CN115612422A - Preparation method of high-strength adhesive tape - Google Patents
Preparation method of high-strength adhesive tape Download PDFInfo
- Publication number
- CN115612422A CN115612422A CN202211196486.1A CN202211196486A CN115612422A CN 115612422 A CN115612422 A CN 115612422A CN 202211196486 A CN202211196486 A CN 202211196486A CN 115612422 A CN115612422 A CN 115612422A
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- China
- Prior art keywords
- conductive
- glue
- adhesive tape
- parts
- glass fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 49
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 80
- 239000003365 glass fiber Substances 0.000 claims abstract description 56
- 239000012790 adhesive layer Substances 0.000 claims abstract description 40
- 239000010410 layer Substances 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 238000002156 mixing Methods 0.000 claims abstract description 12
- 238000005096 rolling process Methods 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000010008 shearing Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 8
- VPASWAQPISSKJP-UHFFFAOYSA-N ethyl prop-2-enoate;isocyanic acid Chemical compound N=C=O.CCOC(=O)C=C VPASWAQPISSKJP-UHFFFAOYSA-N 0.000 claims description 24
- 239000003822 epoxy resin Substances 0.000 claims description 23
- 229920000647 polyepoxide Polymers 0.000 claims description 23
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 20
- 239000002174 Styrene-butadiene Substances 0.000 claims description 20
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 20
- 239000004816 latex Substances 0.000 claims description 20
- 229920000126 latex Polymers 0.000 claims description 20
- 238000003756 stirring Methods 0.000 claims description 20
- 239000011115 styrene butadiene Substances 0.000 claims description 20
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 20
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical group [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 14
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 13
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 13
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 7
- 239000003995 emulsifying agent Substances 0.000 claims description 7
- 239000003999 initiator Substances 0.000 claims description 7
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 2
- 239000002923 metal particle Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 8
- 230000000694 effects Effects 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 5
- 238000005457 optimization Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses a preparation method of a high-strength adhesive tape, which comprises the following steps of S1) mixing glue and a conductive medium to prepare adhesive glue, and coating the adhesive glue on a release film to form an adhesive glue layer; s2) implanting the conductive glass fibers into the adhesive layer through a flocking machine; s3) attaching a conductive base material to the bonding adhesive layer implanted with the conductive glass fiber to obtain a high-strength adhesive tape; and S4) rolling, shearing and packaging the high-strength adhesive tape. According to the invention, the conductive glass fiber is implanted into the adhesive layer, then the conductive substrate is attached to the adhesive layer, and the conductive medium is connected with the conductive substrate through the conductive glass fiber, so that better conductivity can be realized, and a better shielding effect is achieved.
Description
Technical Field
The invention relates to the technical field of adhesive tape processing, in particular to a preparation method of a high-strength adhesive tape.
Background
The tape has various forms, and among them, the conductive tape is widely used in the electronic product industry. As people have higher and higher requirements for communication quality of electronic products, a large amount of conductive shielding tapes are increasingly used.
The conventional conductive adhesive tape is formed by mixing conductive powder and pressure-sensitive glue, coating the mixture on release paper, and then pasting a metal foil and rolling the metal foil. The conductive tape is prone to the following problems: 1. the adhesive strength of the pressure-sensitive adhesive layer is low, so that the adhesive is not firm, and 2, the conductive effect of the pressure-sensitive adhesive and the metal foil is limited, so that the conductive performance and the shielding effect are relatively poor.
In view of the above, the conventional conductive adhesive tape has a drawback of low strength in both adhesive property and shielding property.
Disclosure of Invention
The invention aims to provide a preparation method of a high-strength adhesive tape, which can improve the conductivity and shielding performance of the adhesive tape and improve the bonding effect of the adhesive tape.
In order to achieve the purpose, the invention adopts the technical scheme that: a preparation method of a high-strength adhesive tape comprises the following steps:
s1) mixing glue and a conductive medium to prepare bonding glue, and coating the bonding glue on a release film to form a bonding glue layer;
s2) implanting the conductive glass fiber into the adhesive layer through a flocking machine, wherein the action principle is as follows: the conductive glass fiber can be output into the spray head by the aid of the flocking machine, when the spray head is close to the bonding adhesive layer, the conductive glass fiber is planted into the surface of the bonding adhesive layer from the spray head under the action of a high-voltage electric field and is vertically planted on the bonding adhesive layer, and the conductive glass fiber can extend into the bonding adhesive layer because the bonding adhesive layer is not cured at the moment, so that the conductive glass fiber and the bonding adhesive layer with a conductive effect jointly form a conductor; in this step, the conductive glass fiber can be cut into a desired length, either before or after implantation;
s3) attaching a conductive base material to the bonding adhesive layer implanted with the conductive glass fiber to obtain a high-strength adhesive tape;
and S4) rolling, shearing and packaging the high-strength adhesive tape.
As a further optimization, the glue in the S1 comprises the following components in parts by weight: 30-50 parts of styrene-butadiene latex, 1-3 parts of methyl methacrylate, 0.5-1 part of initiator, 5-10 parts of emulsifier, 20-30 parts of epoxy resin and 10-15 parts of isocyanate ethyl acrylate, so that the epoxy resin and the isocyanate ethyl acrylate are matched, and one end of the isocyanate ethyl acrylate is provided with double bonds and can be subjected to free radical polymerization, and the other end of the isocyanate ethyl acrylate is provided with isocyanate, so that the bonding capacity can be increased, and the bonding effect can be improved;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and an emulsifier into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding an initiator;
s103) adding epoxy resin and isocyanate ethyl acrylate, and uniformly stirring to obtain the glue.
As a further optimization, the emulsifier is one or more of sodium dodecyl sulfate, sodium dodecyl benzene sulfonate and sodium didodecyl phenyl ether disulfonate.
As a further optimization, the initiator is ammonium persulfate or potassium persulfate.
As a further optimization, the conductive medium in S1 is conductive glass fiber, and/or conductive particles.
As a further optimization, the conductive medium in S1 is one or more of metal particles, carbon black, and graphene.
As a further optimization, the conductive glass fiber is made of glass fiber chemical nickel plating.
As a further optimization, the release film is a PET release film.
As a further optimization, the conductive substrate is an aluminum foil, a copper foil or conductive foam.
Compared with the prior art, the invention has the beneficial effects that:
1. the conductive glass fiber is implanted into the adhesive layer, then the conductive substrate is attached to the adhesive layer, and the conductive medium is connected with the conductive substrate through the conductive glass fiber, so that better conductivity can be realized, and a better shielding effect is achieved;
2. the isocyanate ethyl acrylate, the epoxy resin and the conductive glass fiber are added into the glue, so that the peeling force of the adhesive layer after the adhesive layer acts can be improved, and high-strength adhesion is realized.
Drawings
Fig. 1 is a structural view of an embodiment of the high strength adhesive tape of the present invention.
Fig. 2 is a structural view of another embodiment of the high strength adhesive tape of the present invention.
Detailed Description
The following are specific embodiments of the present invention, and the technical solutions of the present invention will be further described with reference to the drawings, but the present invention is not limited to these embodiments.
Example 1
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue 32 and conductive glass fibers 311 to prepare bonding glue, and coating the bonding glue on a release film 40 to form a bonding glue layer 30;
s2) implanting the conductive glass fiber 20 into the adhesive layer 30 through a flocking machine;
s3) attaching an aluminum foil 10 to the adhesive layer implanted with the conductive glass fibers to obtain a high-strength adhesive tape, wherein the structure of the high-strength adhesive tape is shown in figure 1;
and S4) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 42 parts of styrene-butadiene latex, 1.5 parts of methyl methacrylate, 0.5 part of potassium persulfate, 8 parts of sodium dodecyl sulfate, 27 parts of epoxy resin and 13 parts of isocyanate ethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl sulfate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding potassium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and uniformly stirring to obtain the glue.
Example 2
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue and conductive glass fiber to prepare bonding glue, and coating the bonding glue on a release film to form a bonding glue layer;
s2) implanting conductive glass fibers into the adhesive layer through a flocking machine;
s3) attaching conductive foam to the adhesive layer implanted with the conductive glass fiber to obtain a high-strength adhesive tape;
and S4) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 36 parts of styrene-butadiene latex, 2 parts of methyl methacrylate, 0.5 part of potassium persulfate, 5 parts of sodium dodecyl benzene sulfonate, 22 parts of epoxy resin and 12 parts of isocyanate ethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl benzene sulfonate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding potassium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and uniformly stirring to obtain the glue.
Example 3
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue 32 and carbon black 312 to prepare bonding glue, and coating the bonding glue on a release film 40 to form a bonding glue layer 30;
s2) implanting the conductive glass fiber 20 into the adhesive layer 30 through a flocking machine;
s3) attaching an aluminum foil 10 to the adhesive layer implanted with the conductive glass fibers to obtain a high-strength adhesive tape, wherein the structure of the high-strength adhesive tape is shown in figure 2;
and S4) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 46 parts of styrene-butadiene latex, 2.5 parts of methyl methacrylate, 1 part of ammonium persulfate, 8 parts of sodium dodecyl benzene sulfonate, 24 parts of epoxy resin and 14 parts of isocyanate ethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl benzene sulfonate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding ammonium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and uniformly stirring to obtain the glue.
Example 4
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue and metal copper particles to prepare bonding glue, and coating the bonding glue on a release film to form a bonding glue layer;
s2) implanting conductive glass fibers into the adhesive layer through a flocking machine;
s3) attaching a copper foil to the bonding adhesive layer implanted with the conductive glass fibers to obtain a high-strength adhesive tape;
and S4) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 31 parts of styrene-butadiene latex, 2.5 parts of methyl methacrylate, 0.5 part of ammonium persulfate, 7 parts of sodium dodecyl benzene sulfonate, 29 parts of epoxy resin and 12 parts of isocyanate ethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl benzene sulfonate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding ammonium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and uniformly stirring to obtain the glue.
Example 5
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue and graphene to prepare bonding glue, and coating the bonding glue on a release film to form a bonding glue layer;
s2) implanting conductive glass fibers into the adhesive layer through a flocking machine;
s3) attaching a copper foil to the bonding adhesive layer implanted with the conductive glass fiber to obtain a high-strength adhesive tape;
and S4) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 38 parts of styrene-butadiene latex, 1 part of methyl methacrylate, 1 part of potassium persulfate, 6 parts of sodium dodecyl sulfate, 27 parts of epoxy resin and 12 parts of isocyanate ethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl sulfate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding potassium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and uniformly stirring to obtain the glue.
Comparative example 1
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue and conductive glass fiber to prepare bonding glue, and coating the bonding glue on a release film to form a bonding glue layer;
s2) attaching an aluminum foil to the adhesive layer to obtain a high-strength adhesive tape;
and S3) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 41 parts of styrene-butadiene latex, 2 parts of methyl methacrylate, 0.5 part of potassium persulfate, 6 parts of sodium dodecyl benzene sulfonate, 26 parts of epoxy resin and 13 parts of isocyanate ethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl benzene sulfonate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding potassium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and uniformly stirring to obtain the glue.
Comparative example 2
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue and carbon black to prepare bonding glue, and coating the bonding glue on a release film to form a bonding glue layer;
s2) attaching an aluminum foil to the adhesive layer to obtain a high-strength adhesive tape;
and S3) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 40 parts of styrene-butadiene latex, 1 part of methyl methacrylate, 1 part of potassium persulfate, 7 parts of sodium dodecyl benzene sulfonate, 21 parts of epoxy resin and 12 parts of isocyanate ethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and sodium dodecyl benzene sulfonate into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding potassium persulfate;
s103) adding epoxy resin and isocyanate ethyl acrylate, and uniformly stirring to obtain the glue.
Comparative example 3
A preparation method of a high-strength adhesive tape comprises the following steps: s1) mixing glue and conductive glass fiber to prepare bonding glue, and coating the bonding glue on a release film to form a bonding glue layer;
s2) implanting the conductive glass fibers into the adhesive layer through a flocking machine;
s3) attaching an aluminum foil to the bonding adhesive layer implanted with the conductive glass fibers to obtain a high-strength adhesive tape;
and S4) rolling, shearing and packaging the high-strength adhesive tape.
The glue comprises the following components in parts by weight: 41 parts of styrene-butadiene latex, 2 parts of methyl methacrylate, 1 part of ammonium persulfate, 6 parts of sodium dodecyl benzene sulfonate and 25 parts of epoxy resin;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and an emulsifier into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding an initiator;
s103) adding epoxy resin, and uniformly stirring to obtain the glue.
Test results
The tapes prepared in examples 1 to 5 and comparative examples 1 to 3 were cut into sheets of the same specification (thickness, size), wherein the thickness of each layer was the same, and the vertical resistance was measured according to ASTM F390 standard, the peel strength (adhesion of adhesive layer to plastic plate) was measured according to GB2792-81 standard, and the specific test values are shown in the following table,
as can be seen from the comparison between examples 1 and 2 and examples 3/4/5, when the conductive medium is made of conductive glass fibers instead of conventional conductive particles, the conductive medium has a smaller vertical resistance as a whole, so as to achieve a better conductive performance, and has a better shielding effect, because when the conductive glass fibers are used for connecting the adhesive layer and the conductive substrate, the conductive medium in the adhesive layer is also made of conductive glass fibers, and the conductive medium is made of the same conductive material, so as to have a better conductive performance; compared with the comparative example 1 (conductive glass fiber is not flocked, but conductive medium is conductive glass fiber) and the comparative example 2 (conductive glass fiber is not flocked, but conductive medium is other conductive particles), the conductive glass fiber 20 is implanted, so that compared with the conventional method of directly attaching the conductive substrate and the conductive adhesive layer, the bridge with the conductive glass fiber is provided, the conductive glass fiber bridge can better realize the conductive performance, and the shielding effect is improved.
In addition, as can be seen from examples 1 to 5 and comparative example 3 (isocyanate ethyl acrylate is not added in the glue, but conductive glass fiber is added), the bonding force after the adhesive layer is acted can be improved through the bonding system of isocyanate ethyl acrylate and epoxy resin; moreover, it can be seen from the embodiments 1 to 5 that when the glue is a conductive glass fiber rather than a common conductive particle, the conductive glass fiber has better adhesiveness, because the conductive glass fiber can be better dispersed in the glue system, the conductive glass fiber has better compatibility and affinity with the resin, and can be more uniformly dispersed in the glue system of the resin, so as to avoid concentrating on a certain place to form a bump, and also to achieve uniformity of conductivity.
When the conductive base material is attached to the adhesive layer, the conductive base material acts on the conductive glass fiber, bends the conductive glass fiber and the like, further increases the action area of the conductive glass fiber and the conductive base material, and is beneficial to improving the conductivity; meanwhile, the bent conductive glass fiber can further limit the movement of the conductive base material compared with the bonding adhesive layer, and the combination effect of the conductive base material and the bonding adhesive layer is improved.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (10)
1. The preparation method of the high-strength adhesive tape is characterized by comprising the following steps:
s1) mixing glue and a conductive medium to prepare bonding glue, and coating the bonding glue on a release film to form a bonding glue layer;
s2) implanting conductive glass fibers into the adhesive layer through a flocking machine;
s3) attaching a conductive base material to the bonding adhesive layer implanted with the conductive glass fiber to obtain a high-strength adhesive tape;
and S4) rolling, shearing and packaging the high-strength adhesive tape.
2. The preparation method of the high-strength adhesive tape according to claim 1, wherein the glue in S1 comprises the following components in parts by weight: 30-50 parts of styrene-butadiene latex, 1-3 parts of methyl methacrylate, 0.5-1 part of initiator, 5-10 parts of emulsifier, 20-30 parts of epoxy resin and 10-15 parts of isocyanate ethyl acrylate;
the preparation method of the glue comprises the following steps:
s101) adding styrene-butadiene latex, methyl methacrylate and an emulsifier into a reaction kettle, and stirring for 1-2 hours;
s102) heating to 70-80 ℃, and dropwise adding an initiator;
s103) adding epoxy resin and isocyanate ethyl acrylate, and uniformly stirring to obtain the glue.
3. The method of claim 2, wherein the emulsifier is one or more of sodium dodecyl sulfate, sodium dodecyl benzene sulfonate, and sodium didodecyl phenyl ether disulfonate.
4. The method of claim 2 or 3, wherein the initiator is ammonium persulfate or potassium persulfate.
5. The method of claim 1, wherein the conductive medium in S1 is conductive glass fiber.
6. The method of claim 1, wherein the conductive medium in S1 is conductive particles.
7. The method for preparing the high-strength adhesive tape according to claim 1 or 6, wherein the conductive medium in S1 is one or more of metal particles, carbon black and graphene.
8. The method for preparing the high-strength adhesive tape according to claim 1 or 5, wherein the conductive glass fiber is made of glass fiber through chemical nickel plating.
9. The method of claim 1, wherein the release film is a PET release film.
10. The method of claim 1, wherein the conductive substrate is aluminum foil, copper foil or conductive foam.
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| KR19990084381A (en) * | 1998-05-06 | 1999-12-06 | 이용인 | Conductive Adhesive Tape |
| CN107151537A (en) * | 2017-04-26 | 2017-09-12 | 江苏斯瑞达新材料科技有限公司 | A kind of preparation method of flame retardant type shielding tape |
| CN107312492A (en) * | 2017-06-30 | 2017-11-03 | 张家港康得新光电材料有限公司 | A kind of double solidification adhesives and adhesive tape |
| CN109306629A (en) * | 2018-09-21 | 2019-02-05 | 嘉善博华绒业有限公司 | Antistatic flocked carpet production technology |
| CN109762483A (en) * | 2018-12-25 | 2019-05-17 | 苏州义铠轩电子科技有限公司 | Vertical conduction is pyrolyzed adhesive tape and preparation method thereof |
| CN110760035A (en) * | 2019-10-30 | 2020-02-07 | 上海保立佳新材料有限公司 | Self-thickening association type acrylate emulsion and preparation method thereof |
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2022
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990084381A (en) * | 1998-05-06 | 1999-12-06 | 이용인 | Conductive Adhesive Tape |
| CN107151537A (en) * | 2017-04-26 | 2017-09-12 | 江苏斯瑞达新材料科技有限公司 | A kind of preparation method of flame retardant type shielding tape |
| CN107312492A (en) * | 2017-06-30 | 2017-11-03 | 张家港康得新光电材料有限公司 | A kind of double solidification adhesives and adhesive tape |
| CN109306629A (en) * | 2018-09-21 | 2019-02-05 | 嘉善博华绒业有限公司 | Antistatic flocked carpet production technology |
| CN109762483A (en) * | 2018-12-25 | 2019-05-17 | 苏州义铠轩电子科技有限公司 | Vertical conduction is pyrolyzed adhesive tape and preparation method thereof |
| CN110760035A (en) * | 2019-10-30 | 2020-02-07 | 上海保立佳新材料有限公司 | Self-thickening association type acrylate emulsion and preparation method thereof |
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