KR19990084381A - Conductive Adhesive Tape - Google Patents

Conductive Adhesive Tape Download PDF

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Publication number
KR19990084381A
KR19990084381A KR1019980016100A KR19980016100A KR19990084381A KR 19990084381 A KR19990084381 A KR 19990084381A KR 1019980016100 A KR1019980016100 A KR 1019980016100A KR 19980016100 A KR19980016100 A KR 19980016100A KR 19990084381 A KR19990084381 A KR 19990084381A
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South Korea
Prior art keywords
conductive adhesive
adhesive tape
tape
metal
conductive
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KR1019980016100A
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Korean (ko)
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KR100267814B1 (en
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이용인
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이용인
신화물산 주식회사
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Priority to KR1019980016100A priority Critical patent/KR100267814B1/en
Priority to JP03769099A priority patent/JP3226889B2/en
Priority to US09/253,927 priority patent/US6235385B1/en
Priority to CN99104404A priority patent/CN1105762C/en
Publication of KR19990084381A publication Critical patent/KR19990084381A/en
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Publication of KR100267814B1 publication Critical patent/KR100267814B1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/045—Presence of homo or copolymers of ethene in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C09J2423/106—Presence of homo or copolymers of propene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesive Tapes (AREA)

Abstract

본 발명은 전기, 전자 제품을 포함하여 통전성(通電性)을 부여하면서 접착, 고정 또는 연결시키고저 하는 분야에서 사용되는 도전성 점착테이프에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to conductive adhesive tapes used in the fields of bonding, fixing or connecting while imparting electrical conductivity, including electrical and electronic products.

일면에 진공증착방법으로 금속박층(Thin metal film layer)을 증착시킨 합성수지필름의 금속증착면에 도전성 점착제층을 도포하여 테이프 전체의 두께를 극히 얇게한 도전성 점착테이프에 관한 것으로서, 테이프 전체의 두께를 극히 얇게 구성시켜 테이프가 높은 유연성을 갖게 함으로써 밀착성을 개선하여 우수한 도전성을 유지할 수 있도록 함과 동시에 종래 제품에 비하여 제조공정이 간단하고 절단사용시 사용이 편리하도록 한 도전성 점착테이프에 관한 것이다.The present invention relates to a conductive adhesive tape in which the entire thickness of the tape is extremely thin by applying a conductive adhesive layer to the metal deposition surface of the synthetic resin film in which a thin metal film layer is deposited by vacuum deposition on one surface. The present invention relates to a conductive adhesive tape that is made extremely thin and has a high flexibility, thereby improving adhesion and maintaining excellent conductivity, and at the same time, making the manufacturing process simpler and easier to use when cutting and cutting than conventional products.

Description

도전성 점착테이프Conductive Adhesive Tape

본 발명은 도전성(導電性) 점착(粘着)테이프에 관한 것이다. 도전성 점착테이프는 전기, 전자제품을 포함하여 통전성(通電性)을 부여하면서 접착, 고정 또는 연결시키는 분야에서 광범위하게 사용되고 있다.The present invention relates to a conductive adhesive tape. Conductive adhesive tapes are widely used in the fields of bonding, fixing, or connecting while providing electrical conductivity, including electrical and electronic products.

도전성 점착테이프는 텔레비젼 같은 영상기구를 조립할때 브라운관(Braun tube)을 고정시키는 역활을 하면서 브라운관 외주면에 집적(集積)되는 정전기 및 전자파를 통전(通電)시켜 제거시키는데 또는 자동차나 전자 제품의 조립공정에도 널리 이용되고 있다.Conductive adhesive tape plays a role of fixing Braun tube when assembling video equipment such as TV, and removes electricity by electrostatic and electromagnetic wave accumulated on outer surface of Braun tube or in assembly process of automobile or electronic product. It is widely used.

일반적으로 브라운관은 유리로 되어 있고 내부가 진공이어서 외부충격으로 파손될 위험이 있으므로 직접 케이싱이나 하우징에 고정시키지 못하고 금속으로 된 브랑켓을 브라운관의 외주에 점착 고정시킨 다음 이 브랑켓을 이용하여 케이싱 또는 하우징에 고정시킨다.In general, the CRT is made of glass and the inside is vacuum, which can be damaged by external shock. Therefore, the CRT can not be directly fixed to the casing or housing, but the metal bracket is adhesively fixed to the circumference of the CRT. Fix it to

이와같이 완충 점착제 테이프를 사용하여 브라운관을 브랑켓에 고정시켜 주므로서 브라운관의 파손을 방지하고 외부충격이나 사고에 의하여 브라운관이 폭발하는 경우에도 파편의 비산 범위를 극소화시킬 수 있다.Thus, by fixing the CRT to the blanket by using the buffer tape, the breakage of the CRT can be prevented and the scattering of fragments can be minimized even when the CRT explodes due to an external impact or accident.

철제 브랑켓을 브라운관에 고정시키는데 사용되는 점착테이프로서 도전성 테이프를 사용하는 이유는 브라운관 외연부에 집적되는 정전기 및 전자파의 발산을 막아주기 위한 것이다.The reason why the conductive tape is used as the adhesive tape used to fix the iron blanket to the CRT is to prevent the discharge of static electricity and electromagnetic waves accumulated on the CRT edge.

텔레비젼과 같은 영상기구에 사용하는 브라운관은 영상을 형성시키는 방법때문에 내부에 극히 높은 전압을 걸어주어야 한다. 그 결과 외연부에는 정전기가 발생하게 되고 발생된 정전기를 제거시키지 못하게 되면 정전기의 집적으로 자기장과 전기장을 형성하게 되고 그 결과 전자파를 외부로 발산하게 된다.CRTs used in video equipment such as televisions require extremely high voltages inside because of the way the images are formed. As a result, when the static electricity is generated in the outer edge portion and the static electricity cannot be removed, the magnetic field and the electric field are formed by the accumulation of static electricity, and as a result, electromagnetic waves are emitted to the outside.

브라운관의 용도가 확대됨에 따라 사용자가 만지거나 직접 접촉하게 되는 기회가 점점 늘어나고 있으며 정전기 및 전자파는 인체에는 물론 브라운관의 기능에도 나쁜 영향을 미치게 된다. 사용자가 정전기와 과대하게 접촉하게 되면 통전(通電)으로 인한 불쾌감을 느끼는 것은 물론 각종 질병의 원인이 될 수도 있으며, 정전기에 의한 전자 회로의 난조(亂調)와 극단적으로는 화상이 떨리는 현상을 나타난다.As the use of CRTs expands, there is an increasing opportunity for users to touch or contact them directly, and static electricity and electromagnetic waves adversely affect the function of CRT as well as the human body. Excessive contact with static electricity may result in unpleasant feelings caused by energization and cause various diseases, and may result in the hunt of electronic circuits due to static electricity and extremely trembling images. .

이러한 정전기의 집적을 방지하기 위하여 현재 여러가지 방법이 시도되고는 있는데 그중 하나의 방법이 도전성 점착테이프를 사용하는 방법이다.Various methods have been tried to prevent the accumulation of static electricity, and one of them is a method of using a conductive adhesive tape.

도전성 점착테이프를 임의의 길이로 절단하여 이를 브라운관 외연에 등간격으로 점착한 후 철제 방폭밴드에 점착시켜 상호 통전되도록 함으로서 정전기가 방폭밴드를 거쳐 케비넷에 비치한 "어스 회로"를 통하여 방출하게 하는 것이다.The conductive adhesive tape is cut into arbitrary lengths and attached to the outer edge of the CRT at equal intervals, and then adhered to an iron explosion-proof band so as to conduct electricity. .

종래 이러한 용도로 이용되고 있는 도전성 점착테이프로서는 제 1도에 도시된 바와같이 동(銅), 알루미늄 등의 도전성 금속박(foil)과 도전성 점착제 및 이형지(離型紙)로 구성된 것이 보편적으로 사용되고 있다. 물론 점착테이프로 사용할 때는 이형지를 분리한 후 사용한다.Conventionally, as the conductive adhesive tape used for such a purpose, as shown in FIG. 1, a conductive metal foil such as copper or aluminum, a conductive adhesive and a release paper are commonly used. Of course, when using the adhesive tape, remove the release paper.

이 도전성 테이프는 알루미늄 호일(Aluminium foil), 동 호일(Copper foil)등의 도전성 금속박을 이형지 표면에 도전성 점착제를 도포하여서 된 것의 도전성 점착제층과 접착시켜 구성하거나 도전성 금속박 표면을 이형(離型) 처리하여 이형지 없이도 권취할 수 있도록 구성되어 있다.The conductive tape is formed by bonding a conductive metal foil such as aluminum foil or copper foil to a conductive adhesive layer obtained by applying a conductive adhesive on the surface of a release paper, or releasing the surface of the conductive metal foil. It is configured to be wound without release paper.

여기에서 도전성 점착제라 함은 고무 또는 아크릴계 수지를 유기용제에 용해시켜서된 점착성 물질에 일정량 이상의 도전성 금속분말을 첨가하여 첨가된 금속분말의 양에 따라 적절한 도전성을 보유하게한 점착제를 말한다.The conductive adhesive herein refers to an adhesive that has a suitable conductivity according to the amount of the metal powder added by adding a predetermined amount or more of the conductive metal powder to the adhesive material obtained by dissolving a rubber or acrylic resin in an organic solvent.

동, 알루미늄, 닉켈, 크롬, 흑연 등의 도전성 금속분말의 첨가량은 점착성물질 약 100 중량부에 대하여 100메쉬 이하 크기의 도전성 금속분말 50∼200 중량부 정도이다.The addition amount of conductive metal powders such as copper, aluminum, nickel, chromium and graphite is about 50 to 200 parts by weight of the conductive metal powder having a size of 100 mesh or less with respect to about 100 parts by weight of the adhesive material.

도전성 금속분말의 첨가량에 따라 점착제층의 두께와 점착테이프의 전기저항 값을 조정할 수 있다.According to the addition amount of an electroconductive metal powder, the thickness of an adhesive layer and the electrical resistance value of an adhesive tape can be adjusted.

그러나 금속박층과 도전성 점착제층으로 구성된 종래의 도전성 점착테이프는 금속박이 유연성과 신장율(伸張率)이 나쁘기 때문에 쉽게 구겨지거나 잘찢어지며 손으로 절단하고저 할때 길이 방향에 대하여 수직으로 찢어지지 않으며 표면 색상이 알루미늄이나 동의 금속색상이 그대로 나타나게 되므로 주변과 어울리는 색상이 조화(調和)를 이루지 못한다는 단점이 있다. 또한 유연성이 낮기 때문에 굴곡이 있는 부분에 사용시에는 접착성이 나빠서 고정력과 통전성이 떨어지는 단점이 있다.However, the conventional conductive adhesive tape composed of a metal foil layer and a conductive adhesive layer is easily wrinkled or torn because the metal foil has poor flexibility and elongation, and does not tear perpendicularly to the longitudinal direction when cut by hand. Since the color of aluminum or copper metal appears as it is, there is a disadvantage in that the colors that match the surroundings do not harmonize. In addition, since the flexibility is low, there is a disadvantage in that the adhesive strength is poor when used in the portion having a bend and the conductivity is inferior.

동박의 경우 표면의 산화로 청록색 내지 흙갈색의 산화동으로 변화되며 산화동은 비도전성이므로 도전성 점착테이프로서의 통전성이 낮아진다는 문제가 발생하게 된다.In the case of copper foil, the surface is oxidized to blue-brown to earthy brown copper oxide, and the copper oxide is non-conductive, so that the electricity conduction as the conductive adhesive tape is lowered.

또한 종래의 금속박(metal foil)을 사용한 것은 그 두께가 7∼15μ 정도로서 비교적 두꺼운 편이어서 철제밴드와 접착시 잘 구겨지고 또 잘 구겨지기 때문에 면접착이 잘 이루어지지 않고 자체 금속두께로 인하여 유연성이 떨어지기 때문에 굴곡이 있는 면에서의 균일한 면접착(面接着)을 위하여는 인위적인 힘을 가하거나 치구(治具)를 사용하여 밀착시켜 주어야 하는 불편이 있고, 금속박층이 잘 구겨져서 외관이 불량하게 되는 성질이 있을 뿐 아니라 이러한 점착테이프는 통전성만 유지하면 되므로 인장강도 등은 요구되지 않는데 금속박의 두께 때문에 테이프의 두께가 너무 두껍게 되어 생산비용이 증대된다는 단점이 있다.In addition, the use of a conventional metal foil (metal foil) is a relatively thick, 7 ~ 15μ thick, because it is creased and creased well when bonding with the iron band is not good adhesion to the surface due to its own metal thickness is less flexible For uniform surface adhesion on the curved surface, it is inconvenient to apply artificial force or close by using jig, and the metal foil layer is wrinkled well so that the appearance is poor. In addition, the adhesive tape is required only to maintain electrical conductivity, so tensile strength is not required. However, the thickness of the tape is too thick due to the thickness of the metal foil, which increases the production cost.

본 발명은 일면에 금속증착층을 증착시킨 합성수지 필름의 금속증착층 위에 점착제를 도포하여서 된 도전성 점착테이프를 제공하므로서 일정한 강도를 유지하면서 유연성이 좋아 굴곡면에서의 면접착을 용이하게 유지시켜 줄 수 있고 통전성을 유지하면서 제조공정상 생산성이 높고 원자재 사용면에서도 생산원가 절감효과가 크고 전자제품의 경량화에도 부응되는 도전성 점착테이프를 제공하고저 하는 것이다.The present invention provides a conductive adhesive tape formed by applying an adhesive on the metal deposition layer of the synthetic resin film in which the metal deposition layer is deposited on one surface, while maintaining a constant strength, it is easy to maintain surface adhesion on the curved surface. It is to provide a conductive adhesive tape that has high productivity in the manufacturing process, high production cost reduction effect in terms of raw materials, and low weight of electronic products while maintaining electrical conductivity.

제 1도는 종래의 도전성 점착테이프의 단면도이고1 is a cross-sectional view of a conventional conductive adhesive tape

제 2도는 본 발명의 도전성 점착테이프의 단면도이다.2 is a cross-sectional view of the conductive adhesive tape of the present invention.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

1 : 도전성 점착제층 2 : 금속박층 3 : 이형지DESCRIPTION OF SYMBOLS 1 Conductive adhesive layer 2 Metal foil layer 3 Release paper

4 : 금속증착층 5 : 합성수지필름층4: metal deposition layer 5: synthetic resin film layer

본 발명은 폴리에틸렌(이하 PE라 한다)이나 폴리에틸렌테이프탈레이트(이하 PET라 한다), 폴리프로필렌, 또는 나이론과 같은 플라스틱 필름의 일면에 진공증착방법(Vacuum Evaporating Coating)으로 알루미늄 등의 금속을 Å(옹그스트롬, 10-8cm : 0.1mμ) 단위의 극히 얇은 두께로 증착시키고 금속증착층 위에 도전성 점착제를 도포하여서 된 도전성 점착테이프에 관한 것이다. 이때 증착층을 형성하는 금속으로는 알루미늄, 구리, 은, 놋쇠(Brass) 등을 사용할 수 있다.According to the present invention, a metal such as aluminum is deposited on a surface of a plastic film such as polyethylene (hereinafter referred to as PE), polyethylene tapephthalate (hereinafter referred to as PET), polypropylene, or nylon. The present invention relates to a conductive adhesive tape obtained by depositing an extremely thin thickness in units of strom, 10 −8 cm: 0.1 mμ) and applying a conductive adhesive on a metal deposition layer. In this case, aluminum, copper, silver, brass, or the like may be used as the metal for forming the deposition layer.

금속층의 두께를 10Å 정도가 되도록 하고, 합성수지 필름의 두께를 10∼15μ, 도전성 점착제층의 두께를 25∼45μ 정도로 하여 본 발명의 테이프를 구성시켜 주게 되면 테이프 전체의 두께가 40∼60μ정도로서 현재 사용하고 있는 테이프들에 비하여 그 두께를 수준으로 유지시켜 주면서 통전성에는 전여 영향을 주기 않고 유연성이 좋아 접착성을 개선시켜 줄 수 있다.When the thickness of the metal layer is set to about 10 ,, the thickness of the synthetic resin film is about 10 to 15μ, and the thickness of the conductive adhesive layer is about 25 to 45μ, the tape of the present invention is constituted. Compared to the tapes Maintaining this level can improve the adhesiveness with good flexibility without affecting the electrical conductivity.

본 발명의 도전성 점착테이프는 공지의 금속박층을 갖는 도전성 점착테이프에 비하여 잘 구겨지지 않으며 증착금속의 선택에 따라 임의의 색상을 부여할 수 있으며 금속증착층 위에 도전성 점착제가 도포되어 있어 시간이 경과하여도 도전성 증착층의 산화가 일어나지 않기 때문에 유전율(誘電率)의 감소도 일어나지 않는 등의 장점을 갖는다. 이하 본 발명의 테이프 제조방법을 실시예를 들어 설명한다.The conductive adhesive tape of the present invention is less wrinkled than the conductive adhesive tape having a known metal foil layer and can be given any color according to the choice of the deposited metal. In addition, since the oxidation of the conductive deposition layer does not occur, there is an advantage such that no decrease in dielectric constant occurs. Hereinafter, the tape manufacturing method of the present invention will be described with reference to Examples.

실시예Example

○ 아크릴점착제 100 중량부○ 100 parts by weight of acrylic adhesive

(고형분 40%)(40% solids)

○ 평균입도 100메쉬 동분말 50 중량부○ 50 parts by weight of average particle size 100 mesh copper powder

상기 성분들을 균일하게 혼합하여 아크릴계 도전성 점착제를 만든다.The components are uniformly mixed to form an acrylic conductive adhesive.

상기의 도전성 점착제는 이 분야에서 이미 사용되고 있는 도전성 금속분말을 함유하는 고무 또는 아크릴 수지계의 잘 알려져 있는 점착제이다.Said conductive adhesive is a well-known adhesive of rubber | gum or acrylic resin containing the conductive metal powder already used in this field | area.

별도로 금속증착층을 증착시킬 두께 15μ의 PET 필름 일면에 금속증기가 잘 접착되도록 그라비아인쇄 방법으로 접착제를 도포한다. 접착제가 도포된 PET 필름을 진공조내에서 일정속도로 이동시키면서 Al 금속을 증발시켜 Al 증착층의 두께를 10Å 정도되도록 증착시킨다. 이러한 합성수지필름에 알루미늄 등의 금속을 증착시키는 방법은 이미 이 분야에서 잘 알려져 있는 기술이다.Separately, an adhesive is applied by a gravure printing method so that metal vapor is well adhered to one surface of a 15 μm-thick PET film on which a metal deposition layer is to be deposited. The PET film coated with the adhesive is evaporated while moving at a constant speed in a vacuum chamber to deposit the Al deposition layer to a thickness of about 10 Al. The method of depositing a metal such as aluminum on such a synthetic resin film is a technique well known in the art.

이렇게 하여서 얻은 알루미늄 금속증착층을 형성한 PET 필름의 알루미늄 금속증착층 위에 상기한 도전성 점착제를 30μ정도의 두께로 도포, 건조시키면 본 발명의 점착테이프가 완성된다. 이렇게 하여 만들어진 점착테이프의 전체두께는 45μ정도이었다.The adhesive tape of the present invention is completed by applying and drying the above-mentioned conductive adhesive to a thickness of about 30 mu on the aluminum metal deposition layer of the PET film having the aluminum metal deposition layer thus obtained. The total thickness of the adhesive tape thus produced was about 45 mu.

본 발명의 점착테이프는 금속피막이 진공증착으로 Å단위의 미세증착층인 관계상 금속필름이라고 하여도 피착물(프라스틱필름)과 함께 일체성을 유지하여 일정한 강도를 유지하면서 유연성(굴곡성)이 좋고 이면에 도전성 점착제를 도포하므로서 색상변화가 없으며 테이프 제조공정상 생산성이 높고 균일한 제품을 생산 할 수 있으며 원자재 사용면에서도 생산 원가 절감효과가 크며 특히 테이프의 점착면이 균일한 평활성을 유지할 수 있어 제 1도에 도시한 공지의 테이프에 비하여 Al증착층의 두께가 극히 얇아 도전성을 갖는 테이프로서 그 원가 절감효과가 크다. 이와같이 생산된 테이프가 실제 전기, 전자 제품의 정전기제거, 전자파를 차단, 흡수, 감소, 증화 할 수 있는 부위에 적용하였을시 일반 프라스틱필름제품과 같이 부드러우면서 그 면이 평활하여 점착하고자 하는 부위에 잘 접착되고 잘 떨어지지 않으며 접착면에 힘을 가하지 않아도 잘 밀착되어 도전성 효과를 극대화 할 수 있는 완벽한 평면 접착을 이룬다. 작업자의 생산성 향상은 물론 통전효과의 극대화 및 원가절감의 효과가 극대하다. 앞으로 각종 전기, 전자제품 등에서 정전기, 전자파등 환경공해를 방지, 감소 차단시킬 수 있는 테이프로서 이점이 크며 전자제품에서 요구하는 경량화에도 부응되는 제품이라 하겠다.The adhesive tape of the present invention has a good flexibility (flexibility) while maintaining a uniform strength by maintaining the integrity with the adherend (plastic film) even though the metal film is a microdeposition layer of a unit of metal by vacuum deposition. By applying conductive adhesive on the surface, there is no color change, and it is possible to produce uniform product with high productivity in tape manufacturing process, and it is possible to reduce production cost in terms of using raw materials, and in particular, the adhesive surface of tape can maintain uniform smoothness. Compared with the known tape shown in Fig. 1, the Al deposition layer has a very thin thickness, which is conductive and has a large cost reduction effect. When the tape produced in this way is applied to the part that can remove static electricity of electric and electronic products, block, absorb, reduce and increase the electromagnetic wave, it is soft and smooth like the general plastic film product. It adheres well, does not come off easily, and it adheres well without applying force to the adhesive surface to achieve perfect flat adhesion to maximize the conductive effect. In addition to improving worker productivity, the effect of maximizing the energization effect and cost reduction is enormous. In the future, it is a tape that can prevent, reduce and block environmental pollution such as static electricity and electromagnetic waves in various electric and electronic products, and it is a product that meets the light weight required by electronic products.

Claims (3)

도전성 점착제층을 갖는 도전성 점착테이프에 있어서, 일면에 금속증착층을 증착시킨 합성수지 필름의 금속증착층 위에 도전성 점착제를 도포하여서 된 도전성 점착테이프.A conductive adhesive tape having a conductive adhesive layer, wherein the conductive adhesive tape is obtained by applying a conductive adhesive on a metal deposition layer of a synthetic resin film on which a metal deposition layer is deposited on one surface. 제1항에 있어서, 합성수지필름이 폴리에틸렌, 폴리프로필렌, 나일론 또는 폴리에틸렌테레프탈레이트로 된 합성수지필름인 도전성 점착테이프.The conductive adhesive tape according to claim 1, wherein the synthetic resin film is a synthetic resin film made of polyethylene, polypropylene, nylon, or polyethylene terephthalate. 제1항에 있어서, 금속증착층이 알루미늄, 은, 동, 놋쇠(Brass) 중에서 선택된 금속증착층인 도전성 점착테이프.The conductive adhesive tape according to claim 1, wherein the metal deposition layer is a metal deposition layer selected from aluminum, silver, copper, and brass.
KR1019980016100A 1998-05-06 1998-05-06 Conductive adhesive tape KR100267814B1 (en)

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KR1019980016100A KR100267814B1 (en) 1998-05-06 1998-05-06 Conductive adhesive tape
JP03769099A JP3226889B2 (en) 1998-05-06 1999-02-16 Conductive adhesive tape
US09/253,927 US6235385B1 (en) 1998-05-06 1999-02-22 Electrically conductive adhesive tape
CN99104404A CN1105762C (en) 1998-05-06 1999-03-24 Electrically conductive adhesive tape

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100774440B1 (en) * 2007-01-17 2007-11-08 조인셋 주식회사 Conductive pressure sensitive adhesive tape
KR101229058B1 (en) * 2011-09-23 2013-02-04 임동영 Film for shielding electromagnetic wave and radiating heat of cellular phone
CN107247173A (en) * 2017-07-12 2017-10-13 荆州市荆力工程设计咨询有限责任公司 A kind of flexible anti-leak protection band measured for polymer insulated cable conduction current
CN108300359A (en) * 2016-09-19 2018-07-20 东莞爵士先进电子应用材料有限公司 High conductivity adhesive tape and preparation method thereof
CN115612422A (en) * 2022-09-29 2023-01-17 江苏鼎功电子科技有限公司 Preparation method of high-strength adhesive tape

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100774440B1 (en) * 2007-01-17 2007-11-08 조인셋 주식회사 Conductive pressure sensitive adhesive tape
KR101229058B1 (en) * 2011-09-23 2013-02-04 임동영 Film for shielding electromagnetic wave and radiating heat of cellular phone
CN108300359A (en) * 2016-09-19 2018-07-20 东莞爵士先进电子应用材料有限公司 High conductivity adhesive tape and preparation method thereof
CN107247173A (en) * 2017-07-12 2017-10-13 荆州市荆力工程设计咨询有限责任公司 A kind of flexible anti-leak protection band measured for polymer insulated cable conduction current
CN115612422A (en) * 2022-09-29 2023-01-17 江苏鼎功电子科技有限公司 Preparation method of high-strength adhesive tape
CN115612422B (en) * 2022-09-29 2024-03-08 江苏鼎功电子科技有限公司 Preparation method of high-strength adhesive tape

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