CN115572954A - High-uniformity film coating device and method for hemispherical workpiece - Google Patents

High-uniformity film coating device and method for hemispherical workpiece Download PDF

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Publication number
CN115572954A
CN115572954A CN202211146558.1A CN202211146558A CN115572954A CN 115572954 A CN115572954 A CN 115572954A CN 202211146558 A CN202211146558 A CN 202211146558A CN 115572954 A CN115572954 A CN 115572954A
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coating
hemispherical
workpiece
uniformity
hemispherical workpiece
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白峻杰
李钱陶
赵明强
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717th Research Institute of CSIC
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717th Research Institute of CSIC
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • C23C14/505Substrate holders for rotation of the substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • C23C14/545Controlling the film thickness or evaporation rate using measurement on deposited material

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  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

The invention relates to the field of coating of special-shaped workpieces, in particular to a high-uniformity coating device and method for a hemispherical workpiece. The invention innovatively adopts a mode of driving the target gun of the film plating machine in the film plating process, so that the inclination angle of the target gun is adjusted in the film plating process, and the film plating uniformity of the surface of the hemispherical workpiece is further improved; in addition, the calibration of the coating thickness and the coating uniformity of the target guns under different inclination angles is completed through the hemispherical coating uniformity testing tool, so that the coating thickness of each point of the hemispherical workpiece by the target guns under different inclination angles is determined, the time ratio of the target guns at each angle in the whole hemispherical workpiece coating process is calculated, and the purpose of greatly optimizing the coating uniformity of the hemispherical workpiece is achieved. The method has the advantage that the coating uniformity of the hemispherical workpiece is better than +/-2% through actual measurement.

Description

High-uniformity film coating device and method for hemispherical workpiece
Technical Field
The invention relates to the field of coating of special-shaped workpieces, in particular to a high-uniformity coating device and method for a hemispherical workpiece.
Background
A Hemispherical Resonator Gyroscope (HRG) is widely applied to strategic weaponry such as aerospace and is the first choice sensor of current high-value satellites and other spacecrafts. The hemispherical resonator gyroscope is a gyroscope without a high-speed rotor and a movable support, and the angle or the rotating speed is measured by utilizing the mode shift caused by the Coriolis effect generated by the rotation of a hemispherical workpiece vibrated by radial standing waves. The gyro has the precondition that a hemispherical workpiece continuously vibrates at a certain frequency, has the outstanding advantages of good stability, long service life, high reliability, nuclear radiation resistance, high impact vibration resistance, short starting time and the like, and is considered as the most ideal element in the advanced strapdown inertial navigation system in the 21 st century by the inertial technology field.
As shown in fig. 1, the core components of the hemispherical resonator gyroscope comprise a hemispherical workpiece, a detection base and an excitation cover, the three core components are precisely welded and assembled together, then the three core components are sealed in a container, and the container is vacuumized, so that an independent angular velocity sensor or an independent angular sensor can be formed. The hemispherical workpiece is made of quartz glass with high quality factor through ultra-precision machining, and the surface of the hemispherical workpiece is required to be subjected to metallization coating treatment, so that a vibration signal is converted into an electric signal to be conducted into an arithmetic circuit.
The conventional metallization coating process is applied to a planar substrate, and the substrate can be kept in a coating uniform area directly through a large-size target gun or by adjusting the angle of the target gun, so that high-uniformity coating of the planar substrate is realized, but for a hemispherical workpiece, due to the special hemispherical structure of the hemispherical workpiece, including a large curvature and the fact that a coating surface is blocked by a supporting rod, and the like, the conventional coating method cannot meet the requirement of coating a metal film with high uniformity on the surface of the hemispherical workpiece, and the surface uniformity of the conventional coating method is usually between 30 and 90 percent, so that the coating requirement of the hemispherical workpiece in a hemispherical resonant gyroscope is difficult to meet.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a high-uniformity film coating device for a hemispherical workpiece, which at least comprises a workpiece disc, wherein the workpiece disc is used for fixing the hemispherical workpiece and can rotate to ensure the transverse film coating uniformity of the hemispherical workpiece; the magnetic control target gun is used for coating a film on a hemispherical workpiece, and the angle of the magnetic control target gun can be adjusted; and the control system drives the working disc and the magnetic control target gun to work according to a preset program.
The high-uniformity coating device for the hemispherical workpiece, provided by the invention, adopts a mode of driving the target gun of the coating machine in the coating process, so that the inclination angle of the magnetic control target gun is adjusted according to a preset program in the coating process, and the coating uniformity of the surface of the hemispherical workpiece is further improved.
In a preferred embodiment, a negative bias system is arranged below the workpiece disc, and the negative bias system is used for bias cleaning before coating the semi-spherical workpiece.
In a preferred embodiment, the workpiece disc and the magnetron target gun are both located in a vacuum system.
In a preferred embodiment, the magnetron target guns are arranged in a plurality of annular arrays, and the centers of the plurality of magnetron target guns are positioned on the central axis of the hemispherical workpiece.
The invention also provides a high-uniformity film coating method for the hemispherical workpiece, which at least comprises the following steps:
preparing a testing tool for a hemispherical workpiece to be coated, placing the testing tool in the coating device of any one of claims 1 to 3, adjusting the inclination angle of a magnetic control target gun, and coating to a preset thickness at different inclination angles;
measuring and calculating the average value of the coating thicknesses of a plurality of sites at the same height under different inclination angles;
calculating the proportion of the coating time in the whole coating process under different inclination angles according to the same coating thickness of each site at different heights;
and calculating the spraying time at each inclination angle according to the time required by the magnetron target gun to vertically spray to the preset thickness, and coating the semi-spherical workpiece according to the calculated coating time at different inclination angles under the condition that other conditions are not changed.
As a preferred embodiment, the method for measuring the thickness of the plating film at different positions comprises the following steps: and arranging a sample wafer transfer hole on the test tool, installing the round quartz wafer in the sample wafer loading hole, taking down the round quartz wafer in the sample wafer transfer hole after film coating is finished, and measuring the thickness of the round quartz wafer.
As a preferred embodiment, a half of the adhesive tape is pasted on the circular quartz plate, after the film coating is completed, the adhesive tape is torn off, a metal film step is formed on the circular quartz plate, and the step height is measured to obtain the thickness of the film coating.
As a preferred embodiment, the method for calculating the proportion of the coating time in the whole coating process under different inclination angles according to the same coating thickness of each site with different heights comprises the following steps: calculating to solve X according to the following equation a 、X b 、X c ......X m That is, the equation is as follows
X a H a-1 +X b H b-1 +X c H c-1 +.....+X m H m-1 =X a H a-2 +X b H b-2 +X c H c-2 +....+X m H m-2
X a H a-1 +X b H b-1 +X c H c-1 +.....+X m H m-1 =X a H a-3 +X b H b-3 +X c H c-3 +....+X m H m-3
......
X a H a-1 +X b H b-1 +X c H c-1 +.....+X m H m-1 =X a H a-n +X b H b-n +X c H c-n +....+X m H m-n
X a +X b +X c +......+X m =1
Wherein a, b, c.. M are inclination angles during film plating; 1. 2, 3, 4.. N represents n site heights; x is the proportion of the film coating time in the whole film coating process under a certain inclination angle; h is the average value of the film coating thickness of the sites with different heights under different inclination angles.
As a preferred embodiment, the test fixture is further provided with a clamping rod, and the clamping rod is located at the center of the hemispherical test fixture and used for vertically installing and fixing the test fixture.
The invention also provides application of the device and the method in hemispherical resonant gyroscope coating.
The invention innovatively adopts a mode of driving the target gun of the film plating machine in the film plating process, so that the inclination angle of the target gun is adjusted in the film plating process, and the film plating uniformity of the surface of the hemispherical workpiece is further improved; in addition, the calibration of the coating thickness and the coating uniformity of the target guns under different inclination angles is completed through the hemispherical coating uniformity testing tool, so that the coating thickness of each point of the hemispherical workpiece by the target guns under different inclination angles is determined, the time ratio of the target guns at each angle in the whole hemispherical workpiece coating process is calculated, and the purpose of greatly optimizing the coating uniformity of the hemispherical workpiece is achieved. The method has the advantage that the coating uniformity of the hemispherical workpiece is better than +/-2% through actual measurement.
Drawings
FIG. 1 is a schematic diagram of a hemispherical gyroscope core component as described in the background art;
fig. 2 is a schematic structural diagram of a high-uniformity coating apparatus for a hemispherical workpiece according to embodiment 1 of the present invention;
fig. 3 is a schematic structural diagram of a hemispherical workpiece testing tool according to embodiment 2 of the present invention;
fig. 4 is a flowchart of a method for coating a hemispherical workpiece with high uniformity according to embodiment 2 of the present invention.
In the figure:
1 workpiece disc, 2 magnetic control target guns, 3 negative bias system, 4 vacuum chambers, 5 control system, 6 hemispherical substrates, 7 sample loading holes and 8 clamping rods.
Detailed Description
The present invention is further described in detail below with reference to specific examples so that those skilled in the art can more clearly understand the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that spatial relationship terms, such as "under", "below", "beneath", "below", "over", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. The "connection" in the following embodiments is to be understood as "electrical connection", "communication connection", and the like if the connected circuits, modules, units, and the like have transmission of electrical signals or data therebetween.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
Example 1
The embodiment provides a high-uniformity film coating device for a hemispherical workpiece, as shown in fig. 2, the high-uniformity film coating device at least comprises a workpiece tray 1, wherein the workpiece tray 1 is used for fixing the hemispherical workpiece and can rotate to ensure the transverse film coating uniformity of the hemispherical workpiece; the magnetic control target gun 2 is used for coating a film on the hemispherical workpiece, and the angle of the magnetic control target gun can be adjusted; and the control system 5 drives the working disc and the magnetic control target gun to work according to a preset program.
The high-uniformity film coating device for the hemispherical workpiece, provided by the invention, adopts a mode of driving the target gun of the film coating machine in the film coating process, so that the inclination angle of the magnetic control target gun 2 is adjusted according to a preset program in the film coating process, and the uniformity of the surface coating of the hemispherical workpiece is further improved.
In this embodiment, the apparatus further includes a negative bias system 3, where the negative bias system 3 is disposed below the workpiece tray 1, and is used to perform bias cleaning before coating on the hemispherical workpiece, and improve surface activity of the hemispherical workpiece to increase adhesion between the bonding layer and the quartz substrate.
During actual work, the working disc 1, the magnetic control target gun 2 and the negative bias system 3 are all arranged in the vacuum chamber, and the vacuum system ensures the vacuum degree in the vacuum chamber.
Illustratively, the magnetron target guns 2 are arranged in a plurality of annular arrays, and the centers of the plurality of magnetron target guns are positioned on the central axis of the hemispherical workpiece.
When the device works, a hemispherical workpiece can be connected and fixed on the workpiece disc 1 through the metal fixture, and the workpiece disc 1 can rotate at a high speed according to a preset speed under the control of the control system 5 to ensure the uniformity of the transverse film coating of the hemispherical workpiece. It can be understood that the hemispherical workpiece needs to be fixed at the center of the workpiece tray 1, and the center deviation is required to be less than 0.1-1 mm.
The two magnetic control target guns 2 can be symmetrically arranged, sputtering targets enables metal target molecules to be plated on the surface of a hemispherical workpiece, and due to poor binding force between the hemispherical workpiece and inert metal, a bonding layer needs to be plated on the surface of the hemispherical workpiece first, and then a protective layer is plated on the bonding layer. The magnetic control target gun 2 can control the inclination angle through an external vacuum motor in a mechanical transmission mode, further realize the angle control of the magnetic control target gun in the coating process of the hemispherical workpiece, and achieve the purpose of optimizing the uniformity of the hemispherical coating, and generally, the inclination range includes but is not limited to 0-45 ℃.
Example 2
The embodiment provides a high-uniformity film coating method for a hemispherical workpiece, which comprises the steps of calibrating the film coating thickness and uniformity of a magnetic control target gun under a plurality of different inclination angles through a hemispherical film coating uniformity testing tool, determining the film coating thickness of the target gun on each point of the hemispherical workpiece under different inclination angles, and calculating the time ratio of the magnetic control target gun at each angle in the whole film coating process of the hemispherical workpiece, so that the purpose of greatly optimizing the film coating uniformity of the hemispherical workpiece is achieved, wherein the film coating uniformity of the hemispherical workpiece is better than +/-2% through actual measurement. The detailed steps are as follows:
s1, preparing a testing tool of a hemispherical workpiece to be coated, then placing the testing tool in the coating device in the embodiment 1, adjusting the inclination angle of a magnetic control target gun, and coating to a preset thickness under different inclination angles;
it can be understood that the hemispherical substrate 6 of the test fixture and the hemispherical workpiece to be coated have the same size, the material can be stainless steel, aluminum alloy and other cheap materials, and the hemispherical workpiece is generally hemispherical with a diameter of 10-100 mm.
S2, measuring and calculating the average value of the coating thicknesses of a plurality of sites at the same height under different inclination angles;
in this step, the plurality of points at the same height are points at the same latitude and different longitudes on the hemispherical workpiece, i.e., a plurality of points are taken at the same latitude on the hemispherical workpiece to measure the thickness of the coating film, and then the average value of the thicknesses is calculated. The specific method comprises the following steps:
and a sample loading hole 7 is formed in the test tool, the round quartz plate is installed in the sample loading hole, and after coating is finished, the round quartz plate in the sample loading hole is taken down and the thickness of the round quartz plate is measured. The size of the sample loading hole is 1-10 mm in diameter, which is related to the size of the hemispherical substrate.
In order to better simulate the actual coating process and facilitate the measurement, a half of adhesive tape is pasted on the circular quartz plate, after the coating is finished, the adhesive tape is torn off, a metal film step is formed on the circular quartz plate, and the step height is measured to be the coating thickness.
In order to conveniently install and fix the test tool, the test tool is further provided with a clamping rod 8, the clamping rod 8 is located at the center of the hemispherical test tool and used for vertically installing and fixing the test tool, and the clamping rod can be connected through a threaded hole or directly milled and ground for forming. The clamping bar may be a cylindrical structure having a diameter of 5 to 10mm and a length of 10 to 100mm, in association with the size of the hemispherical substrate.
And S3, calculating the proportion of the coating time in the whole coating process under different inclination angles according to the same coating thickness of each site at different heights.
In this step, the same plating thickness at each site of different heights means that the same plating thickness at each site of different dimensions.
Under the condition of measuring different inclination angles of the magnetic control target gun 2, the coating thickness distribution of different point positions on the hemispherical coating uniformity test tool is measured, and the time of different inclination angles in the coating process of the hemispherical workpiece is balanced by calculating the proportion of the maximum thickness point to the minimum thickness point. Specifically, X is calculated and solved according to the following equation a 、X b 、X c ......X m The equation is obtained as follows:
X a H a-1 +X b H b-1 +X c H c-1 +.....+X m H m-1 =X a H a-2 +X b H b-2 +X c H c-2 +....+X m H m-2
X a H a-1 +X b H b-1 +X c H c-1 +.....+X m H m-1 =X a H a-3 +X b H b-3 +X c H c-3 +....+X m H m-3
......
X a H a-1 +X b H b-1 +X c H c-1 +.....+X m H m-1 =X a H a-n +X b H b-n +X c H c-n +....+X m H m-n
X a +X b +X c +......+X m =1
wherein a, b, c.. M are inclination angles during film plating; 1. 2, 3, 4.. N represents n site heights; x is the proportion of the film coating time in the whole film coating process under a certain inclination angle; h is the average value of the coating thicknesses of the sites with different heights under different inclination angles.
Further examples are explained below: h a-1 、H b-1 、H c-1 、......H m-1 The average value of the coating thickness at the first height under different inclination angles is obtained; h a-2 、H b-2 、H c-2 、......H m-2 The average value of the coating thickness at the second height under different inclination angles; h a-3 、H b-3 、H c-3 、......H m-3 The average value of the coating thickness at the third height under different inclination angles; h a-4 、H b-4 、H c-4 、......H m-4 The average value of the thickness of the coating film at the fourth height under different inclination angles.
And S4, calculating the spraying time at each inclination angle according to the time required by the magnetron target gun to vertically spray to the preset thickness, and coating the semi-spherical workpiece according to the calculated coating time at different inclination angles under the condition that other conditions are not changed.
Example 3
The embodiment provides a method for coating a hemispherical workpiece with high uniformity, as shown in fig. 4, which comprises the following steps:
firstly, a round quartz plate is installed in a sample plate loading hole of a hemispherical coating uniformity test tool, a half of adhesive tape is pasted on the round quartz plate, the hemispherical coating uniformity test tool is placed into a vacuum chamber of the coating device in the embodiment 1, the inclination angle of a magnetic control target gun is set to be 0 degree, the hemispherical coating uniformity test tool is coated, and the thickness of a coated metal film is set to be 500mm.
And secondly, taking out the hemispherical coating uniformity testing tool from the vacuum chamber, taking down the circular quartz stone in the sample wafer loading hole, tearing off the adhesive tape on the circular quartz wafer to form a metal step film, and measuring the step height by using a step profiler to obtain the thickness of the metal film on the circular quartz wafer.
Thirdly, recording the average thickness of the metal films on four round quartz plates at the same height, and respectively recording the average thickness as H 0-1 、H 0-2 、H 0-3 、H 0-4 Wherein 0 represents that the inclination angle of the magnetic control target gun is 0 degree, and 1, 2 and 3 represent the average value of the coating thickness of the hemispherical coating uniformity test tool at different heights.
Fourthly, respectively measuring the average values of the coating thicknesses of the hemispherical coating uniformity test tool under the conditions that the inclination angles of the magnetic control target guns are 10 degrees, 20 degrees, 30 degrees and 40 degrees according to the method in the first step and the method in the third step, and recording the average values as H 10-1 、H 10-2 、H 10-3 、H 10-4 、H 20-1 、H 20-2 、H 20-3 、H 20-4 、H 30-1 、H 30-2 、H 30-3 、H 30-4 、H 40-1 、H 40-2 、H 40-3 、H 40-4
Fifthly, calculating the ratio of the overall time occupied by each inclination angle of the magnetic control target gun, wherein the calculation formula is as follows:
X 0 H 0-1 +X 10 H 10-1 +X 20 H 20-1 +X 30 H 30-1 +X 40 H 40-1 =X 0 H 0-2 +X 10 H 10-2 +X 20 H 20-2 +X 30 H 30-2 +X 40 H 40-2
X 0 H 0-1 +X 10 H 10-1 +X 20 H 20-1 +X 30 H 30-1 +X 40 H 40-1 =X 0 H 0-3 +X 10 H 10-3 +X 20 H 20-3 +X 30 H 30-3 +X 40 H 40-3
X 0 H 0-1 +X 10 H 10-1 +X 20 H 20-1 +X 30 H 30-1 +X 40 H 40-1 =X 0 H 0-4 +X 10 H 10-4 +X 20 H 20-4 +X 30 H 30-4 +X 40 H 40-4
X 0 +X 10 +X 20 +X 30 +X 40 =1
wherein, X 0 、X 10 、X 20 、X 30 、X 40 The time proportion of the target gun in the process of coating the hemispherical workpiece under the conditions that the inclination angle of the target gun is 0 degrees, 10 degrees, 20 degrees, 30 degrees and 40 degrees respectively.
Solve to X 0 、X 10 、X 20 、X 30 、X 40 The proper inclination angle and the time proportion occupied in the process of coating the hemispherical workpiece can be calculated.
And sixthly, calculating the spraying time at each inclination angle according to the time required by the magnetic control target gun to vertically spray to the preset thickness, and coating the semi-spherical workpiece according to the calculated coating time at different inclination angles under the condition that other conditions are not changed.
The conditions that the inclination angles of the magnetron target guns are 0 degrees, 10 degrees, 20 degrees, 30 degrees and 40 degrees in the embodiment are only possible to sample, other inclination angle combinations can be adopted to calibrate the coating speed at each angle, and then the inclination angles of the magnetron target guns are driven to change by a vacuum motor in the subsequent coating process of the hemispherical workpiece, so that the coated hemispherical workpiece with the coating uniformity better than +/-2% can be obtained.
It should be noted that the above examples are only for further illustration and description of the technical solution of the present invention, and are not intended to further limit the technical solution of the present invention, and the method of the present invention is only a preferred embodiment, and is not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A high-uniformity film coating device for a hemispherical workpiece is characterized by at least comprising
The workpiece disc is used for fixing the hemispherical workpiece and can rotate to ensure the transverse coating uniformity of the hemispherical workpiece;
the magnetic control target gun is used for coating a film on a hemispherical workpiece, and the angle of the magnetic control target gun can be adjusted;
and the control system drives the working disc and the magnetic control target gun to work according to a preset program.
2. The apparatus of claim 1, wherein a negative bias system is disposed under the workpiece tray for bias cleaning the hemispherical workpiece before coating.
3. The apparatus for coating a hemispherical workpiece with high uniformity as claimed in claim 1 or 2, wherein the workpiece disk and the magnetron target gun are both located in a vacuum system.
4. The method for high-uniformity coating of a hemispherical workpiece according to claim 1, wherein a plurality of magnetron target guns are arranged in an annular array, and the centers of the plurality of magnetron target guns are located on the central axis of the hemispherical workpiece.
5. A high-uniformity film coating method for a hemispherical workpiece is characterized by at least comprising the following steps:
preparing a testing tool for a hemispherical workpiece to be coated, placing the testing tool in the coating device of any one of claims 1 to 3, adjusting the inclination angle of a magnetic control target gun, and coating to a preset thickness at different inclination angles;
measuring and calculating the average value of the coating thicknesses of a plurality of sites at the same height under different inclination angles;
calculating the proportion of the coating time in the whole coating process under different inclination angles according to the same coating thickness of each site at different heights;
and calculating the spraying time at each inclination angle according to the time required by the magnetron target gun to vertically spray to the preset thickness, and coating the semi-spherical workpiece according to the calculated coating time at different inclination angles under the condition that other conditions are not changed.
6. The method for high-uniformity coating of hemispherical workpieces according to claim 5,
the method for measuring the thickness of the plating films at different positions comprises the following steps: and arranging a sample wafer transfer hole on the test tool, installing the round quartz wafer in the sample wafer loading hole, taking down the round quartz wafer in the sample wafer transfer hole after film coating is finished, and measuring the thickness of the round quartz wafer.
7. The method for coating a hemispherical workpiece with high uniformity as claimed in claim 6, wherein a half of the adhesive tape is pasted on the circular quartz plate, after the coating is completed, the adhesive tape is torn off, a metal film step is formed on the circular quartz plate, and the step height is measured to obtain the coating thickness.
8. The method for highly uniformly coating a hemispherical workpiece according to claim 5, wherein the method for calculating the ratio of the coating time at different inclination angles in the whole coating process according to the same coating thickness at each point with different heights comprises: calculating to solve X according to the following equation a 、X b 、X c ......X m That is, the equation is as follows
X a H a-1 +X b H b-1 +X c H c-1 +.....+X m H m-1 =X a H a-2 +X b H b-2 +X c H c-2 +....+X m H m-2
X a H a-1 +X b H b-1 +X c H c-1 +.....+X m H m-1 =X a H a-3 +X b H b-3 +X c H c-3 +....+X m H m-3
......
X a H a-1 +X b H b-1 +X c H c-1 +.....+X m H m-1 =X a H a-n +X b H b-n +X c H c-n +....+X m H m-n
X a +X b +X c +......+X m =1
Wherein a, b, c.. M are inclination angles during film plating; 1. n represents n site heights; x is the proportion of the film coating time in the whole film coating process under a certain inclination angle; h is the average value of the coating thicknesses of the sites with different heights under different inclination angles.
9. The method for high-uniformity film coating of the hemispherical workpiece according to claim 5, wherein the testing tool is further provided with a clamping rod, and the clamping rod is located at the center of the hemispherical testing tool and used for vertically installing and fixing the hemispherical workpiece.
10. The device for coating the hemispherical workpiece with high uniformity as claimed in claims 1 to 3 and the application of the coating method as claimed in claims 4 to 9 in hemispherical resonator gyroscope coating.
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Publication number Priority date Publication date Assignee Title
KR20180027140A (en) * 2016-09-06 2018-03-14 한국원자력연구원 Apparatus and Method for controlling film-thickness in inline-type vapor deposition process
CN109652780A (en) * 2018-12-12 2019-04-19 上海航天控制技术研究所 A kind of control method improving special-shaped part plating film uniformity
CN213932442U (en) * 2020-11-28 2021-08-10 华中光电技术研究所(中国船舶重工集团公司第七一七研究所) Hemisphere coating uniformity detects frock
CN113913773A (en) * 2021-09-10 2022-01-11 北京自动化控制设备研究所 Hemispherical harmonic oscillator metal film coating device and method
WO2022067433A1 (en) * 2020-09-30 2022-04-07 Angstrom Engineering Inc. System and method for controlling film thickness, and film deposition system and method using same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180027140A (en) * 2016-09-06 2018-03-14 한국원자력연구원 Apparatus and Method for controlling film-thickness in inline-type vapor deposition process
CN109652780A (en) * 2018-12-12 2019-04-19 上海航天控制技术研究所 A kind of control method improving special-shaped part plating film uniformity
WO2022067433A1 (en) * 2020-09-30 2022-04-07 Angstrom Engineering Inc. System and method for controlling film thickness, and film deposition system and method using same
CN213932442U (en) * 2020-11-28 2021-08-10 华中光电技术研究所(中国船舶重工集团公司第七一七研究所) Hemisphere coating uniformity detects frock
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