KR101746334B1 - Adhesive film for electric connection of eletronic fabric and connection method thereof - Google Patents

Abstract

An adhesive film for electrical connection of an electronic fabric and a connecting method therefor are presented. An adhesive film for electrical connection of an electronic fabric, comprising: an adhesive film for adhering conductive fibers to an upper portion of a substrate having an electrode formed thereon to electrically connect the electrode and the fibers; The resin is introduced into the pores between the fibers as the viscosity decreases and the fibers between the fibers are adhered by the resin introduced into the pores between the fibers and the fibers are adhered to the electrodes.

Description

TECHNICAL FIELD [0001] The present invention relates to an adhesive film for electrical connection of an electronic fabric,

The following embodiments relate to an adhesive film for electrical connection of an electronic fabric and a connecting method thereof.

As interest in healthcare, safety, and convenience has increased as the emergence of a connected society represented by Internet of Things (IoT), interest in electronic devices that can be directly worn on the human body, that is, wearable devices , And smart watches, smart glasses, and smart bands. However, because these products are characterized by their flexibility and elongation, they are interested in flexible and flexible devices that can be worn on the body naturally and electronic packaging and connection technology that can electrically connect these devices.

In order to overcome the limitations of the conventional two-dimensional (planar) packaging technology, semiconductor packaging technology has been actively developed in accordance with the trend of multifunction and high integration of existing electronic products. In recent years, Printed Circuit Board (PCB)) are stacked in a multilayer structure to speed up signal processing, miniaturize the system, and reduce power consumption. As one of such packaging techniques, anisotropic conductive film (ACF) can realize fine pitch connection for high integration and is widely applied in the display field because a thin package can be realized.

Korean Patent Publication No. 10-2011-0027378 discloses a resin composition for such an adhesive film and a technique relating to an adhesive film using the same.

The embodiments describe an adhesive film for electrical connection of an electronic fabric and a method of connecting the same. More specifically, the present invention provides a technique for electrically connecting electrodes and fibers by adhering conductive fibers using an adhesive film on a substrate on which electrodes are formed do.

The embodiments are simple processes in which the adhesive film is lowered in viscosity by heat and pressure, the resin flows into the pores between the fibers to bond the fibers, and the fibers and the electrodes are bonded to each other, thereby electrically connecting the electrodes and the fibers. And an electrical connection can be realized at the same time, and a method of connecting the same.

An adhesive film for electrical connection of an electronic fabric according to an embodiment includes an adhesive film for adhering conductive fibers to an upper portion of a substrate on which an electrode is formed to electrically connect the electrode and the fibers, The resin is introduced into the pores between the fibers due to heat and pressure, and the fibers are adhered to each other by the resin introduced into the pores between the fibers, and the fibers are adhered to the electrodes.

Here, the adhesive film has a low viscosity when heat is applied, the resin flows into the pores between the fibers, and the viscosity of the introduced resin rapidly increases due to the curing reaction, - stage (B-stage) state.

The adhesive film may be a non-conductive film (NCF) having no conductive particles and forming a conductive conduction path by directly contacting the conductive fiber with the electrode.

Wherein the adhesive film comprises a plurality of conductive particles such that the conductive particles are sandwiched between the electrode and the conductive fibers or the conductive particles are introduced between the fibers to electrically connect the fibers, Anisotropic conductive film (ACF) in which a plurality of conductive paths for electrically connecting by direct contact are formed and contact resistance is reduced.

The conductive particles may have an elliptical shape having a long transverse diameter, and the transverse diameter may be longer than the width of the irregularities formed on the fibers.

The conductive particles are formed in a micro-rod shape, so that the contact area between the conductive particles and the fibers or the electrodes is wider than that of spherical conductive particles, thereby reducing the contact resistance.

A structure comprising an adhesive film for electrical connection of an electronic fabric according to another embodiment, the structure comprising: a substrate having an electrode formed thereon; An adhesive film disposed on the substrate; And a conductive fiber disposed on the substrate and electrically connected to the electrode by the adhesive film, wherein the adhesive film has a low viscosity due to the heat and pressure, and resin And the fibers are adhered to each other by the resin introduced into the pores between the fibers, and the fibers and the electrodes are adhered to each other.

Here, the adhesive film may be a non-conductive film (NCF) having no conductive particles to directly contact the conductive fiber and the electrode to form a conductive conduction path.

Wherein the adhesive film comprises a plurality of conductive particles such that the conductive particles are sandwiched between the electrode and the conductive fibers or the conductive particles are introduced between the fibers to electrically connect the fibers, Anisotropic conductive film (ACF) in which a plurality of conductive paths for electrically connecting by direct contact are formed and contact resistance is reduced.

The amount of the resin to be introduced into the fibers of the adhesive film may be determined according to the porosity of the fibers and the minimum viscosity of the resin.

The adhesive film is disposed on the substrate, conductive fibers are disposed on the adhesive film, heat and pressure are applied in a downward direction from the upper side, and the viscosity is lowered by the heat and the pressure, And the fibers are adhered to each other by the resin introduced into the pores between the fibers, and between the fibers and the electrodes by the resin remaining on the top of the electrode.

When the porosity of the fiber is equal to or larger than a predetermined size, the adhesive film is coated on the fiber, and the heat and pressure are applied to the resin to flow the fibers between the fibers, It can be bonded to the fibers to realize an electrical connection.

According to still another embodiment of the present invention, there is provided a method of connecting an adhesive film for electrical connection of an electronic fabric, comprising: disposing an adhesive film on a substrate on which an electrode is formed; Disposing conductive fibers on top of the adhesive film; Applying heat and pressure downward from the top of the conductive fiber; The viscosity of the adhesive film is lowered by the heat and the pressure, so that the resin flows into the pores between the fibers; And the resin is adhered between the fibers by the resin introduced into the pores between the fibers and is adhered between the fibers and the electrode by the resin remaining on the top of the electrode so that the electrodes and the fibers are electrically connected .

The adhesive film may be a non-conductive film (NCF) having no conductive particles and forming a conductive conduction path by directly contacting the conductive fiber with the electrode.

Wherein the adhesive film comprises a plurality of conductive particles such that the conductive particles are sandwiched between the electrode and the conductive fibers or the conductive particles are introduced between the fibers to electrically connect the fibers, Anisotropic conductive film (ACF) in which a plurality of conductive paths for electrically connecting by direct contact are formed and contact resistance is reduced.

The amount of the resin to be introduced into the fibers of the adhesive film may be determined according to the porosity of the fibers and the minimum viscosity of the resin.

According to another aspect of the present invention, there is provided a method of connecting an adhesive film for electrical connection of an electronic fabric, the method comprising: disposing conductive fibers on an upper portion of a substrate on which an electrode is formed; Applying the adhesive film on the fiber; Applying heat and pressure from the top to the bottom to introduce the resin between the fibers; And the electrode and the fiber are in direct contact so that the resin is in contact with the fiber and is electrically connected.

Wherein the resin has a porosity of a predetermined size or more, and the adhesive film is applied on the fiber, and the heat and pressure are applied to the resin so that the resin and the fiber are in direct contact with each other, The amount of the resin to be introduced into the fibers of the adhesive film may be determined according to the porosity of the fibers and the minimum viscosity of the resin.

According to the embodiments, it is possible to provide an adhesive film for electrical connection of an electronic fabric and a method of connecting the same, wherein the electrode and the fiber are electrically connected to each other by adhering the conductive fiber using an adhesive film on a substrate on which the electrode is formed.

According to the embodiments, the viscosity of the adhesive film is lowered by heat and pressure, the resin flows into the pores between the fibers to adhere the fibers, and the fibers and the electrodes are adhered to each other. Thus, The present invention can provide an adhesive film for electrical connection of an electronic fabric and a connecting method thereof that can simultaneously realize bonding and electrical connection and reduce cost.

1 is a view for explaining a bonding method using a general anisotropic conductive film.
2 is a view for explaining a connection between a conductive fiber and a substrate using an adhesive film according to an embodiment.
3 to 5 are views for explaining the contact resistance characteristics according to the minimum viscosity of the adhesive film according to one embodiment.
6 is a graph for explaining the curing reaction of the adhesive film according to one embodiment.
Figs. 7 and 8 are views for explaining the connection between the conductive fiber and the substrate using the adhesive film according to another embodiment. Fig.
Figs. 9 and 10 are views for explaining a connection between a conductive fiber and a substrate using an adhesive film according to another embodiment. Fig.
11 and 12 are views for explaining the contact resistance between the conductive fiber and the substrate according to the adhesive film according to another embodiment.
13 is a flowchart showing a method of connecting an adhesive film for electrical connection of an electronic fabric according to an embodiment.
14 is a flowchart showing a method of connecting an adhesive film for electrical connection of an electronic fabric according to another embodiment.
Figs. 15 and 16 are views for explaining an adhesive film in which conductive particles having a curved surface are formed according to another embodiment. Fig.

Hereinafter, embodiments will be described with reference to the accompanying drawings. However, the embodiments described may be modified in various other forms, and the scope of the present invention is not limited by the embodiments described below. In addition, various embodiments are provided to more fully describe the present invention to those skilled in the art. The shape and size of elements in the drawings may be exaggerated for clarity.

1 is a view for explaining a bonding method using a general anisotropic conductive film.

Referring to FIG. 1, a flexible substrate 20 is disposed on a flat and rigid printed circuit board (PCB) 30 in the case of a bonding method using an anisotropic conductive film 10, Anisotropic conductive film 10 containing conductive particles (or conductive balls) 11 between the substrate 30 and the flexible substrate 20 is subjected to heat and pressure of 120 ° C to 250 ° C, The conductive particles 11 may be sandwiched between the Cu electrodes of the first and second electrodes 11a and 11b. Here, the anisotropic conductive film (ACF) 10 is an adhesive film composed of a thermosetting polymer resin 12 and conductive particles 11.

The bonding method using the anisotropic conductive film 10 can be divided into thermo-compression (T / C) bonding and ultrasonic bonding (U / S bonding) The polymer resin 12 itself is locally heated by application of ultrasonic vibration, and bonding can be performed at a room temperature within a short time.

In this case, the conductive particles 11 can be generally used as a polymer ball having a spherical conductive metal ball or a spherical metal skin. In the case of polymer balls, the thickness ranges from a few μm to 35 μm, and the metal surface (nickel or gold) thickness of the outer surface can be about 50 to 200 nm thick.

In the case of the polymer resin film used for the anisotropic conductive film 10, for example, an acrylic type or an epoxy type may be commonly used. At this time, the thickness of the anisotropic conductive film 10 can be generally determined by the sum of the upper and lower electrode heights. In such a bonding method, there is no problem in electrical connection because one substrate or both substrates are flat without bending and pore.

There is no problem in using such an anisotropic conductive film 10 on a flat substrate without bending and pore. However, there is no problem in that the anisotropic conductive film 10 is a substrate having a flat surface such as a building, a furniture, a fiber or a fiber, The conductive particles 11 are trapped in a hollow space such as an uneven groove or pore of the substrate, so that electrical connection between the substrates (electrodes) can not be achieved and high resistance connection or non-connection is caused do.

In addition to the conventional polyimide-based flexible substrate or PCB, it can be mounted on a flat, curved body, clothes, shoes, etc., and can realize electrical performance while maintaining flexural characteristics and elasticity. Interest is growing. These fibers are called smart textile or electronic textile (e-textiles). Fiber-based devices can be implemented through printed electronics technology, which directly prints electrical circuits on the fiber, and embroidering transistors, passive devices, etc. into the fiber. Research is also underway to integrate the electrical devices by electrically interconnecting the fiber devices implemented in this way.

Among them, the Flex-on-Fabric package structure is a structure for connecting a flexible and stretchable conductive fiber and a flexible substrate, and is commonly used for interconnection of fiber elements. It is one of the important technologies to be used.

Conventional methods for electrically connecting smart fibers can be divided into a method using conductive paint adhesives, a method of connecting the electrodes on the fiber by using soldering, and a method of physical bonding.

The method of using soldering is a method generally used in the field of packaging, but it is not only susceptible to mechanical bending, but also has a problem in that it is difficult to apply to heat-sensitive fibers because a high temperature of the solder is accompanied by a high temperature process. In addition, the wetting property of the solder is poor with respect to the silver-coated fiber, which makes it difficult to form a stable connection.

The method of using an adhesive film (conductive adhesive) is a method in which a conductive yarn or a metal fiber is weaved to form a weaving circuit, To realize an electrical connection and adhesion. However, the narrower the pitch of the conductive fibers, the more the connection using such an adhesive film can cause a short, and further encapsulation is necessary to protect the connection. In addition, the physical bonding method is a very nontrivial conductive method in which conductive fibers and other parts are physically bonded using a rivet or the like.

2 is a view for explaining a connection between a conductive fiber and a substrate using an adhesive film according to an embodiment.

2A schematically shows a cross section of a shape before connection between a conductive fiber and a substrate using an adhesive film according to an embodiment, and Fig. 2B schematically shows a cross section of a shape after being connected by heat and pressure. Referring to FIG. 2, a connection method between a conductive fiber and a flexible substrate (FPC) using an adhesive film can be specifically described by way of example.

Here, the adhesive film 230 may be an anisotropic conductive film (ACF) containing conductive particles and a nonconductive film (NCF) without conductive particles.

The adhesive film 230 for electrical connection of the electronic fabric according to an embodiment is formed by adhering conductive fibers 240 to an upper portion of a substrate 210 on which an electrode 220 is formed to form an electrode 220 and a fiber 240 And may include an adhesive film 230 for electrically connecting.

As shown in FIG. 2A, the adhesive film 230 is disposed between the electrode 220 of the substrate 210 and the fibers 240, and can be bonded by heat and pressure. At this time, the adhesive film 230 may be introduced by heat and pressure at the upper portion of the pores 240 having a large pore, thereby bonding the electrode 220 of the substrate 210 and the fibers 240.

As the adhesive film 230, a polymer film may be used. For example, an acrylic type or an epoxy type may be used. Further, the adhesive film 230 may be a non-conducting film (NCF) polymer adhesive layer, and may be formed of a thermosetting resin and laminated or double coated.

As shown in FIG. 2B, the adhesive film 230 has a low viscosity due to heat and pressure, and a resin flows into the pores between the fibers 240. By the resin introduced into the pores between the fibers 240, The electrode 220 and the fiber 240 can be electrically connected by the adhesion A 'between the fibers 240 and the adhesion A between the fibers 240 and the electrode 220.

When the adhesive film 230 is heated, the viscosity of the adhesive film 230 is lowered so that the resin flows into the pores between the fibers 240. Since the inflow resin rapidly increases in viscosity due to the curing reaction, It can be bonded. At this time, the adhesive film 230 may be in a B-stage state.

For example, the adhesive film 230 may be formed of a non-conducting film (NCF). The nonconductive film (NCF) has no conductive particles, so that the conductive fibers 240 and the electrodes 220 are in direct contact with each other to form a conductive conduction path.

As another example, the adhesive film 230 may be formed of an anisotropic conductive film (ACF). The anisotropic conductive film ACF includes a plurality of conductive particles such that the conductive particles are sandwiched between the electrode 220 and the conductive fibers 240 or conductive particles are introduced between the fibers 240 to electrically connect the fibers 240. [ And a plurality of conductive paths for electrically connecting the fibers 240 and the electrodes 220 by direct contact are formed, so that the contact resistance can be reduced.

Here, the conductive particles of the anisotropic conductive film (ACF) may be formed as spherical as well as non-spherical.

For example, the conductive particles of the anisotropic conductive film (ACF) are formed in an elliptical shape having a long transverse diameter, and the transverse diameter is formed to be longer than the width of the unevenness (or curvature) 240 can be prevented from being interposed between the concave and convex portions. The elliptical conductive particles can be formed by a simple method of controlling the pressure and temperature in the conventional spherical metal coated polymer conductive particles.

In another example, the conductive particles of the anisotropic conductive film (ACF) may be in the form of a micro-rod. In the case of the rod-shaped conductive particles, the contact area with the fibers 240 or the electrode 220 is widened as compared with the case where spherical conductive particles are used, so that the contact resistance can be reduced. Here, the rod shape may include a polygonal column such as a rectangular parallelepiped, a cylinder, or a triangular column.

As another example, the conductive particles of the anisotropic conductive film (ACF) may have a shape in which the surface is bent. That is, the shape of the spherical conductive particles or the shape of the elliptical conductive particles may be formed in a shape in which the surface of the spherical conductive particles has uneven bends.

The shape of the conductive particles used in the anisotropic conductive film (ACF) is not limited to a spherical shape. Various shapes such as an elliptical shape, a cylindrical shape, a rod shape, A plurality of non-spherical conductive particles may be aligned in a predetermined direction by applying an electrical bias in a B-stage film state.

Hereinafter, a structure including the adhesive film 230 for electrical connection of the electronic fabric according to this embodiment will be described.

A structure 200 including an adhesive film 230 for electrical connection of an electronic fabric according to one embodiment may comprise a substrate 210, an adhesive film 230, and fibers 240.

The substrate 210 is formed with an electrode 220 on an upper portion of the substrate 210. The substrate 210 may be a printed circuit board (PCB) 210 or a flexible printed circuit board (FPCB) (Hereinafter referred to as " 210 "). A flexible-on-fabric package structure can be formed by connecting the flexible and stretchable conductive fibers 240 with the flexible flexible substrate 210.

As the adhesive film 230, a polymer film may be used. For example, an anisotropic conductive film (ACF) containing conductive particles and a nonconductive film (NCF) without conductive particles may be used.

The adhesive film 230 may be disposed on the substrate 210 on which the electrode 220 is formed. More specifically, the adhesive film 230 may be disposed between the electrode 220 of the substrate 210 and the fibers 240 and adhered thereto by heat and pressure. At this time, the adhesive film 230 may be introduced by heat and pressure at the upper portion of the pores 240 having a large pore, thereby bonding the electrode 220 of the substrate 210 and the fibers 240.

The adhesive film 230 is low in viscosity due to heat and pressure to allow the resin to flow into the pores between the fibers 240. The fibers 240 are bonded together by the resin introduced into the pores between the fibers 240. [ And the fiber 240 and the electrode 220 can be bonded together.

B-stage adhesive films 230 such as anisotropic conductive films and non-conductive films (NCFs) have a low viscosity temporarily due to heat during the bonding process, It has the feature of being hardened after filling pores (empty space).

Herein, when the adhesive film 230 and the process are applied to the porous substrate 210 such as the fibers 240, the resin flows into the fibers 240 through the pores. As a result, the conductive fibers 240 directly contact the electrodes 220 to achieve electrical connection, and the resin impregnated into the fibers 240 is hardened to adhere firmly to the fibers 240 .

For example, the adhesive film 230 may be a nonconductive film (NCF) that does not have conductive particles and the conductive fibers 240 and the electrodes 220 directly contact to form a conductive conduction path.

The adhesive film 230 may include a plurality of conductive particles such that the conductive particles are sandwiched between the electrode 220 and the conductive fibers 240 or conductive particles are introduced between the fibers 240, And an anisotropic conductive film (ACF) having a reduced contact resistance by forming a plurality of conductive paths for electrically connecting the fibers 240 and the electrodes 220 by direct contact may be used. At this time, the conductive particles of the anisotropic conductive film (ACF) may be formed not only in a spherical shape, but also in an irregular shape such as an elliptical shape, a rod shape, and a cylindrical shape.

For example, the non-spherical conductive particles may have an elliptical shape having a long transverse diameter, and the length of the transverse diameter may be determined by the shape of the irregularities (or grooves, As shown in FIG. Here, the elliptical conductive particles can be formed by a simple method of controlling the pressure and the temperature in the conventional spherical conductive particles.

As another example, the non-spherical conductive particles may be formed of at least one of a cylinder, a rod, and a polygonal columnar shape, and the non-spherical conductive particles may be formed to have at least one surface longer than the width of the irregularities.

As another example, as shown in FIG. 15, the conductive particles of the anisotropic conductive film (ACF) may have a shape in which the surface is bent. That is, the shape of the spherical conductive particles or the shape of the elliptical conductive particles may be formed in a shape in which the surface of the spherical conductive particles has uneven bends.

As shown in FIG. 16, a cross section of a sample bonded with an anisotropic conductive film (ACF) in which conductive particles having a bumpy curvature are formed on the surface can be confirmed. At this time, it can be confirmed that the conductive particles are inserted between the fibers, and that the conductive particles captured between the electrodes and the fibers deform the fibers as shown in FIG. 16B. At this time, it can be seen that the Ag layer coated on the fiber is not lost, or that the Ag layer which is not lost at least is contacted with the bent particles, and the contact resistance is low.

In this way, the conductive fibers are deformed and contacted due to the characteristics of the metal particles, which can be seen not only as conductive particles having a curved surface, but also spherical conductive particles. In this case, the non-spherical conductive particles can be arranged in the vertical or horizontal direction by applying an external electric field or a magnetic field in the B-stage film state. Particularly, It is possible to prevent the conductive particles from sticking to the concave and convex portions of the concave and convex portions.

The plurality of non-spherical conductive particles distributed in the adhesive film 230 may be formed in such an amount that the plurality of conductive particles do not contact with each other, and may be disposed at appropriate intervals even after pressing to disperse the conductive particles without aggregation.

The fibers 240 may be conductive fibers 240, such as smart fabrics or electronic fabrics. The fibers 240 are disposed on the top of the substrate 210 and can be electrically connected to the electrodes 220 by an adhesive film 230.

The structure 200 including the adhesive film 230 for electrical connection of the electronic fabric according to this embodiment includes an adhesive film 230 disposed on the substrate 210 and conductive fibers 230 disposed on the adhesive film 230 The resin is introduced into the pores between the fibers 240 by the heat and the pressure and the resin flows into the pores between the fibers 240. The resin flows into the pores between the fibers 240, The fibers 240 are adhered to each other and the fibers 240 and the electrodes 220 are adhered to each other by the resin remaining on the upper portion of the electrode 220.

The structure 200 including the adhesive film 230 for electrical connection of the electronic fabric according to another embodiment may have a structure in which when the porosity of the fibers 240 is equal to or larger than a predetermined size, The resin 220 may be directly contacted with the fibers 240 by applying heat and pressure to the fibers 240 after the resin is applied to the fibers 240 to bond the fibers to the fibers 240 to realize electrical connection.

The amount of the resin of the adhesive film 230 flowing into the fibers 240 may be determined according to the porosity of the fibers 240 and the minimum viscosity of the resin.

The electrode 220 and the fiber 240 can be electrically connected by bonding the conductive fiber 240 using the adhesive film 230 on the substrate 210 on which the electrode 220 is formed.

According to the embodiment, the viscosity of the adhesive film 230 is lowered by heat and pressure, the resin flows into the pores between the fibers 240, the fibers 240 are adhered, and the fibers 240 and the electrodes 220 are adhered , And a simple process of electrically connecting the electrode 220 and the fiber 240, it is possible to simultaneously realize mechanical bonding and electrical connection, and the cost is reduced.

The contact resistance characteristics according to the minimum viscosity of the adhesive film 230 will be described in more detail below, for example.

3 to 5 are views for explaining the contact resistance characteristics according to the minimum viscosity of the adhesive film according to one embodiment.

Referring to FIG. 3A, if the minimum viscosity of the adhesive film 330 is very low, the resin may be desorbed from the electrode 320 because the resin is exhausted between the fibers 340. That is, it can be confirmed that the resin is not left on the electrode 320 and delamination occurs as shown in FIG. 3A.

In other words, the adhesive film 330 is disposed on the substrate 310, the conductive fibers 340 are disposed on the adhesive film 330, and heat and pressure are applied from the upper side to the lower side, The viscosity of the film 330 is lowered so that the resin can flow into the pores between the fibers 340 and the fibers 340 can be adhered by the resin introduced into the pores between the fibers 340.

3B, when the resin is not left on the electrode 320 and delamination occurs, adhesion between the fiber 340 and the electrode 320 is not performed, 340 are difficult to be electrically connected.

Referring to FIG. 4B, when the viscosity of the adhesive film 430 is very high or the fiber 440 has a dense structure without pores, the resin may contact the fibers 440 and the electrode 440 as shown in FIG. 420, so that electrical contact may not occur. Therefore, the fibers 440 do not touch the electrode 420 and the contact resistance increases.

When the viscosity of the resin is high or the fibers 440 are tightly woven so that the resin remains excessively between the substrate 410 and the fibers 440, the conductive fibers 440 and the electrodes 420 may be directly or There is a difficulty in realizing the electrical connection through the manner in which the conductive particles are caught.

Thus, by adjusting the viscosity of the adhesive film 430 resin, it is possible to set conditions that enable stable electrical connection to specific process conditions and specific fabrics.

5, an example of the contact resistance characteristic according to the minimum viscosity of the adhesive film according to one embodiment can be shown. NCF C and NCF B described in FIG. 2 can have a low contact resistance with an appropriate minimum viscosity, and have a high contact resistance when the minimum viscosity of the adhesive film is very low or extremely high.

6 is a graph for explaining the curing reaction of the adhesive film according to one embodiment.

As shown in FIG. 6, it can be seen that the viscosity increases sharply (B-stage) by the curing reaction after decreasing the viscosity.

13 is a flowchart showing a method of connecting an adhesive film for electrical connection of an electronic fabric according to an embodiment.

A method of connecting an adhesive film for electrical connection of an electronic fabric according to an embodiment includes the steps of placing an adhesive film on a substrate on which an electrode is formed (1310), disposing conductive fibers on the adhesive film (1320) (1330) applying heat and pressure downward from the top of the conductive fibers, applying a resin (1340) to the pores between the fibers as the adhesive film is lowered in viscosity by heat and pressure, and pores between the fibers And a step (1350) in which the fibers are adhered to each other by the inflow resin and the fibers and the electrodes are adhered to each other by a resin remaining on the top of the electrode, thereby electrically connecting the electrodes and the fibers.

According to the embodiment, the electrode and the fiber can be electrically connected by bonding the conductive fiber to the substrate on which the electrode is formed using an adhesive film.

According to the embodiment, the viscosity of the adhesive film is lowered by heat and pressure, the resin flows into the pores between the fibers to adhere the fibers, and the fibers and the electrodes are adhered to each other. Thus, And electrical connection can be realized at the same time and the cost is reduced.

Hereinafter, a method of connecting an adhesive film for electrical connection of an electronic fabric according to an embodiment will be described in more detail with an example.

Referring to FIG. 13, a method for connecting an adhesive film for electrical connection of an electronic fabric according to an embodiment will be described in more detail using an adhesive film for electrical connection of an electronic fabric according to one embodiment described in FIGS. 1 to 6 can do. And each step of the method for connecting the adhesive film for electrical connection of the electronic fabric according to an embodiment can be carried out by a structure making system (simply referred to as a producing system) for connecting the adhesive film for electrical connection of the electronic fabric have.

In step 1310, in the method of connecting an adhesive film for electrical connection of an electronic fabric according to an embodiment, the production system may dispose an adhesive film on a substrate on which an electrode is formed.

For example, a printed circuit board (PCB) or a flexible printed circuit board (FPCB) may be used as the substrate.

As the adhesive film, an anisotropic conductive film (ACF) containing conductive particles and a nonconductive adhesive film (NCF) having no conductive particles can be used.

For example, the adhesive film may be a non-conductive film (NCF) which does not have conductive particles and which directly contacts the conductive fiber and the electrode to form a conductive conduction path.

As another example, the adhesive film may include a plurality of conductive particles so that the conductive particles are sandwiched between the electrodes and the conductive fibers, or the conductive particles are flowed between the fibers to electrically connect the fibers, and the conductive particles are electrically connected And may be an anisotropic conductive film (ACF) in which a plurality of current carrying paths are formed to reduce the contact resistance.

(B-stage) adhesive films such as anisotropic conductive films and nonconductive films (NCF) are temporarily hardened by heat during the bonding process and filled with pores (void spaces) between the substrate and the fibers, .

In step 1320, the fabrication system may place the conductive fibers on top of the adhesive film. The conductive fibers may be, for example, smart fabrics or electronic fabrics.

In step 1330, the fabrication system may apply heat and pressure downward from the top of the conductive fibers.

In step 1340, the viscosity of the adhesive film is lowered by heat and pressure, and the resin may flow into the pores between the fibers. Here, the amount of the resin in the adhesive film fed into the fiber can be determined by the porosity of the fiber and the minimum viscosity of the resin.

In step 1350, fibers are bonded between the fibers by the resin introduced into the pores between the fibers, and the fibers and the electrodes are bonded by the resin remaining on the top of the electrodes, so that the electrodes and the fibers can be electrically connected.

Figs. 7 and 8 are views for explaining the connection between the conductive fiber and the substrate using the adhesive film according to another embodiment. Fig.

As described above, generally, after the adhesive film is applied on the substrate for connection between the conductive fibers and the substrate, the conductive fibers can be raised and pressed by applying heat and pressure.

In the case of high-porosity conductive fibers, the use of such a method may cause the resin of the adhesive film to be sandwiched between the fibers and the electrodes, resulting in an unstable connection.

FIG. 7A schematically shows a cross section of a shape before connection between a conductive fiber and a substrate using an adhesive film according to another embodiment, and FIG. 7B schematically shows a cross section of a shape after being connected by heat and pressure.

 7A and 7B, in the case of the highly porous conductive fiber 740, the adhesive film 730 is applied on the fiber 740, and then the resin is flowed between the fibers 740 through heat and pressure, The fibers 720 and the fibers 740 are in direct contact with each other so that the resin can fix the fibers 740 and electrically connect them.

Accordingly, in the case of the highly porous conductive fibers 740, the resin can fill the space between the fibers 740 in a state where the fibers 740 are in contact with the electrodes 720.

In other words, when the above-mentioned nonconductive film or anisotropic conductive film (NCF / ACF) is used for connection of the highly porous conductive fibers 740, the conductive fibers 740 are completely covered by the flow of the resin .

In this case, instead of applying the adhesive film 730 on the substrate 710 first, the adhesive fiber 740 is applied on the upper side of the fiber 740 before the conductive fiber 740 is adhered to the electrode 720 Since the resin flowing down from the upper part completely contacts the fiber 740 to be bonded, the more stable electrical connection can be realized as shown in FIG.

14 is a flowchart showing a method of connecting an adhesive film for electrical connection of an electronic fabric according to another embodiment.

According to another embodiment of the present invention, there is provided a method of connecting an adhesive film for electrical connection of an electronic fabric, comprising the steps of placing conductive fibers 1410 on an upper portion of a substrate on which an electrode is formed, applying an adhesive film 1420 on the fibers, (1430) applying heat and pressure in a downward direction to the resin between the fibers, and a step (1440) wherein the electrodes and the fibers are in direct contact so that the resin contacts and is electrically connected to the fibers have.

Hereinafter, a method of connecting an adhesive film for electrical connection of an electronic fabric according to another embodiment will be described in more detail with an example.

Referring to Fig. 14, a method for connecting an adhesive film for electrical connection of an electronic fabric according to another embodiment is described in more detail using an adhesive film for electrical connection of an electronic fabric according to another embodiment described in Figs. 7 and 8 can do. And each step of the method for connecting an adhesive film for electrical connection of an electronic fabric according to another embodiment can be carried out by a structure making system (simply referred to as a producing system) for connecting an adhesive film for electrical connection of an electronic fabric have. The method of connecting an adhesive film for electrical connection of an electronic fabric according to another embodiment of the present invention is applicable to a case of a conductive fiber having high porosity.

In the case of highly porous conductive fibers, an adhesive film is applied on the fibers, and then the resin is flowed between the fibers through heat and pressure, so that the electrodes and the fibers are in direct contact, and the resin can be electrically connected by fixing the fibers.

In step 1410, in a method of connecting an adhesive film for electrical connection of an electronic fabric according to another embodiment, the fabrication system may place conductive fibers on top of a substrate on which an electrode is formed. For example, a printed circuit board (PCB) or a flexible printed circuit board (FPCB) may be used as the substrate.

In step 1420, the fabrication system may apply an adhesive film onto the fibers.

The adhesive film may be an anisotropic conductive film (ACF) containing conductive particles and a nonconductive adhesive film (NCF) having no conductive particles.

For example, the adhesive film may be made of a non-conducting film (NCF). The nonconductive film (NCF) has no conductive particles, so that the conductive fibers and the electrodes are in direct contact with each other to form a conductive conduction path.

As another example, the adhesive film may be made of an anisotropic conductive film (ACF). The anisotropic conductive film (ACF) includes a plurality of conductive particles so that the conductive particles are sandwiched between the electrodes and the conductive fibers, or the conductive particles flow into the fibers to electrically connect the fibers, The contact resistance can be reduced.

In step 1430, the fabrication system may apply heat and pressure from top to bottom to allow resin to flow between the fibers.

The adhesive film is in a non-stage (B-stage) state. When heat is applied, the viscosity is lowered and the resin flows into the pores between the fibers. The viscosity of the resin is rapidly increased by the curing reaction, It can be firmly adhered.

In step 1440, the electrodes and the fibers are in direct contact so that the resin can contact the fibers and be electrically connected.

The porosity of the fiber is not less than a predetermined size. After the adhesive film is applied on the fiber, heat and pressure are applied to introduce the resin between the fibers so that the electrode and the fiber are in direct contact with each other, have. At this time, the amount of the resin of the adhesive film introduced into the fiber can be determined according to the porosity of the fiber and the minimum viscosity of the resin.

Figs. 9 and 10 are views for explaining a connection between a conductive fiber and a substrate using an adhesive film according to another embodiment. Fig.

Referring to FIG. 9A, an electrical connection using an anisotropic conductive film (ACF) is shown. When an anisotropic conductive film (ACF) using a metal-coated polymer ball is used as compared to a nonconductive film .

In other words, in the case of the anisotropic conductive film (ACF) including the conductive particles 950, the conductive particles 950 enter the void space between the conductive fibers 940, and the direct contact between the fibers 940 and the electrodes 920 Conductive film (NCF) compared to the non-conductive film (NCF), such as by placing conductive particles between the fibers 940 and the electrodes 920 or by entering bridging between pores between the fibers 940 There is an effect that the contact resistance is further lowered by adding the energizing path of the resistor.

As shown in FIG. 10A, it can be confirmed that the contact resistance is reduced because the conductive particles are sandwiched between the electrodes and the conductive fibers, or the conductive particles flow into the fibers to electrically connect the fibers.

9B, electrical connection using an anisotropic conductive film (ACF) having non-spherical conductive particles 950 is shown. For example, when using micro-rod-shaped conductive particles 950, It is confirmed that the contact resistance is further reduced because the contact area of contact is widened when the conductive particles are used.

If the conductive particles 950 of the adhesive film 930 are small spherical particles, the particles can not fall into the fibers due to the flow of the resin and can not reduce the contact resistance. Accordingly, when rod-shaped or elliptical conductive particles are used as shown in FIG. 10B, the non-spherical particles are positioned only between the fibers and the electrodes, thereby further reducing the contact resistance.

11 and 12 are views for explaining the contact resistance between the conductive fiber and the substrate according to the adhesive film according to another embodiment.

Referring to FIGS. 11 and 12, when the anisotropic conductive film (ACF) is used as the adhesive film, it is confirmed that the contact resistance is reduced as compared with the nonconductive film (NCF) in FIG.

As described above, according to the embodiments, various kinds of characteristics of the resin used in the anisotropic conductive film and the bonding method can be variously optimized, so that various types of flexible and flexible substrates can be electrically connected and the application range is wide.

In addition, according to the embodiments, mechanical bonding and electrical connection can be realized at the same time as compared with the electrical connection method of an electronic fiber using an existing adhesive, thereby simplifying the process and reducing the cost.

According to the embodiments, the shape of the conductive particles of the anisotropic conductive film, the bonding method, and the physical properties of the adhesive film can be varied to broaden the application range.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

Claims (19)

An adhesive film for electrical connection of an electronic fabric,
An adhesive film for electrically connecting the electrode and the fiber by bonding conductive fibers to an upper portion of a substrate on which an electrode is formed,
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The above-
And an anisotropic conductive film (ACF) comprising a plurality of conductive particles, wherein the conductive particles are sandwiched between the electrodes and the fibers, or the conductive particles are introduced into void spaces between the fibers, And a plurality of conductive paths for electrically connecting the fibers and the electrodes by direct contact are formed so as to electrically connect the fibers and the electrodes so that the contact resistance is reduced and the length of the transverse diameters of the conductive particles is the width of the irregularities The conductive particles are prevented from being caught in the concavities and convexities, and the contact area with the fibers or the electrodes is wider than in the case of using spherical conductive particles, Reducing the resistance,
The adhesive film is disposed on a substrate on which an electrode is formed, a conductive fiber is disposed on the adhesive film, heat and pressure are applied in a downward direction from the upper side of the fiber, The resin of the adhesive film flows into the pores between the fibers disposed at the upper part because the viscosity is lowered and the fibers between the fibers are adhered by the resin introduced into the pores between the fibers, And the electrode and the fiber are electrically connected to each other
Wherein the adhesive layer comprises an adhesive agent. The method according to claim 1,
The above-
The resin is introduced into the pores between the fibers when the heat is applied and the viscosity of the resin is increased by the curing reaction so that the fibers are firmly adhered to each other, ) State
Wherein the adhesive layer comprises an adhesive agent. delete delete The method according to claim 1,
The conductive particles may be,
And the length of the transverse diameter is longer than the width of the irregularities formed on the fibers
Wherein the adhesive layer comprises an adhesive agent. The method according to claim 1,
The conductive particles may be,
A contact area is widened as compared with the case where spherical conductive particles are used because of the micro-rod shape, and the contact resistance is reduced
Wherein the adhesive layer comprises an adhesive agent. The method according to claim 1,
The conductive particles may be,
The contact area is widened as compared with the case where spherical conductive particles are used, and the contact resistance is reduced
Wherein the adhesive layer comprises an adhesive agent. delete delete A structure comprising an adhesive film for electrical connection of an electronic fabric,
A substrate on which an electrode is formed;
Conductive fibers disposed on the substrate and electrically connected to the electrodes in direct contact therewith; And
A resin is applied to the upper portion of the fiber and heat and pressure are applied from the upper portion to the lower portion to cause a resin to flow through the pores between the fibers to adhere the fibers to the electrode.
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The above-
And an anisotropic conductive film (ACF) comprising a plurality of conductive particles, wherein the conductive particles flow into the void space between the fibers to electrically connect the fibers, A plurality of conductive paths electrically connected by contact are formed to reduce the contact resistance and decrease the viscosity by heat and pressure so that the resin flows into the pores between the fibers and the resin flows into the pores between the fibers. The fibers are adhered between the fibers by the resin, and the fibers are adhered between the electrodes,
The resin flowing down from the upper portion of the fiber in a state in which the fiber is in direct contact with the electrode fills the void space between the fibers to bond the fibers and the electrode, and the electrode and the fiber are electrically connected,
The conductive particles of the adhesive film have a shape in which the length of the transverse diameter is greater than the width of the irregularities formed on the fibers or the irregular shape of the irregularities is formed on the surface of the conductive particles to prevent the conductive particles from sticking to the irregularities The contact area with the fiber or the electrode is widened as compared with the case where spherical conductive particles are used to reduce the contact resistance
Characterized in that it comprises an adhesive film for electrical connection of an electronic fabric. delete delete delete A method of connecting an adhesive film for electrical connection of an electronic fabric,
Disposing an adhesive film on a substrate on which an electrode is formed;
Disposing conductive fibers on top of the adhesive film;
Applying heat and pressure downward from the top of the fiber;
The resin of the adhesive film flows into the pores between the fibers disposed above the adhesive film due to the heat and the pressure being lowered; And
The fibers are adhered to each other by the resin introduced into the pores between the fibers and the fibers are adhered to each other by the resin remaining on the upper portion of the electrode so that the electrodes and the fibers are electrically connected
Lt; / RTI >
The above-
And an anisotropic conductive film (ACF) comprising a plurality of conductive particles, wherein the conductive particles are sandwiched between the electrodes and the fibers, or the conductive particles are introduced into void spaces between the fibers, And a plurality of conductive paths for electrically connecting the fibers and the electrodes by direct contact are formed so as to electrically connect the fibers and the electrodes so that the contact resistance is reduced and the length of the transverse diameters of the conductive particles is the width of the irregularities The conductive particles are prevented from being caught in the concavities and convexities, and the contact area with the fibers or the electrodes is wider than in the case of using spherical conductive particles, Reducing resistance
Wherein the adhesive layer is formed on the adhesive layer. delete delete 15. The method of claim 14,
The amount of the resin to be introduced into the fibers of the adhesive film,
Which is determined by the porosity of the fiber and the minimum viscosity of the resin
Wherein the adhesive layer is formed on the adhesive layer. delete delete

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