CN115565913B - Face recognition chip packaging equipment - Google Patents
Face recognition chip packaging equipment Download PDFInfo
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- CN115565913B CN115565913B CN202211134080.0A CN202211134080A CN115565913B CN 115565913 B CN115565913 B CN 115565913B CN 202211134080 A CN202211134080 A CN 202211134080A CN 115565913 B CN115565913 B CN 115565913B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 238000003825 pressing Methods 0.000 claims abstract description 56
- 238000005538 encapsulation Methods 0.000 claims abstract description 26
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 239000012528 membrane Substances 0.000 claims description 11
- 238000005096 rolling process Methods 0.000 claims description 10
- 230000000087 stabilizing effect Effects 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 22
- 230000003028 elevating effect Effects 0.000 description 10
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 3
- 239000002775 capsule Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Abstract
The invention discloses a packaging device of a face recognition chip, which comprises a machine body, wherein a supporting shell is fixedly connected to the side surface of the machine body and positioned at the end part, a lifting mechanism is fixedly connected to the top of the inner wall of the supporting shell, a packaging host is fixedly connected to the working end of the lifting mechanism, a guiding pressing device is fixedly connected to the side surface of the packaging host, a supporting rotating shaft is rotatably connected to the inside of the machine body and close to the central position, a clamping device is fixedly connected to the top of a working table and close to the edge position, a power mechanism is fixedly connected to the bottom of the inner wall of the machine body, and the output end of the power mechanism is connected with the surface of the supporting rotating shaft through gear engagement. This face identification chip's encapsulation equipment has reached steady encapsulation's effect, can carry out steady clamp to the circuit board, reduces the influence that receives external force or vibrations for the operation is more stable, helps quick accurate encapsulation, safe and reliable has improved work efficiency and performance.
Description
Technical Field
The invention relates to the technical field of chip packaging equipment, in particular to packaging equipment for face recognition chips.
Background
Face recognition is a biological recognition technology for carrying out identity recognition based on facial feature information of people. A series of related technologies, commonly referred to as image recognition and face recognition, are used to capture images or video streams containing faces with a camera or cameras, and automatically detect and track the faces in the images, thereby recognizing the detected faces. The chip is an important component in face recognition, and the chip needs to be processed by a packaging process in the application process.
At present, the packaging equipment structure of the existing chip is too simple, and when the chip is packaged, the chip is clamped in a rigid mode, the circuit board is easy to damage, meanwhile, the circuit board is easy to be influenced by external force or vibration, the circuit board is poor in stability, accurate packaging is not easy to perform, the working efficiency is influenced, the chip packaging equipment is not suitable for mass production, and the service performance is reduced.
Disclosure of Invention
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a packaging equipment of face identification chip, includes the organism, the side of organism and be located tip position fixedly connected with support housing, support housing's inner wall top fixedly connected with elevating system, elevating system's work end fixedly connected with encapsulation host computer, encapsulation host computer's side fixedly connected with direction press device, direction press device is provided with two, and two direction press device symmetry sets up, the inside of organism and be close to central point put and rotate and be connected with the support pivot, support pivot's top runs through the inner wall top and extends to its outside, support pivot's top fixedly connected with workstation, workstation's top and be close to edge position fixedly connected with clamping device, the inner wall bottom fixedly connected with power unit of organism, power unit's output passes through gear engagement with support pivot's surface and is connected, places the circuit board on clamping device, and then presss tightly the circuit board, places the chip on the encapsulation host computer this moment to wholly drive encapsulation host computer through elevating system and move down, direction press device also moves down along with together, and utilizes direction press device and clamp device to act on each other, make the whole and has improved the stability and can make the whole device carry out the steady operation, and has improved the stability and stability to the face identification, and high accuracy and stability, and high-speed, and high accuracy and stability.
Preferably, the guiding pressing device comprises a connecting rod, the top end of the connecting rod is fixedly connected with the side face of the packaging host, the bottom end of the connecting rod is fixedly connected with a pressing block, the surface of the pressing block is provided with an arc face, and the surface of the pressing block is in rolling connection with a roller at the position of the arc face.
Preferably, the rollers are uniformly distributed on the surface of the pressing block and positioned at the position of the circular arc surface, and rolling grooves matched with the rollers are formed in the surface of the pressing block.
Preferably, the clamping device comprises a base, the bottom of base and the top fixed connection of workstation, the standing groove has been seted up to the top central point of base put, the inner wall of base just is located the position of standing groove and is provided with stop device, stop device is provided with two, and two stop device symmetry settings, the surface of base is provided with auxiliary support device, when the circuit board put into the standing groove on the base, utilizes clamping device to press from both sides the circuit board, and when elevating system drives down with the encapsulation host computer, the pressing block surface and the guide rail surface contact on the guide pressing device this moment, and the surface of pressing block is provided with the arc surface, and then coincide with the guide rail surface, play the effect of direction, make encapsulation host computer steady downwardly moving, and under the pressure effect of connecting rod, pressing block downwardly moving, and the roller rolls, and then applys the rolling pressing force to the pressurized plate, and then help the steady support of follow-up auxiliary support device to the circuit board, reduce the influence of flat external force, fully link the structure together, multiple functions have been realized, safety and reliability has improved the performance.
Preferably, the limiting device comprises a clamping plate device, the clamping plate device is provided with the inner wall of the base and is positioned at the position of the placing groove, a butterfly-shaped elastic piece is fixedly connected between the end part of the clamping plate device and the two corresponding sides of the inner wall of the base, and a compressed air spraying bag is arranged between the surface of the clamping plate device and the two corresponding sides of the inner wall of the base and close to the butterfly-shaped elastic piece.
Preferably, the splint device includes the splint main part, rotate between the inner wall of one end and the base of splint main part and be connected, the fixed surface of splint main part is connected with flexible clamp block, the tip fixedly connected with arc pole of splint main part, the one end fixedly connected with spacing stick of splint main part is kept away from to the arc pole, the surface of splint main part just is close to top position fixedly connected with air nozzle, communicate between the gas port of air nozzle and the gas port of pressurized jetting bag, when the circuit board is put into the standing groove to promote the circuit board, the splint main part on the splint device receives behind the thrust of circuit board this moment, and combine to rotate between the inner wall of one end and the base of splint main part and be connected, the splint main part is reverse to rotate this moment, and then compress butterfly elastic component, receive the pressurized jetting bag, and combine effort and reaction force, make elastic component, receive the jetting bag to apply reverse elastic force to the splint main part, and combine flexible clamp block to press from each other to press from the circuit board, be difficult for removing at will this moment, and the tip top of circuit board is at the surface of spacing stick, and then carries out spacing to the circuit board, along with receiving the jetting bag by compression, the air compressor, and exhaust air bag inside and the air bag is connected with the air inlet and air duct, and the effect that has been realized, and the mutual effect has been realized, and the chip is connected to the air duct and has been sealed.
Preferably, the surface of the clamping plate main body is provided with an arc-shaped surface, and the air nozzles are uniformly distributed on the surface of the clamping plate main body and are close to the top position.
Preferably, the auxiliary supporting device comprises a pressure receiving plate, the top of the pressure receiving plate is rotationally connected with the side surface of the base, an elastic sheet is fixedly connected between two sides corresponding to the side surface of the pressure receiving plate, a pressure receiving elastic bag is arranged between two sides corresponding to the side surface of the pressure receiving plate and the side surface of the base and close to the position of the elastic sheet, a stabilizing device is fixedly connected with the bottom of the inner wall of the base, a guide rail is fixedly connected with the surface of the pressure receiving plate, an air passage is formed in the base, and the air passage is communicated between the pressure receiving elastic bag and the stabilizing device.
Preferably, the surface of the pressure receiving plate and the surface of the guide rail are both arc-shaped, and the elastic sheets are uniformly distributed between the surface of the pressure receiving plate and two sides corresponding to the side surfaces of the base.
Preferably, the stabilizing device comprises a supporting block, the bottom of supporting block and the inner wall bottom fixed connection of base, the recess has been seted up at the top of supporting block, the gas port of recess communicates with the one end of air flue, the top of supporting block just is located the position fixedly connected with elastic membrane of recess, the surface of elastic membrane is provided with the skid resistant course, after pressing block surface and guide rail surface contact, and along with moving down, and then apply the compressive force to the pressurized plate, make the pressurized plate rotate, the elastic sheet, pressurized elastic bag receives the compression this moment, and under reverse elasticity effect, make the roller on the direction pressing device closely laminate with the guide rail surface, and then make the operation more stable between the whole structure, receive compressed pressurized elastic bag inside gas to carry in the recess through the air flue simultaneously, this moment along with the increase of gas pressure, make the elastic membrane drive skid resistant course inflation, and then make the surface of skid resistant course laminate with the bottom laminating of circuit board, further make stable, and fill the gap between circuit board bottom and the supporting block top, support steadily, utilize the structure to associate each other pressure, and fully combine the function together, safety and reliability have been realized.
The invention provides a packaging device of a face recognition chip. The beneficial effects are as follows:
1. this encapsulation equipment of face identification chip, through the organism, support the casing, elevating system, encapsulation host computer, direction press device, support the pivot, the workstation, clamping device, power unit, place clamping device with the circuit board on, and then press from both sides tightly the circuit board, this moment on placing encapsulation host computer with the chip, and wholly drive encapsulation host computer through elevating system and move down, direction press device also moves down along with together this moment, and utilize the interact between direction press device and the clamping device, make overall structure more stable, and then promoted the encapsulation to face identification chip, whole device is rational in infrastructure simple, convenient to use, can carry out steady clamp to the circuit board, reduce the influence that receives external force or vibrations, make whole equipment operation more stable, help quick accurate encapsulation, and safe and reliable, work efficiency and performance have been improved.
2. This encapsulation equipment of face identification chip, through direction press device, the connecting rod, press briquetting, the arc surface, the roller, clamping device, the base, the standing groove, stop device, auxiliary stay device, when the circuit board is put into the standing groove on the base, utilize clamping device to press from both sides the circuit board, and when elevating system drives encapsulation host computer downwardly moving, the last pressing block surface of direction press device contacts with the guide rail surface this moment, and the surface of pressing block is provided with the arc surface, and then coincide with the guide rail surface, the effect of direction has been played, make encapsulation host computer steadily downwardly moving, and under the pressure effect of connecting rod, the pressing block downwardly moving, and the roller rolls, and then apply the rolling pressing force to the pressure bearing plate, and then help the steady support of follow-up auxiliary stay device to the circuit board, reduce the flat influence of receiving external force, fully link the structure together, multiple functions have been realized, safe and reliable, and usability has been improved.
3. This encapsulation equipment of face identification chip, through stop device, the splint device, butterfly elastic component, the pressurized spouts the gasbag, the splint main part, flexible clamp piece, the arc pole, spacing stick, the air nozzle, when the circuit board is put into the standing groove, and promote the circuit board, the splint main part on the splint device receives the thrust back of circuit board this moment, and combine and rotate between the inner wall of one end and the base of splint main part and be connected, this moment the splint main part is reverse rotation, and then compress butterfly elastic component, pressurized spouts the gasbag, and combine effort and reaction force, make butterfly elastic component, pressurized spouts the gasbag and will apply reverse elastic force to splint main part, and press from both sides tight piece and press from both sides tightly to press from both sides the circuit board, be difficult for moving at will, and the tip of circuit board is propped on the surface of spacing stick, and then spacing to the circuit board, simultaneously along with pressurized spouting the gasbag is compressed, the inside gas discharge of pressurized spouting the gasbag this moment, and combine the intercommunication between the mouth of air nozzle, this moment gas blows off to the surface of circuit board from the mouth, and then, the debris on circuit board surface is blown off, and the effect of the chip of self-cleaning has been realized, the subsequent use of the effect of the chip, and the mutual effect between the structure is realized, and multiple functions have been realized, and the packaging effect is realized.
4. This encapsulation equipment of face identification chip, through auxiliary stay device, the pressurized board, the elastic sheet, the pressurized elastic bag, the securing device, the guide rail, the air flue, the supporting shoe, the recess, the elastic membrane, the skid resistant course, after pressing the surface of piece and guide rail surface contact, and along with moving down, and then apply the pressing force to the pressurized board, make the pressurized board rotate, at this moment, the elastic sheet, pressurized elastic bag receives the compression, and under reverse elasticity effect, make the roller on the direction pressing device closely laminate with the guide rail surface, and then make the operation between the whole structure more stable, receive compressed pressurized elastic bag inside gas to carry in the recess through the air flue simultaneously, at this moment along with the increase of gas pressure, make the elastic membrane drive skid resistant course inflation, and then make the surface of skid resistant course laminate with the bottom laminating of circuit board, the skid resistant effect has been played, further make stably, and filled the gap between circuit board bottom and the supporting shoe top, carry out steady support, utilize the interrelationship between the structure, and fully combine gas pressure, link together the structure, multiple functions, safe and reliable have improved the performance.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of the internal structure of the present invention;
FIG. 3 is a schematic view of the structure of the guiding pressing device of the present invention;
FIG. 4 is a schematic view of a clamping device according to the present invention;
FIG. 5 is a schematic view of a limiting device according to the present invention;
FIG. 6 is a schematic view of the structure of the clamping plate device of the present invention;
FIG. 7 is a schematic view of the auxiliary supporting device of the present invention;
fig. 8 is an enlarged view of a portion of fig. 7 at a in accordance with the present invention.
In the figure: the device comprises a machine body 1, a support shell 2, a lifting mechanism 3, a packaging main machine 4, a guide pressing device 5, a support rotating shaft 6, a workbench 7, a clamping device 8, a power mechanism 9, a connecting rod 51, a pressing block 52, a circular arc surface 53, a roller 54, a base 81, a placing groove 82, a limiting device 83, an auxiliary supporting device 84, a clamping plate device 831, a butterfly-shaped elastic piece 832, a compressed air spraying bag 833, a clamping plate 8311 main body 8312, a flexible clamping block 8313, an arc-shaped rod 8314, a limiting rod 8315 air nozzle, a pressure-bearing plate 841, an elastic sheet 842, a compressed elastic bag 843, a stabilizing device 844, a guide rail 845, an air passage 846, a supporting block 8441, a groove 8442, an elastic membrane 8443 and an anti-skid layer 8444.
Detailed Description
The invention will be described in further detail with reference to the drawings and the detailed description. The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Example 1
Referring to fig. 1-8, the present invention provides a technical solution: the utility model provides a packaging equipment of face identification chip, including organism 1, the side of organism 1 and be located tip position fixedly connected with support housing 2, the inner wall top fixedly connected with elevating system 3 of support housing 2, elevating system 3's work end fixedly connected with encapsulation host computer 4, encapsulation host computer 4's side fixedly connected with direction press device 5, direction press device 5 is provided with two, and two direction press device 5 symmetry sets up, organism 1's inside and be close to central point and put the rotation and be connected with support pivot 6, support pivot 6's top runs through organism 1's inner wall top and extends to its outside, support pivot 6's top fixedly connected with workstation 7, workstation 7's top and be close to edge position fixedly connected with clamping device 8, organism 1's inner wall bottom fixedly connected with power unit 9, power unit 9's output and support pivot 6's surface pass through gear engagement and be connected, place the clamping device 8 with the circuit board, and then press from each other tightly to the circuit board, at this moment place the chip on encapsulation host computer 4, and through elevating system 3 with encapsulation host computer 4 whole drive and move down, direction press device 5 also moves down along with moving down together, and use the guide device 5 to make the effect down, and make the whole device has improved the effect of the device, and the whole device has improved the stability of the performance, and can be used for the whole device, the device has improved the performance of the device has improved, the device has improved the performance, and can be more stable, and has the device.
Example 2
The guiding pressing device 5 comprises a connecting rod 51, the top end of the connecting rod 51 is fixedly connected with the side face of the packaging host 4, the bottom end of the connecting rod 51 is fixedly connected with a pressing block 52, the surface of the pressing block 52 is provided with an arc face 53, and the surface of the pressing block 52 is provided with a roller 54 in a rolling connection mode at the position of the arc face 53.
The rollers 54 are uniformly distributed on the surface of the pressing block 52 and located at the position of the circular arc surface 53, and rolling grooves matched with the rollers 54 are formed in the surface of the pressing block 52.
The clamping device 8 comprises a base 81, the bottom of the base 81 is fixedly connected with the top of the workbench 7, a placing groove 82 is formed in the center of the top of the base 81, limiting devices 83 are arranged on the inner wall of the base 81 and located at the place of the placing groove 82, the limiting devices 83 are arranged two, the two limiting devices 83 are symmetrically arranged, an auxiliary supporting device 84 is arranged on the surface of the base 81, when a circuit board is placed in the placing groove 82 on the base 81, the clamping device 8 is used for clamping the circuit board, and when the lifting mechanism 3 drives the packaging host 4 to move downwards, the surface of a pressing block 52 on the guiding pressing device 5 is contacted with the surface of a guide rail 845 at the moment, the surface of the pressing block 52 is provided with an arc surface 53 which is matched with the surface of the guide rail 845, the guiding effect is achieved, the packaging host 4 stably moves downwards under the pressure effect of the connecting rod 51, the pressing block 52 rolls downwards, the roller 54 further applies rolling pressing force to the pressing plate 841, the subsequent auxiliary supporting device 84 stably supports the circuit board, and the influence of the external force on the circuit board is reduced.
Example 3
The limiting device 83 comprises a clamping plate device 831, the clamping plate device 831 is provided with the inner wall of the base 81 and is located at the position of the placing groove 82, a butterfly-shaped elastic piece 832 is fixedly connected between two sides of the end part of the clamping plate device 831 corresponding to the inner wall of the base 81, and a compressed air spraying bag 833 is arranged between the two sides of the surface of the clamping plate device 831 corresponding to the inner wall of the base 81 and close to the butterfly-shaped elastic piece 832.
The clamping plate device 831 comprises a clamping plate main body 8311, one end of the clamping plate main body 8311 is rotationally connected with the inner wall of the base 81, a flexible clamping block 8312 is fixedly connected with the surface of the clamping plate main body 8311, an arc-shaped rod 8313 is fixedly connected with the end of the clamping plate main body 8311, one end of the arc-shaped rod 8313, which is far away from the clamping plate main body 8311, is fixedly connected with an air nozzle 8314, the surface of the clamping plate main body 8311 is fixedly connected with an air nozzle 8315, and an air port of the air nozzle 8315 is communicated with an air port of the compressed air spraying bag 833.
The surface of splint main part 8311 sets up to the arcwall face, air nozzle 8315 evenly distributed is in the surface of splint main part 8311 and be close to the top position, when the circuit board is put into in the standing groove 82, and promote the circuit board, after the splint main part 8311 on the clamping plate device 831 receives the thrust of circuit board this moment, and combine and rotate between the inner wall of one end of splint main part 8311 and base 81 to be connected, this moment, the reverse rotation of splint main part 8311, and then compress butterfly elastic component 832, pressurized air bag 833, and combine effort and reaction force, make butterfly elastic component 832, pressurized air bag 833 will apply reverse elastic force to splint main part 8311, and combine flexible clamp piece 8312 to press from both sides the circuit board at will, and the tip top of circuit board is at the surface of spacing stick 8314, and then spacing to the circuit board, simultaneously along with pressurized air bag 833 is compressed, this moment the inside gas discharge of air bag 833, and combine the air port of air nozzle 8315 and intercommunication between the gas port of air bag 833, this moment, the gas is from air nozzle 8315 to the surface of board, and then the dust of circuit board is blown off the surface of the circuit board has been realized, and the subsequent encapsulation debris has been blown out to the chip has been realized.
The auxiliary supporting device 84 comprises a pressure receiving plate 841, the top of the pressure receiving plate 841 is rotationally connected with the side surface of the base 81, an elastic sheet 842 is fixedly connected between the surface of the pressure receiving plate 841 and two sides corresponding to the side surface of the base 81, a pressure receiving elastic bag 843 is arranged between the surface of the pressure receiving plate 841 and two sides corresponding to the side surface of the base 81 and close to the elastic sheet 842, a fixing device 844 is fixedly connected with the bottom of the inner wall of the base 81, a guide rail 845 is fixedly connected with the surface of the pressure receiving plate 841, an air passage 846 is formed in the base 81, and the air passage 846 communicates the pressure receiving elastic bag 843 with the fixing device 844.
The surface of the pressure receiving plate 841 and the surface of the guide rail 845 are both provided in an arc shape, and the elastic pieces 842 are uniformly distributed between the surface of the pressure receiving plate 841 and the two sides corresponding to the sides of the base 81.
The stabilizer 844 includes supporting shoe 8441, the bottom of supporting shoe 8441 and the inner wall bottom fixed connection of base 81, the recess 8442 has been seted up at the top of supporting shoe 8441, the gas port and the one end intercommunication of air flue 846 of recess 8442, the top of supporting shoe 8441 and the fixed connection of position that is located recess 8442 have elastic membrane 8443, the surface of elastic membrane 8443 is provided with skid resistant course 8444, after pressing piece 52 surface and guide rail 845 surface contact, and move down with following, and then apply the compressive force to pressure receiving plate 841, make pressure receiving plate 841 rotate, the elastic sheet 842 at this moment, pressure receiving elastic capsule 843 receive the compression, and under reverse elasticity effect, make the roller 54 on the direction press device 5 closely laminate with the guide rail 845 surface, and then make and move more steadily between the whole structure, receive the inside gas of compressed pressure receiving elastic capsule 843 to carry in the recess 8442 through air flue 846 simultaneously, at this moment along with the increase of gas pressure, make elastic membrane 8443 drive skid resistant course 8444 expand, and then make the surface and the bottom laminating of skid resistant course 8444, and the bottom of circuit board, make and steady supporting plate between the bottom, and the bottom has made the steady supporting plate, and support 41.
When in use, the whole device is placed at a designated position, when the circuit board is placed in the placing groove 82 on the base 81, the clamping device 8 is used for clamping the circuit board, and when the packaging host 4 is driven to move downwards along with the lifting mechanism 3, the surface of the pressing block 52 on the guiding pressing device 5 is contacted with the surface of the guide rail 845, the surface of the pressing block 52 is provided with the arc surface 53 and then is matched with the surface of the guide rail 845, the guiding effect is achieved, the packaging host 4 moves downwards steadily, under the pressure of the connecting rod 51, the pressing block 52 moves downwards, the roller 54 rolls, the rolling pressing force is applied to the pressing plate 841, the stable support of the circuit board by the follow-up auxiliary supporting device 84 is facilitated, the influence of external force on the flatness is reduced, and when the circuit board is placed in the placing groove 82, the circuit board is pushed, at this time, after the clamping plate main body 8311 on the clamping plate device 831 receives the thrust of the circuit board, and combines with the rotational connection between one end of the clamping plate main body 8311 and the inner wall of the base 81, at this time, the clamping plate main body 8311 rotates reversely, and further compresses the butterfly-shaped elastic piece 832 and the compressed air-jetting bag 833, and combines with the acting force and the reacting force, so that the butterfly-shaped elastic piece 832 and the compressed air-jetting bag 833 apply reverse elastic force to the clamping plate main body 8311, combine with the flexible clamping block 8312 to clamp the circuit board, and are not easy to move at will, and simultaneously compress along with the compressed air-jetting bag 833, at this time, the air in the compressed air-jetting bag 833 is discharged, and combines with the air port of the air nozzle 8315 to communicate with the air port of the compressed air-jetting bag 833, at this time, the air blows out from the air nozzle 8315 to the surface of the circuit board, and further blows dust and sundries on the surface of the circuit board, thereby realizing the self-cleaning effect, and facilitating the packaging of the subsequent chip, and after the surface of the pressing block 52 contacts with the surface of the guide rail 845, and moves downwards, further, a pressing force is applied to the pressing plate 841, so that the pressing plate 841 rotates, at this time, the elastic sheet 842 and the pressed elastic bag 843 are compressed, and under the action of reverse elasticity, the roller 54 on the guide pressing device 5 is tightly attached to the surface of the guide rail 845, so that the whole structure operates more stably, meanwhile, the compressed air in the pressed elastic bag 843 is conveyed into the groove 8442 through the air channel 846, at this time, along with the increase of the air pressure, the elastic film 8443 drives the anti-slip layer 8444 to expand, and then the surface of the anti-slip layer 8444 is attached to the bottom of the circuit board, so that the anti-slip effect is achieved, the stability is further achieved, gaps between the bottom of the circuit board and the top of the supporting block 8441 are filled, stable supporting is carried out, the structures are connected with each other, the structures are combined with the air pressure, multiple functions are realized, safety and reliability is improved, and the service performance is improved.
It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present invention without the inventive step, are intended to be within the scope of the present invention. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.
Claims (6)
1. The utility model provides a face identification chip's encapsulation equipment, includes organism (1), its characterized in that: the device comprises a machine body (1), a supporting shell (2) is fixedly connected to the side surface of the machine body (1) and located at the end part, a lifting mechanism (3) is fixedly connected to the top of the inner wall of the supporting shell (2), a packaging host machine (4) is fixedly connected to the working end of the lifting mechanism (3), guide pressing devices (5) are fixedly connected to the side surface of the packaging host machine (4), the two guide pressing devices (5) are symmetrically arranged, a supporting rotating shaft (6) is rotatably connected to the inner side of the machine body (1) and close to the central position, the top end of the supporting rotating shaft (6) penetrates through the top of the inner wall of the machine body (1) and extends to the outer side of the inner wall, a workbench (7) is fixedly connected to the top of the supporting rotating shaft (6) and is fixedly connected to a clamping device (8) close to the edge position, a power mechanism (9) is fixedly connected to the bottom of the inner wall of the machine body (1), and the output end of the power mechanism (9) is connected to the surface of the supporting rotating shaft (6) through gear engagement;
the guiding pressing device (5) comprises a connecting rod (51), the top end of the connecting rod (51) is fixedly connected with the side face of the packaging host machine (4), the bottom end of the connecting rod (51) is fixedly connected with a pressing block (52), the surface of the pressing block (52) is provided with an arc surface (53), and a roller (54) is in rolling connection with the surface of the pressing block (52) and located at the position of the arc surface (53);
the clamping device (8) comprises a base (81), the bottom of the base (81) is fixedly connected with the top of the workbench (7), a placement groove (82) is formed in the center of the top of the base (81), limiting devices (83) are arranged on the inner wall of the base (81) and located in the placement groove (82), two limiting devices (83) are arranged, the two limiting devices (83) are symmetrically arranged, and auxiliary supporting devices (84) are arranged on the surface of the base (81);
the limiting device (83) comprises a clamping plate device (831), wherein the clamping plate device (831) is provided with the inner wall of the base (81) and is positioned at the position of the placing groove (82), a butterfly-shaped elastic piece (832) is fixedly connected between the end part of the clamping plate device (831) and the two sides corresponding to the inner wall of the base (81), and a pressurized air spraying bag (833) is arranged between the surface of the clamping plate device (831) and the two sides corresponding to the inner wall of the base (81) and close to the butterfly-shaped elastic piece (832);
the splint device (831) comprises a splint main body (8311), one end of the splint main body (8311) is rotationally connected with the inner wall of the base (81), a flexible clamping block (8312) is fixedly connected with the surface of the splint main body (8311), an arc-shaped rod (8313) is fixedly connected with the end of the splint main body (8311), a limit rod (8314) is fixedly connected with the end of the arc-shaped rod (8313) away from the splint main body (8311), an air nozzle (8315) is fixedly connected with the surface of the splint main body (8311) and is close to the top position, and an air port of the air nozzle (8315) is communicated with an air port of the compressed air spraying bag (833).
2. The face recognition chip packaging device according to claim 1, wherein: the rollers (54) are uniformly distributed on the surface of the pressing block (52) and located at the position of the circular arc surface (53), and rolling grooves matched with the rollers (54) are formed in the surface of the pressing block (52).
3. The face recognition chip packaging device according to claim 1, wherein: the surface of the clamping plate main body (8311) is provided with an arc-shaped surface, and the air nozzles (8315) are uniformly distributed on the surface of the clamping plate main body (8311) and are close to the top position.
4. The face recognition chip packaging device according to claim 1, wherein: the auxiliary supporting device (84) comprises a pressure receiving plate (841), the top of the pressure receiving plate (841) is rotationally connected with the side face of the base (81), an elastic sheet (842) is fixedly connected between the surface of the pressure receiving plate (841) and the corresponding two sides of the side face of the base (81), a pressed elastic bag (843) is arranged between the surface of the pressure receiving plate (841) and the corresponding two sides of the side face of the base (81) and close to the position of the elastic sheet (842), a stabilizing device (844) is fixedly connected with the bottom of the inner wall of the base (81), a guide rail (845) is fixedly connected with the surface of the pressure receiving plate (841), an air passage (846) is formed in the base (81), and the air passage (846) is communicated between the pressed elastic bag (843) and the stabilizing device (844).
5. The face recognition chip packaging device according to claim 4, wherein: the surface of the pressure receiving plate (841) and the surface of the guide rail (845) are both arc-shaped, and the elastic sheets (842) are uniformly distributed between the surface of the pressure receiving plate (841) and two sides corresponding to the side surfaces of the base (81).
6. The face recognition chip packaging device according to claim 4, wherein: the stabilizing device (844) comprises a supporting block (8441), the bottom of the supporting block (8441) is fixedly connected with the bottom of the inner wall of the base (81), a groove (8442) is formed in the top of the supporting block (8441), an air port of the groove (8442) is communicated with one end of an air passage (846), an elastic membrane (8443) is fixedly connected to the top of the supporting block (8441) and located in the position of the groove (8442), and an anti-slip layer (8444) is arranged on the surface of the elastic membrane (8443).
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| CN202211134080.0A CN115565913B (en) | 2022-09-22 | 2022-09-22 | Face recognition chip packaging equipment |
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| CN202211134080.0A CN115565913B (en) | 2022-09-22 | 2022-09-22 | Face recognition chip packaging equipment |
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