CN114530399A - Push type integrated circuit board packaging equipment - Google Patents
Push type integrated circuit board packaging equipment Download PDFInfo
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- CN114530399A CN114530399A CN202210141911.0A CN202210141911A CN114530399A CN 114530399 A CN114530399 A CN 114530399A CN 202210141911 A CN202210141911 A CN 202210141911A CN 114530399 A CN114530399 A CN 114530399A
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- fixing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The present invention relates to a package device, and more particularly, to a press-type package device for an ic board. The invention provides a push type integrated circuit board packaging device which is convenient for taking and placing an integrated circuit board and can avoid damaging the integrated circuit board. The invention provides a press type integrated circuit board packaging device which comprises a guide rail plate, a placing table, an installation frame, a placing plate, an installation plate and the like, wherein the placing table for placing a circuit board is arranged on the upper side of the guide rail plate in a sliding mode, the installation frame is connected to the right part of the guide rail plate, and the placing plate and the installation plate are sequentially connected between the front side and the rear side in the installation frame from left to right. Can conveniently drive integrated circuit board through putting the platform and remove, adjustable splint can be with not epoxy of equidimension centre gripping to reach the effect of diversified centre gripping, the third reset spring can avoid the centre gripping too tightly and lead to damaging, and supplementary compensation through the fly leaf can make the effect of centre gripping more stable.
Description
Technical Field
The present invention relates to a package device, and more particularly, to a press-type package device for an ic board.
Background
In integrated circuit board's encapsulation operation, one of them step is in the integrated circuit board top with epoxy encapsulation, when carrying out shell plate and integrated circuit board's encapsulation, adopt the gluey mode of glue to encapsulate a bit, then directly adopt the mode of joint to encapsulate a bit, these two kinds of encapsulation modes all need press epoxy and integrated circuit board, traditional artifical encapsulation mode can't fix a position epoxy and integrated circuit board fast and press, this can waste more time, lead to whole process time longer, and after the present most of encapsulation equipment encapsulate, it is inconvenient to take out integrated circuit board, and machining efficiency is low.
According to patent grant publication No. CN212322977U, announcement date is 20210108, specifically relates to the field of packaging equipment, and comprises a protective frame, a base, a packaging mold and a plurality of supporting columns, wherein the top ends of the supporting columns are fixedly provided with an ejecting mechanism; the pop-up mechanism comprises a workbench, a groove is formed in the workbench, a first sleeve is fixedly arranged at the top end of the base, a first spring is fixedly arranged at the bottom end of the first sleeve, a first round bar is fixedly arranged at the top end of the first spring, a transverse plate is fixedly arranged at the top end of the first round bar, second sliding grooves are formed in two side walls in the workbench, second sliding blocks are fixedly arranged on two sides of the transverse plate, and a fixing mechanism is fixedly arranged at the top end of the transverse plate. This press type integrated circuit board encapsulation equipment presss from both sides integrated circuit board through two risers, starts bamboo joint formula electric putter, makes the encapsulation mould support integrated circuit board, just can encapsulate the operation to integrated circuit board this moment, and this kind of method can encapsulate integrated circuit board, but can't conveniently remove integrated circuit board, and consequently integrated circuit board's getting and putting operation can be more time consuming to also damage integrated circuit board easily when carrying out the centre gripping.
According to the defects in the prior art, the push type integrated circuit board packaging equipment which is convenient for taking and placing the integrated circuit board and can avoid damaging the integrated circuit board is designed.
Disclosure of Invention
The invention aims to overcome the defects that the prior art can not conveniently move the integrated circuit board, so that the taking and placing operation of the integrated circuit board is time-consuming, and the integrated circuit board is easy to damage during clamping.
In order to solve the technical problem, the invention provides pressing type integrated circuit board packaging equipment which comprises a guide rail plate, a placing table, a mounting frame, a placing plate, a mounting plate, a pressing mechanism, an auxiliary mechanism and a clamping mechanism, wherein the placing table for placing a circuit board is arranged on the upper side of the guide rail plate in a sliding mode, the mounting frame is connected to the right part of the guide rail plate, the placing plate and the mounting plate are sequentially connected between the front side and the rear side in the mounting frame from left to right, the pressing mechanism for pressing the circuit board is arranged on the mounting frame, and the auxiliary mechanism for clamping the circuit board and the clamping mechanism for clamping the circuit board are arranged on the pressing mechanism.
Preferably, pressing mechanism is connected with the deflector that is used for the direction including deflector, clamp plate, depression bar and first reset spring, mounting bracket upside, and the depression bar has been run through to the deflector middle part slidingtype, is connected with first reset spring between depression bar and the deflector, and the depression bar downside is connected with the clamp plate.
Preferably, the auxiliary mechanism comprises a mounting block, a movable plate and a second return spring, the mounting block is symmetrically arranged at the front and back of the lower side of the pressing plate, the movable plate for clamping epoxy resin penetrates through the lower portion of the mounting block in a sliding manner, and the second return spring is connected between the movable plate and the mounting block.
Preferably, clamping mechanism is including the fixed plate, two-way screw rod, solid fixed ring, splint and third reset spring, and clamp plate middle part downside is connected with the fixed plate, and fixed plate lower part rotary type runs through two-way screw rods that are the bilateral symmetry formula and set up, and two-way screw rod outside threaded connection have two solid fixed rings that are the bilateral symmetry formula and set up, and solid fixed ring middle part slidingtype cover is equipped with the splint that are used for pressing from both sides tight circuit board, is connected with third reset spring between splint and the solid fixed ring.
Preferably, still including the feeding mechanism who is used for transporting epoxy, feeding mechanism is including the guide block, the guide bar, first coupling spring, first push pedal, guide rail frame and second push pedal, the mounting panel right part upside is connected with the guide block that is used for the direction, the guide block middle part slidingtype runs through there is the guide bar, the guide bar left side is connected with first push pedal, be connected with between first push pedal and the guide block around establishing the first coupling spring in the guide bar outside, it is connected with the guide rail frame to place the board upside, the gliding style is equipped with the second push pedal that is used for promoting epoxy to remove on the guide rail frame.
Preferably, still including the feed mechanism that is used for placing epoxy, feed mechanism is equipped with the dwang including dwang, torsional spring and last flitch, guide rail frame left part rotary type, and the dwang middle part cover is equipped with the last flitch that is used for supporting epoxy, goes up to be connected with two between flitch and the guide rail frame around establishing the torsional spring in the dwang outside.
Preferably, still including being used for stabilizing feeding mechanism's fixed establishment, fixed establishment is equipped with the cardboard including mount, second coupling spring, fixture block and cardboard, first push pedal right side longitudinal symmetry formula, and mounting plate left part downside longitudinal symmetry formula is equipped with the mount, and the slidable runs through on the mount has the fixture block that is used for blocking the cardboard, is connected with second coupling spring between fixture block and the mount.
Preferably, still including being used for supplementary fixed establishment's stretching mechanism, stretching mechanism is including fixed block, pipe, stay cord, arm-tie, draw frame and C type piece, and the symmetry formula is equipped with the fixed block that is located the mount right side around the mounting panel downside, and it has the pipe to run through on the fixed block, and the fixture block upside is connected with the slidingtype stay cord that runs through in the pipe, and stay cord trailing end connection has the arm-tie, and the symmetry formula is equipped with the arm-tie around the top right side in the depression bar, and arm-tie lower part left side is connected with the C type piece that is used for pulling the arm-tie and removes.
On the basis of overcoming the defects of the prior art, the invention can also achieve the following beneficial effects:
1. can conveniently drive integrated circuit board through putting the platform and remove, adjustable splint can be lived with the epoxy centre gripping of equidimension not to reach the effect of diversified centre gripping, third reset spring can avoid the centre gripping too tightly and lead to damaging, and supplementary compensation through the fly leaf can make the effect of centre gripping more stable.
2. Epoxy transports between the splint of front and back both sides through second push pedal and first push pedal to this operation that can make the operation people material loading is convenient and fast more.
3. The upwarping of the upper plate can indicate that the epoxy resin is not clamped by the clamping plates, and meanwhile, the protection effect can be achieved when the packaging operation is not needed, so that the phenomenon that the bidirectional screw rod is clamped by foreign matters is avoided.
4. The clamping plate is clamped by the clamping block, so that when the circuit board is packaged, the first push plate is prevented from rebounding under the reset effect of the first connecting spring to influence the packaging of the circuit board.
5. The pressing rod drives the C-shaped block to move downwards through the pull frame to loosen the pull plate, so that the clamping plate can be clamped quickly by the clamping block when the circuit board is packaged, and the pressing rod can drive the C-shaped block to push the pull plate to move upwards through the pull frame after packaging is completed, so that the clamping plate can be loosened quickly by the clamping block after packaging operation is completed.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a partial perspective sectional view of the present invention.
Fig. 3 is a perspective sectional view of the pressing mechanism of the present invention.
Fig. 4 is a schematic perspective view of a part of the pressing mechanism, the clamping mechanism and the auxiliary mechanism of the present invention.
Fig. 5 is a sectional view of a first three-dimensional structure of the feeding mechanism of the present invention.
Fig. 6 is a sectional view of a second three-dimensional structure of the feeding mechanism of the present invention.
Fig. 7 is an enlarged view of the invention at a.
Fig. 8 is a three-dimensional structural section view of the feeding mechanism of the present invention.
The labels in the figures are: 1-guide rail plate, 11-placing table, 2-mounting frame, 21-placing plate, 22-mounting plate, 3-pressing mechanism, 31-guide plate, 32-pressing plate, 33-pressing rod, 34-first return spring, 4-auxiliary mechanism, 41-mounting block, 42-movable plate, 43-second return spring, 5-clamping mechanism, 51-fixing plate, 52-two-way screw rod, 53-fixing ring, 54-clamping plate, 55-third return spring, 6-feeding mechanism, 61-guide block, 62-guide rod, 63-first connecting spring, 64-first pushing plate, 65-guide rail frame, 66-second pushing plate, 7-feeding mechanism, 71-rotating rod, 72-torsion spring, 73-feeding plate, 8-fixing mechanism, 81-fixing frame, 82-second connecting spring, 83-clamping block, 84-clamping plate, 9-stretching mechanism, 91-fixing block, 92-guide pipe, 93-pull rope, 94-pull plate, 95-pulling frame and 96-C type block.
Detailed Description
The invention is further described below with reference to the figures and examples.
Example 1
The utility model provides a push type integrated circuit board encapsulation equipment, as shown in fig. 1-4, including guide rail plate 1, place platform 11, mounting bracket 2, place board 21, mounting panel 22, pressing means 3, complementary unit 4 and clamping mechanism 5, the platform 11 is place to 1 upside slidingtype of guide rail plate, 1 right part bolt of guide rail plate has mounting bracket 2, turn right from a left side and have connected gradually and place board 21 and mounting panel 22 in the mounting bracket 2 between the front and back both sides, be provided with pressing means 3 on the mounting bracket 2, be provided with complementary unit 4 and clamping mechanism 5 on the pressing means 3.
As shown in fig. 2, the pressing mechanism 3 includes a guide plate 31, a pressing plate 32, a pressing rod 33 and a first return spring 34, the guide plate 31 is bolted to the upper side of the mounting frame 2, the pressing rod 33 slidably penetrates through the middle of the guide plate 31, the first return spring 34 is connected between the pressing rod 33 and the guide plate 31, and the pressing plate 32 is welded to the lower side of the pressing rod 33.
As shown in fig. 4, the auxiliary mechanism 4 includes a mounting block 41, a movable plate 42 and a second return spring 43, the mounting block 41 is bolted symmetrically in a front-back manner on the lower side of the pressure plate 32, the movable plate 42 slidably penetrates through the lower portion of the mounting block 41, and the second return spring 43 is connected between the movable plate 42 and the mounting block 41.
As shown in fig. 4, the clamping mechanism 5 includes a fixing plate 51, two-way screws 52, fixing rings 53, a clamping plate 54 and a third return spring 55, the fixing plate 51 is bolted to the lower side of the middle portion of the pressing plate 32, two-way screws 52 are rotatably penetrated through the lower portion of the fixing plate 51, the two-way screws 52 are arranged in a bilateral symmetry manner, two fixing rings 53 are threadedly connected to the outer sides of the two-way screws 52, the two fixing rings 53 are arranged in a bilateral symmetry manner, the clamping plate 54 is slidably sleeved in the middle of the fixing rings 53, and the third return spring 55 is connected between the clamping plate 54 and the fixing rings 53.
Firstly, an operator places the integrated circuit board on the placing table 11, the placing table 11 drives the integrated circuit board to move right to the position under the pressing plate 32, then the two-way screw 52 is rotated, the two-way screw 52 drives the fixing rings 53 on the front and rear sides to move in the opposite directions, the fixing rings 53 on the front and rear sides respectively drive the clamping plates 54 on the front and rear sides to move in the opposite directions, the operator reversely rotates the two-way screw 52, the fixing rings 53 on the front and rear sides respectively drive the clamping plates 54 on the front and rear sides to move in the opposite directions, so that the distance between the clamping plates 54 on the front and rear sides can be adjusted according to the width of the epoxy resin, the operator places the epoxy resin between the clamping plates 54 on the front and rear sides to clamp the epoxy resin, the third return spring 55 is compressed, when the epoxy resin is large, the operator moves the two movable plates 42 in the opposite directions, the second return spring 43 is compressed to loosen the two movable plates 42, the second return spring 43 is reset, the two movable plates 42 move in opposite directions to clamp the epoxy resin under the reset action of the second return spring 43, so that the epoxy resin can be stabilized, the epoxy resin fracture phenomenon is avoided, the operator drives the pressing plate 32 to move downwards through the pressing rod 33, the first return spring 34 is compressed, the clamping plate 54 and the movable plates 42 drive the epoxy resin to move downwards and be packaged on the integrated circuit board, then the operator rotates the bidirectional screw 52 anticlockwise, the bidirectional screw 52 drives the fixing rings 53 on the front side and the rear side to move in a direction away from each other, the fixing rings 53 on the front side and the rear side respectively drive the clamping plates 54 on the front side and the rear side to move in a direction away from each other to loosen the epoxy resin, the third return spring 55 is reset, the operator moves the two movable plates 42 in a direction away from each other, the second return spring 43 is compressed to enable the two movable plates 42 to release the epoxy resin, the operator releases the press rod 33 and the two movable plates 42 again, the first return spring 34 and the second return spring are reset, the press rod 33 drives the press plate 32 to move upwards under the reset action of the first return spring 34, the two movable plates 42 move in opposite directions under the reset action of the second return spring 43, the integrated circuit board packaging operation can be completed, and the operator drives the packaged integrated circuit board to move leftwards through the placing plate 21, so that the integrated circuit board can be taken out of the placing plate 21.
Example 2
On the basis of embodiment 1, as shown in fig. 1, 5 and 8, the feeding device further includes a feeding mechanism 6, the feeding mechanism 6 includes a guide block 61, a guide rod 62, a first connecting spring 63, a first push plate 64, a guide rail frame 65 and a second push plate 66, the guide block 61 is bolted on the upper side of the right portion of the mounting plate 22, the guide rod 62 is slidably penetrated through the middle portion of the guide block 61, the first push plate 64 is connected on the left side of the guide rod 62, the first connecting spring 63 is connected between the first push plate 64 and the guide block 61, the first connecting spring 63 is wound on the outer side of the guide rod 62, the guide rail frame 65 is bolted on the upper side of the placing plate 21, and the second push plate 66 is slidably arranged on the guide rail frame 65.
As shown in fig. 1 and 8, the rail guide rail device further comprises a feeding mechanism 7, wherein the feeding mechanism 7 comprises a rotating rod 71, a torsion spring 72 and a feeding plate 73, the rotating rod 71 is rotatably arranged at the left part of the rail guide frame 65, the feeding plate 73 is sleeved at the middle part of the rotating rod 71, two torsion springs 72 are connected between the feeding plate 73 and the rail guide frame 65, and the torsion spring 72 is wound outside the rotating rod 71.
As shown in fig. 2, 6 and 7, the fixing device further includes a fixing mechanism 8, the fixing mechanism 8 includes a fixing frame 81, a second connecting spring 82, a clamping block 83 and a clamping plate 84, the clamping plate 84 is symmetrically bolted on the right side of the first pushing plate 64 in a front-back manner, the fixing frame 81 is symmetrically bolted on the left lower side of the mounting plate 22 in a front-back manner, the clamping block 83 is slidably penetrated on the fixing frame 81, and the second connecting spring 82 is connected between the clamping block 83 and the fixing frame 81.
As shown in fig. 2, 6 and 7, the drawing device further comprises a drawing mechanism 9, the drawing mechanism 9 comprises a fixing block 91, a guide pipe 92, a pull rope 93, a pull plate 94, a pull frame 95 and a C-shaped block 96, the fixing block 91 is symmetrically arranged at the front and back of the lower side of the mounting plate 22, the fixing block 91 is positioned at the right side of the fixing frame 81, the guide pipe 92 penetrates through the fixing block 91, the pull rope 93 is connected to the upper side of the fixing block 83, the guide pipe 92 penetrates through the pull rope 93 in a sliding manner, the pull plate 94 is connected to the tail end of the pull rope 93, the pull frame 95 is symmetrically arranged at the front and back of the right side of the inner top of the pressing rod 33, and the C-shaped block 96 is connected to the left side of the lower portion of the pull frame 95.
An operator places epoxy resin on the feeding plate 73, the feeding plate 73 is stressed to rotate downwards and is parallel to the guide rail frame 65, the torsion spring 72 deforms, the operator pushes the epoxy resin to move rightwards through the second push plate 66, the epoxy resin can extrude the first push plate 64 to drive the guide rod 62 and the clamping plate 84 to move rightwards, the first connecting spring 63 compresses, so that the epoxy resin moves to a position between the clamping plates 54 on the front side and the rear side, the second push plate 66 clamps the feeding plate 73 at the moment, the operator clamps the epoxy resin through the clamping plate 54 again, then the circuit board packaging operation can be carried out, the first C-shaped block 96 clamps the pulling plate 94, the second connecting spring 82 is in a compression state, when the operator moves the pressing rod 33 downwards, the pressing rod 33 can drive the C-shaped block 96 to move downwards through the pulling frame 95 to release the pulling plate 94, the second connecting spring 82 resets, the clamping block 83 moves upwards under the action of the second connecting spring 82 resetting, at this time, the clamping plate 84 is located right above the clamping block 83, the clamping block 83 moves upwards to clamp the clamping plate 84, so that the first pushing plate 64 can be fixed, after the packaging operation of the circuit board is completed, the pressing rod 33 moves upwards to drive the C-shaped block 96 to pull the pulling plate 94 to move upwards through the pulling frame 95, the pulling plate 94 pulls the clamping block 83 to move downwards through the pulling rope 93, the second connecting spring 82 compresses, the clamping block 83 moves downwards to release the clamping plate 84, the first connecting spring 63 resets, the first pushing plate 64 drives the guide rod 62 and the clamping plate 84 to move leftwards to reset under the reset action of the first connecting spring 63, the operator drives the second pushing plate 66 to move leftwards to release the feeding plate 73, the torsion spring 72 resets, the feeding plate 73 rotates upwards to reset under the reset action of the torsion spring 72, and the next feeding operation can be prepared.
The above examples are merely representative of preferred embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, various changes, modifications and substitutions can be made without departing from the spirit of the present invention, and these are all within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. The utility model provides a push type integrated circuit board encapsulation equipment, including guide rail board (1), place platform (11), mounting bracket (2), place board (21) and mounting panel (22), guide rail board (1) upside slidingtype is equipped with places platform (11) that are used for placing the circuit board, guide rail board (1) right part is connected with mounting bracket (2), turn right from a left side and put board (21) and mounting panel (22) between the front and back both sides in mounting bracket (2) in proper order, a serial communication port, still including pressing means (3), complementary unit (4) and clamping mechanism (5), be provided with pressing means (3) that are used for pressing the circuit board on mounting bracket (2), be provided with complementary unit (4) that are used for blocking the circuit board on pressing means (3) and clamping mechanism (5) that are used for clamping the circuit board.
2. The push type integrated circuit board packaging equipment according to claim 1, wherein the pressing mechanism (3) comprises a guide plate (31), a pressing plate (32), a pressing rod (33) and a first return spring (34), the guide plate (31) for guiding is connected to the upper side of the mounting frame (2), the pressing rod (33) penetrates through the middle of the guide plate (31) in a sliding manner, the first return spring (34) is connected between the pressing rod (33) and the guide plate (31), and the pressing plate (32) is connected to the lower side of the pressing rod (33).
3. The press type packaging equipment for the integrated circuit board according to claim 2, wherein the auxiliary mechanism (4) comprises a mounting block (41), a movable plate (42) and a second return spring (43), the mounting block (41) is symmetrically arranged in front and back of the lower side of the press plate (32), the movable plate (42) for clamping the epoxy resin is slidably penetrated through the lower part of the mounting block (41), and the second return spring (43) is connected between the movable plate (42) and the mounting block (41).
4. A press type ic board packaging apparatus as claimed in claim 3, wherein the clamping mechanism (5) comprises a fixing plate (51), a two-way screw (52), a fixing ring (53), a clamping plate (54) and a third return spring (55), the fixing plate (51) is connected to the lower side of the middle portion of the pressing plate (32), two-way screws (52) are arranged in bilateral symmetry in a rotary manner and penetrate through the lower portion of the fixing plate (51), two fixing rings (53) are arranged in bilateral symmetry in a threaded manner and connected to the outer side of the two-way screws (52), the clamping plate (54) for clamping the circuit board is slidably sleeved in the middle portion of the fixing ring (53), and the third return spring (55) is connected between the clamping plate (54) and the fixing ring (53).
5. The press type IC board packaging device according to claim 4, further comprising a feeding mechanism (6) for transporting epoxy resin, wherein the feeding mechanism (6) comprises a guide block (61), a guide rod (62), and a first connecting spring (63), first push pedal (64), guide rail frame (65) and second push pedal (66), mounting panel (22) right part upside is connected with guide block (61) that are used for the direction, guide block (61) middle part slidingtype runs through has guide bar (62), guide bar (62) left side is connected with first push pedal (64), be connected with between first push pedal (64) and guide block (61) around establishing first connecting spring (63) in the guide bar (62) outside, place board (21) upside and be connected with guide rail frame (65), the gliding type is equipped with second push pedal (66) that are used for promoting the epoxy removal on guide rail frame (65).
6. The push type integrated circuit board packaging device according to claim 5, further comprising a feeding mechanism (7) for placing epoxy resin, wherein the feeding mechanism (7) comprises a rotating rod (71), a torsion spring (72) and a feeding plate (73), the rotating rod (71) is rotatably arranged at the left part of the guide rail frame (65), the feeding plate (73) for supporting the epoxy resin is sleeved at the middle part of the rotating rod (71), and two torsion springs (72) wound outside the rotating rod (71) are connected between the feeding plate (73) and the guide rail frame (65).
7. The push type integrated circuit board packaging device according to claim 6, further comprising a fixing mechanism (8) for stabilizing the feeding mechanism (6), wherein the fixing mechanism (8) comprises a fixing frame (81), a second connecting spring (82), a clamping block (83) and a clamping plate (84), the clamping plate (84) is symmetrically arranged on the right side of the first push plate (64) in a front-back manner, the fixing frame (81) is symmetrically arranged on the left lower side of the mounting plate (22) in a front-back manner, the clamping block (83) for clamping the clamping plate (84) is slidably penetrated through the fixing frame (81), and the second connecting spring (82) is connected between the clamping block (83) and the fixing frame (81).
8. The push type integrated circuit board packaging equipment as claimed in claim 7, further comprising a stretching mechanism (9) for assisting the fixing mechanism (8), wherein the stretching mechanism (9) comprises fixing blocks (91), guide pipes (92), a pull rope (93), a pull plate (94), a pull frame (95) and C-shaped blocks (96), the fixing blocks (91) located on the right side of the fixing frame (81) are symmetrically arranged on the lower side of the mounting plate (22) in a front-back manner, the guide pipes (92) penetrate through the fixing blocks (91), the pull rope (93) slidably penetrating through the guide pipes (92) is connected to the upper side of the fixing blocks (83), the pull plate (94) is connected to the tail end of the pull rope (93), the pull frames (95) are symmetrically arranged on the right side of the inner top of the press rod (33) in the front-back manner, and the C-shaped blocks (96) for pulling the pull plate (94) to move are connected to the left side of the lower portion of the pull frame (95).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210141911.0A CN114530399B (en) | 2022-02-16 | 2022-02-16 | Push type integrated circuit board packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210141911.0A CN114530399B (en) | 2022-02-16 | 2022-02-16 | Push type integrated circuit board packaging equipment |
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| Publication Number | Publication Date |
|---|---|
| CN114530399A true CN114530399A (en) | 2022-05-24 |
| CN114530399B CN114530399B (en) | 2022-10-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210141911.0A Active CN114530399B (en) | 2022-02-16 | 2022-02-16 | Push type integrated circuit board packaging equipment |
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| CN (1) | CN114530399B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115565913A (en) * | 2022-09-22 | 2023-01-03 | 江苏广图信息技术有限公司 | Packaging equipment for face recognition chip |
| CN116072576A (en) * | 2023-03-24 | 2023-05-05 | 广州雅量商业智能技术有限公司 | Integrated circuit board packaging device and packaging method thereof |
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| CN112317912A (en) * | 2020-10-29 | 2021-02-05 | 广州好未来科技研究有限公司 | Auxiliary dismounting device of integrated block for maintaining high-performance integrated circuit |
| CN112492769A (en) * | 2020-11-07 | 2021-03-12 | 章凯云 | Push type integrated circuit board intelligence encapsulation equipment |
| CN113038733A (en) * | 2021-03-10 | 2021-06-25 | 梁健玲 | Welding equipment for assembling printed circuit board |
| CN215601762U (en) * | 2021-07-12 | 2022-01-21 | 武汉科立杰电子科技有限公司 | Paster device of printed circuit board |
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2022
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| CN112317912A (en) * | 2020-10-29 | 2021-02-05 | 广州好未来科技研究有限公司 | Auxiliary dismounting device of integrated block for maintaining high-performance integrated circuit |
| CN112492769A (en) * | 2020-11-07 | 2021-03-12 | 章凯云 | Push type integrated circuit board intelligence encapsulation equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115565913A (en) * | 2022-09-22 | 2023-01-03 | 江苏广图信息技术有限公司 | Packaging equipment for face recognition chip |
| CN115565913B (en) * | 2022-09-22 | 2023-12-22 | 江苏广图信息技术有限公司 | Face recognition chip packaging equipment |
| CN116072576A (en) * | 2023-03-24 | 2023-05-05 | 广州雅量商业智能技术有限公司 | Integrated circuit board packaging device and packaging method thereof |
| CN116072576B (en) * | 2023-03-24 | 2023-08-08 | 广州雅量商业智能技术有限公司 | Integrated circuit board packaging device and packaging method thereof |
Also Published As
| Publication number | Publication date |
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| CN114530399B (en) | 2022-10-21 |
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