
さらに、本発明の接着剤は、低温で低い時間の加工
（プレス）であってもすぐれた接着性が得られるので、
生産性の向上に寄与する。Furthermore, since the adhesive of the present invention can obtain excellent adhesiveness even at a low temperature for a short time (pressing),
It contributes to improving productivity.
本発明の接着剤組成物によってポリイミドフィルムと
銅箔とを接着した場合、貼合シートは極めて柔軟性に富
み、剥離強度は1kg/cm以上、ハンダ耐熱性（280℃）は3
0秒以上である。さらに酸、アルカリ、トリクレン、塩
化メチレン等に対する耐薬品性にもすぐれている。When the polyimide film and the copper foil are bonded by the adhesive composition of the present invention, the bonding sheet is extremely rich, the peel strength is 1 kg / cm or more, and the solder heat resistance (280 ° C.) is 3
0 seconds or more. Furthermore, it has excellent chemical resistance to acids, alkalis, trichlene, methylene chloride and the like.
＜実施例＞ 以下に本発明を実施例によって説明するが、本発明は
実施例のみに限定されるものではない。<Example> Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to the examples.
参考例−１ 還流冷却器、温度計、窒素ガス導入管を備えた500ml
−フラスコに、アクリロニトリル18.6g、ｎ−ブチルア
クリレート77g、メタアクリル酸4.3g、ジオクチルスル
ホコハク酸ナトリウム1.0gを仕込み、蒸留水200gを加え
て撹拌下に乳化状とする。これに、過硫酸カリウム0.3g
と亜硫酸水素ナトリウム0.1gを加え、窒素ガスを吹込み
内部の空気を完全に置換してから60℃まで１時間かけて
昇温し、窒素ガス気流下で３時間重合した。Reference Example-1 500 ml equipped with a reflux condenser, a thermometer, and a nitrogen gas inlet tube
-A flask is charged with 18.6 g of acrylonitrile, 77 g of n-butyl acrylate, 4.3 g of methacrylic acid, and 1.0 g of sodium dioctyl sulfosuccinate, and 200 g of distilled water is added thereto to form an emulsion under stirring. 0.3g of potassium persulfate
And 0.1 g of sodium hydrogen sulfite were added, nitrogen gas was blown in to completely replace the air inside, and then the temperature was raised to 60 ° C. over 1 hour, followed by polymerization for 3 hours under a nitrogen gas stream.
重合終了後、室温まで冷却し、塩化ナトリウム約30g
を徐々に添加してポリマーの塩析を行い、濾過・水洗を
３回繰返してから乾燥し、固型のアクリル共重合体96g
を得る。After the polymerization, cool to room temperature and add about 30 g of sodium chloride.
Is added slowly to carry out salting out of the polymer, and filtration and washing are repeated three times, and then dried to obtain 96 g of a solid acrylic copolymer.
Get.
参考例−２ 参考例−１で得られたアクリルポリマー32gをメチル
エチルケトン264gに溶解し、透明粘稠液を得る。この粘
稠液にスミエポキシESA−011（住友化学性ビスフィルム
Ａ型固型エポキシ樹脂）4.4gと、スミマールＭ−40S
（住友化学製メチル化メラミン樹脂、80％キシレン希釈
品）0.8gを加え、撹拌溶解し透明粘稠液を得る。Reference Example 2 A transparent viscous liquid is obtained by dissolving 32 g of the acrylic polymer obtained in Reference Example 1 in 264 g of methyl ethyl ketone. To this viscous liquid, 4.4 g of Sumiepoxy ESA-011 (Sumitomo Chemical Bisfilm A type solid epoxy resin) and Sumimar M-40S
0.8 g of methylated melamine resin (manufactured by Sumitomo Chemical, diluted in 80% xylene) is added and dissolved by stirring to obtain a transparent viscous liquid.
参考例−３ 参考例−１で得られたアクリルポリマー32gをメチル
エチルケトン264gに溶解し、スミマールＭ−40Sの2.4g
及びスミエポキシESA−011の4.4gを加え、撹拌溶解し透
明粘稠液を得る。Reference Example-3 32 g of the acrylic polymer obtained in Reference Example-1 was dissolved in 264 g of methyl ethyl ketone, and 2.4 g of Sumimar M-40S was dissolved.
And 4.4 g of Sumiepoxy ESA-011 were added and dissolved by stirring to obtain a transparent viscous liquid.
参考例−４ 参考例−１で得られたアクリルポリマー32gをメチル
エチルケトン264gに溶解し、スミエポキシESA−011の4g
を加え、撹拌溶解し透明粘稠液を得る。Reference Example-4 32 g of the acrylic polymer obtained in Reference Example-1 was dissolved in 264 g of methyl ethyl ketone, and 4 g of Sumiepoxy ESA-011 was dissolved.
And dissolve with stirring to obtain a transparent viscous liquid.
実施例−１ 参考例−２で得た粘稠液をポリプロコートの離型紙上
にボックスコーターを用いて流延し、常温〜130℃の温
度で乾燥させ30〜50ミクロン厚のポリマーフィルムを得
る。Example-1 The viscous liquid obtained in Reference Example-2 was cast on a polyprocoat release paper using a box coater, and dried at room temperature to 130 ° C to obtain a polymer film having a thickness of 30 to 50 microns. .
得られたフィルム状接着剤を、カプトン ポリイミ
ドフィルム（Du Pont社製品）と銅箔（古河サーキット
ホイル社TSTO処理品）との間にはさみ、25kg/cm2、180
℃の条件で40分の熱プレスを行った。得られた貼合物に
ついて剥離強度、ハンダ耐熱性を測定した。結果を第１
表に示す。 The resulting film-like adhesive is Kapton Polyimi
Film (Du Pont product) and copper foil (Furukawa Circuit)
Between foil and TSTO products), 25kg / cmTwo, 180
Heat pressing was performed at 40 ° C. for 40 minutes. On the resulting glue
Then, peel strength and solder heat resistance were measured. First result
It is shown in the table.
得られたフィルム状接着剤を、と同様の被着体の
間に挟み、25kg/cm2、160℃の条件で３分の熱プレスを
行った。得られた貼合物について剥離強度、ハンダ耐熱
性を測定した。結果を第１表に示す。The obtained film adhesive was sandwiched between adherends similar to the above, and hot-pressed at 25 kg / cm 2 and 160 ° C. for 3 minutes. The peel strength and solder heat resistance of the obtained bonded product were measured. The results are shown in Table 1.
得られたフィルム状接着剤を、アルミ板（0.9mm
厚）とFCL（東レDu Pont社製ポリイミド面）との間には
さみ、30kg/cm2、160℃の条件で３分の熱プレスを行っ
た。所定時間後、プレス圧を開放し、ただちに接着面の
剥離（フクレ）の有無を目視により確認した。結果を第
１表に示す。The obtained film adhesive was applied to an aluminum plate (0.9 mm
Thickness) and FCL (polyimide surface manufactured by Toray Du Pont) and hot-pressed at 30 kg / cm 2 and 160 ° C. for 3 minutes. After a predetermined time, the press pressure was released, and immediately the presence or absence of peeling (swelling) of the adhesive surface was visually confirmed. The results are shown in Table 1.
実施例−２ 参考例−３で得られた粘稠液を、実施例−１と全く同
様の方法によりポリマーフィルムとした後に、実施例−
１と全く同様な方法で剥離強度、ハンダ耐熱性等を測定
した。Example-2 The viscous liquid obtained in Reference Example-3 was converted into a polymer film in the same manner as in Example-1.
The peel strength, solder heat resistance and the like were measured in exactly the same manner as in Example 1.
比較例−１ 参考例−４で得られた粘稠液を、実施例−１と全く同
様の方法によりポリマーフィルムとした後に、実施例−
１と全く同様な方法で剥離強度、ハンダ耐熱性等を測定
した。Comparative Example-1 The viscous liquid obtained in Reference Example-4 was converted into a polymer film by the same method as in Example-1.
The peel strength, solder heat resistance and the like were measured in exactly the same manner as in Example 1.
比較例−２ スミエポキシESA−011（住友化学製ビスフェノールＡ
型固型エポキシ樹脂）を100g、可とう性付与剤として非
反応性のジブチルフタレート18g、およびジシアンジア
ミド4g、２−エチル−４−メチルイミダゾール0.5gを45
gのメチルセロソルブおよび10gのメチルエチルケトンに
溶解し、実施例−１と同様の方法でキャストフィルムを
得た。Comparative Example-2 Sumiepoxy ESA-011 (Bisphenol A manufactured by Sumitomo Chemical Co., Ltd.)
Mold solid epoxy resin), 45 g of non-reactive dibutyl phthalate (18 g) as a flexibility-imparting agent, 4 g of dicyandiamide, and 0.5 g of 2-ethyl-4-methylimidazole.
g of methyl cellosolve and 10 g of methyl ethyl ketone, and a cast film was obtained in the same manner as in Example-1.
その後、実施例−１と全く同様な方法により貼合物を
得、剥離強度、ハンダ耐熱性等を測定した。結果を第１
表に示す。Thereafter, a bonded product was obtained in exactly the same manner as in Example 1, and the peel strength, solder heat resistance, and the like were measured. First result
It is shown in the table.
比較例３ アクリロニトリル、ブチルアクリレートとメタアクリ
ル酸からなる共重合体およびフェノール樹脂からなる市
販のフィルム状接着剤（パイララックスLF、50μｍ厚、
Du Pont社製）をポリマーフィルムとして用い実施例−
１と全く同様方法で剥離強度及びハンダ耐熱性等を測定
した。結果を第１票に示す。Comparative Example 3 A commercially available film adhesive composed of acrylonitrile, a copolymer composed of butyl acrylate and methacrylic acid, and a phenol resin (Piralux LF, 50 μm thick,
Example using Du Pont) as a polymer film
Peel strength, solder heat resistance, etc. were measured in exactly the same manner as in Example 1. The results are shown in the first vote.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 今井 孝太郎 奈良県奈良市平松４丁目16―17 (56)参考文献 特開 昭55−147578（ＪＰ，Ａ) 特公 昭40−8143（ＪＰ，Ｂ１) 特公 昭36−16939（ＪＰ，Ｂ１) 特公 昭48−9463（ＪＰ，Ｂ１) 特公 昭47−51809（ＪＰ，Ｂ１) ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Kotaro Imai 4-16-17 Hiramatsu, Nara City, Nara Prefecture (56) References JP-A-55-147578 (JP, A) JP-B-40-8143 (JP, B1) ) JP-B-36-16939 (JP, B1) JP-B-48-9463 (JP, B1) JP-B-47-51809 (JP, B1)
Claims (1)
しくは、メタクリロニトリルまたはそれらの混合物、
（ｂ）45〜85重量％のエチルアクリレート、ブチルアク
リレート若しくは２−エチルヘキシルアクリレートまた
はそれらの混合物、および（ｃ）２〜10重量％のアクリ
ル酸、メタクリル酸若しくは、イタコン酸またはそれら
の混合物の共重合体であるアクリル樹脂（Ａ）75〜97重
量％とエポキシ樹脂（Ｂ）２〜15重量％及びメラミン樹
脂（Ｃ）１〜10重量％からなる、ポリイミドフィルムと
金属箔との接着用アクリル系接着剤組成物。(A) 10 to 50% by weight of acrylonitrile or methacrylonitrile or a mixture thereof,
(B) copolymerization of 45-85% by weight of ethyl acrylate, butyl acrylate or 2-ethylhexyl acrylate or a mixture thereof, and (c) 2-10% by weight of acrylic acid, methacrylic acid or itaconic acid or a mixture thereof. Acrylic adhesive for bonding polyimide film and metal foil, comprising 75 to 97% by weight of acrylic resin (A), 2 to 15% by weight of epoxy resin (B), and 1 to 10% by weight of melamine resin (C) Composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1169001A JP2724619B2 (en) | 1989-06-29 | 1989-06-29 | Acrylic adhesive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1169001A JP2724619B2 (en) | 1989-06-29 | 1989-06-29 | Acrylic adhesive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0333174A JPH0333174A (en) | 1991-02-13 |
| JP2724619B2 true JP2724619B2 (en) | 1998-03-09 |
Family
ID=15878510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1169001A Expired - Fee Related JP2724619B2 (en) | 1989-06-29 | 1989-06-29 | Acrylic adhesive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2724619B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5461106A (en) * | 1994-12-12 | 1995-10-24 | The Dow Chemical Company | Latent initiator of N-base acid salt-containing emulsion polymer |
| KR100393822B1 (en) * | 2001-01-06 | 2003-08-06 | 한울주식회사 | A composition of photosetting acrylic adhesives |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55147578A (en) * | 1979-05-09 | 1980-11-17 | Nippon Carbide Ind Co Ltd | Adhesive composition |
-
1989
- 1989-06-29 JP JP1169001A patent/JP2724619B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0333174A (en) | 1991-02-13 |
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