CN217411237U

CN217411237U - Ultrasonic atomizer and atomizing device

Info

Publication number: CN217411237U
Application number: CN202220349988.2U
Authority: CN
Inventors: 沈万程; 彭策; 廖朝兴; 鲁国志; 陈耕潮; 胡雪仪; 肖建新; 张炯炯
Original assignee: Shenzhen Smoore Technology Ltd
Current assignee: Shenzhen Smoore Technology Ltd
Priority date: 2022-02-21
Filing date: 2022-02-21
Publication date: 2022-09-13
Anticipated expiration: 2032-02-21

Abstract

The utility model relates to an ultrasonic atomizer and atomizing device, ultrasonic atomizer includes the piezoceramics base member, the sheetmetal, the electrode body, the protective layer, conductive adhesive layer and flexible circuit board, the piezoceramics base member has the back that is located thickness side ascending, the sheetmetal sets up the one side of locating at the back, the electrode body is including adhering to on the piezoceramics base member and polarity opposite's first electrode and second electrode, the protective layer adopts insulating material to make and cover on first electrode and second electrode, conductive adhesive layer inlays to be established in the protective layer, all splice on first electrode and the second electrode and be connected with conductive adhesive layer, flexible circuit board and conductive adhesive layer splice the connection. Thus, the influence of high temperature on the electrical performance of the piezoelectric ceramic matrix can be reduced. Simultaneously, the conducting glue layer can effectively cover the electrode body, avoids the electrode body to be exposed because of not being covered completely, prevents that air and liquid from corroding and oxidizing the electrode body, further improves ultrasonic atomizer's reliability and product quality.

Description

Ultrasonic atomizer and atomizing device

Technical Field

The utility model relates to an atomizing technical field especially relates to an ultrasonic atomizer and contain atomizing device of this ultrasonic atomizer.

Background

The ultrasonic atomizer generally comprises a piezoelectric ceramic matrix and a metal sheet, wherein the metal sheet is attached to the piezoelectric ceramic matrix and provided with an atomization hole, the piezoelectric ceramic matrix vibrates under the action of voltage, and the metal sheet absorbs the vibration energy, so that liquid in the atomization hole is atomized. However, the conventional ultrasonic atomizer generally has the defect of low reliability, thereby affecting the quality of the product.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem how to improve ultrasonic nebulizer's reliability.

The utility model provides an ultrasonic atomizer, includes piezoceramics base member, sheetmetal, electrode body, protective layer, conductive adhesive layer and flexible circuit board, piezoceramics base member has the back that is located thickness direction, the sheetmetal sets up one side that the back was located, the electrode body is including adhering to on the piezoceramics base member and polarity opposite first electrode and second electrode, the protective layer adopts insulating material to make and cover first electrode with on the second electrode, conductive adhesive layer inlays to be established in the protective layer, first electrode with equal splice connection has on the second electrode conductive adhesive layer, flexible circuit board with conductive adhesive layer splice and connect.

In one embodiment, the piezoceramic matrix further comprises a front surface facing opposite to the back surface, and the first electrode and the second electrode are attached to the front surface and are connected with the conductive adhesive layer.

In one embodiment, the piezoelectric ceramic substrate further includes a side peripheral surface circumferentially connected between the front surface and the back surface, the electrode body further includes a third electrode electrically connected to the first electrode and a fourth electrode electrically connected to the second electrode, and the third electrode and the fourth electrode are both located on the side peripheral surface and cover a portion of the back surface.

In one embodiment, the metal sheet further comprises a first insulating glue layer fixedly connected between the back surface and the metal sheet.

In one embodiment, the first electrode and the second electrode are attached to the back surface, and the flexible circuit board and the metal sheet are both integrally formed.

In one embodiment, the piezoceramic body further comprises a front surface and a side peripheral surface, the front surface and the back surface are oppositely oriented, the side peripheral surface is connected between the front surface and the back surface in a surrounding manner, the electrode body further comprises a third electrode and a fourth electrode, the third electrode is electrically connected with the first electrode, the fourth electrode is electrically connected with the second electrode, and the third electrode and the fourth electrode are both located on the side peripheral surface and cover a part of the front surface.

In one embodiment, the piezoelectric ceramic substrate further comprises a front surface opposite to the back surface, the second insulating glue layer is fixedly connected between the front surface and the piezoelectric film, and the thickness of the piezoelectric film is 5 μm to 20 μm; when the pressing force applied to the piezoelectric film changes, the voltages applied to the first electrode and the second electrode change.

In one embodiment, at least one of the following schemes is further included:

the electrode body is made of silver material;

the metal sheet is made of stainless steel or aluminum material.

In one embodiment, the protective layer is made of an ink material, and the thickness of the protective layer is 5 μm to 10 μm.

An atomising device comprising an ultrasonic atomiser as claimed in any one of the preceding claims.

The utility model discloses a technical effect of an embodiment is: the conductive adhesive layer is embedded in the protective layer, the first electrode and the second electrode are both connected with the conductive adhesive layer in an adhesive mode, the flexible circuit board is connected with the conductive adhesive layer in an adhesive mode, and the flexible circuit board is fixed on the electrode body in an adhesive connection mode through the conductive adhesive layer. Therefore, the forming temperature of the conductive adhesive layer is relatively low, the influence of local high temperature on the piezoelectric ceramic matrix can be reduced, the piezoelectric ceramic matrix is ensured to have reasonable electrical performance, and the reliability of the ultrasonic atomizer is improved. Simultaneously, the conducting glue layer can effectively cover the electrode body, avoids the electrode body to be exposed because of not being covered completely, prevents that air and liquid from corroding and oxidizing the electrode body, further improves ultrasonic atomizer's reliability and product quality.

Drawings

Fig. 1 is a schematic partial perspective view of an ultrasonic atomizing device according to an embodiment;

fig. 2 is a partial cross-sectional structural schematic view of an ultrasonic atomizing device provided in a first embodiment;

fig. 3 is a partial sectional structural schematic view of an ultrasonic atomizing device provided in a second embodiment.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Referring to fig. 1, 2 and 3, an ultrasonic atomizer 10 according to an embodiment of the present invention is used for atomizing a liquid. The ultrasonic atomizer 10 includes a piezoelectric ceramic substrate 100, a metal sheet 200, an electrode body 300, a protective layer 410, a conductive adhesive layer 420, and a flexible circuit board 430. The piezoelectric ceramic substrate 100 generates ultrasonic vibration under the action of voltage, the metal sheet 200 may be made of aluminum material or stainless steel material, the metal sheet 200 is provided with atomizing holes 210, and the metal sheet 200 absorbs the vibration energy of the piezoelectric ceramic substrate 100, so that the liquid in the atomizing holes 210 is atomized to form liquid mist due to the ultrasonic vibration.

The piezoelectric ceramic body 100 may have a substantially annular shape, and the piezoelectric ceramic body 100 has a front surface 110 and a peripheral surface 130 on the rear surface 120 side, and when the liquid is atomized, the liquid mist is ejected from the rear surface 120 in a direction toward the front surface 110. Both the front surface 110 and the back surface 120 are two outer surfaces in the thickness direction of the piezoelectric ceramic body 100, and therefore both the front surface 110 and the back surface 120 face oppositely. The side circumferential surface 130 may be a circular ring surface, one end of the side circumferential surface 130 is connected to the periphery of the front surface 110, and the other end of the side circumferential surface 130 is connected to the periphery of the back surface 120, so that the side circumferential surface 130 is connected around between the front surface 110 and the back surface 120. The front and

rear faces

110 and 120 are horizontally disposed and the side circumferential surfaces 130 are vertically disposed.

The electrode body 300 comprises a first electrode 310, a second electrode 320, a third electrode 330 and a fourth electrode 340. The conductive adhesive layer 420 may be formed of an anisotropic conductive adhesive film or anisotropic conductive paste. The first electrode 310 and the second electrode 320 have opposite polarities, and the conductive adhesive layer 420 is disposed on both of the first electrode 310 and the second electrode 320, so that the conductive adhesive layer 420 is connected to the first electrode 310 and the second electrode 320 by adhesive bonding, and meanwhile, the conductive adhesive layer 420 is also connected to the flexible circuit board 430 by adhesive bonding. It can be understood that the flexible circuit board 430 can be connected to the first electrode 310 and the second electrode 320 by the conductive adhesive layer 420 in a physical adhesive connection relationship and an electrical connection relationship, so that the flexible circuit board 430 applies a voltage to the first electrode 310 and the second electrode 320 by the conductive adhesive layer 420. The electrode body 300 may be made of a silver material so that the electrode body 300 has excellent conductive properties.

The protective layer 410 is made of an insulating material, and may be made of an ink material, for example. The protective layer 410 made of the ink material may be baked at a temperature ranging from 80 to 100 ℃ for 0.5 to 1 hour, so that the protective layer 410 may cover the first and

second electrodes

310 and 320. The thickness of the protection layer 410 may be 5 μm to 10 μm, for example, the thickness may be 5 μm, 8 μm, or 10 μm. The protective layer 410 may protect the first electrode 310 and the second electrode 320 from oxidation of the first electrode 310 and the second electrode 320. Meanwhile, the baking temperature of the protective layer 410 made of the ink material is relatively low, so that the manufacturing cost can be reduced, volatilization of elements in the piezoelectric ceramic matrix 100 under the action of high temperature is reduced, and the stability of the electrical property of the piezoelectric ceramic matrix 100 is improved.

The protective layer 410 may be provided with a mounting hole 411, and the mounting hole 411 may penetrate the entire protective layer 410 in the thickness direction so that the electrode body 300 can be exposed through the mounting hole 411. The conductive adhesive layer 420 is fitted into the mounting hole 411 such that the conductive adhesive layer 420 is embedded in the protective layer 410. The anisotropic conductive film or the anisotropic conductive paste may be baked at a temperature ranging from 80 ℃ to 100 ℃ for 0.5h to 1h, so as to be transformed into the conductive adhesive layer 420, and the flexible circuit board 430 is connected to the electrode body 300 by the adhesive layer 420.

If the flexible circuit board 430 is directly connected to the electrode body 300 by soldering, the soldering process is relatively expensive. On the other hand, the temperature generated during the soldering process will be greater than 300 ℃, so that the local high temperature generated during the soldering will have an adverse effect on the stability of the electrical properties of the piezoelectric ceramic substrate 100. In another aspect, in view of the limitation of the welding process, the welding table generated by welding will have difficulty filling the entire mounting hole 411, that is, the welding table will have difficulty covering the electrode body 300 exposed in the mounting hole 411, so that the electrode body 300 near the edge of the mounting hole 411 is still in an exposed state, which may cause the exposed electrode body 300 to be in contact with air to generate oxidation, and meanwhile, the liquid will also corrode and oxidize the electrode body 300 through the remaining space of the mounting hole 411 that is not filled by the welding table, which may affect the reliability of the ultrasonic atomizer 10 and reduce the product quality of the ultrasonic atomizer 10.

With the ultrasonic atomizer 10 of the above embodiment, the flexible circuit board 430 is fixed to the electrode body 300 by means of the adhesive layer 420 in an adhesive bonding manner. One is that the process cost of the glue joint is relatively low, which can reduce the manufacturing cost of the entire ultrasonic atomizer 10. Secondly, the temperature required by the conductive adhesive layer 420 in the molding process is lower than 100 ℃, which can reduce energy loss, reduce the influence of local high temperature on the piezoelectric ceramic matrix 100, and ensure that the piezoelectric ceramic matrix 100 has reasonable electrical properties. Thirdly, the conductive adhesive layer 420 is easy to fill the whole mounting hole 411, so that the conductive adhesive layer 420 can completely cover the electrode body 300 exposed in the mounting hole 411, and not only can prevent the electrode body 300 from being oxidized due to contact with air, but also can prevent liquid from entering from the mounting hole 411 and corroding and oxidizing the electrode body 300. Meanwhile, even if the whole mounting hole 411 is not filled with the conductive adhesive layer 420, the adhesive liquid can be conveniently injected into the unfilled residual space in the mounting hole 411 in a dispensing manner, and the solidified adhesive liquid can further fill the residual space of the mounting hole 411, so that the exposed electrode body 300 is covered, the electrode body 300 is prevented from being oxidized under the action of air and liquid, and the reliability and the product quality of the ultrasonic atomizer 10 are finally improved.

Referring to fig. 1 and 2, in some embodiments, the first electrode 310 and the second electrode 320 are located on the front surface 110 of the piezoceramic substrate 100, and the metal sheet 200 is located on the back surface 120 of the piezoceramic substrate 100. The third electrode 330 is located on the lateral periphery 130 and covers a portion of the back surface 120, specifically, the third electrode 330 is connected to the first electrode 310, a portion of the third electrode 330 is located on the lateral periphery 130, and another portion of the third electrode 330 is located on the back surface 120 and covers a portion of the back surface 120. The fourth electrode 340 is located on the lateral periphery 130 and covers a part of the back surface 120, specifically, the fourth electrode 340 is connected to the second electrode 320, a part of the fourth electrode 340 is located on the lateral periphery 130, and another part of the fourth electrode 340 is located on the back surface 120 and covers a part of the back surface 120. The first electrode 310 and the third electrode 330 can be regarded as positive electrodes, and the second electrode 320 and the fourth electrode 340 can be regarded as negative electrodes. Portions of the third electrode 330 and the fourth electrode 340 on the lateral circumferential surface 130 may also be covered by the protective layer 410. In other embodiments, for example, in the case that the third electrode 330 covers the entire back surface 120, the fourth electrode 340 does not cover the back surface 120 and does not form an electrical connection relationship with the third electrode 330; for another example, in a case where the fourth electrode 340 covers the entire rear surface 120, the third electrode 330 does not cover the rear surface 120 and does not form an electrical connection relationship with the fourth electrode 340.

The ultrasonic atomizer 10 may further include a first adhesive layer 510, the first adhesive layer 510 is used for fixing the metal sheet 200, and specifically, when the third electrode 330 and the fourth electrode 340 both cover the back surface 120, the first adhesive layer 510 is attached to the third electrode 330 and the fourth electrode 340, and at the same time, the first adhesive layer 510 may fill a gap between the third electrode 330 and the fourth electrode 340, and prevent the gap from affecting a vibration mode of the piezoelectric ceramic matrix 100. Obviously, the protective layer 410 also fills the gap between the first electrode 310 and the second electrode 320, and also prevents the gap from affecting the vibration mode. The metal sheet 200 is attached to the first adhesive layer 510, so that the metal sheet 200 is fixed on the piezoceramic substrate 100 through the first adhesive layer 510. Since the conductive adhesive layer 420 is disposed on the first electrode 310 and the second electrode 320, it is possible to effectively avoid forming a welding convex hull for welding a wire on the metal sheet 200, so that the metal sheet 200 does not need to be punched, and the manufacturing cost of the metal sheet 200 is reduced.

Referring to fig. 1 and 3, in some embodiments, the first electrode 310 and the second electrode 320 are attached to the back surface 120 of the piezoelectric ceramic substrate 100, the flexible circuit board 430 and the metal sheet 200 are integrally formed, the integrally formed structure can be regarded as a flexible circuit board 430 with metal reinforcement, which is referred to as a metal-reinforced flexible circuit board 201, and the atomization hole 210 is opened on the metal-reinforced flexible circuit board 201.

Considering that the flexible circuit board 430 and the metal sheet 200 are integrally formed into the metal reinforced flexible circuit board 201, the situation that the circuit board and the metal sheet 200 are arranged at intervals in the thickness direction of the piezoelectric ceramic substrate 100 can be avoided, and the effect of reducing the thickness of the ultrasonic atomizer 10 is achieved. And the atomization holes 210 can be formed on the metal reinforced flexible circuit board 201 in a laser drilling mode, so that the processing efficiency and the precision of the atomization holes 210 can be reasonably improved. Meanwhile, the metal reinforced flexible circuit board 201 can be installed at one time, so that the situation that the circuit board and the metal sheet 200 are installed separately is avoided, and the assembly efficiency of the ultrasonic atomizer 10 can be improved.

In view of the fact that the protection layer 410 covers the first electrode 310 and the second electrode 320, the first electrode 310 and the second electrode 320 are provided with the mounting hole 411 for mounting the conductive adhesive layer 420, and the conductive adhesive layer 420 fills the mounting hole 411, so that the metal-reinforced flexible circuit board 201 is connected to the first electrode 310 and the second electrode 320 by adhesive bonding and is electrically connected to the first electrode 310 and the second electrode 320 through the conductive adhesive layer 420, obviously, the metal-reinforced flexible circuit board 201 is located on the side where the back surface 120 is located. Therefore, the metal reinforced flexible circuit board 201 not only has the function of atomizing the liquid, but also has the function of electrically connecting with the first electrode 310 and the second electrode 320.

The third electrode 330 is located on the lateral periphery 130 and covers a portion of the back surface 120, specifically, the third electrode 330 is connected to the first electrode 310, and a portion of the third electrode 330 is located on the lateral periphery, and another portion of the third electrode 330 is located on the front surface 110 and covers a portion of the front surface 110. The fourth electrode 340 is located on the lateral periphery 130 and covers a portion of the back surface 120, specifically, the fourth electrode 340 is connected to the second electrode 320, a portion of the fourth electrode 340 is located on the lateral periphery 130, and another portion of the fourth electrode 340 is located on the front surface 110 and covers a portion of the front surface 110. The first electrode 310 and the third electrode 330 can be regarded as positive electrodes, and the second electrode 320 and the fourth electrode 340 can be regarded as negative electrodes. Portions of the third electrode 330 and the fourth electrode 340 on the lateral circumferential surface 130 may also be covered by the protective layer 410. In other embodiments, for example, in the case that the third electrode 330 covers the entire front surface 110, the fourth electrode 340 does not cover the front surface 110 and does not form an electrical connection with the third electrode 330; for another example, in a case where the fourth electrode 340 covers the entire front surface 110, the third electrode 330 does not cover the front surface 110 and does not form an electrical connection with the fourth electrode 340.

The ultrasonic atomizer 10 may further include a second adhesive insulating layer 520 and a piezoelectric film 530, and the second adhesive insulating layer 520 may cover the third electrode 330 and the fourth electrode 340 on the front surface 110 and fill a gap between the third electrode 330 and the fourth electrode 340, preventing the gap from affecting a vibration mode of the piezoceramic substrate 100. The piezoelectric film 530 is attached to the second adhesive insulating layer 520, and the piezoelectric film 530 can be fixed on the piezoceramic substrate 100 by the action of the second adhesive insulating layer 520. The thickness of the piezoelectric film 530 is 5 μm to 20 μm, and the specific value of the thickness of the piezoelectric film 530 may be 5 μm, 10 μm, 15 μm, or 20 μm. The piezoelectric film 530 may be a piezoelectric organic film, and may function as a pressure sensor.

When a user applies a pressing force to the ultrasonic atomizer 10, the piezoelectric film 530 senses the pressing force and feeds back information of the pressing force to the control system, so that the control system adjusts the voltage loaded on the first electrode 310 and the second electrode 320 through the flexible circuit board 430 according to a preset algorithm, further changes the vibration energy of the piezoelectric ceramic substrate 100, and finally adjusts the atomizing speed and the atomizing amount of the ultrasonic atomizer 10. For example, when the pressing force is 150g or less, the atomization amount of the ultrasonic atomizer 10 is 0.3 g/min; when the pressing force is between 150g and 300g, the atomization amount of the ultrasonic atomizer 10 is 0.4 g/min; when the pressing force is 300g or more, the atomization amount of the ultrasonic atomizer 10 is 0.5 g/min. Therefore, by arranging the piezoelectric film 530, the ultrasonic atomizer 10 can recognize pressing forces of users with different sizes, so that the atomization amount can be reasonably adjusted, different requirements of the users can be met by the atomization amount of the ultrasonic atomizer 10, and finally the user experience of the ultrasonic atomizer 10 is improved.

The utility model also provides an atomizing device, which comprises the ultrasonic atomizer 10, and the reliability of the atomizing device can be improved by arranging the ultrasonic atomizer 10,

the technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides an ultrasonic atomizer, its characterized in that, includes piezoceramics base member, sheetmetal, electrode body, protective layer, conductive adhesive layer and flexible circuit board, piezoceramics base member has the back that is located thickness direction ascending, the sheetmetal sets up one side that the back was located, the electrode body is including adhering to piezoceramics base member is last and opposite polarity's first electrode and second electrode, the protective layer adopts insulating material to make and covers first electrode with on the second electrode, conductive adhesive layer inlays to be established in the protective layer, first electrode with all glue on the second electrode and be connected with conductive adhesive layer, the flexible circuit board with conductive adhesive layer splices and connects.

2. The ultrasonic atomizer of claim 1, wherein said piezoceramic matrix further comprises a front surface facing opposite said back surface, said first electrode and said second electrode being attached to said front surface and both being connected to said layer of conductive adhesive.

3. The ultrasonic atomizer of claim 2, wherein said piezoceramic body further comprises a side periphery circumferentially connected between said front surface and said back surface, said electrode body further comprising a third electrode electrically connected to said first electrode and a fourth electrode electrically connected to said second electrode, said third electrode and said fourth electrode each being located on said side periphery and covering a portion of said back surface.

4. The ultrasonic atomizer of claim 2 further comprising a first layer of adhesive insulation fixedly attached between said back surface and said metal sheet.

5. The ultrasonic atomizer of claim 1, wherein said first electrode and said second electrode are attached to said back surface, and said flexible circuit board and said metal sheet are both integrally formed.

6. The ultrasonic atomizer of claim 5 wherein said piezoceramic body further comprises a front face facing opposite said back face and a side perimeter face circumferentially connected between said front face and said back face, said electrode body further comprising a third electrode electrically connected to said first electrode and a fourth electrode electrically connected to said second electrode, said third and fourth electrodes each being located on said side perimeter face and covering a portion of said front face.

7. The ultrasonic atomizer of claim 5 further comprising a second layer of insulating glue and a piezoelectric film, said piezoelectric ceramic substrate further comprising a front surface facing opposite to said back surface, said second layer of insulating glue being fixedly attached between said front surface and said piezoelectric film, said piezoelectric film having a thickness of 5 to 20 μm; when the pressing force applied to the piezoelectric film changes, the voltages applied to the first electrode and the second electrode change accordingly.

8. The ultrasonic nebulizer of claim 1, further comprising at least one of:

the electrode body is made of silver material;

the metal sheet is made of stainless steel or aluminum material.

9. The ultrasonic atomizer of claim 1, wherein said protective layer is made of an ink material, and said protective layer has a thickness of 5 μm to 10 μm.

10. An atomisation device comprising an ultrasonic atomiser according to any of claims 1 to 9.