CN115532508A

CN115532508A - Expandable micro-grid atomization assembly, atomizer and manufacturing process of atomization assembly of atomizer

Info

Publication number: CN115532508A
Application number: CN202211288971.1A
Authority: CN
Inventors: 郑瑶
Original assignee: Shenzhen Shang Jin Electronic Science And Technology Co ltd
Current assignee: Shenzhen Shang Jin Electronic Science And Technology Co ltd
Priority date: 2022-10-20
Filing date: 2022-10-20
Publication date: 2022-12-30

Abstract

The invention discloses an extensible microgrid atomizing component, an atomizer and a manufacturing process of the atomizing component, and relates to the technical field of atomizing sheets, wherein a plurality of atomizing units of the extensible microgrid atomizing component comprise a first cover film, FPC (flexible printed circuit) flexible circuit carrier plate attaching parts, piezoelectric ceramics and conducting layers which are distributed from top to bottom, and the FPC flexible circuit carrier plate attaching parts of the plurality of atomizing units are integrally connected with an FPC flexible circuit carrier plate line arranging part; the FPC flexible circuit carrier plate line arranging part and the FPC flexible circuit carrier plate attaching parts are integrally connected to form an FPC flexible circuit carrier plate; the piezoelectric ceramic is electrically connected with a first lead and a second lead, and the first lead and the second lead are uniformly distributed on the wire arrangement part of the FPC flexible circuit carrier plate; the application provides an extensible microgrid atomization component atomizing is efficient, possess high atomizing efficiency and flow, and atomizing flow scalability is strong, and the structure is retrencied, and area occupied is few.

Description

Expandable micro-grid atomization assembly, atomizer and manufacturing process of atomization assembly of atomizer

Technical Field

The invention relates to the technical field of atomizing sheets, in particular to an expandable micro-grid atomizing assembly, an atomizer and a manufacturing process of the atomizing assembly.

Background

The atomization principle of the micro-grid atomization technology is that liquid is repeatedly compressed by micro-conical holes under the condition of periodic oscillation, so that the liquid is changed into a large number of independent liquid drops to form aerosol, the oscillation amplitude can be changed by changing input power, the size of the liquid drops can be changed by changing the size of the micro-conical holes, and the size distribution of the liquid drops is very uniform due to the screening advantage of the micro-conical holes; meanwhile, the method has the advantages of high electric energy utilization rate and the like, and has wide application potential.

The micro-grid atomization technology further expands the application and meets a plurality of bottlenecks, part of liquid has strong corrosivity to metal, for example, solutions such as pesticides and fertilizers have extremely low corrosivity to organic materials, but have strong corrosivity to stainless steel metal and other materials, particularly, the corrosion rate is far higher than the normal level due to the fact that the contact surface area is greatly increased on the micro-cone hole, and the atomization function can be rapidly failed once the micro-cone hole is corroded; meanwhile, the micro-grid atomization has the characteristic of low atomization flow, and the single micro-grid atomization piece has the atomization rate of only 2 ml/min under the condition that the diameter of fog drops is about 15 microns; the requirement can be met only by using a large number of atomizing sheets under the application scene of high atomizing flow needed such as pesticide spraying, and the like, but the structural and assembly complexity is improved at the same time, and the solution is far less than that of a compression pump and a spray head with extremely low efficiency.

Around the practical requirements of the above applications, firstly the material of the atomizing plate must be resistant to corrosion of chemical solvents, and secondly the atomizing plate must meet higher atomizing flow rate, so that the atomizing plate can have wider application potential.

Disclosure of Invention

In view of the above, the present invention provides an expandable microgrid atomizing assembly, an atomizer and a manufacturing process of the atomizing assembly thereof, and the expandable microgrid atomizing assembly provided by the present invention has the advantages of high atomizing efficiency, extremely high atomizing efficiency and flow rate, strong expandability of atomizing flow rate, simple structure and small occupied area.

In order to achieve the purpose, the invention adopts the following technical scheme:

an extensible microgrid atomizing component comprises a plurality of atomizing units, wherein each atomizing unit comprises a first cover film, an FPC (flexible printed circuit) flexible circuit carrier plate attaching part, piezoelectric ceramics and a conducting layer which are distributed from top to bottom, and the FPC flexible circuit carrier plate attaching parts of the plurality of atomizing units are integrally connected with an FPC flexible circuit carrier plate line arranging part; the FPC flexible circuit carrier plate line arranging part and the FPC flexible circuit carrier plate attaching parts are integrally connected to form an FPC flexible circuit carrier plate; the piezoelectric ceramic is electrically connected with a first lead and a second lead, the first lead and the second lead are uniformly distributed on a line arranging part of the FPC flexible circuit carrier plate, the plurality of atomization units correspond to the plurality of first leads and the plurality of second leads, and the end parts of the plurality of first leads and the end parts of the plurality of second leads are converged to form a connector.

As a preferred scheme: a plurality of slots for reducing vibration energy consumption are arranged on the outer circumference of each atomization unit at intervals, and are located on the outer side of the attaching portion of the FPC flexible circuit carrier plate.

As a preferred scheme: the plurality of slots are arc-shaped and are evenly arranged on the FPC flexible circuit carrier plate line arranging part outside the FPC flexible circuit carrier plate attaching part at intervals.

As a preferred scheme: the plurality of first conducting wires are distributed on the flexible circuit carrier plate line arranging part in parallel or in series, and the plurality of second conducting wires are distributed on the flexible circuit carrier plate line arranging part in parallel or in series.

As a preferred scheme: the FPC flexible circuit carrier plate comprises a second cover film, a second adhesive film and a conducting strip which are sequentially attached from top to bottom, wherein a first adhesive film is attached between the first cover film and the second cover film, and a conductive adhesive film is attached between the conducting strip and the piezoelectric ceramic.

As a preferred scheme: the piezoelectric ceramic is provided with an A-surface electrode and a B-surface electrode, the A-surface electrode is electrically attached to the plane of the conducting sheet, and the B-surface electrode is electrically attached to the plane of the conducting layer; the conducting plate is electrically connected with the first conducting wire, and the conducting layer is electrically connected with the second conducting wire.

As a preferred scheme: the conducting layer is a conductive adhesive tape, a connecting part is integrally extended from the edge of the conductive adhesive tape, and the connecting part is electrically connected with the second lead.

As a preferred scheme: and the surface of an area outside the plane electric joint position of the conductive adhesive tape and the B-surface electrode is coated with an insulating layer.

As a preferred scheme: the plurality of atomizing units are distributed in a single-row shape or in a multi-row shape.

As a preferred embodiment: and the first conducting wire and the second conducting wire are coated with insulating oil.

An atomizer comprises the expandable microgrid atomizing component, a liquid storage tank and a base, wherein the liquid storage tank is used for containing liquid to be atomized, and the expandable microgrid atomizing component is located between the liquid storage tank and the base.

As a preferred embodiment: the liquid storage tank is provided with a plurality of first outlets which correspond to the atomizing units one by one; a plurality of second outlets are arranged on the base and correspond to the atomizing units one by one.

As a preferred scheme: a first sealing ring is arranged between the first outlet hole and the upper surface of the atomization unit, and a second sealing ring is arranged between the lower surface of the atomization unit and the second outlet hole.

The manufacturing process of the expandable microgrid atomizing assembly comprises the following steps:

s1: preparing an FPC flexible circuit carrier plate with a plurality of slots; the FPC flexible circuit carrier plate comprises an FPC flexible circuit carrier plate line arranging part and a plurality of FPC flexible circuit carrier plate attaching parts which are integrally connected;

s2: etching the centers of the conductive sheets of the attaching parts of the FPC flexible circuit carrier boards to form etching areas, electroplating the exposed areas of the conductive sheets corresponding to the A-surface electrodes, and exposing the second adhesive film in the etching areas;

s3: removing the second adhesive film and the second cover film in the etched area to form a through hole;

s4: coating a first adhesive film on the periphery of the through hole on the outer side surface of the second cover film;

s5: attaching the first cover film to the first adhesive film in its entirety such that the first cover film completely covers the via region;

s6: placing a conductive adhesive film on the piezoelectric ceramic, and placing the product formed in the step S5 on the conductive adhesive film;

s7: electrically attaching the electrode on the surface A to the plane of the conducting sheet, and electrically attaching the electrode on the surface B to the plane of the conducting layer; the conducting plate is electrically connected with the first conducting wire, and the conducting layer is electrically connected with the second conducting wire;

s8: the plurality of atomization units are correspondingly provided with a plurality of first conducting wires and a plurality of second conducting wires, the plurality of first conducting wires are distributed on the flexible circuit carrier plate line arranging part of the FPC in parallel or in series, and the plurality of second conducting wires are distributed on the flexible circuit carrier plate line arranging part of the FPC in parallel or in series; the end parts of the plurality of first wires and the end parts of the plurality of second wires are converged to form a connector;

s9: putting the product formed in the step S8 into a press machine for pressing, wherein the center positions of the first cover film, the first adhesive film, the second cover film, the second adhesive film and the conducting strip of each atomizing unit form a bulge facing one side of the conducting adhesive film;

s10: all the first cover films of the plurality of atomization units of the product well pressed in the S9 are provided with atomization micropores;

s11: and (5) carrying out power-on detection on the product obtained in the step (S10) to obtain a qualified product.

As a preferred embodiment: and in the S10, the first covering films of the plurality of atomizing units are respectively provided with atomizing micropores one by one.

As a preferred scheme: and in the S1, a plurality of slots are positioned outside the attaching part of the FPC flexible circuit carrier plate.

Compared with the prior art, the invention has obvious advantages and beneficial effects, and particularly, according to the technical scheme, the expandable microgrid atomizing assembly provided by the invention has high atomizing efficiency: the atomization assembly has ultrahigh atomization efficiency, each atomization unit works independently, and therefore the atomization assembly also has excellent fault tolerance rate, the atomization assembly does not work due to the fault of a single atomization unit, redundant design is made under the allowed condition, and the damage of a plurality of atomization units is allowed without influencing the overall working performance of the atomization assembly; after the plurality of atomization units are connected in series, the design of a driving circuit can be simplified, the efficiency of a boosting ratio booster circuit with reasonable design can be further improved, and the overall power conversion loss of the plurality of booster circuits is smaller; the micro-mesh atomization technology shows higher atomization efficiency under the condition of lower requirement on droplet diameter; the extensible microgrid atomizing component provided by the application has atomizing efficiency and flow which cannot be compared with any atomizing technology; the application provides an extensible microgrid atomization component's atomizing flow scalability is strong: the design of the atomization assembly has the atomization flow which can be expanded and adjusted at will, and the atomization rate of the atomization assembly can be adjusted at will by changing the number of the atomization units; the application provides an extensible microgrid atomization component structure is retrencied, and area occupied is few.

To more clearly illustrate the structural features and effects of the present invention, the following detailed description is given with reference to the accompanying drawings and specific embodiments.

Drawings

FIG. 1 is a perspective view of an atomizer according to the present invention;

FIG. 2 is a perspective view of an atomizer according to the present invention;

FIG. 3 is an exploded view of the atomizer of the present invention;

FIG. 4 is a first perspective view of the atomizing assembly of the present invention;

FIG. 5 is a perspective view of the atomizing assembly of the present invention from a second perspective;

FIG. 6 is a schematic perspective view of an atomizing unit according to the present invention;

FIG. 7 is a cross-sectional view of an atomizing unit of the present invention;

FIG. 8 is an enlarged view of the invention taken at M in FIG. 7;

FIG. 9 is an exploded view of the atomizing unit of the present invention;

fig. 10 is a process flow diagram illustrating the fabrication of an expandable microgrid atomizing assembly according to the present invention.

Description of the figures:

in the figure: 10. an atomizing assembly; 11. an atomizing unit; 111. a first cover film; 1111. atomizing micropores; 112. a first adhesive film; 110. an FPC flexible circuit carrier plate attaching part; 120. arranging parts of an FPC flexible circuit carrier plate; 100. an FPC flexible circuit carrier board; 113. a second cover film 1131, a through hole; 114. a second adhesive film; 115. a conductive sheet 1151, an etched region; 116. a conductive adhesive film; 117. piezoelectric ceramics; 1171. an A-side electrode; 1172. a B-side electrode; 1173. a first conductive line; 1174. a second conductive line; 1175. a connector; 130. grooving; 118. a conductive layer; 1181. a connecting portion; 119. a protrusion; 20. a liquid storage tank; 21. a first outlet bore; 22. a first seal ring; 30. a base; 31. a second exit orifice; 32. and a second seal ring.

Detailed Description

As shown in fig. 1 to 10, the present invention provides an expandable microgrid atomizing assembly, which comprises a plurality of atomizing units 11, wherein each of the plurality of atomizing units 11 comprises a first cover film 111, an FPC flexible circuit carrier attachment portion 110, a piezoelectric ceramic 117 and a conductive layer 118, which are distributed from top to bottom, and the FPC flexible circuit carrier attachment portions 110 of the plurality of atomizing units 11 are integrally connected with an FPC flexible circuit carrier line portion 120; the FPC flexible circuit carrier board arranging part 120 and the FPC flexible circuit carrier board attaching parts 110 are integrally connected to form an FPC flexible circuit carrier board 100; the piezoelectric ceramic 117 is electrically connected with a first conducting wire 1173 and a second conducting wire 1174, the first conducting wire 1173 and the second conducting wire 1174 are uniformly distributed on the arranging part 120 of the FPC flexible circuit carrier, the plurality of atomizing units 11 are correspondingly provided with a plurality of first conducting wires 1173 and a plurality of second conducting wires 1174, and the end parts of the plurality of first conducting wires 1173 and the end parts of the plurality of second conducting wires 1174 are converged to form a connecting head 1175.

The maximum atomization flow of the single atomization unit 11 is extremely low, the way of expanding the atomization flow is to increase the aperture of the taper hole and increase the driving power of the driving circuit, but the maximum rate is only 2 ml/min, and the input power of the driving circuit exceeds 2W at this time, the energy consumption efficiency is sharply reduced, and meanwhile, the fatigue life of the metal diaphragm is extremely low, so the life of the atomization sheet diaphragm is also sharply shortened at this power; the aperture that increases the taper hole also has the upper limit, can lead to appearing the weeping phenomenon when the aperture is too big, downward (gravity direction) because the aperture of taper hole is minimum only a few microns when the atomizer spraying direction, the surface tension of liquid is the main acting force under this yardstick, and the gravity loading of this moment liquid can ensure that liquid also can not flow through the taper hole under the inoperative condition of atomizer owing to can't break through surface tension to the taper hole position, but the gravity of liquid can break through surface tension and make liquid pass through the taper hole when the diameter of taper hole further increases, thereby the weeping appears.

Therefore, parallel operation of multiple atomizers is an effective way for increasing the atomizing flow, but the structure complexity is increased greatly, each atomizing sheet needs an independent wire to connect electrodes, and meanwhile, sealing treatment is needed.

The first cover film 111 in the application adopts a high molecular organic material, so that the problem of fatigue life of the vibrating diaphragm is effectively solved, the atomizing component 10 is allowed to have more atomizing micropores 1111 and a higher upper limit of power, the atomizing flow can reach 5 ml/min through actual tests, and a further lifting space is provided; while the atomizing assembly 10 is configured to have a larger expansion space.

A plurality of slots 130 for reducing vibration energy consumption are arranged at intervals on the outer circumference of the plurality of atomizing units 11, and the plurality of slots 130 are located outside the flexible circuit carrier board attaching portion 110 of the FPC.

The plurality of slots 130 are arc-shaped, and the plurality of slots 130 are uniformly spaced on the flexible circuit carrier line portion 120 outside the flexible circuit carrier attaching portion 110.

The first wires 1173 are distributed on the flexible printed circuit board line arranging part 120 in parallel or in series, and the second wires 1174 are distributed on the flexible printed circuit board line arranging part 120 in parallel or in series.

The FPC flexible circuit carrier 100 includes a second coverlay film 113, a second adhesive film 114, and a conductive sheet 115 sequentially attached from top to bottom, a first adhesive film 112 is attached between the first coverlay film 111 and the second coverlay film 113, and a conductive adhesive film 116 is attached between the conductive sheet 115 and the piezoelectric ceramic 117.

The piezoceramic 117 has an a-side electrode 1171 and a B-side electrode 1172, the a-side electrode 1171 is electrically attached to the plane of the conductive sheet 115, and the B-side electrode 1172 is electrically attached to the plane of the conductive layer 118; the conductive plate 115 is electrically connected to the first conductive line 1173, and the conductive layer 118 is electrically connected to the second conductive line 1174.

The FPC flexible circuit carrier plate 100 is introduced to serve as an intermediate carrier, the connection mode of the A-surface electrode 1171 and the B-surface electrode 1172 of the piezoelectric ceramic 117 and a driving circuit is simplified, the manufacturing process of the atomization assembly 10 is further suitable for automatic batch manufacturing, the yield of products is improved again, and the basis is provided for the expandability of the atomization assembly 10.

The a-side electrode 1171 and the B-side electrode 1172 of the piezoelectric ceramic 117 are connected to the same FPC flexible circuit carrier board 100, and then the a-side electrode 1171 and the B-side electrode 1172 are connected together by using a standard connector and a driving circuit, the atomization assembly 10 has an extremely high atomization flow rate exceeding 0.1 liter/minute, and only 20W of input power is needed, and the excellent consistency of the atomization unit 11 even allows the atomization unit 11 to be connected in series, so that the connection between the atomization assembly 10 and the driving circuit is reduced, and only the driving voltage needs to be increased.

The conductive layer 118 is a conductive adhesive tape, a connection portion 1181 is integrally extended from an edge of the conductive adhesive tape, and the connection portion 1181 is electrically connected to the second wire 1174.

The FPC flexible line carrier 100 serves as a carrier for ultrasonic oscillation and also serves as a carrier for the a-side electrodes 1171 and the B-side electrodes 1172 of the piezoelectric ceramic 117, and connects both the a-side electrodes 1171 and the B-side electrodes 1172 of the piezoelectric ceramic 117 to the same standard interface.

The B-side electrode 1172 is connected to the FPC flexible line carrier attaching portion 110 by a conductive adhesive tape, the first lead 1173 and the second lead 1174 are routed and arranged by the FPC flexible line carrier line portion 120, the a-side electrode 1171 and the B-side electrode 1172 of all the atomizing units 11 are collected together, and are connected by a standard FPC connector and a driving circuit at the collecting position, which has the advantage of convenient assembly and disassembly.

The surface of the area outside the plane electric joint position of the conductive adhesive tape and the B-surface electrode is coated with an insulating layer.

The insulating layer is insulating oil, and the expandable microgrid atomizing assembly 10 in the present application includes a first cover film 111, a first adhesive film 112, a second cover film 113, a second adhesive film 114, a conductive sheet 115, a conductive adhesive film 116, a piezoelectric ceramic 117, a conductive adhesive tape, and insulating oil, which are sequentially attached from top to bottom.

The plurality of atomizing units 11 are distributed in an array, and the plurality of atomizing units 11 are distributed in a single-row or multi-row.

The FPC flexible line carrier plate arranging part 120 is used for routing arrangement of the first conducting wires 1173 and the second conducting wires 1174, higher expansibility is allowed, the array arrangement mode can be adjusted randomly under the condition that routing is allowed, furthermore, the double-sided FPC flexible line carrier plate arranging part 120 can be used for routing, and therefore the requirement of the routing on the space of the FPC flexible line carrier plate 100 is smaller; meanwhile, the length of the connecting line between the FPC flexible circuit carrier 100 and the driving circuit is allowed to be changed at will, and the application range is wide.

The array mode of atomizing unit 11 is unrestricted, can also can adopt multiseriate mode in single-column mode, simultaneously can also establish ties a plurality of A face electrodes 1171 of a plurality of atomizing units 11 according to drive circuit's adaptation, establish ties a plurality of B face electrodes 1172 of a plurality of atomizing units 11, can show like this and reduce the quantity of connecting the interface wire between atomizing subassembly 10 and the drive circuit, and simplify atomizing drive circuit's design by a wide margin, it only needs the high frequency alternating current boost circuit of a higher boost ratio to drive a plurality of atomizing units 11 of establishing ties, the cost of whole atomizer can be showing to reduce.

The expansibility of the atomizing assembly 10 is represented by the arbitrary flexibility of the number of the atomizing units 11, and simultaneously the expansibility of the arbitrary plurality of atomizing assemblies 10, so that the atomizer manufactured based on the design idea has the adjustability of arbitrary atomizing flow, only 1 standard connecting interface is used for connecting a single atomizing assembly 10 and a driving circuit, and the connection can be understood as a single wire, so that the assembly of the atomizer can be greatly simplified, meanwhile, the 1 standard interface can allow the electrical connection of more than 100 atomizing units 11 at most, and the 100 atomizing units 11 can bring about the atomizing flow of 0.5 liter/minute and can be regarded as 1 device, and the simultaneous operation of the plurality of atomizing assemblies 10 can realize the ultrahigh atomizing flow of 5 liters/minute under the electric power input of 1KW, thereby providing more application choices for the application of high atomizing flow.

The atomizing units 11 are provided with atomizing micropores 1111, the center of the conductive sheet 115 is provided with an etching region 1151, and the second cover film 113 corresponding to the center of the etching region 1151 is provided with a through hole 1131, the area of which is smaller than that of the etching region 1151; the first cover film 111 is provided with atomization holes 1111 at positions corresponding to the through holes 1131.

The first lead 1173 and the second lead 1174 are coated with insulating oil.

The material of the atomizing unit 11 must be resistant to the corrosion of chemical solvents, preferably organic polymer material is selected, and then higher atomizing flow rate is required, so that the application in the agricultural field is feasible, and the efficiency requirement of large-scale agriculture can be met only when the atomizing unit is used for spraying flying pesticide and fertilizer with higher atomizing flow rate; the micro-grid atomization system based on the micro-grid atomization technology has the advantages that the micro-grid atomization system based on the requirements is further improved and innovated, the problem of high flow and structural complexity is solved through the extensible micro-grid atomization assembly 10, the structure and the control design difficulty are greatly simplified under the condition that the number of micro-grid atomization is increased to bring larger spray flow, and finally the micro-grid atomization system based on the micro-grid atomization technology can have the advantages of energy conservation and high efficiency and can have extremely high atomization flow.

The application provides an atomizing of scalable microgrid atomization component 10 is efficient: the atomization assembly 10 has ultrahigh atomization efficiency, each atomization unit 11 works independently, and therefore the atomization assembly 10 also has excellent fault tolerance, the atomization assembly 10 does not work due to the fault of a single atomization unit 11, redundant design is made under the allowed condition, and the plurality of atomization units 11 are allowed to be damaged without affecting the overall working performance of the atomization assembly 10; after the plurality of atomization units 11 are connected in series, the design of a driving circuit can be simplified, the efficiency of a boosting ratio booster circuit with reasonable design can be further improved, and the overall power conversion loss of the plurality of booster circuits is smaller; the microgrid atomization technology shows higher atomization efficiency under the condition of lower requirement of droplet diameter, for example, the diameter of the droplets is 10-20 microns, the expandable microgrid atomization component 10 provided by the application has the atomization efficiency and flow rate which cannot be compared with any atomization technology, and the atomization efficiency and flow rate can reach 3-5 ml/min/each atomization unit 11.

The scalable microgrid atomizing component 10 provided by the application has strong atomizing flow scalability: the design of this atomizing subassembly 10 possesses the atomizing flow that can expand the adjustment wantonly, through changing the quantity of atomizing unit 11, the spraying rate of atomizing subassembly 10 can be adjusted wantonly in the unit of 0.005 liter/minute, can also independently control every atomizing unit 11 under necessary circumstances, and atomizing subassembly 10 has high space efficiency, this application adopts atomizing subassembly 10 that 4 rows 5 column arrays arrange its atomizing part length width is only 110mmX88mm, and present size can also be carried out the reduction after optimizing.

The extensible micro-grid atomization assembly 10 is simple in structure and small in occupied area.

A nebulizer comprises an expandable microgrid nebulizer assembly 10, a reservoir 20 for containing a liquid to be nebulized, and a base 30, the expandable microgrid nebulizer assembly 10 being located between the reservoir 20 and the base 30.

A plurality of first outlets 21 are formed in the liquid storage tank 20, and the plurality of first outlets 21 correspond to the plurality of atomizing units 11 one by one; the base 30 is provided with a plurality of second outlets 31, and the plurality of second outlets 31 correspond to the plurality of atomizing units 11 one by one.

A first sealing ring 22 is arranged between the first outlet hole 21 and the upper surface of the atomizing unit 11, and a second sealing ring 32 is arranged between the lower surface of the atomizing unit 11 and the second outlet hole 31.

The connector 1175 of the atomizer is connected to an atomization driver with multi-path driving capability to form an atomization module, the module has extremely high atomization flow and extremely low electric input power, and the atomization flow of 0.1 liter/minute can be realized only by the input power of 20W; the first sealing rings 22 used for sealing in the atomizing module can be integrally connected instead of independent annular rubber rings, and the second sealing rings 32 can also be integrally connected; consequently this atomizer adopts a multichannel atomizing circuit to realize the atomizer work that spare part is few, and atomizer overall structure is simple, has simplified the multichannel atomizer design based on the atomizing of microgrid by a wide margin, possess very big flexibility and scalability simultaneously, can also reduce atomizing driver's volume and weight by a wide margin under the condition of using 11 series connections of many atomizing units, and this kind of optimal design is significant when using in aviation pesticide spraying field.

The manufacturing process of the expandable microgrid atomizing assembly 10 comprises the following steps:

s1: preparing an FPC flexible circuit carrier 100 having a plurality of slots 130; the FPC flexible circuit carrier 100 comprises an FPC flexible circuit carrier line arranging part 120 and a plurality of FPC flexible circuit carrier attaching parts 110 which are integrally connected;

the slot 130 is a conventional process in the FPC manufacturing process; the key point is that the groove 130 is formed at each position of the atomizing unit 11 to prevent energy loss, and the FPC flexible circuit carrier board line arranging part 120 connected at the interval of the groove 130 is connected with the atomizing unit 11, so that the connection not only can physically prevent the atomizing unit 11 from falling off, but also keeps the line connection of the A-surface electrode 1171 and the B-surface electrode 1172; the slot 130 is formed during the manufacturing process of the FPC flexible line carrier 100, and the remaining portion after the slot 130 plays a role of connection.

The grooves 130 are used for cutting off part of connection between the FPC flexible circuit carrier line arranging part 120 and the atomizing units 11, as the transmission of the oscillation waveform of the piezoelectric ceramics 117 is bidirectional, namely the oscillation waveform is transmitted to the central position to cause the first covering film 111 to oscillate, and is also transmitted to the outer side to cause the FPC flexible circuit carrier 100 to oscillate, a large amount of oscillation energy of the piezoelectric ceramics 117 can be consumed, so that the oscillation efficiency of the micro-taper hole is sharply reduced, in order to avoid the situation, the grooves 130 are required to be arranged on the FPC flexible circuit carrier line arranging part 120 to cut off most of connection between the atomizing units 11 and the FPC flexible circuit carrier line arranging part 120; the spacing position of the slot 130 is the connecting position between the atomizing unit 11 and the FPC flexible circuit carrier line arrangement portion 120, and the purpose of the connection is to fix the position of the atomizing unit 11, and at the same time, to serve as a suspension to buffer the oscillation of the atomizing unit 11, to avoid unnecessary resonance after the number of the atomizing units 11 is increased, and also to serve as the routing positions of the first conducting wire 1173 and the second conducting wire 1174, where the first conducting wire 1173 and the second conducting wire 1174 are both covered with insulating oil.

S2: etching the center of the conductive sheet 115 of the FPC flexible circuit carrier attaching parts 110 to form an etched area 1151, performing electroplating treatment on the exposed area of the conductive sheet 115 corresponding to the A-side electrode 1171, and exposing the second adhesive film 114 in the etched area 1151;

s3: forming a through hole 1131 by removing the second adhesive film 114 and the second cover film 113 in the etched region 1151;

the area of the through hole 1131 is smaller than that of the etching region 1151, the integrity of the plating layer is ensured in the process of removing the second adhesive film 114 and the second cover film 113 to form the through hole 1131, and the through hole 1131 is formed by adopting a stamping or laser cutting mode; the conductive sheet 115 needs to be plated; maintaining the integrity of the plating of the conductive sheet 115 when the conductive sheet 115 and the second adhesive film 114 are removed in S3; the exposed conducting strip 115 part needs to be plated with gold, the specific coating implementation mode is not required, and other material coatings can be adopted to improve the corrosion resistance of the material, so that the whole service life of the micro-grid atomizing sheet is prolonged.

S4: coating the first adhesive film 112 on the periphery of the through hole 1131 on the outer side surface of the second cover film 113;

avoiding glue coating in the area of the through hole 1131; the first adhesive film 112 in S3 is an organic polymer film; the first adhesive film 112 is an epoxy resin; the first adhesive film 112 meets the temperature use range requirement of-30 ℃ to 150 ℃ or above 150 ℃; the glue has conductivity, and the temperature application range meets minus 30 ℃ to 150 ℃ or above 150 ℃;

s5: attaching the first cover film 111 to the first adhesive film 112 entirely so that the first cover film 111 completely covers the through hole 1131 area;

s6: placing the conductive adhesive film 116 on the piezoelectric ceramic 117, and placing the product formed in S5 on the conductive adhesive film 116;

s7: the A-side electrode 1171 is electrically attached to the plane of the conducting strip 115, and the B-side electrode 1172 is electrically attached to the plane of the conducting layer 118; electrically connecting the conductive sheet 115 with the first conductive line 1173, and electrically connecting the conductive layer 118 with the second conductive line 1174;

the electrode 1171 on the A surface is electrically attached to the plane of the conducting strip 115, and the electrode 1172 on the B surface is electrically attached to the plane of the conducting tape; the first wire 1173 is electrically connected to the conductive plate 115, and the second wire 1174 is electrically connected to the conductive tape; the conductive layer 118 is bonded to the entire surface of the B-side electrode 1172, that is, the conductive adhesive tape is bonded to the entire surface of the B-side electrode 1172, so that the entire surface of the B-side electrode 1172 of the piezoelectric ceramic 117 is covered, and if necessary, point contact can be adopted, but the entire surface covering can also protect the B-side electrode 1172 of the piezoelectric ceramic 117, so that the B-side electrode 1172 is prevented from oxidation reaction, the service life of the microgrid atomizing patch is greatly prolonged, and therefore, the B-side electrode 1172 of the piezoelectric ceramic 117 is preferably connected in an entire surface covering manner.

The micro-grid atomizing sheet manufactured by the traditional process needs to adopt a welding mode to electrically connect the second lead 1174 with the B-surface electrode 1172 of the piezoelectric ceramic 117, the A-surface electrode 1171 is electrically attached to the plane of the conducting sheet 115, and the B-surface electrode 1172 is electrically attached to the plane of the conducting layer 118; the first conductive line 1173 is electrically connected to the conductive plate 115, and the second conductive line 1174 is electrically connected to the conductive layer 118; a first lead 1173 and a second lead 1174 are respectively led out from the A-surface electrode 1171 and the B-surface electrode 1172 of the piezoelectric ceramic 117 in a corresponding mode by adopting a fitting mode, the second lead 1174 is prevented from being directly welded on the B-surface electrode 1172 of the piezoelectric ceramic 117, the surface flatness of the piezoelectric ceramic 117 is ensured, the piezoelectric ceramic 117 cannot be damaged by using the fitting mode, the damage of welding to the piezoelectric ceramic 117 is avoided, and the micro-grid atomization sheet does not need to avoid welding spots in structural design.

S8: the plurality of atomization units 11 are correspondingly provided with a plurality of first conducting wires 1173 and a plurality of second conducting wires 1174, the plurality of first conducting wires 1173 are distributed on the FPC flexible circuit carrier board line arranging part 120 in parallel or in series, and the plurality of second conducting wires 1174 are distributed on the FPC flexible circuit carrier board line arranging part 120 in parallel or in series; the ends of the first leads 1173 and the ends of the second leads 1174 are converged to form a connecting head 1175;

s9: putting the product formed in the step S8 into a press machine for pressing, wherein a protrusion 119 facing one side of the conductive adhesive film 116 is formed at the center position of the first cover film 111, the first adhesive film 112, the second cover film 113, the second adhesive film 114 and the conductive sheet 115 of each atomizing unit 11;

the protrusions 119 of the conductive sheet 115 can provide better supporting function, and the first cover film 111 and the second cover film 113 are prevented from springing back; the height of the protrusions 119 is about 0.5 times the total thickness of the micro mesh nebulizing patch.

Specifically, placing a silica gel gasket on the upper side and the lower side of the product obtained in the step S8, then placing the product into a press machine, heating the press machine to 80-150 ℃ at the same time under the pressure of 6-15 MPa to press the product, and continuing for 100-300 seconds; the protrusions 119 impart surface tension to the first cover film 111 and the second cover film 113, so that resonance efficiency is effectively improved, thereby improving resonance uniformity.

A bulge 119 is formed in the middle of the micro-grid atomizing sheet after hot pressing under the action of extrusion force, the height of the bulge 119 is about 0.5 time of the total thickness of the micro-grid atomizing sheet, the bulge 119 deforms and stretches the PI film, so that the self elastic modulus of the PI film is consumed due to over-stretching, at the moment, the ultrasonic wave of the piezoelectric ceramic 117 forms a surface tension wave with a sine wave shape on the surface of the film, the wave length of the wave shape is equal to the transmission speed of the ultrasonic wave in the PI material divided by the oscillation frequency of the piezoelectric ceramic 117, and the amplitude is 1/2 of the wave length, so that the resonance efficiency is improved; the coupling state of the PI film plane without the shape is loose, the energy of ultrasonic waves can be consumed and converted into heat because of the elastic modulus of the PI film, so that the energy of the ultrasonic waves is not effectively utilized, only a few redundant energy exceeding the deformation energy of the elastic modulus can form surface tension waves, the amplitude of the waveform is extremely low, the atomizing holes cannot effectively compress liquid, even tension waves can not be generated on the PI film of the micro-grid atomizing sheet at the discrete error part, namely the waveform of ultrasonic vibration is completely converted into heat by the elastic modulus of the PI film, finally, defective products are generated, and therefore extrusion filling of the silica gel gasket in the hot pressing process is very important for shaping of the conducting sheet 115 and the PI film.

S10: atomizing micropores 1111 are formed in the first cover film 111 of the atomizing units 11 of the product well pressed in the step S9;

The through hole 1131 is formed by removing the second adhesive film 114 and the second cover film 113 at the central position of the etching area 1151, the through hole 1131 area of the second cover film 113 is no longer attached to the second adhesive film 114, the first cover film 111 and the second cover film 113 are independent, and no material is in contact with the first adhesive film 112 and the second adhesive film 114 in the through hole 1131 areas of the piezoelectric ceramic 117, the conductive adhesive film 116 and the conductive sheet 115, so that liquid is not in contact with any material except the material of the first cover film 111, and the defect of surface roughness of the micro-grid atomization sheet can be improved by the added first cover film 111.

In S10, the first cover films 111 of the plurality of atomizing units 11 respectively atomize the micropores 1111 one by one.

The plurality of slots 130 in S1 are located outside the FPC flexible circuit carrier attaching portion 110.

In S10, the atomization micropores 1111 are in a tapered structure, the aperture of the atomization micropores 1111 decreases gradually from the first cover film 111 to the conductive layer 118, and the end of the atomization micropores 1111 with the smaller aperture faces the conductive sheet 115; the aperture of the atomization micropores 1111 is in micron order.

The S9 medium-pressure conditions: the press is heated to 80-150 ℃ at the same time under the pressure of 6-15 MPa to press the product, and the pressing lasts for 100-300 seconds.

The use method and the principle of the expandable micro-grid atomization assembly are as follows:

the piezoelectric ceramic is provided with an A-surface electrode and a B-surface electrode, the A-surface electrode is electrically jointed with the plane of the conducting sheet, and the B-surface electrode is electrically jointed with the plane of the conducting layer; the edge of the conducting sheet is electrically connected with a first conducting wire, and the edge of the conducting layer is electrically connected with a second conducting wire; the first conducting wire and the second conducting wire are distributed side by side; high-frequency alternating voltage is connected between an A-surface electrode and a B-surface electrode of the piezoelectric ceramic, the frequency and the peak value of the alternating voltage are adjusted according to the working performance of the piezoelectric ceramic, the piezoelectric ceramic is controlled by an external electric field to generate regular deformation consistent with the input frequency, and the conducting strip and the PI film are pressed into a whole, so that the deformation energy of the copper foil is concentrated on the PI film, a bulge is arranged at the circle center of the PI film, the processed micron-sized small holes 4 are all in the bulge area, the bulge area generates reciprocating motion consistent with the input frequency at the moment, the motion direction is vertical to the surface of the micro-mesh atomization sheet, the upper surface (the surface far away from the conducting strip) of the organic polymer film is contacted with liquid to be atomized, and the liquid is sprayed along the hole position under the condition of the extrusion of the organic polymer film; the liquid moves from the organic polymer film to the conducting strip, because the micron-sized pores are in a conical structure, the pore diameter of the atomization micropores is gradually reduced from the first covering film to the conducting layer, and the end with the small pore diameter of the atomization micropores faces the direction of the piezoelectric ceramics, the extrusion force applied to the liquid moving towards the lower surface (namely the surface close to the conducting strip) of the organic polymer film is larger, and the liquid is easier to pass through the micron-sized pores on the organic polymer film, so that water mist is formed; and a plurality of atomizing units are driven to work by adopting a multi-path atomizing circuit.

The design of the invention is characterized in that the atomization efficiency of the expandable micro-grid atomization assembly provided by the invention is high: the atomization assembly has ultrahigh atomization efficiency, each atomization unit works independently, and therefore the atomization assembly also has excellent fault tolerance rate, the atomization assembly does not work due to the fault of a single atomization unit, redundant design is made under the allowed condition, and the damage of a plurality of atomization units is allowed without influencing the overall working performance of the atomization assembly; after the plurality of atomization units are connected in series, the design of a driving circuit can be simplified, the efficiency of a boosting ratio booster circuit with reasonable design can be further improved, and the overall power conversion loss of the plurality of booster circuits is smaller; the micro-mesh atomization technology shows higher atomization efficiency under the condition of lower requirement on droplet diameter; the extensible microgrid atomizing component provided by the application has atomizing efficiency and flow which cannot be compared with any atomizing technology; the application provides an atomizing flow scalability of scalable microgrid atomization component is strong: the design of the atomization assembly has the atomization flow which can be expanded and adjusted at will, and the atomization rate of the atomization assembly can be adjusted at will by changing the number of the atomization units; the application provides an extensible microgrid atomization component structure is retrencied, and area occupied is few.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.

Claims

1. An expandable microgrid atomizing assembly is characterized in that; the flexible printed circuit board comprises a plurality of atomization units, wherein each atomization unit comprises a first cover film, an FPC flexible circuit carrier board attaching part, piezoelectric ceramics and a conductive layer which are distributed from top to bottom, and the FPC flexible circuit carrier board attaching parts of the atomization units are integrally connected with an FPC flexible circuit carrier board arranging part; the FPC flexible circuit carrier plate line arranging part and the FPC flexible circuit carrier plate attaching parts are integrally connected to form an FPC flexible circuit carrier plate; the piezoelectric ceramic is electrically connected with a first lead and a second lead, the first lead and the second lead are uniformly distributed on a line arranging part of the FPC flexible circuit carrier, the plurality of atomization units correspond to the plurality of first leads and the plurality of second leads, and the end parts of the plurality of first leads and the end parts of the plurality of second leads are converged to form a connector.

2. The expandable microgrid misting assembly of claim 1, wherein; a plurality of slots for reducing vibration energy consumption are arranged on the outer circumference of each atomization unit at intervals, and are located on the outer side of the attaching portion of the FPC flexible circuit carrier plate.

3. The scalable microgrid misting assembly of claim 2, wherein the first and second movable plates are movable relative to each other; the plurality of slots are arc-shaped and are evenly arranged on the FPC flexible circuit carrier plate line arranging part outside the FPC flexible circuit carrier plate attaching part at intervals.

4. The expandable microgrid misting assembly of claim 1, wherein; the plurality of first conducting wires are distributed on the flexible circuit carrier plate line arranging part in parallel or in series, and the plurality of second conducting wires are distributed on the flexible circuit carrier plate line arranging part in parallel or in series.

5. The scalable microgrid misting assembly of claim 1, wherein the first and second sets of misting members are configured to be selectively activated; the FPC flexible circuit carrier plate comprises a second cover film, a second adhesive film and a conducting strip which are sequentially attached from top to bottom, wherein a first adhesive film is attached between the first cover film and the second cover film, and a conductive adhesive film is attached between the conducting strip and piezoelectric ceramic.

6. The expandable microgrid misting assembly of claim 5, wherein; the piezoelectric ceramic is provided with an A-surface electrode and a B-surface electrode, the A-surface electrode is electrically attached to the plane of the conducting sheet, and the B-surface electrode is electrically attached to the plane of the conducting layer; the conducting plate is electrically connected with the first conducting wire, and the conducting layer is electrically connected with the second conducting wire.

7. The expandable microgrid misting assembly of claim 6, wherein the first end of the first string is connected to the first end of the second string; the conducting layer is a conducting adhesive tape, the edge of the conducting adhesive tape integrally extends to form a connecting part, and the connecting part is electrically connected with the second lead.

8. The expandable microgrid misting assembly of claim 7, wherein; and the surface of an area outside the plane electric joint position of the conductive adhesive tape and the B-surface electrode is coated with an insulating layer.

9. The expandable microgrid misting assembly of claim 1, wherein; the plurality of atomization units are distributed in a single row or in multiple rows.

10. The expandable microgrid misting assembly of claim 1, wherein; and the first lead and the second lead are coated with insulating oil.

11. An atomizer, characterized in that; the scalable microgrid atomizing assembly of any one of claims 1-10 and a reservoir and a base for holding a liquid to be atomized, the scalable microgrid atomizing assembly being located between the reservoir and the base.

12. A nebulizer as claimed in claim 11, wherein; the liquid storage tank is provided with a plurality of first outlets which correspond to the atomizing units one by one; a plurality of second outlets are formed in the base and correspond to the atomizing units one by one.

13. A nebulizer as claimed in claim 12, wherein; a first sealing ring is arranged between the first outlet hole and the upper surface of the atomization unit, and a second sealing ring is arranged between the lower surface of the atomization unit and the second outlet hole.

14. A process for manufacturing the expandable microgrid misting assembly of any one of claims 1 to 10, wherein the first and second sets of misting elements are arranged in a staggered pattern; the method comprises the following steps:

s5: integrally attaching the first cover film to the first adhesive film so that the first cover film completely covers the through hole area;

s7: electrically attaching the electrode on the surface A to the plane of the conducting sheet, and electrically attaching the electrode on the surface B to the plane of the conducting layer; the conducting sheet is electrically connected with the first conducting wire, and the conducting layer is electrically connected with the second conducting wire;

s8: the plurality of atomization units are correspondingly provided with a plurality of first conducting wires and a plurality of second conducting wires, the plurality of first conducting wires are distributed on the flexible circuit carrier plate line part of the FPC in parallel or in series, and the plurality of second conducting wires are distributed on the flexible circuit carrier plate line part of the FPC in parallel or in series; the end parts of the plurality of first wires and the end parts of the plurality of second wires are converged to form a connector;

15. The process of making the expandable microgrid misting assembly of claim 14, wherein the first and second electrodes are electrically connected; and in the S10, the first covering films of the plurality of atomizing units are respectively provided with atomizing micropores one by one.

16. The process of making the expandable microgrid misting assembly of claim 14, wherein the first and second electrodes are electrically connected; and in the S1, a plurality of slots are positioned outside the attaching part of the FPC flexible circuit carrier plate.