CN115565913A - Packaging equipment for face recognition chip - Google Patents
Packaging equipment for face recognition chip Download PDFInfo
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- CN115565913A CN115565913A CN202211134080.0A CN202211134080A CN115565913A CN 115565913 A CN115565913 A CN 115565913A CN 202211134080 A CN202211134080 A CN 202211134080A CN 115565913 A CN115565913 A CN 115565913A
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- fixedly connected
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- face recognition
- splint
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 41
- 238000003825 pressing Methods 0.000 claims abstract description 53
- 238000005538 encapsulation Methods 0.000 claims abstract description 27
- 230000003028 elevating effect Effects 0.000 claims description 9
- 238000005096 rolling process Methods 0.000 claims description 8
- 230000000087 stabilizing effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 13
- 230000007246 mechanism Effects 0.000 abstract description 13
- 238000005507 spraying Methods 0.000 description 20
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 239000012528 membrane Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The invention discloses packaging equipment for a face recognition chip, which comprises a machine body and a machine body, wherein a supporting shell is fixedly connected to the side surface of the machine body and positioned at the end part of the machine body, a lifting mechanism is fixedly connected to the top of the inner wall of the supporting shell, a packaging host is fixedly connected to the working end of the lifting mechanism, a guiding and pressing device is fixedly connected to the side surface of the packaging host, a supporting rotating shaft is rotatably connected to the position, close to the center, inside the machine body, a clamping device is fixedly connected to the position, close to the edge, of the top of a workbench, a power mechanism is fixedly connected to the bottom of the inner wall of the machine body, and the output end of the power mechanism is meshed with the surface of the supporting rotating shaft through a gear. This face identification chip's encapsulation equipment has reached the effect of steady encapsulation, can steadily press from both sides the tight to the circuit board, reduces the influence that receives external force or vibrations for the operation is more stable, helps quick accurate encapsulation, and safe and reliable has improved work efficiency and performance.
Description
Technical Field
The invention relates to the technical field of chip packaging equipment, in particular to packaging equipment for a face recognition chip.
Background
Face recognition is a biometric technology for identity recognition based on facial feature information of a person. A series of related technologies, also called as face recognition and face recognition, are used to capture an image or video stream containing a face with a camera or a video camera, automatically detect and track the face in the image, and further recognize the detected face. The chip is an especially important component in face recognition, and the chip needs to be processed by a packaging process in the application process.
At present, the structure of the existing chip packaging equipment is too simple, when the chip is packaged, rigid clamping is mostly adopted, the circuit board is easily damaged and is easily influenced by external force or vibration, the circuit board is poor in stability, accurate packaging is not easy to carry out, the working efficiency is influenced, the existing chip packaging equipment is not suitable for mass production, and the use performance is reduced.
Disclosure of Invention
In order to achieve the purpose, the invention is realized by the following technical scheme: the packaging equipment for the face recognition chip comprises a machine body, wherein a supporting shell is fixedly connected to the side face of the machine body and positioned at the end part position, a lifting mechanism is fixedly connected to the top of the inner wall of the supporting shell, a packaging host is fixedly connected to the working end of the lifting mechanism, two guiding pressing devices are fixedly connected to the side face of the packaging host, the two guiding pressing devices are symmetrically arranged, a supporting rotating shaft is rotatably connected to the inner part of the machine body and close to the central position, the top end of the supporting rotating shaft penetrates through the top of the inner wall of the machine body and extends to the outer part of the machine body, a workbench is fixedly connected to the top end of the supporting rotating shaft, a clamping device is fixedly connected to the top of the workbench and close to the edge position, and a power mechanism is fixedly connected to the bottom of the inner wall of the machine body, the output end of the power mechanism is connected with the surface of the supporting rotating shaft through gear engagement, the circuit board is placed on the clamping device, the circuit board is clamped, the chip is placed on the packaging host machine at the moment, the packaging host machine is integrally driven to move downwards through the lifting mechanism, the guide pressing device also moves downwards along with the chip at the moment, interaction between the guide pressing device and the clamping device is utilized, the overall structure is more stable, the packaging of the face recognition chip is promoted, the whole device is reasonable and simple in structure, the use is convenient, the circuit board can be stably clamped, the influence of external force or vibration is reduced, the whole device is enabled to run more stably, the rapid and accurate packaging is facilitated, safety and reliability are realized, and the working efficiency and the use performance are improved.
Preferably, the direction press device includes the connecting rod, the top of connecting rod and the side fixed connection of encapsulation host computer, the bottom fixedly connected with of connecting rod presses the briquetting, press the surface of briquetting and be provided with the arc surface, the position roll connection that just is located the arc surface according to the surface of briquetting has the roller.
Preferably, the rollers are uniformly distributed on the surface of the pressing block and located at the positions of the arc surfaces, and the surface of the pressing block is provided with rolling grooves matched with the rollers.
Preferably, the clamping device comprises a base, the bottom of the base is fixedly connected with the top of the workbench, a placement groove is formed in the center of the top of the base, two limiting devices are arranged on the inner wall of the base and in the placement groove, the two limiting devices are symmetrically arranged, an auxiliary supporting device is arranged on the surface of the base, when the circuit board is placed in the placement groove in the base, the circuit board is clamped by the clamping device, and the surface of the pressing block on the guiding and pressing device is in contact with the surface of the guide rail when the packaging host machine is driven by the lifting mechanism to move downwards, and the surface of the pressing block on the guiding and pressing device is provided with an arc surface, so that the pressing block is matched with the surface of the guide rail, a guiding effect is achieved, the packaging host machine stably moves downwards, the pressing block moves downwards under the pressure of the connecting rod, the roller rolls, rolling pressing force is further applied to the pressed plate, further, the stable support of the circuit board by the subsequent auxiliary supporting devices is facilitated, the influence of external force on the circuit board is reduced, the structure is fully linked together, multiple functions are achieved, safety and reliability is improved in use performance.
Preferably, stop device includes the splint device, the inner wall that is provided with the base of splint device just is located the position of placing the groove, fixedly connected with butterfly elastic component between the corresponding both sides of splint device tip and base inner wall, the position that just is close to butterfly elastic component between the corresponding both sides of splint device surface and base inner wall is provided with the pressurized and spouts the gasbag.
Preferably, the clamping plate device comprises a clamping plate main body, one end of the clamping plate main body is rotatably connected with the inner wall of the base, a flexible clamping block is fixedly connected to the surface of the clamping plate main body, an arc-shaped rod is fixedly connected to the end portion of the clamping plate main body, one end, far away from the clamping plate main body, of the arc-shaped rod, an air nozzle is fixedly connected to the surface of the clamping plate main body and close to the top of the clamping plate main body, an air port of the air nozzle is communicated with an air port of the pressurized air spraying bag, when the circuit board is placed in the placing groove, the circuit board is pushed, the clamping plate main body on the clamping plate device is pushed by the thrust of the circuit board and is rotatably connected with the inner wall of the base, the clamping plate main body rotates reversely at the moment, the butterfly-shaped elastic piece and the pressurized air spraying bag are compressed and are combined with the acting force and the reacting force, so that the butterfly-shaped elastic piece and the pressurized air spraying bag exert the reverse elastic force on the clamping plate main body and clamp the circuit board by combining the flexible clamping block, the end portion of the circuit board is pressed against the surface of the limiting rod, the circuit board, and the air nozzle is compressed, the pressurized air spraying bag discharges the internal gas, and is used for realizing the reliable connection with the air inlet and the safety chip of the air nozzle, thereby realizing the safety chip.
Preferably, the surface of splint main part sets up to the arcwall face, air nozzle evenly distributed is on the surface of splint main part and near the top position.
Preferably, the auxiliary supporting device comprises a pressed plate, the top of the pressed plate is connected with the side face of the base in a rotating mode, an elastic sheet is fixedly connected between the surface of the pressed plate and the two corresponding sides of the side face of the base, a pressed elastic bag is arranged between the surface of the pressed plate and the two corresponding sides of the side face of the base and close to the elastic sheet, a stabilizing device is fixedly connected to the bottom of the inner wall of the base, a guide rail is fixedly connected to the surface of the pressed plate, an air passage is formed in the base, and the air passage is communicated with the pressed elastic bag and the stabilizing device.
Preferably, the surface of the pressure receiving plate and the surface of the guide rail are both arc-shaped, and the elastic pieces are uniformly distributed between the surface of the pressure receiving plate and two sides corresponding to the side faces of the base.
Preferably, the fixing device comprises a supporting block, the bottom of the supporting block is fixedly connected with the bottom of the inner wall of the base, a groove is formed in the top of the supporting block, a gas port of the groove is communicated with one end of the gas channel, an elastic membrane is fixedly connected to the top of the supporting block and located in the groove, an anti-slip layer is arranged on the surface of the elastic membrane, after the surface of the pressing block is contacted with the surface of the guide rail, the pressing force is exerted on the pressed plate along with the downward movement, the pressed plate rotates, the elastic sheet and the pressed elastic bag are compressed at the moment, under the action of reverse elasticity, a roller on the guide pressing device is tightly attached to the surface of the guide rail, the whole structure is more stable in operation, meanwhile, gas inside the compressed pressed elastic bag is conveyed into the groove through the gas channel, the elastic membrane drives the anti-slip layer to expand along with the increase of gas pressure, the surface of the anti-slip layer is attached to the bottom of the circuit board, the anti-slip effect is achieved, the stability is further achieved, gaps between the bottom of the circuit board and the bottom of the supporting block and the top of the circuit board are filled, the structures are stably supported, the mutual connection of the structures is achieved, and the safety performance is improved.
The invention provides a packaging device of a face recognition chip. The method has the following beneficial effects:
1. this face identification chip's encapsulation equipment, which comprises a bod, the supporting housing, elevating system, the encapsulation host computer, direction press device, support the pivot, a workbench, clamping device, power unit, place the circuit board on clamping device, and then press from both sides the circuit board, this moment on placing the encapsulation host computer with the chip, and will encapsulate the whole drive of host computer and carry out the downstream through elevating system, direction press device also along with downstream together this moment, and utilize the interact between direction press device and the clamping device, make overall structure more stable, and then promoted the encapsulation to face identification chip, whole device is rational in infrastructure simple, high durability and convenient use, can steadily press from both sides the circuit board, the reduction receives the influence of external force or vibrations, make whole equipment operation more stable, help quick accurate encapsulation, safety and reliability, work efficiency and performance have been improved.
2. This encapsulation equipment of face identification chip, through direction press device, the connecting rod, press the briquetting, the arc surface, the roller, clamping device, a pedestal, the standing groove, stop device, supplementary strutting arrangement, when the circuit board is put into the standing groove on the base, utilize clamping device to press from both sides the circuit board, and when going down with the host drive of encapsulation along with elevating system, press briquetting surface and guide rail surface contact on the direction press device this moment, and the surface of pressing the briquetting is provided with the arc surface, and then coincide with the guide rail surface, the effect of direction has been played, make encapsulation host steady downstream, and under the pressure effect of connecting rod, press the briquetting downstream, and the roller rolls, and then exert roll pressing force to the board that is pressed, and then help follow-up supplementary strutting arrangement to the steady support of circuit board, reduce and flatly receive the influence of external force, fully link the structure together, multiple functions have been realized, safety and reliability, performance has been improved.
3. The packaging equipment of the face recognition chip comprises a limiting device, a clamping plate device, a butterfly elastic part, a pressure spraying air bag, a clamping plate main body, a flexible clamping block, an arc-shaped rod, a limiting rod and an air nozzle, wherein when a circuit board is placed in a placing groove and pushes the circuit board, the clamping plate main body on the clamping plate device is pushed by the circuit board and is connected with the inner wall of a base in a rotating way by combining one end of the clamping plate main body, the clamping plate main body rotates reversely at the moment, the butterfly elastic part and the pressure spraying air bag are compressed and are combined with acting force and reacting force, so that the butterfly elastic part and the pressure spraying air bag apply reverse elastic force to the clamping plate main body, the circuit board is clamped by combining the flexible clamping block and is not easy to move randomly, the end part of the circuit board abuts against the surface of the limiting rod, the circuit board is limited, meanwhile, the pressurized spraying air bag is compressed, at the moment, gas in the pressurized spraying air bag is exhausted, and the gas port of the gas nozzle is communicated with the gas port of the pressurized spraying air bag, at the moment, the gas is blown out from the gas nozzle to the surface of the circuit board, so that dust and sundries on the surface of the circuit board are blown off, the self-cleaning effect is achieved, the follow-up chip packaging is facilitated, the structure interaction is utilized, the structure is linked together, the safety and reliability are realized, multiple functions are realized, and the packaging effect is good.
4. This encapsulation equipment of face identification chip, through supplementary strutting arrangement, receive the pressure board, the flexure strip, the compression elasticity bag, securing device, the guide rail, the air flue, the supporting shoe, the recess, the elastic membrane, anti-skidding layer, after pressing the briquetting surface and the surface contact of guide rail, and along with moving down, and then exert the pressing force to receiving the pressure board, make to receive the rotation of pressure board, the flexure strip this moment, the compression elasticity bag receives the compression, and under reverse elasticity, make roller and guide rail surface on the direction press device closely laminate, and then make the structure whole between more stable, the inside gas of the compression elasticity bag that receives the compression simultaneously carries in the recess through the air flue, at this moment along with the increase of gas pressure, make the elastic membrane drive anti-skidding layer inflation, and then make the surface of anti-skidding layer and the bottom laminating of circuit board, anti-skidding's effect has been played, further make stably, and the gap between circuit board bottom and the supporting shoe top has been filled, steady support, utilize the interrelation between the structure, and fully combine gas pressure together, multiple functions have been realized, safety and reliability, performance has been improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is a schematic view of a guiding and pressing device according to the present invention;
FIG. 4 is a schematic view of a clamping device according to the present invention;
FIG. 5 is a schematic view of the structure of the position limiting device of the present invention;
FIG. 6 is a schematic view of the clamping device of the present invention;
FIG. 7 is a schematic view of the structure of the auxiliary supporting device of the present invention;
FIG. 8 is an enlarged view of a portion of FIG. 7 according to the present invention.
In the figure: 1 machine body, 2 supporting shells, 3 lifting mechanisms, 4 packaging hosts, 5 guiding pressing devices, 6 supporting rotating shafts, 7 working tables, 8 clamping devices, 9 power mechanisms, 51 connecting rods, 52 pressing blocks, 53 arc surfaces, 54 rollers, 81 bases, 82 placing grooves, 83 limiting devices, 84 auxiliary supporting devices, 831 clamping devices, 832 butterfly elastic pieces, 833 pressed spraying air bags, 8311 clamping plate bodies, 8312 flexible clamping blocks, 8313 arc rods, 8314 limiting rods, 8315 air nozzles, 841 pressed plates, 842 elastic pieces, 843 pressed elastic bags, 844 stabilizing devices, 845 guide rails, 846 air passages, 8441 supporting blocks, 8442 grooves, 8443 elastic films and 8444 anti-skidding layers.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Example 1
Referring to fig. 1 to 8, the present invention provides a technical solution: the utility model provides a packaging equipment of face identification chip, including organism 1, the side of organism 1 just is located tip position fixedly connected with support housing 2, support housing 2's inner wall top fixedly connected with elevating system 3, elevating system 3's work end fixedly connected with encapsulation host computer 4, the side fixedly connected with direction press device 5 of encapsulation host computer 4, direction press device 5 is provided with two, and two direction press device 5 symmetry settings, the inside of organism 1 just is close to central position rotation and is connected with supporting shaft 6, supporting shaft 6's top runs through the inner wall top of organism 1 and extends to its outside, supporting shaft 6's top fixedly connected with workstation 7, workstation 7's top just is close to marginal position fixedly connected with clamping device 8, the inner wall bottom fixedly connected with power unit 9 of organism 1, power unit 9's output and supporting shaft 6's surface are connected through gear engagement, place the circuit board on clamping device 8, and then press from both sides the circuit board tightly, place the chip on encapsulation host computer 4 at this moment, and drive encapsulation host computer 4 wholly through elevating system 4 and move down, and also along with pressing from both sides together with the pressing from both sides and press device 5, and utilize, the smooth and smooth mutual influence of the encapsulation device, make whole reliable and more convenient to carry out the operation, the encapsulation structure, make whole stable and more convenient use, the whole encapsulation efficiency, the encapsulation device, the efficiency of the encapsulation is improved, the efficiency of the encapsulation, the convenience is improved.
Example 2
The guide pressing device 5 comprises a connecting rod 51, the top end of the connecting rod 51 is fixedly connected with the side surface of the packaging host 4, the bottom end of the connecting rod 51 is fixedly connected with a pressing block 52, an arc surface 53 is arranged on the surface of the pressing block 52, and a roller 54 is connected on the surface of the pressing block 52 and at the position of the arc surface 53 in a rolling manner.
The rollers 54 are uniformly distributed on the surface of the pressing block 52 and located at the position of the arc surface 53, and the surface of the pressing block 52 is provided with rolling grooves matched with the rollers 54.
Example 3
The limiting device 83 comprises a clamping plate device 831, the inner wall of the clamping plate device 831, which is provided with a base 81, is located at the position of the placing groove 82, a butterfly-shaped elastic piece 832 is fixedly connected between the end of the clamping plate device 831 and the two corresponding sides of the inner wall of the base 81, and a pressure spraying air bag 833 is arranged between the surface of the clamping plate device 831 and the two corresponding sides of the inner wall of the base 81 and is close to the butterfly-shaped elastic piece 832.
The splint device 831 includes splint main part 8311, rotates between the one end of splint main part 8311 and the inner wall of base 81 to be connected, and splint main part 8311's fixed surface is connected with flexible clamp block 8312, and splint main part 8311's tip fixedly connected with arc pole 8313, arc pole 8313 keep away from the spacing stick 8314 of the one end fixedly connected with of splint main part 8311, and splint main part 8311's surface just is close to top position fixedly connected with air nozzle 8315, communicates between the gas port of air nozzle 8315 and the gas port of pressurized jet bag 833.
The surface of the clamping plate main body 8311 is provided with an arc-shaped surface, the air nozzles 8315 are uniformly distributed on the surface of the clamping plate main body 8311 and are close to the top, when a circuit board is placed in the placing groove 82 and pushed to the circuit board, at the moment, the clamping plate main body 8311 on the clamping plate device 831 is pushed by the circuit board and is combined with one end of the clamping plate main body 8311 to be connected with the inner wall of the base 81 in a rotating mode, at the moment, the clamping plate main body 8311 rotates reversely, the butterfly-shaped elastic member 832 and the compressed air spraying bag 833 are compressed and combined with acting force and reacting force, so that the butterfly-shaped elastic member 832 and the compressed air spraying bag 833 apply reverse elastic force to the clamping plate main body 8311, the circuit board is clamped by the flexible clamping block 8312 and is not easy to move randomly, the end portion of the circuit board abuts against the surface of the limiting rod 8314 to limit the circuit board, meanwhile, the air in the compressed air spraying bag 833 is compressed along with the compression, at the moment, air in the air nozzles 8315 are communicated with the surface of the air nozzles 8315, so that dust blown out of the circuit board is blown off from the surface of the circuit board, and the chip is further beneficial to the subsequent chip packaging effect of the chip is achieved.
Auxiliary supporting device 84 includes by pressure board 841, the top that receives board 841 rotates with the side of base 81 to be connected, by fixedly connected with elastic sheet 842 between the corresponding both sides in board 841 surface and base 81 side, be provided with by pressure elastic bag 843 between the corresponding both sides in board 841 surface and base 81 side and the position that is close to elastic sheet 842, inner wall bottom fixedly connected with securing device 844 of base 81, the surface fixedly connected with guide rail 845 that receives board 841, air flue 846 has been seted up to the inside of base 81, air flue 846 is with communicateing between pressure elastic bag 843 and the securing device 844.
The surface of the pressed plate 841 and the surface of the guide rail 845 are both set to be arc-shaped, and the elastic pieces 842 are uniformly distributed between the surface of the pressed plate 841 and the two sides corresponding to the side surfaces of the base 81.
The stabilizing device 844 comprises a supporting block 8441, the bottom of the supporting block 8441 is fixedly connected with the bottom of the inner wall of the base 81, a groove 8442 is formed in the top of the supporting block 8441, a gas port of the groove 8442 is communicated with one end of the gas passage 846, the top of the supporting block 8441 is fixedly connected with an elastic film 8443 located in the groove 8442, an anti-slip layer 8444 is arranged on the surface of the elastic film 8443, after the surface of the pressing block 52 is contacted with the surface of the guide rail 845, the pressing force is applied to the pressed plate 841 along with downward movement, so that the pressed plate 841 rotates, at the moment, the elastic sheet 842 and the pressed elastic bag 843 are compressed, under the action of reverse elasticity, a roller 54 on the guide pressing device 5 is tightly attached to the surface of the guide rail 845, the whole structure is more stable, meanwhile, the gas inside the compressed pressed elastic bag 843 is conveyed into the groove 8442 through the gas passage 846, at the moment, along with the increase of gas pressure, the elastic film 8443 drives the anti-slip layer 8444 to expand, so that the surface of the anti-slip layer 8444 is attached to the bottom of the circuit board, the bottom of the circuit board is further, the supporting block 8444 is further stable, and gaps between the supporting block 8441 are filled.
When the device is used, the whole device is placed at a designated position, when a circuit board is placed in the placing groove 82 on the base 81, the circuit board is clamped by the clamping device 8, and when the packaging host machine 4 is driven by the lifting mechanism 3 to move downwards, the surface of the pressing block 52 on the guiding and pressing device 5 is in contact with the surface of the guide rail 845, the surface of the pressing block 52 is provided with the arc surface 53, and is matched with the surface of the guide rail 845, so that the packaging host machine 4 moves downwards stably, the pressing block 52 moves downwards under the pressure action of the connecting rod 51, the roller 54 rolls, and further the rolling pressing force is applied to the pressed plate 841, so that the follow-up auxiliary supporting device 84 can stably support the circuit board, the influence of external force on the circuit board is reduced, and when the circuit board is placed in the placing groove 82, the circuit board is pushed, at this time, after the splint main body 8311 on the splint device 831 is pushed by the circuit board, and the splint main body 8311 is connected with the inner wall of the base 81 in a rotating manner by combining one end of the splint main body 8311, at this time, the splint main body 8311 rotates reversely, so as to compress the butterfly elastic member 832 and the pressurized spraying air bag 833, and combine the acting force and the reacting force, so that the butterfly elastic member 832 and the pressurized spraying air bag apply reverse elastic force to the splint main body 8311, and combine the flexible clamping block 8312 to clamp the circuit board, so as to be difficult to move randomly, and at the same time, as the pressurized spraying air bag 833 is compressed, the gas inside the pressurized spraying air bag 833 is discharged, and combines the communication between the air port 833 of the air nozzle 8315 and the air port of the pressurized spraying air bag 833, at this time, the gas is blown out from the air nozzle 8315 to the surface of the circuit board, and then the dust and sundries on the surface of the circuit board are blown off, so as to realize the self-cleaning effect, and contribute to the packaging of the subsequent chip, and after the surface of the pressing block 52 is contacted with the surface of the guide rail 845, the pressing block moves downwards, and further pressing force is applied to the pressed plate 841, so that the pressed plate 841 rotates, at the moment, the elastic sheet 842 and the pressed elastic bag 843 are compressed, and under the action of reverse elasticity, the roller 54 on the guide pressing device 5 is tightly attached to the surface of the guide rail 845, further the whole structure is more stable in operation, meanwhile, the gas inside the compressed pressed elastic bag 843 is conveyed into the groove 8442 through the air channel 846, at the moment, along with the increase of the gas pressure, the elastic film 8443 drives the anti-slip layer 8444 to expand, further the surface of the anti-slip layer 8444 is attached to the bottom of the circuit board, an anti-slip effect is achieved, further stability is achieved, gaps between the bottom of the circuit board and the top of the supporting block 8441 are filled, stable supporting is achieved, the structures are linked with each other, and the gas pressure is fully combined, multiple functions are achieved, safety and reliability are improved in service performance.
It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by one of ordinary skill in the art and related arts based on the embodiments of the present invention without any creative effort, shall fall within the protection scope of the present invention. Structures, devices, and methods of operation not specifically described or illustrated herein are generally practiced in the art without specific recitation or limitation.
Claims (10)
1. The utility model provides a packaging equipment of face identification chip, includes organism (1), its characterized in that: the side of organism (1) just is located tip position fixedly connected with support casing (2), the inner wall top fixedly connected with elevating system (3) of support casing (2), the work end fixedly connected with encapsulation host computer (4) of elevating system (3), the side fixedly connected with direction press device (5) of encapsulation host computer (4), direction press device (5) are provided with two, and two direction press device (5) symmetry sets up, the inside of organism (1) just is close to central position and rotates and be connected with support pivot (6), the inner wall top that organism (1) was run through on the top of support pivot (6) extends to its outside, the top fixedly connected with workstation (7) of support pivot (6), the top of workstation (7) just is close to marginal position fixedly connected with clamping device (8), the inner wall bottom fixedly connected with power unit (9) of organism (1), the output of power unit (9) is connected through gear engagement with the surface of support pivot (6) through gear engagement.
2. The packaging device of the face recognition chip as claimed in claim 1, wherein: the guide pressing device (5) comprises a connecting rod (51), the top end of the connecting rod (51) is fixedly connected with the side face of the packaging host (4), a pressing block (52) is fixedly connected to the bottom end of the connecting rod (51), an arc surface (53) is arranged on the surface of the pressing block (52), and a roller (54) is connected to the surface of the pressing block (52) in a rolling mode and is located at the position of the arc surface (53).
3. The packaging device of the face recognition chip as claimed in claim 2, wherein: the rollers (54) are uniformly distributed on the surface of the pressing block (52) and are positioned at the position of the arc surface (53), and the surface of the pressing block (52) is provided with rolling grooves matched with the rollers (54).
4. The packaging device of the face recognition chip as claimed in claim 1, wherein: clamping device (8) include base (81), the top fixed connection of the bottom of base (81) and workstation (7), standing groove (82) have been seted up to the top central point of base (81), the inner wall of base (81) and the position that is located standing groove (82) are provided with stop device (83), stop device (83) are provided with two, and two stop device (83) symmetry sets up, the surface of base (81) is provided with auxiliary stay device (84).
5. The packaging device of the face recognition chip as claimed in claim 4, wherein: stop device (83) are including splint device (831), splint device (831) be provided with the inner wall of base (81) and be located the position of standing groove (82), fixedly connected with butterfly elastic component (832) between splint device (831) tip and the corresponding both sides of base (81) inner wall, the position that just is close to butterfly elastic component (832) is provided with pressurized between splint device (831) surface and the corresponding both sides of base (81) inner wall and spouts gasbag (833).
6. The packaging device of the face recognition chip as claimed in claim 5, wherein: splint device (831) are including splint main part (8311), rotate between the one end of splint main part (8311) and the inner wall of base (81) and be connected, the fixed surface of splint main part (8311) is connected with flexible clamp block (8312), the tip fixedly connected with arc pole (8313) of splint main part (8311), the spacing stick (8314) of one end fixedly connected with of splint main part (8311) is kept away from in arc pole (8313), the surface of splint main part (8311) just is close to top position fixedly connected with air nozzle (8315), communicate between the gas port of air nozzle (8315) and the pressurized gas port of spouting gasbag (833).
7. The packaging device of the face recognition chip as claimed in claim 6, wherein: the surface of the splint main body (8311) is arranged to be an arc-shaped surface, and the air nozzles (8315) are uniformly distributed on the surface of the splint main body (8311) and are close to the top position.
8. The packaging device of the face recognition chip as claimed in claim 4, wherein: supplementary strutting arrangement (84) are including being pressed board (841), the top of being pressed board (841) is rotated with the side of base (81) and is connected, be pressed between board (841) surface and the corresponding both sides in base (81) side fixedly connected with elastic sheet (842), be pressed between board (841) surface and the corresponding both sides in base (81) side and be close to the position of elastic sheet (842) and be provided with pressed elasticity bag (843), the inner wall bottom fixedly connected with securing device (844) of base (81), the fixed surface of being pressed board (841) is connected with guide rail (845), air flue (846) have been seted up to the inside of base (81), air flue (846) will be pressed and communicate between elasticity bag (843) and securing device (844).
9. The packaging device of the face recognition chip as claimed in claim 8, wherein: the surface that receives pressure plate (841) and guide rail (845) all set up to the arc, flexure strip (842) evenly distributed receives between pressure plate (841) surface and base (81) side corresponding both sides.
10. The packaging device of the face recognition chip as claimed in claim 8, wherein: the stabilizing device (844) comprises a supporting block (8441), the bottom of the supporting block (8441) is fixedly connected with the bottom of the inner wall of the base (81), a groove (8442) is formed in the top of the supporting block (8441), an air port of the groove (8442) is communicated with one end of the air channel (846), an elastic film (8443) is fixedly connected to the position, located in the groove (8442), of the top of the supporting block (8441), and an anti-slip layer (8444) is arranged on the surface of the elastic film (8443).
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| CN115565913B (en) | 2023-12-22 |
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