CN112246517A - Microporous atomizing tablet and ultrasonic atomizing device - Google Patents
Microporous atomizing tablet and ultrasonic atomizing device Download PDFInfo
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- CN112246517A CN112246517A CN202011133294.7A CN202011133294A CN112246517A CN 112246517 A CN112246517 A CN 112246517A CN 202011133294 A CN202011133294 A CN 202011133294A CN 112246517 A CN112246517 A CN 112246517A
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- 239000000919 ceramic Substances 0.000 claims abstract description 86
- 238000000889 atomisation Methods 0.000 claims abstract description 49
- 239000010410 layer Substances 0.000 claims description 172
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004887 air purification Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000222 aromatherapy Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
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- 238000002207 thermal evaporation Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
- B05B17/0646—Vibrating plates, i.e. plates being directly subjected to the vibrations, e.g. having a piezoelectric transducer attached thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0653—Details
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- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Special Spraying Apparatus (AREA)
Abstract
The invention provides a microporous atomization sheet and an ultrasonic atomization device, comprising: piezoelectric ceramic plates; the first conducting layer is stacked with the piezoelectric ceramic piece and is positioned on the first side of the piezoelectric ceramic piece; the second conducting layer is stacked with the piezoelectric ceramic piece and is positioned on the second side of the piezoelectric ceramic piece, which is far away from the first conducting layer; the first conducting layer extends to the second side of the piezoelectric ceramic piece along the side wall of the piezoelectric ceramic piece, so that the part of the first conducting layer on the second side is used for abutting against the first elastic pin, and the second conducting layer on the second side is used for abutting against the second elastic pin; wherein, the first conducting layer or the second conducting layer is provided with atomization holes. Therefore, the aim that the atomizing plate is easy to assemble and disassemble so as to be convenient for self replacement is fulfilled.
Description
Technical Field
The invention relates to the technical field of atomization, in particular to a microporous atomization sheet and an ultrasonic atomization device.
Background
The micropore atomization sheet comprises piezoelectric ceramic and a metal micropore diaphragm, the metal micropore diaphragm is driven to resonate by high-frequency vibration of the piezoelectric ceramic, and the metal micropore continuously and repeatedly deforms along with vibration to extrude and break solution into fine droplets to form atomized steam. It has wide application in various fields such as household humidification, aromatherapy beauty treatment, surface spraying, air purification, medical appliances and the like. When the existing micropore atomization sheet is electrically connected, generally, one electrode is formed on piezoelectric ceramics, the other electrode is formed on a metal membrane, two leads are respectively welded on the two electrodes, and voltage is applied through the two leads to enable the piezoelectric ceramics to generate vibration. In the micropore atomization piece of welding lead wire, the lead wire is the lug connection on the electrode for lead wire and electrode junction break easily, and need the manual work earlier with the lead wire welding on the electrode when batch production, difficult equipment, the atomization piece can't directly be demolishd, thereby makes the unable self-service change of user.
Disclosure of Invention
The invention provides a microporous atomization sheet and an ultrasonic atomization device, which are easy to assemble and disassemble and convenient to replace by oneself.
In order to solve the above technical problems, a first technical solution provided by the present invention is: there is provided a microporous atomizing sheet comprising: piezoelectric ceramic plates; the first conducting layer is stacked with the piezoelectric ceramic piece and is positioned on the first side of the piezoelectric ceramic piece; the second conducting layer is stacked with the piezoelectric ceramic piece and is positioned on the second side of the piezoelectric ceramic piece, which is far away from the first conducting layer; the first conducting layer extends to the second side of the piezoelectric ceramic piece along the side wall of the piezoelectric ceramic piece, so that the part of the first conducting layer on the second side is used for abutting against the first elastic pin, and the second conducting layer on the second side is used for abutting against the second elastic pin; wherein, the first conducting layer or the second conducting layer is provided with atomization holes.
The first conductive layer comprises a main body part and an extension part; the extension part is connected with the main body part and extends to the second side along the side wall of the piezoelectric ceramic piece, and the extension part is used for abutting against the first elastic needle.
Wherein, extension and main part integrated into one piece, extension include parcel portion and butt portion, and parcel portion connects the main part to the partial lateral wall of parcel piezoceramics piece, butt portion connection parcel portion just sets up in the second side, and butt portion is used for the first bullet needle of butt.
The second conducting layer is provided with an opening at the position corresponding to the abutting part, and the abutting part is attached to the partial surface of the piezoelectric ceramic piece exposed through the opening and is insulated from the second conducting layer.
The first conducting layer is provided with an atomizing hole, and the atomizing hole is located at the position, corresponding to the central through hole of the piezoelectric ceramic piece, of the main body part.
Wherein, the second conducting layer is provided with atomization holes.
Wherein the first conductive layer is formed by coating or deposition.
Wherein the thickness of the first conducting layer is 0.05 mm-0.1 mm; the surface of the butting part far away from the piezoelectric ceramic piece is further provided with a metal sheet, and the metal sheet is used for butting the first elastic needle.
The extension part is an element independent from the main body part, the extension part comprises a bonding part, a wrapping part and an abutting part, the bonding part is electrically connected to the surface of the main body part, the wrapping part wraps part of the side wall of the piezoelectric ceramic piece, the abutting part is arranged on the second side, and the abutting part is insulated from the second conducting layer.
Wherein, the second conducting layer is provided with atomizing holes, and the main body part of the first conducting layer is formed by coating or deposition; the second conducting layer is provided with an opening at the position corresponding to the abutting part, and the abutting part is attached to the partial surface of the piezoelectric ceramic piece exposed through the opening.
Wherein, the second conducting layer is provided with atomizing holes, and the main body part of the first conducting layer is formed by coating or deposition; the extension part is a flexible circuit board, two ends of the flexible circuit board are bent towards the same side, one end of the flexible circuit board is electrically connected with the main body part as the attaching part, and the other end of the flexible circuit board is fixed on the surface of the second conducting layer away from the piezoelectric ceramic piece as the abutting part.
Wherein, the thickness of the first conducting layer is 0.1 mm-0.5 mm.
Wherein, micropore atomizing piece still includes: the first adhesive layer is positioned between the first conducting layer and the piezoelectric ceramic piece so as to adhere the first conducting layer and the piezoelectric ceramic piece; and the second adhesive layer is positioned between the second conducting layer and the piezoelectric ceramic piece so as to bond the second conducting layer and the piezoelectric ceramic piece.
And the edge position of the first conducting layer or the second conducting layer is provided with a positioning part.
In order to solve the above technical problems, a second technical solution provided by the present invention is: providing an ultrasonic atomization device, wherein the ultrasonic atomization device comprises a micropore atomization sheet and a power supply assembly; the power supply module includes: the power supply, and a first elastic needle and a second elastic needle which are connected with the power supply; the microporous atomization sheet of any one of the above, wherein the first conductive layer of the microporous atomization sheet abuts the first pogo pin on the second side, and the second conductive layer abuts the second pogo pin on the second side.
The invention has the beneficial effects that the atomization plate is different from the prior art, the first conducting layer extends to the second side of the piezoelectric ceramic plate along the side wall of the piezoelectric ceramic plate, so that the first conducting layer is used for abutting against the first elastic needle at the second side, and the second conducting layer is used for abutting against the second elastic needle at the second side, so that the atomization plate is easy to assemble and easy to disassemble so as to be replaced by a user.
Drawings
FIG. 1 is a schematic structural diagram of a microporous atomizing sheet according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of a first embodiment of the microporous atomizing sheet shown in FIG. 1;
FIG. 3 is a schematic structural view of a second embodiment of the microporous atomizing sheet shown in FIG. 1;
FIG. 4 is a schematic structural view of a third embodiment of the microporous atomizing sheet shown in FIG. 1;
FIG. 5 is a schematic structural view of a fourth embodiment of the microporous atomizing sheet shown in FIG. 1;
FIG. 6 is a schematic structural view of a fifth embodiment of the microporous atomizing sheet shown in FIG. 1;
fig. 7 is a schematic structural diagram of an ultrasonic atomizing device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first", "second" and "third" in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. All directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly. The terms "comprising" and "having" and any variations thereof in embodiments of the present invention are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Please refer to fig. 1, which is a schematic structural diagram of the microporous atomizing sheet of the present invention. Wherein, the micropore atomization sheet 100 comprises a piezoelectric ceramic sheet 10, and when the micropore atomization sheet 100 is used for atomization, voltage needs to be applied to two surfaces of the piezoelectric ceramic sheet 10 by using an electrode, so that the micropore atomization sheet vibrates, and the atomization substrate is atomized.
Specifically, please refer to fig. 2, which is a schematic structural diagram of the microporous atomization sheet shown in fig. 1 according to the first embodiment. The microporous atomization sheet 100 includes a piezoelectric ceramic sheet 10, a first conductive layer 12, and a second conductive layer 11. The first conductive layer 12 is stacked with the piezoelectric ceramic plate 10 and located on a first side of the piezoelectric ceramic plate 10. The second conductive layer 11 is stacked with the piezoelectric ceramic plate 10 and located on a second side of the piezoelectric ceramic plate 10 away from the first conductive layer 12. In order to atomize the atomizing substrate, the first conductive layer 12 or the second conductive layer 11 has atomizing holes. This embodiment will be described by taking an example in which the second conductive layer 11 has an atomization hole. Specifically, in order to apply a voltage to both surfaces of the piezoelectric ceramic sheet 10 to cause the piezoelectric ceramic sheet to vibrate, conductive electrodes need to be provided for the first conductive layer 12 and the second conductive layer 11 on both sides of the piezoelectric ceramic sheet 10. In this embodiment, the first conductive layer 12 extends to the second side of the piezoelectric ceramic plate 10 (i.e., the side where the second conductive layer 11 is located) along the sidewall of the piezoelectric ceramic plate 10, so that the portion of the first conductive layer 12 located at the second side of the piezoelectric ceramic plate 10 is used for abutting against the first pogo pin, the second conductive layer 11 is directly used for abutting against the second pogo pin at the second side of the piezoelectric ceramic plate 10, the first pogo pin and the second pogo pin are both disposed at the second side of the piezoelectric ceramic plate 10 and electrically connected to the power supply, and the power supply applies voltage to the first conductive layer 12 and the second conductive layer 11 through the first pogo pin and the second pogo pin.
Specifically, in an embodiment, the piezoelectric ceramic plate 10 is circular, as shown in fig. 2, in another embodiment, the piezoelectric ceramic plate 10 may also be square, trapezoid, etc., and it should be noted that, regardless of the shape of the piezoelectric ceramic plate 10, the center thereof has a position of the annular through hole where the atomization hole is exposed. The present application will be described by taking the piezoelectric ceramic sheet 10 as a circular shape. The first conductive layer 12 includes a body portion 121 and an extension portion 122. The extension portion 122 is connected to the main body portion 121 and extends to the second side of the piezoceramic wafer 10 along the sidewall of the piezoceramic wafer 10, and the extension portion 122 is used for abutting against the first pogo pin. Further, the extension portion 122 includes a wrapping portion 123 and an abutting portion 124, the wrapping portion 123 is connected to the main body portion 121 and wraps a part of the side wall of the piezoelectric ceramic plate 10, the abutting portion 124 is connected to the wrapping portion 123 and disposed on the second side of the piezoelectric ceramic plate 10, and the abutting portion 124 is used for abutting against the first pogo pin. In this embodiment, the second conductive layer 11 serves as a carrier of the atomization holes, and thus the main body portion 121 of the first conductive layer 12 has a circular ring shape. In one embodiment, the main portion 121 of the first conductive layer 12 completely coincides with the projection of the piezoceramic sheet 10 in the vertical direction. That is, the body 121 of the first conductive layer 12 and the piezoelectric ceramic sheet 10 have the same shape and size and are completely overlapped. It is understood that the size of the main body 121 of the first conductive layer 12 may also be slightly smaller or larger than the size of the piezoceramic sheet 10, for example, the inner diameter of the main body 121 of the first conductive layer 12 is larger than the inner diameter of the piezoceramic sheet 10, and the outer diameter is smaller or equal to the outer diameter of the piezoceramic sheet 10; or the inner diameter of the main body part 121 of the first conductive layer 12 is smaller than or equal to the inner diameter of the piezoceramic sheet 10, and the outer diameter is smaller than the outer diameter of the piezoceramic sheet 10. The shapes of the wrapping portion 123 and the abutting portion 124 are not limited, and may be designed as necessary.
In one embodiment, the extension portion 122 of the first conductive layer 12 is integrally formed with the main body portion 121, and may be a self-supporting metal layer, such as a metal layer formed by a sheet metal process, and the metal may be a conductive material such as copper, aluminum alloy, stainless steel, and the like. The self-supporting property means that the metal layer may be separated from the support and exist independently, or may be detached from the support to be distinguished from the metal layer formed by the plating process. Specifically, the extension portion 122 and the main body portion 121 of the first conductive layer 12 are copper foils. In order to prevent the first conductive layer from being worn and broken during the voltage application process, the thickness of the first conductive layer 12 is 0.1-0.5 mm. Specifically, the thickness of the extension portion 122 and the thickness of the main body portion 121 are both 0.1-0.5 mm.
In an embodiment, the second conductive layer 11 has an opening 111 at a position corresponding to the abutting portion 124, and the abutting portion 124 is attached to a portion of the surface of the piezoelectric ceramic plate 10 exposed through the opening 111 and insulated from the second conductive layer 11. Specifically, as shown in fig. 2, the extension portion 122 is used to lead the electrode on the upper surface of the piezoceramic sheet 10 (i.e. the main portion 121 of the first conductive layer 12) to one side of the second conductive layer 11, so as to facilitate installation with a power supply. Specifically, the outline of the opening 111 may be any shape, such as rectangular, arc, trapezoid, and the like. The opening 111 may be an arc-shaped notch or a through hole at the edge of the second conductive layer 11. Preferably, the opening 111 is an arc notch located at the edge of the second conductive layer 11, and has a shape corresponding to the abutting portion 124 and a size larger than that of the abutting portion 124, so that the area of the opening 111 can be reduced when the pogo pin is abutted, and the imbalance of the first conductive layer 12 during vibration can be reduced. The abutting portion 124 and the second conductive layer 11 may be directly insulated from each other by another method, for example, an insulating layer may be provided between the abutting portion 124 and the second conductive layer 11.
In one embodiment, the thickness of the second conductive layer 11 is 0.1 to 0.5mm, which is the same as the thickness of the first conductive layer 12, and the material of the second conductive layer 11 is the same as the material of the first conductive layer 12, such as copper, aluminum alloy, stainless steel, and other conductive materials.
Specifically, in this embodiment, since the first pogo pin and the second pogo pin connection position are both located on one side of the second conductive layer 11, in this embodiment, the second conductive layer 11 is provided with the positioning portion 113 by staggering the edge positions of the first pogo pin and the second pogo pin, so as to ensure that the first pogo pin abuts against the abutting portion 124 of the first conductive layer 12, and the second pogo pin abuts against the second conductive layer 11. Specifically, in an embodiment, the positioning portion 113 is a protrusion or a groove.
Further, since the first conductive layer 12 and the second conductive layer 11 of the present application have self-supporting properties, they need to be fixed on the first side and the second side of the piezoceramic sheet 10, and in a specific embodiment, they may be welded by means of welding, or they may be adhered by using an adhesive glue. Thus, as shown in fig. 2, the microporous atomization sheet 100 further includes: a first adhesive layer 13 and a second adhesive layer 14, wherein the first adhesive layer 13 is located between the first conductive layer 12 and the piezoceramic sheet 10 to bond the first conductive layer 12 and the piezoceramic sheet 10. The second adhesive layer 14 is located between the second conductive layer 11 and the piezoceramic sheet 10 to bond the second conductive layer 11 and the piezoceramic sheet 10. It is understood that first adhesive layer 13 and second adhesive layer 14 are both circular in shape. As shown in fig. 2, second adhesive layer 14 also has a corresponding opening at a location corresponding to opening 111. Both the first adhesive layer 13 and the second adhesive layer 14 are conductive adhesives.
In this embodiment, the second conductive layer 11 has an atomizing hole 112, specifically, the second conductive layer 11 is in a shape of a circular disc and covers the central through hole of the piezoelectric ceramic sheet 10, and the atomizing hole 112 is located in a portion of the second conductive layer 11 corresponding to the central through hole of the piezoelectric ceramic sheet 10, specifically as shown in fig. 2, that is, the atomizing hole 112 is exposed by the piezoelectric ceramic sheet 10. The atomization holes 112 may be one or any combination of conical, rectangular, circular. In one embodiment, the atomization holes 112 are tapered.
In another embodiment, please refer to fig. 3 specifically, which is a schematic structural diagram of a microporous atomization sheet shown in fig. 1 according to a second embodiment. The second conductive layer 11 has a protrusion 114 corresponding to the central through hole of the piezoceramic sheet 10, and the atomization holes 112 are distributed on the protrusion 114. The protrusion 114 is one or any combination of a spherical surface shape and a trapezoid shape. It should be noted that the direction of projection of the projections 114 is preferably the direction of flow of the aerosolized matrix.
Fig. 4 is a schematic structural diagram of a microporous atomization sheet shown in fig. 1 according to a third embodiment. In this embodiment, the main portion 121 and the extension portion 122 of the first conductive layer 12 are integrally formed. Compared with the second embodiment shown in fig. 3, the difference is that in this embodiment, the first conductive layer 12 is directly formed on the surface of the piezoceramic sheet 10 by deposition or coating. For example, in the present embodiment, the first conductive layer 12 is a metal layer formed on the surface of the piezoelectric ceramic plate 10 by silver spraying, screen printing, electroplating, thermal deposition, chemical vapor deposition, sputtering, and the like. In one embodiment, the material of the first conductive layer 12 is conductive silver paste.
Specifically, the thickness of the first conductive layer 12 is 0.05 to 0.1mm, and the main body portion 121 and the extension portion 122 of the first conductive layer 12 are integrally formed, that is, the thicknesses of the main body portion 121, the wrapping portion 123 and the abutting portion 124 are all 0.05 to 0.1mm, so that the abutting portion 124 is thin. In order to prevent the abutting portion 124 of the first conductive layer 12 from being worn by the pogo pin to cause a failure problem, a metal plate 15 is further provided on the surface of the abutting portion 124 away from the piezoceramic sheet 10, the metal plate 15 being used to abut against the first pogo pin. Specifically, the metal sheet 15 may be welded or fixed on the surface of the abutting portion 124 away from the piezoelectric ceramic sheet 10 by an adhesive, and the metal sheet 15 may be a copper sheet, an aluminum sheet, or the like, and has a thickness of 0.1 to 0.5 mm.
It should be noted that, since the first conductive layer 12 is directly deposited or coated on the piezoceramic sheet 10 in this embodiment, an adhesive layer is not required to be disposed between the first conductive layer 12 and the piezoceramic sheet 10, but only the third adhesive layer 16 is disposed between the second conductive layer 11 and the piezoceramic sheet 10, and the third adhesive layer 16 is used to bond the second conductive layer 11 and the piezoceramic sheet 10. The third adhesive layer 16 has the same structure as the second adhesive layer 14 shown in fig. 3, and detailed description thereof is omitted.
Fig. 5 is a schematic structural diagram of a microporous atomizing sheet according to a fourth embodiment of the present invention. Specifically, compared with the second embodiment shown in fig. 4, the difference is that in this embodiment, the main body portion 121 and the extension portion 122 of the first conductive layer 12 are independent elements. Specifically, the extension portion 122 includes a bonding portion 125, a wrapping portion 123 and an abutting portion 124, the bonding portion 125 is electrically connected to a surface of the main body portion 121 far away from the piezoelectric ceramic plate 10, the wrapping portion 123 wraps a portion of the side wall of the piezoelectric ceramic plate 10, and the abutting portion 124 is disposed on the second side of the piezoelectric ceramic plate 10.
The abutting portion 124 is insulated from the second conductive layer 11. In an embodiment, the shape of the abutting portion 124 corresponds to the shape of the opening 111, the abutting portion 124 is attached to a portion of the surface of the piezoelectric ceramic plate 10 exposed through the opening 111, and the abutting portion 124 and the second conductive layer 11 are disposed at an interval. In one embodiment, the extending portion 122 is a flexible circuit board, two ends of the flexible circuit board are bent toward the same side, the middle portion of the flexible circuit board is a wrapping portion 123, one end of the flexible circuit board is used as a bonding portion 125 and electrically connected to the main body portion 121, and the other end of the flexible circuit board is used as an abutting portion 124 and fixed on the surface of the second conductive layer 11 away from the piezoelectric ceramic plate 10. It is understood that the flexible wiring board is a wiring board having a conductive wiring layer and an insulating dielectric layer on one side. Specifically, the attaching portion 125 may be welded to the surface of the main body portion 121 by a welding method, and the attaching portion 124 may be adhered to the surface of the second conductive layer 11 away from the piezoelectric ceramic plate 10 by glue.
In another embodiment, the first conductive layer 12 may also be a self-supporting metal sheet bonded to the first side of the piezoceramic sheet by an adhesive layer, which is not limited herein.
Fig. 6 is a schematic structural diagram of a microporous atomization sheet shown in fig. 1 according to a fifth embodiment. Specifically, in the present embodiment, the conductive layer 11 serves as the first conductive layer 11, and the conductive layer 12 serves as the second conductive layer 12. Compared with the first embodiment shown in fig. 2, the difference is that: the first conductive layer 11 has an atomization hole 112 thereon, and includes a main body portion 121 and an extension portion 122. Specifically, the main body 121 of the first conductive layer 11 is circular, and the atomization hole 112 is located at a position of the main body 121 corresponding to the central through hole of the piezoceramic sheet 10. The extension portion 122 is correspondingly located on the first conductive layer 11, and specifically, the structure of the extension portion 122 is the same as that in fig. 2 to 5, which is not described herein again.
In this embodiment, the abutting portion 124 of the extension portion 122 on the second conductive layer 12 has an opening 111 so that the abutting portion 124 of the first conductive layer 11 is insulated from the second conductive layer 12.
In the microporous atomization sheet shown in the above embodiment of the present invention, the first conductive layer and the second conductive layer are disposed on two sides of the piezoelectric ceramic, and the first conductive layer extends to one side of the second conductive layer, so that the pogo pin abutting against the first conductive layer and the second conductive layer is disposed on one side of the second conductive layer, thereby achieving the purpose of easy assembly and convenient replacement of the atomization sheet, and avoiding the problem of easy breakage of the lead wire.
Fig. 7 is a schematic structural diagram of an ultrasonic atomizing device according to an embodiment of the present invention. The ultrasonic atomization device comprises a micropore atomization sheet 100 and a power supply assembly, wherein the power supply assembly comprises a power supply and a first elastic needle 71 and a second elastic needle 72 which are electrically connected with the power supply. The microporous atomization sheet 100 is the microporous atomization sheet 100 shown in any one of fig. 2 to 6, in which the abutting portion 124 of the first conductive layer 12 of the microporous atomization sheet 100 abuts against the first pogo pin 71 on the second side, and the second conductive layer 11 abuts against the second pogo pin 72 on the second side.
In the ultrasonic atomizing device according to the above embodiment of the present invention, the first conductive layer and the second conductive layer are disposed on two sides of the piezoelectric ceramic, and the first conductive layer extends to one side of the second conductive layer, so that the first conductive layer and the second conductive layer abut against the first pogo pin and the second pogo pin in the power supply on one side of the second conductive layer, thereby achieving the purpose of easy assembly and convenient replacement of the atomizing sheet, and avoiding the problem of easy breakage of the lead wire.
The specific structure of the power supply of the ultrasonic atomization device of this embodiment is the same as that of the power supply in the prior art, and is not described herein again.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (15)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011133294.7A CN112246517A (en) | 2020-10-21 | 2020-10-21 | Microporous atomizing tablet and ultrasonic atomizing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011133294.7A CN112246517A (en) | 2020-10-21 | 2020-10-21 | Microporous atomizing tablet and ultrasonic atomizing device |
Publications (1)
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| CN112246517A true CN112246517A (en) | 2021-01-22 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115534493A (en) * | 2022-10-20 | 2022-12-30 | 深圳市尚进电子科技有限公司 | Micro-grid atomizing sheet based on FPC (Flexible printed Circuit) flexible circuit board and manufacturing process thereof |
| WO2023116220A1 (en) * | 2021-12-23 | 2023-06-29 | 深圳摩尔雾化健康医疗科技有限公司 | Ultrasonic atomization assembly and ultrasonic atomization device |
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| CN110918357A (en) * | 2019-12-05 | 2020-03-27 | 湖南嘉业达电子有限公司 | Frequency-adaptive microporous atomization element and preparation method thereof |
| CN214234714U (en) * | 2020-10-21 | 2021-09-21 | 深圳麦克韦尔科技有限公司 | Microporous atomizing sheet and ultrasonic atomizing device |
| CN217165065U (en) * | 2022-01-20 | 2022-08-12 | 深圳摩尔雾化健康医疗科技有限公司 | Micropore atomization sheet and ultrasonic atomization device |
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| WO2023116220A1 (en) * | 2021-12-23 | 2023-06-29 | 深圳摩尔雾化健康医疗科技有限公司 | Ultrasonic atomization assembly and ultrasonic atomization device |
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