CN115534493A - Micro-grid atomizing sheet based on FPC (Flexible printed Circuit) flexible circuit board and manufacturing process thereof - Google Patents

Micro-grid atomizing sheet based on FPC (Flexible printed Circuit) flexible circuit board and manufacturing process thereof Download PDF

Info

Publication number
CN115534493A
CN115534493A CN202211287181.1A CN202211287181A CN115534493A CN 115534493 A CN115534493 A CN 115534493A CN 202211287181 A CN202211287181 A CN 202211287181A CN 115534493 A CN115534493 A CN 115534493A
Authority
CN
China
Prior art keywords
film
circuit board
atomizing sheet
cover film
fpc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211287181.1A
Other languages
Chinese (zh)
Inventor
郑瑶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Shang Jin Electronic Science And Technology Co ltd
Original Assignee
Shenzhen Shang Jin Electronic Science And Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Shang Jin Electronic Science And Technology Co ltd filed Critical Shenzhen Shang Jin Electronic Science And Technology Co ltd
Priority to CN202211287181.1A priority Critical patent/CN115534493A/en
Publication of CN115534493A publication Critical patent/CN115534493A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M11/00—Sprayers or atomisers specially adapted for therapeutic purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2459/00—Nets, e.g. camouflage nets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2535/00—Medical equipment, e.g. bandage, prostheses, catheter

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Anesthesiology (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Hematology (AREA)
  • Manufacturing & Machinery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Ceramic Engineering (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Special Spraying Apparatus (AREA)

Abstract

The invention discloses a microgrid atomizing sheet based on an FPC (flexible printed circuit) flexible circuit board, which comprises a first cover film, a first adhesive film, a second cover film, a second adhesive film, a copper foil layer, a conductive adhesive film and piezoelectric ceramics which are sequentially attached from top to bottom, wherein the second cover film, the second adhesive film and the copper foil layer are combined to form the FPC flexible circuit board; the first cover film is covered on the through holes through the first adhesive layer, atomization micropores are formed in the positions, corresponding to the through holes, of the first cover film, and the distribution range of the atomization micropores is smaller than that of the through holes; the microgrid atomizing sheet provided by the invention can ensure that liquid does not contact any material except a covering film material, and the safety of the microgrid atomizing sheet in the application of the medical field is improved.

Description

Micro-grid atomizing sheet based on FPC (Flexible printed Circuit) flexible circuit board and manufacturing process thereof
Technical Field
The invention relates to the technical field of atomization pieces, in particular to a micro-grid atomization piece based on an FPC (flexible printed circuit) and a manufacturing process thereof.
Background
The micro-grid atomizing sheet in the prior art is mainly composed of an FPC (flexible printed circuit), a conductive adhesive film and piezoelectric ceramics, the piezoelectric ceramics drive the transmission of liquid after being electrified, and fine small droplets continuously overflow from micropores, so that the atomization of the liquid is realized; the micro-grid atomizing sheet in the prior art usually has the technical problem that liquid is contacted with glue in actual use, so that the atomizing effect is influenced; conductive adhesive film's among the prior art temperature performance is lower, and conductive adhesive film can appear softening under the circumstances of temperature rising to 85 ℃ to unable effective transmission ultrasonic oscillation, lead to the microgrid atomizing piece high temperature work efficiency lower, consequently make multinomial improvement to FPC flexible circuit board to these several kinds of circumstances, can effectively improve the work efficiency of microgrid atomizing piece when with improving manufacturability, and further improve the security of microgrid atomizing piece in the medical field is used.
Disclosure of Invention
In view of the above, the present invention provides a microgrid atomizing sheet based on an FPC flexible circuit board and a manufacturing process thereof, and aims to improve the manufacturing process of the FPC flexible circuit board so that no material is in contact with a first adhesive layer film and a second adhesive layer film in a through hole region of a piezoelectric ceramic, a conductive adhesive film and a copper foil layer, thereby ensuring that liquid is not in contact with any material except a first cover film material, and improving the safety of the microgrid atomizing sheet in the application of the medical field.
In order to achieve the purpose, the invention adopts the following technical scheme:
a microgrid atomizing sheet based on an FPC (flexible printed circuit) comprises a first cover film, a first glue film, a second cover film, a second glue film, a copper foil layer, a conductive glue film and piezoelectric ceramics which are sequentially attached from top to bottom, wherein the second cover film, the second glue film and the copper foil layer are combined to form the FPC flexible circuit board; the first cover film is covered on the through holes through the first adhesive layer, atomization micropores are formed in the positions, corresponding to the through holes, of the first cover film, and the distribution range of the atomization micropores is smaller than that of the corresponding areas of the through holes.
The manufacturing process of the micro-grid atomizing sheet based on the FPC comprises the following steps:
s1: etching the center of the copper foil layer of the FPC flexible circuit board to form a circular etching area, and electroplating the side wall of the etching area of the copper foil layer to expose the second adhesive film in the etching area;
s2: removing the second glue film layer and the second cover film at the center of the etching area to form a through hole, wherein the area of the through hole is smaller than that of the etching area, and the integrity of the electroplated layer is ensured in the process of removing the second glue film layer and the second cover film to form the through hole;
s3: coating a first adhesive layer film on the periphery of the through hole on the outer side surface of the second covering film, and avoiding adhesive coating in the through hole area;
s4: attaching the first covering film to the first adhesive film layer so that the first covering film completely covers the through hole area;
s5: placing a conductive adhesive film on the piezoelectric ceramic, and placing the product formed in the step S4 on the conductive adhesive film;
s6: putting the product formed in the step S5 into a press machine, simultaneously heating the press machine to 80-150 ℃ under the pressure of 6-15 MPa, and pressing the product for 100-300 seconds; the center positions of the first cover film, the first glue film, the second cover film, the second glue film and the copper foil layer are all provided with bulges facing to one side of the conductive glue film;
s7: uniformly drilling a plurality of atomization micropores on the first covering film by using a laser machine on the product pressed in the step S6;
s8: and (5) carrying out power-on detection on the product obtained in the step (S7) to obtain a qualified product.
As a preferred embodiment: the first cover film and the second cover film are both PI films.
As a preferred embodiment: and the through hole in the S2 is formed in a stamping or laser cutting mode.
As a preferred scheme: and the height of the protrusions in the S6 is 0.5 times of the total thickness of the micro-grid atomizing sheet.
As a preferred scheme: the thickness of the copper foil layer is 5-50 microns, and the thickness of the first covering film and the thickness of the second covering film are both 10-200 microns.
As a preferred embodiment: and the first glue film in the S3 is an organic polymer film.
As a preferred embodiment: the first glue film is made of epoxy resin.
As a preferred embodiment: the first adhesive layer film meets the requirement of the temperature use range of-30-150 ℃ or above 150 ℃.
As a preferred embodiment: the aperture of the atomization micropore is micron-sized.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and concretely, by adopting the technical scheme, the first rubber layer film is not attached to the through hole area of the first cover film of the FPC flexible circuit board any more, the through hole area of the second cover film is not covered with a second adhesive film layer any more, the first cover film and the second cover film are independent, and no material is in contact with the first adhesive film layer and the second adhesive film layer in the through hole areas of the piezoelectric ceramic, the conductive adhesive film and the copper foil layer; therefore, when the micro-grid atomizing sheet is applied to medical use, the liquid to be atomized is ensured not to be contacted with any material except the first covering film material, the safety of the micro-grid atomizing sheet in the medical use is improved, and the defect that the surface of the micro-grid atomizing sheet is rough can be overcome due to the added first covering film.
To more clearly illustrate the structural features and effects of the present invention, the following detailed description is given with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a flow chart of the manufacturing process of the micro-grid atomizing sheet with adhesive layer film according to the present invention;
FIG. 2 is a schematic view of a three-dimensional structure of a film micro-grid atomizing sheet with an adhesive layer according to the present invention;
FIG. 3 is a exploded view of the coated membrane micro-grid atomizing plate of the present invention;
FIG. 4 is a cross-sectional view of a coated membrane micro-mesh atomizing sheet of the present invention;
FIG. 5 is an enlarged view of the invention at M in FIG. 4;
fig. 6 is a schematic view of a first-view perspective structure of the film-free micro-grid atomizing sheet of the present invention;
fig. 7 is a schematic diagram of a second perspective three-dimensional structure of the film-free micro-grid atomizing sheet of the present invention;
FIG. 8 is a schematic diagram of a film-free micro-grid atomizing plate according to the present invention;
FIG. 9 is a cross-sectional view of a film-free microgrid atomizing plate of the present invention;
FIG. 10 is an enlarged view of the position N in FIG. 9 according to the present invention.
The attached drawings indicate the following:
in the figure: 10. piezoelectric ceramics; 20. a conductive adhesive film; 30. a copper foil layer; 31. etching the area; 40. covering the film; 41. a first cover film; 42. a first glue film; 43. a second cover film; 44. a second adhesive film; 50. a protrusion; 60. and a through hole.
Detailed Description
As shown in fig. 1 to 5, the invention relates to a microgrid atomizing sheet based on an FPC flexible circuit board, which comprises a first cover film 41, a first adhesive film 42, a second cover film 43, a second adhesive film 44, a copper foil layer 30, a conductive adhesive film 20 and a piezoelectric ceramic 10 which are sequentially attached from top to bottom, wherein the second cover film 43, the second adhesive film 44 and the copper foil layer 30 are combined to form the FPC flexible circuit board, an etching area 31 is arranged at the center of the copper foil layer 30 of the FPC flexible circuit board, a through hole 60 with an area smaller than that of the etching area 31 is arranged at the center of the etching area 31 on the second cover film 43, and the first adhesive film 42 is positioned at the periphery of the through hole 60; the first cover film 41 covers the through holes 60 through the first adhesive layer film 42, and atomization micropores are formed in the first cover film 41 at positions corresponding to the through holes 60, and the distribution range of the atomization micropores is smaller than that of areas corresponding to the through holes 60.
The distribution range of the atomized micro-holes is smaller than the area of the through holes 60 corresponding to the first cover film 41, so that it is ensured that the liquid does not come into contact with any material other than the material of the first cover film 41.
First cover film 41: a complete PI film (polyimide film) plane is adopted, and micropores are processed in the center of the first covering film 41; the adhesive layer between the copper foil layer 30 and the second coverlay film 43 is referred to as a second adhesive film layer; copper foil layer 30: as a metal supporting layer, the electrode wire also functions as an electrode lead; conductive adhesive film 20: the piezoelectric ceramic 10 and the FPC flexible wiring board are connected, and the electrode of the piezoelectric ceramic 10 and the copper foil layer 30 are electrically connected to each other, thereby achieving a conductive function, and an adhesive having a conductive property is required.
The manufacturing process of the micro-grid atomizing sheet based on the FPC comprises the following steps:
s1: etching the center of the copper foil layer 30 of the FPC flexible circuit board to form a circular etching area 31, performing electroplating treatment on the side wall of the etching area 31 of the copper foil layer 30, and exposing the second glue film 44 in the etching area 31;
s2: removing the second glue film layer and the second cover film 43 from the center of the etching area 31 to form a through hole 60, wherein the area of the through hole 60 is smaller than that of the etching area 31, and the integrity of the electroplated layer is ensured in the process of removing the second glue film layer and the second cover film 43 to form the through hole 60; the copper foil layer 30 needs to be plated; in the step S2, the integrity of the plating layer of the copper foil layer 30 is maintained when the copper foil layer 30 and the second adhesive film layer 44 are removed; the exposed copper foil layer 30 needs to be plated with gold, the specific implementation mode of the plating layer is not required, and other material plating layers can be adopted to improve the corrosion resistance of the material, so that the overall service life of the micro-grid atomization sheet is prolonged.
S3: coating a first adhesive layer film 42 on the periphery of the through hole 60 on the outer side surface of the second covering film 43, and avoiding adhesive coating in the through hole 60 area;
s4: attaching the first cover film 41 to the first adhesive layer film 42 so that the first cover film 41 completely covers the through hole 60 region;
s5: placing the conductive adhesive film 20 on the piezoelectric ceramic 10, and placing the product formed in the step S4 on the conductive adhesive film 20;
s6: putting the product formed in the step S5 into a press machine, simultaneously heating the press machine to 80-150 ℃ under the pressure of 6-15 MPa, and pressing the product for 100-300 seconds; the center positions of the first cover film 41, the first glue film 42, the second cover film 43, the second glue film 44 and the copper foil layer 30 are all formed with a protrusion 50 facing one side of the conductive glue film 20; wherein the protrusions 50 of the copper foil layer 30 provide better support to prevent the first cover film 41 and the second cover film 43 from rebounding;
specifically, in S6, placing a silica gel gasket on each of the upper side and the lower side of the product obtained in S5, then placing the product into a press machine, heating the press machine to 80-150 ℃ at the same time under the pressure of 6-15 MPa to press the product, and continuing for 100-300 seconds; the protrusions 50 give surface tension to the first cover film 41 and the second cover film 43, so that resonance efficiency is effectively improved, thereby improving resonance uniformity.
A bulge 50 is formed in the middle of the micro-grid atomizing sheet after hot pressing under the action of extrusion force, the height of the bulge 50 is 0.5 times of the total thickness of the micro-grid atomizing sheet, the bulge 50 deforms and stretches the PI film, so that the self elastic modulus of the PI film is consumed due to excessive stretching, at the moment, the ultrasonic wave of the piezoelectric ceramic 10 can form a surface tension wave with a sine wave shape on the surface of the film, the wave shape wavelength is equal to the transmission speed of the ultrasonic wave in the PI material divided by the oscillation frequency of the piezoelectric ceramic 10, and the amplitude is 1/2 of the wavelength, so that the resonance efficiency is improved; the PI film plane coupling state without the shape is loose, the energy of ultrasonic waves is consumed and converted into heat because of the elastic modulus of the PI film, the ultrasonic energy is not effectively utilized, only a few excess energy exceeding the elastic modulus deformation energy can form surface tension waves, the amplitude of the waveform is extremely low, the atomizing holes cannot effectively compress liquid, even tension waves can not be generated on the PI film of the micro-grid atomizing sheet at the discrete error part, namely the waveform of ultrasonic vibration is completely converted into heat by the elastic modulus of the PI film, finally, defective products are generated, and therefore extrusion filling of the silica gel gasket in the hot pressing process is very important for shaping of the copper foil layer 30 and the PI film.
S7: uniformly drilling a plurality of atomization micropores in the pressed product in the step S6 on the first covering film 41 by using a laser machine;
s8: and (5) carrying out power-on detection on the product obtained in the step (S7) to obtain a qualified product.
The first cover film 41 and the second cover film 43 are both PI films; the PI film is a polyimide film.
The through hole 60 in S2 is formed by stamping or laser cutting.
The height of the bulge 50 in the S6 is 0.5 times of the total thickness of the micro-grid atomizing sheet.
The copper foil layer 30 has a thickness of 5 to 50 microns, and the first and second coverlay films 43 each have a thickness of 10 to 200 microns.
The first glue film 42 in S3 is an organic polymer film.
The first adhesive film 42 is an epoxy resin.
The first adhesive layer film 42 meets the requirement of the temperature use range of minus 30 ℃ to 150 ℃ or above 150 ℃; the conductive adhesive film 20 in the prior art can be softened when the temperature exceeds 85 ℃, so that a liquid conductive epoxy resin adhesive is used, and the specific requirements of the liquid conductive epoxy resin adhesive are as follows: the glue has conductivity, the temperature application range meets minus 30 ℃ to 150 ℃ or more than 150 ℃, and the glue meeting the requirements can be selected; the glue can be coated on the position covered by the original conductive adhesive film 20 in a coating mode or a silk screen missing printing mode to replace the conductive adhesive film 20.
The aperture of the atomization micropore is micron-sized; the micron-sized pores are in a conical structure (horn shape); the surface of the atomized micropores having a small pore diameter faces the piezoelectric ceramic 10.
In the prior art, a glue copper production process is mostly used for FPC flexible circuit boards, but a glue copper layer is remained in the area after a central circle is etched, and a part of micropores are in the glue film layer after laser processing, so that liquid passes through the glue film layer in the process of spraying out the liquid through the micropores in the working process of the micro-grid atomizing sheet, and epoxy resin materials in the glue film layer are separated out, so that the components of the liquid are changed, the atomization in the medical field can cause serious medical accident potential, and the volume consistency of atomized liquid particles is greatly reduced due to different physical characteristics of the glue film layer and the cover film; by adopting the manufacturing process of the FPC flexible circuit board provided by the invention, the first adhesive film 42 is not attached to the through hole 60 area of the first cover film 41 of the FPC flexible circuit board, the second adhesive film is not attached to the through hole 60 area of the second cover film 43, the first cover film 41 and the second cover film 43 are independent, and no material is contacted with the first adhesive film 42 and the second adhesive film 44 in the through hole 60 areas of the piezoelectric ceramic 10, the conductive adhesive film 20 and the copper foil layer 30, so that liquid can be ensured not to be contacted with any material except the material of the first cover film 41, and the defect of rough surface of the micro-grid atomization sheet can be improved by the added first cover film 41.
The invention is not limited to the manufacturing process of the single micro-grid atomizing sheet, and the production process of the FPC flexible circuit board is usually in a full-page operation mode, so that the FPC full-page operation mode is also adopted for manufacturing in the actual industrial manufacturing process for improving the production efficiency, and the single form of the product can form an independent individual body only by a laser cutting or blanking mode after the pressing process is completed, so that the process is also suitable for the full-page operation mode of an FPC production line under the condition that the process is not described.
As shown in fig. 6 to 10, in another microgrid atomizing sheet without a film, an FPC flexible circuit board of the microgrid atomizing sheet only comprises a copper foil layer 30 and a cover film 40, and a film layer is not contained between the copper foil layer 30 and the cover film 40, so that the condition that liquid contacts the film layer to cause pollution does not exist; the flexible printed circuit board comprises piezoelectric ceramics 10, a conductive adhesive film 20 and an FPC (flexible printed circuit), wherein the conductive adhesive film 20 is attached between the piezoelectric ceramics 10 and the FPC, the FPC comprises a copper foil layer 30 and a cover film 40, the copper foil layer 30 is attached to the upper surface of the conductive adhesive film 20, and the cover film 40 is attached to the upper surface of the copper foil layer 30; the center positions of the copper foil layer 30 and the cover film 40 are both provided with a protrusion 50 facing one side of the conductive adhesive film 20, and the protrusion 50 position of the cover film 40 is provided with an atomizing micropore.
A process for manufacturing the micro-grid atomizing sheet without the adhesive layer film comprises the following steps:
firstly: etching the center of a copper foil layer 30 of the FPC flexible circuit board to form a circular etching area 31, performing electroplating treatment on the side wall of the etching area 31 of the copper foil layer 30, and exposing a covering film 40 in the etching area 31;
secondly, placing the conductive adhesive film 20 on the piezoelectric ceramic 10, and placing the FPC flexible circuit board on the conductive adhesive film 20, wherein the copper foil layer 30 of the FPC flexible circuit board is attached to the conductive adhesive film 20;
thirdly, the method comprises the following steps: putting the product formed in the step two into a press machine, simultaneously heating the press machine to 80-150 ℃ under the pressure of 6-15 MPa to press the product, and continuing for 100-300 seconds; the center positions of the cover film 40 and the copper foil layer 30 are formed with a protrusion 50 facing one side of the conductive adhesive film 20;
fourthly: uniformly drilling a plurality of atomization micropores on the covering film 40 by using a laser machine on the product pressed in the third step;
fifth, the method comprises the following steps: and (5) carrying out power-on detection on the product obtained in the fourth step to obtain a qualified product.
The FPC flexible circuit board of the microgrid atomizing sheet without the adhesive film only consists of the copper foil layer 30 and the cover film 40, and after a central circle is etched on the basis, no other substances exist in an etched area, so that liquid can not contact with substances except the cover film 40 in the working process of the microgrid atomizing sheet after the cover film 40 is subjected to laser processing, and the safety of the microgrid atomizing sheet is further improved; the process has the simplest process flow and the minimized material requirement, can obviously reduce the overall production cost of the micro-grid atomizing sheet, and has obvious price advantage in some low-cost applications.
The working principle of the micro-grid atomizing sheet is as follows:
applying an alternating voltage with a certain frequency to a copper foil layer, transmitting the alternating voltage to one electrode bonded with the piezoelectric ceramic and the copper foil layer through the copper foil layer, wherein the other electrode is an exposed electrode of the piezoelectric ceramic, the connection mode is not limited, 2 electrodes are connected with a high-frequency alternating voltage, the frequency and the peak value of the alternating voltage are adjusted according to the working performance of the piezoelectric ceramic, the piezoelectric ceramic is controlled by an external electric field to generate regular deformation consistent with the input frequency, the copper foil layer and a PI film are pressed and integrated, so the deformation energy of the copper foil is concentrated on the PI film, a bulge is arranged at the circle center of the PI film, processed micron-sized pores (atomizing micropores) are arranged in the bulge area, the bulge area generates reciprocating motion consistent with the input frequency at the moment, the motion direction is vertical to the surface of the micro-grid atomizing sheet, at the moment, the upper surface (namely, the surface far away from the metal sheet) of the organic polymer film is contacted with liquid to be atomized, and the liquid is sprayed along the position of the pores under the extrusion condition of the organic polymer film; that is, liquid is removed by organic polymer membrane to sheetmetal direction, because micron order aperture is conical platform structure, and the little one end in this atomizing micropore aperture is towards the sheetmetal direction, and consequently liquid is more towards the extrusion force that the lower surface (be close to the sheetmetal one side promptly) motion of organic polymer membrane received, and liquid is also easier to pass through the micron order aperture on the organic polymer membrane to form water smoke.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention are within the technical scope of the present invention.

Claims (10)

1. A microgrid atomizing sheet based on an FPC (flexible printed circuit) is characterized in that a micro-grid atomizing sheet is arranged on the surface of a flexible printed circuit board; the flexible printed circuit board comprises a first cover film, a first adhesive film, a second cover film, a second adhesive film, a copper foil layer, a conductive adhesive film and piezoelectric ceramics which are sequentially attached from top to bottom, wherein the second cover film, the second adhesive film and the copper foil layer are combined to form the flexible printed circuit board, an etching area is arranged at the center of the copper foil layer of the flexible printed circuit board, a through hole with the area smaller than that of the etching area is formed in the second cover film corresponding to the center of the etching area, and the first adhesive film is positioned on the periphery of the through hole; the first cover film is covered on the through holes through the first adhesive layer, atomization micropores are formed in the positions, corresponding to the through holes, of the first cover film, and the distribution range of the atomization micropores is smaller than that of the corresponding areas of the through holes.
2. The manufacturing process of the microgrid atomizing sheet based on the FPC (flexible printed circuit) as claimed in claim 1, characterized in that: the method comprises the following steps:
s1: etching the center of a copper foil layer of the FPC flexible circuit board to form a circular etching area, and electroplating on the side wall of the etching area of the copper foil layer to expose a second glue film in the etching area;
s2: removing the second glue film layer and the second cover film at the center of the etching area to form a through hole, wherein the area of the through hole is smaller than that of the etching area, and the integrity of the electroplated layer is ensured in the process of removing the second glue film layer and the second cover film to form the through hole;
s3: coating a first adhesive layer film on the periphery of the through hole on the outer side surface of the second covering film, and avoiding adhesive coating in the through hole area;
s4: attaching the first covering film to the first adhesive film layer so that the first covering film completely covers the through hole area;
s5: placing a conductive adhesive film on the piezoelectric ceramic, and placing the product formed in the step S4 on the conductive adhesive film;
s6: putting the product formed in the step S5 into a press machine, simultaneously heating the press machine to 80-150 ℃ under the pressure of 6-15 MPa to press the product, and continuing for 100-300 seconds; the center positions of the first cover film, the first glue film, the second cover film, the second glue film and the copper foil layer are all provided with bulges facing to one side of the conductive glue film;
s7: uniformly drilling a plurality of atomization micropores on the first covering film by using a laser machine on the product pressed in the step S6;
s8: and (5) carrying out power-on detection on the product obtained in the step (S7) to obtain a qualified product.
3. The manufacturing process of the microgrid atomizing sheet based on the FPC flexible circuit board as claimed in claim 2, characterized in that: the first cover film and the second cover film are both PI films.
4. The manufacturing process of the microgrid atomizing sheet based on the FPC flexible circuit board as claimed in claim 2, characterized in that: and the through hole in the S2 is formed in a stamping or laser cutting mode.
5. The manufacturing process of the microgrid atomizing sheet based on the FPC flexible circuit board as claimed in claim 2, characterized in that: and the height of the protrusions in the S6 is 0.5 times of the total thickness of the micro-grid atomizing sheet.
6. The manufacturing process of the microgrid atomizing sheet based on the FPC flexible circuit board as claimed in claim 2, characterized in that: the thickness of the copper foil layer is 5-50 microns, and the thickness of the first covering film and the thickness of the second covering film are both 10-200 microns.
7. The manufacturing process of the microgrid atomizing sheet based on the FPC flexible circuit board as claimed in claim 2, characterized in that: and the first glue film in the S3 is an organic polymer film.
8. The manufacturing process of the microgrid atomizing sheet based on the FPC flexible circuit board as claimed in claim 7, characterized in that: the first glue film is made of epoxy resin.
9. The manufacturing process of the microgrid atomizing sheet based on an FPC (flexible printed circuit) as claimed in claim 2, is characterized in that: the first adhesive layer film meets the requirement of the temperature use range of-30-150 ℃ or above 150 ℃.
10. The manufacturing process of the microgrid atomizing sheet based on the FPC flexible circuit board as claimed in claim 2, characterized in that: the aperture of the atomization micropore is micron-sized.
CN202211287181.1A 2022-10-20 2022-10-20 Micro-grid atomizing sheet based on FPC (Flexible printed Circuit) flexible circuit board and manufacturing process thereof Pending CN115534493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211287181.1A CN115534493A (en) 2022-10-20 2022-10-20 Micro-grid atomizing sheet based on FPC (Flexible printed Circuit) flexible circuit board and manufacturing process thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211287181.1A CN115534493A (en) 2022-10-20 2022-10-20 Micro-grid atomizing sheet based on FPC (Flexible printed Circuit) flexible circuit board and manufacturing process thereof

Publications (1)

Publication Number Publication Date
CN115534493A true CN115534493A (en) 2022-12-30

Family

ID=84735461

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211287181.1A Pending CN115534493A (en) 2022-10-20 2022-10-20 Micro-grid atomizing sheet based on FPC (Flexible printed Circuit) flexible circuit board and manufacturing process thereof

Country Status (1)

Country Link
CN (1) CN115534493A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015180079A1 (en) * 2014-05-28 2015-12-03 王长津 Micropore atomization sheet and micropore atomization apparatus
WO2017202014A1 (en) * 2016-05-23 2017-11-30 湖南中烟工业有限责任公司 Ultrasonic atomizing sheet, and electronic cigarette atomizing core and atomizer
CN110193442A (en) * 2019-04-24 2019-09-03 深圳市尚进电子科技有限公司 A kind of mesh-type ultrasonic atomization piece and manufacturing process
CN110324985A (en) * 2019-07-10 2019-10-11 深圳市尚进电子科技有限公司 Ultrasonic atomization piece production technology
CN111053291A (en) * 2019-12-02 2020-04-24 深圳麦克韦尔科技有限公司 Electronic atomization device, atomization core and preparation method of atomization core
CN112246517A (en) * 2020-10-21 2021-01-22 深圳麦克韦尔科技有限公司 Microporous atomizing sheet and ultrasonic atomizing device
CN213670143U (en) * 2020-11-03 2021-07-13 深圳市优盛利科技有限公司 Film microporous atomizing sheet
CN216877472U (en) * 2021-11-23 2022-07-05 桐乡清锋科技有限公司 Medical PI film atomizing sheet
CN217411237U (en) * 2022-02-21 2022-09-13 深圳麦克韦尔科技有限公司 Ultrasonic atomizer and atomizing device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015180079A1 (en) * 2014-05-28 2015-12-03 王长津 Micropore atomization sheet and micropore atomization apparatus
WO2017202014A1 (en) * 2016-05-23 2017-11-30 湖南中烟工业有限责任公司 Ultrasonic atomizing sheet, and electronic cigarette atomizing core and atomizer
CN110193442A (en) * 2019-04-24 2019-09-03 深圳市尚进电子科技有限公司 A kind of mesh-type ultrasonic atomization piece and manufacturing process
US20220008949A1 (en) * 2019-04-24 2022-01-13 Shenzhen Shang Jin Electronic Science And Technology Co., Ltd. Ultrasonic atomization piece and manufacturing process thereof
CN110324985A (en) * 2019-07-10 2019-10-11 深圳市尚进电子科技有限公司 Ultrasonic atomization piece production technology
CN111053291A (en) * 2019-12-02 2020-04-24 深圳麦克韦尔科技有限公司 Electronic atomization device, atomization core and preparation method of atomization core
CN112246517A (en) * 2020-10-21 2021-01-22 深圳麦克韦尔科技有限公司 Microporous atomizing sheet and ultrasonic atomizing device
CN213670143U (en) * 2020-11-03 2021-07-13 深圳市优盛利科技有限公司 Film microporous atomizing sheet
CN216877472U (en) * 2021-11-23 2022-07-05 桐乡清锋科技有限公司 Medical PI film atomizing sheet
CN217411237U (en) * 2022-02-21 2022-09-13 深圳麦克韦尔科技有限公司 Ultrasonic atomizer and atomizing device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
孙文镇;周沁;赵婕;向超;宋海深;罗远汇;: "金属膜凸台高度对微孔雾化器性能的影响", 桂林电子科技大学学报, no. 04, 25 August 2018 (2018-08-25) *

Similar Documents

Publication Publication Date Title
US4680226A (en) Heat sensitive type adhesive connector
KR20010021431A (en) So nicator, multilayer flexible circuit board and method for producing the same
WO2021004117A1 (en) Manufacturing process for ultrasonic atomization sheet
US7189302B2 (en) Multi-layer printed circuit board and fabricating method thereof
JP2022530329A (en) Ultrasonic atomization sheet and its manufacturing method
CN111134671B (en) Flexible multi-channel repeatable array type HD-sEMG sensor and preparation
CN213280231U (en) Embedded circuit board, mobile device and sensing assembly
CN115534493A (en) Micro-grid atomizing sheet based on FPC (Flexible printed Circuit) flexible circuit board and manufacturing process thereof
CN108607765A (en) A kind of micropore atomization element and its processing method
KR20080027234A (en) Porous resin substrate, method for manufacturing same, and multilayer substrate
CN108184310B (en) Manufacturing method of transparent flexible multilayer PCB
WO2024103819A1 (en) Flexible elastic thin film sensing array and manufacturing method therefor
CN218605090U (en) Micro-grid atomizing sheet without welding electrode
TW202347105A (en) Touch device
JPH0997643A (en) Low resistance connector and manufacture thereof
CN218571401U (en) Extensible micro-grid atomization assembly and atomizer
CN116614957A (en) Flexible circuit board, preparation method of flexible circuit and wearable electronic equipment
CN115608552A (en) Micro-grid atomizing sheet without welding electrode and manufacturing process thereof
CN114590018A (en) Ultrasonic blood pressure patch manufacturing method based on silk-screen printing
CN116118298A (en) Screen type ultrasonic atomization sheet production process based on simplified composite board
CN115532508A (en) Expandable micro-grid atomization assembly, atomizer and manufacturing process of atomization assembly of atomizer
CN113394555A (en) Method for preparing antenna by adopting TDP silver paste transfer printing process
KR200400380Y1 (en) Key pad for electronic device
CN205491433U (en) Reduce flexible printed circuit, FPC of piezoelectric resonator impedance
KR100624155B1 (en) Conductive silicon powder and Method for making the same and Anisotropic conductive film and Conductive paste using the same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination