WO2023116220A1

WO2023116220A1 - Ultrasonic atomization assembly and ultrasonic atomization device

Info

Publication number: WO2023116220A1
Application number: PCT/CN2022/129352
Authority: WO
Inventors: 唐茗; 朱勇雄; 谢锡田
Original assignee: 深圳摩尔雾化健康医疗科技有限公司
Priority date: 2021-12-23
Filing date: 2022-11-02
Publication date: 2023-06-29
Also published as: CN217664227U

Abstract

An ultrasonic atomization device. The ultrasonic atomization device comprises a housing (10), an ultrasonic atomization assembly (20), and a power supply assembly (30). The ultrasonic atomization assembly (20) comprises a piezoelectric driving element (22), a metal substrate (23), and a flexible connecting member (201); the piezoelectric driving element (22) has a first through hole (221); the metal substrate (23) and the piezoelectric driving element (22) are stacked; a micropore area (231) is provided at the position on the metal substrate (23) corresponding to the first through hole (221); and the flexible connecting member (201) is stacked on the surface of the piezoelectric driving element (22) facing away from the metal substrate (23) and/or the surface of the metal substrate (23) facing away from the piezoelectric driving element (22), and is used for electrically connecting to the piezoelectric driving element (22) and/or the metal substrate (23). According to the ultrasonic atomization assembly, by stacking the flexible connecting member and the piezoelectric driving element and/or the metal substrate, vibration during working can be reduced, thereby preventing a local high temperature and improving the atomization performance.

Description

Ultrasonic atomization component and ultrasonic atomization device

Cross References to Related Applications

This application claims its priority based on the Chinese patent application 202123270921.4 submitted on December 23, 2021, and its entire description is incorporated herein by reference.

【Technical field】

The present application relates to the technical field of electronic atomization, in particular to an ultrasonic atomization component and an ultrasonic atomization device.

【Background technique】

Ultrasonic atomization uses the high-frequency vibration of piezoelectric ceramics to drive the metal microporous diaphragm to resonate. The metal micropores are continuously and repeatedly deformed with the vibration, and the aerosol-generating matrix is extruded and broken into fine mist droplets to generate atomized vapor (gas Sol). It has a wide range of applications in various fields such as household humidification, aromatherapy, surface spraying, air purification and medical equipment.

The current ultrasonic atomization components are mainly composed of piezoelectric ceramic sheets and microporous atomization sheets, and the wires are welded to the ultrasonic atomization components by local welding, so that when the ultrasonic atomization components are energized, the atomization generates gas. Sol.

However, the way of welding will change the local mode shape of the ultrasonic atomization component, resulting in local high temperature, making the atomization effect of the ultrasonic atomization component poor.

【Application content】

The ultrasonic atomization assembly and the ultrasonic atomization device provided by the present application can significantly reduce the impact on the vibration mode of the piezoelectric drive element during operation, prevent local high temperature, and improve the atomization performance.

In order to solve the above technical problems, a technical solution adopted by this application is: provide an ultrasonic atomization assembly, including a piezoelectric drive element, a metal substrate and a flexible connector; the piezoelectric drive element has a first through hole; the The metal substrate and the piezoelectric driving element are stacked, and the metal substrate is provided with a microhole area corresponding to the first through hole; The surface of the metal substrate and/or the surface of the metal substrate away from the piezoelectric driving element is used for electrical connection with the piezoelectric driving element and/or the metal substrate.

In one embodiment, the flexible connector includes a first flexible connector disposed on the piezoelectric driving element and a second flexible connector disposed on the metal substrate; the first flexible connector includes A first annular body portion, and the first annular body portion has a second through hole at a position corresponding to the microporous area; the second flexible connector includes a second annular body portion; and the second annular body portion A third through hole is provided at a position corresponding to the micropore area.

In one embodiment, the first flexible connector further includes a first extension part, one end of the first extension part is connected to the edge of the first annular body part, and the other end extends out of the piezoelectric driving element. ; The second annular body part is electrically connected to the first extension part through a wire; or, the second flexible connector further includes a second extension part, and one end of the second extension part is connected to the second annular The edge of the body part is connected, and the other end extends out of the piezoelectric driving element; the first ring-shaped body part is electrically connected to the second extension part through a wire; or, the first flexible connection part also includes the first An extension part, one end of the first extension part is connected to the edge of the first annular body part, and the other end extends out of the piezoelectric driving element; the second flexible connection part also includes the second extension part , one end of the second extension part is connected to the edge of the second annular body part, and the other end extends out of the piezoelectric driving element.

In one embodiment, the diameter of the first through hole is greater than or equal to the diameter of the microporous region; the diameter of the second through hole is greater than or equal to the diameter of the first through hole; the diameter of the third through hole The diameter is greater than or equal to the diameter of the microporous region.

In one embodiment, the first annular body part is bonded to the surface of the piezoelectric driving element facing away from the metal substrate; or, the second flexible ring-shaped body part is bonded to the surface of the metal substrate facing away from the metal substrate. The surface of the piezoelectric driving element; or, the piezoelectric driving element is bonded and fixed to the metal substrate.

In one embodiment, the flexible connecting member includes a first flexible connecting member disposed on the piezoelectric driving element, and the edge of the metal substrate has a lug.

In one embodiment, the first flexible connector further includes a first annular body portion and a first extension portion, one end of the first extension portion is connected to the edge of the first annular body portion, and the other end extends out The piezoelectric drive element.

In one embodiment, the metal substrate is circular; the piezoelectric driving element and the first annular body part are circular.

In one embodiment, the flexible connector is a flexible circuit board.

In one embodiment, the flexible connector includes an annular body part disposed on the surface of the piezoelectric driving element away from the metal substrate and/or the surface of the metal substrate away from the piezoelectric driving element, and an extension portion electrically connected to the annular body portion.

In one embodiment, the annular body part and the extension part are integrally formed.

In one embodiment, the annular body portion is circular.

In one embodiment, the flexible connector is a half-surface conductive contact structure; wherein, the surface of the flexible connector facing the piezoelectric driving element and the surface facing the metal substrate have exposed contacts for It is in contact with and electrically connected with the piezoelectric driving element and/or the metal substrate.

In one embodiment, it further includes a temperature measuring element, which is arranged on the surface of the flexible connector facing the piezoelectric driving element or the surface facing the metal substrate, and is in contact with the piezoelectric driving element.

In order to solve the above technical problems, the second technical solution adopted by this application is to provide an ultrasonic atomization device, including a casing, an ultrasonic atomization assembly, and a power supply assembly; the casing has a liquid storage chamber; the ultrasonic atomization The atomization component is used to atomize the aerosol generating substrate from the liquid storage cavity when the power is turned on; the ultrasonic atomization component is the ultrasonic atomization component described in any one of the above; the power supply component and the ultrasonic The atomization component is electrically connected to control the operation of the ultrasonic atomization component.

Different from the prior art, the ultrasonic atomization assembly and the ultrasonic atomization device provided by this application include a piezoelectric drive element, a metal substrate and a flexible connector; the piezoelectric drive element has a first through hole; the metal substrate and the piezoelectric The driving elements are stacked, and the metal substrate is provided with a micropore area at the position corresponding to the first through hole; the flexible connector is stacked on the surface of the piezoelectric driving element facing away from the metal substrate and/or the surface of the metal substrate facing away from the piezoelectric driving element , for electrical connection with the piezoelectric driving element and/or the metal substrate. In the present application, by stacking the flexible connector with the piezoelectric driving element and/or the metal substrate, the impact on the vibration mode of the piezoelectric driving element during operation can be significantly reduced, local high temperature can be prevented, and the atomization performance can be improved.

【Description of drawings】

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative work, wherein:

Fig. 1 is a schematic structural diagram of an ultrasonic atomization device provided by an embodiment of the present application;

Fig. 2 is a schematic structural diagram of the ultrasonic atomization assembly provided by the first embodiment of the present application;

Fig. 3 is an exploded view of a specific embodiment of the ultrasonic atomization assembly in Fig. 2;

Figure 4 is an exploded view of another embodiment of the ultrasonic atomization assembly in Figure 2;

Fig. 5 is an exploded view of the ultrasonic atomization assembly provided by another specific embodiment of the ultrasonic atomization assembly in Fig. 2;

Fig. 6 is a schematic structural diagram of the ultrasonic atomization assembly provided by the second embodiment of the present application;

Fig. 7 is a schematic structural diagram of the ultrasonic atomization assembly provided by the third embodiment of the present application;

Fig. 8 is an exploded view of another embodiment of the ultrasonic atomization assembly in Fig. 2;

Fig. 9 is an exploded view of a specific embodiment of the ultrasonic atomization assembly in Fig. 6 .

【Detailed ways】

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

In the above descriptions of this specification, unless otherwise clearly specified and limited, terms such as "fixed", "installed", "connected" or "connected" should be interpreted in a broad sense. For example, as far as the term "connection" is concerned, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediary , or it can be the internal communication of two elements or the interaction relationship between two elements. Therefore, unless otherwise clearly defined in this specification, those skilled in the art can understand the specific meanings of the above terms in this application according to specific situations.

The terms "first" and "second" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features shown. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally further includes For other steps or units inherent in these processes, methods, products or apparatuses.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood by those skilled in the art, both explicitly and implicitly, that the embodiments described herein can be combined with other embodiments.

The inventors of the present application found that the atomization of the current ultrasonic atomization component is mainly to weld the wire to the ultrasonic atomization component by local welding, so that when the ultrasonic atomization component is energized, the atomization generates aerosol. Since the wire is welded to the ultrasonic atomization component by local welding, on the one hand, the high temperature of the welding will cause the electrical parameters of the ultrasonic atomization component to change and affect the performance; on the other hand, it will also destroy the overall symmetry of the ultrasonic atomization component, resulting in The local mode shape is destroyed and local high temperature is easily generated at the solder joint; at the same time, the consistency during the welding process is difficult to guarantee, which affects the overall performance of the ultrasonic atomization component, resulting in poor atomization effect. The present application provides a new ultrasonic atomization assembly and an ultrasonic atomization device using the ultrasonic atomization assembly.

The application will be described in detail below in conjunction with the accompanying drawings and embodiments.

Referring to Figures 1-8, Figure 1 is a schematic structural view of an ultrasonic atomization device provided in an embodiment of the present application; Figure 2 is a schematic structural view of an ultrasonic atomization assembly provided in the first embodiment of the present application; An exploded view of a specific embodiment of the ultrasonic atomization assembly; Fig. 4 is an exploded view of another specific embodiment of the ultrasonic atomization assembly in Fig. 2; Fig. 5 is another embodiment of the ultrasonic atomization assembly in Fig. 2. The exploded view of the ultrasonic atomization assembly; Figure 6 is a schematic structural view of the ultrasonic atomization assembly provided by the second embodiment of the present application; Figure 7 is a schematic structural view of the ultrasonic atomization assembly provided by the third embodiment of the application; Figure 8 is Fig. 2 is an exploded view of another specific embodiment of the ultrasonic atomization assembly; Fig. 9 is an exploded view of a specific embodiment of the ultrasonic atomization assembly in Fig. 6 .

Referring to FIG. 1 , the ultrasonic atomization device includes: a housing 10 , an ultrasonic atomization assembly 20 and a power supply assembly 30 .

Wherein, the casing 10 has a liquid storage chamber 11 , a liquid outlet 12 and a mist outlet 13 communicating with the liquid storage chamber 11 ; the liquid storage chamber 11 is used for storing the aerosol generating substrate A. The aerosol generating base A can be a medicinal liquid for treating a certain disease, a cosmetic humidifying liquid or any other liquid suitable for ultrasonic atomization. The ultrasonic atomization component 20 is arranged at the liquid outlet 12 of the housing 10, and is used to generate high-frequency micro-oscillations when energized so that the atomization of the aerosol-generating substrate A introduced into the ultrasonic atomization component 20 has vector properties. The aerosol of tiny particles is then discharged from the mist outlet 13 along the mist outlet direction B. The power supply component 30 is electrically connected with the ultrasonic atomization component 20, and is used for supplying power to the ultrasonic atomization component 20 and controlling the operation of the ultrasonic atomization component 20.

Referring to FIGS. 2-9 , there are schematic structural diagrams of an ultrasonic atomization assembly 20 provided in some embodiments of the present application. The ultrasonic atomization assembly 20 includes a flexible connector 201 , a piezoelectric driving element 22 and a metal substrate 23 . Specifically, the piezoelectric driving element 22 has a first through hole 221; the metal substrate 23 is stacked with the piezoelectric driving element 22, and the metal substrate 23 is provided with a micropore area 231 at a position corresponding to the first through hole 221; the flexible connector The layer 201 is stacked on the surface of the piezoelectric driving element 22 away from the metal substrate 23 and/or the surface of the metal substrate 23 away from the piezoelectric driving element 22 for electrical connection with the piezoelectric driving element 22 and/or the metal substrate 23 . In this application, by stacking the flexible connector 201 with the piezoelectric driving element 22 and/or the metal substrate 23, the impact on the vibration mode of the piezoelectric driving element 22 during operation can be significantly reduced, local high temperature can be prevented, and the atomization performance can be improved.

In some embodiments, the flexible connector 201 includes an annular body part 202 disposed on the surface of the piezoelectric driving element 22 facing away from the metal substrate 23 and/or the surface of the metal substrate 23 facing away from the piezoelectric driving element 22, and the annular body part 202 The extension part 203 electrically connected to the part 202. Specifically, the ring-shaped body part 202 is attached to the piezoelectric driving element 22 and/or the metal substrate, and the extension part 203 electrically connects the ring-shaped body part 202 to the power supply assembly 30, so that when the ultrasonic atomization device is working, the power supply assembly 30 The ultrasonic atomization component 20 atomizes the aerosol to form the matrix A through the flexible connection piece 201 .

Wherein, the ring-shaped body part 202 and the extension part 203 may be electrically connected through wires, or integrally formed. When the annular body part 202 and the extension part 203 are integrally formed, the piezoelectric driving element 22 and the metal substrate 23 are directly connected to the power supply assembly 30 through the flexible connector 201, without intermediate electrical connection points, thereby reducing the occurrence of short-circuit and disconnection . Moreover, components with different functions can be integrated on the flexible connector 201 , for example, a temperature control component can be integrated, so that the ultrasonic atomization component 20 has a temperature measurement function at the same time.

2 and 3, the flexible connector 201 includes a first flexible connector 21 and a second flexible connector 24, and the ultrasonic atomization assembly 20 is the first flexible connector 21, the piezoelectric driving element 22, the metal The substrate 23 and the second flexible connector 24 . Among them, the first flexible connector 21 and the second flexible connector 24 are equivalent to two electrodes, which are respectively used for electrical connection with the positive and negative electrodes on the power supply assembly 30, and the power supply assembly 30 is connected to the first flexible connector 21 and the second flexible connector. When the connecting piece 24 is energized, the first flexible connecting piece 21 forms a loop with the second flexible connecting piece 24 through the piezoelectric driving element 22 and the metal substrate 23, and the piezoelectric driving element 22 generates high-frequency micro-oscillation under the energized condition , drive the metal substrate 23 stacked with the piezoelectric drive element 22 to generate high-frequency micro-oscillations correspondingly, so that the aerosol introduced on the metal substrate 23 generates matrix A, and the vibration generates aerosols with vectorial tiny particles. The sol is further guided out from the mist outlet 13 along the mist outlet direction B.

Wherein, the piezoelectric driving element 22 may be an annular piezoelectric ceramic sheet with a first through hole 221 , so as to lead out the aerosol generated by atomization on the metal substrate 23 from the first through hole 221 .

The metal substrate 23 and the piezoelectric driving element 22 are stacked, and the position of the metal substrate 23 corresponding to the first through hole 221 is provided with a microporous area 231 composed of a microporous screen, and the aerosol generating substrate A in the liquid storage chamber 11 flows into the After the microporous area 231 , it is atomized by the microporous screen oscillating at high frequency to generate vectorial aerosol, which is then exported through the first through hole 221 .

The first flexible connecting member 21 has a first annular body portion 211 , and the first annular body portion 211 is stacked on the surface of the piezoelectric driving element 22 away from the metal substrate 23 . Wherein, the first annular body portion 211 has a second through hole 213, and the second through hole 213 is set corresponding to the first through hole 221 so that the microporous area 231 is at least partially exposed, so that the aerosol generated on the microporous area 231 can be Lead out through the first through hole 221 and the second through hole 213 .

The second flexible connecting piece 24 is disposed close to the liquid outlet 12 , and the second flexible connecting piece 24 has a second ring-shaped body portion 241 , and the second ring-shaped body portion 241 is stacked on the surface of the metal substrate 23 away from the piezoelectric driving element 22 . Wherein, the second annular body portion 241 has a third through hole 243, so that the microporous area 231 is at least partially exposed, so that the aerosol generating substrate A in the liquid storage bin 11 can be exported to the metal substrate through the second through hole 213 The microporous area 231 on the 23 is then atomized to generate an aerosol.

Wherein, the first annular body part 211 is stacked on the surface of the piezoelectric driving element 22 away from the metal substrate 23, and the second annular body part 241 is stacked on the surface of the metal substrate 23 away from the piezoelectric driving element 22. Compared with the traditional The local connection method can significantly reduce the impact on the vibration mode of the piezoelectric driving element 22 during operation, prevent local high temperature, and improve the atomization performance.

It can be understood that in order to reduce the impact on the vibration mode of the piezoelectric driving element 22 during operation, in this embodiment, the piezoelectric driving element 22, the metal substrate 23, the first annular body part 211 and the second annular body part The outer contours of 241 can all be oval, rectangular or circular. In a specific embodiment, in order to make the piezoelectric driving element 22 produce the optimal vibration mode during operation, the metal substrate 23 is circular, and the piezoelectric driving element 22 and the metal substrate 23 remove the part of the micropore area 231 , the first annular body portion 211 and the second annular body portion 241 are both annular and coaxially arranged. It can be understood that on the one hand, the ring shape can ensure the optimal vibration mode, and on the other hand, the ring shape can also ensure that the first ring body part 211 and the second ring body part 241 are in contact with the piezoelectric driving element 22 or the metal substrate 23 respectively. The electrical connection of the ultrasonic atomization assembly 20 is good, avoiding a single contact failure, and improving the reliability of the electrical connection of the ultrasonic atomization component 20 .

Specifically, in order not to affect the aerosol generating matrix A in the liquid storage chamber, the substrate A is introduced into the microporous area 231 and the aerosol generated by atomization on the microporous area 231 is discharged from the mist outlet 13 . In this embodiment, the diameter of the first through hole 221 on the piezoelectric driving element 22 is greater than or equal to the diameter of the micropore area 231, that is, the piezoelectric driving element 22 is arranged around the micropore area 231; The diameter of the through hole 213 is greater than or equal to the diameter of the first through hole 221, that is, the first annular body part 211 is set around the first through hole 221; the diameter of the third through hole 243 on the second annular body part 241 is greater than or equal to the microporous area The diameter of 231 , that is, the second annular body portion 241 is set around the microporous area 231 .

In order to make the wiring beautiful, avoid the risk of short circuit and open circuit between the wires, and facilitate the connection, in a specific implementation of this embodiment, referring to FIG. One end of an extension portion 212 is connected to the edge of the first annular body portion 211 , and the other end extends out from the piezoelectric driving element 22 for electrical connection with the power supply assembly 30 . It can be understood that, in some implementations, the first flexible connecting member 21 may be a flexible circuit board, that is, an FPC. An end of the first extension portion 212 close to the first annular body portion 211 is integrated with the first annular body portion 211 . Wherein, the first annular body part 211 is electrically connected to the power supply assembly 30 through the first extension part 212 , and the second annular body part 211 is electrically connected to the power supply assembly 30 through an external wire. Alternatively, the first extension part 212 can also be integrated with a plurality of independently arranged wires, and the second annular body part 241 of the second flexible connector 24 is electrically connected to one of the wires on the first extension part 212 through an external wire; Then through the first extension part 212, the positive and negative poles of the ultrasonic atomization assembly 20 and the power supply assembly 30 are electrically connected respectively, so that one pole of the positive and negative poles is electrically connected with the first annular body part 211, and the other pole is electrically connected with the second annular body part 211. The annular body portion 241 is electrically connected.

In another specific implementation of this embodiment, referring to FIG. 4 , the second flexible connector 24 further includes a second extension part 242, one end of the second extension part 242 is connected to the edge of the second ring-shaped body part 241, and the other end The piezoelectric driving element 22 is extended to be electrically connected with the power supply assembly 30 . Specifically, the second annular body part 241 is electrically connected to the power supply assembly 30 through the second extension part 242 , and the first annular body part 211 is electrically connected to the power supply assembly 30 through an external wire.

In yet another specific implementation of this embodiment, referring to FIG. 5 , the first flexible connector 21 further includes a first extension part 212, one end of the first extension part 212 is connected to the edge of the first annular body part 211, and the other end The piezoelectric driving element 22 is extended to be electrically connected to one of the positive electrode and the negative electrode of the power supply assembly 30 . The second flexible connector 24 also includes a second extension part 242, one end of the second extension part 242 is connected to the edge of the second annular body part 241, and the other end extends out of the piezoelectric driving element 22 for connecting with the positive pole of the power supply assembly 30. The electrode is electrically connected to the other electrode of the negative electrode. Both the first extension 212 and the second extension 242 are provided with contacts.

In this embodiment, the first flexible connecting member 21 and the second flexible connecting member 24 may both be flexible circuit boards, which are bonded to the surfaces of the piezoelectric driving element 22 and the metal substrate 23 respectively. Wherein, the flexible circuit board is a half-surface conductive contact structure, and the flexible circuit board faces the side of the piezoelectric driving element 22 and the metal substrate 23, and the contact formed by the exposed conductive circuit is used to communicate with the electrode layer or the piezoelectric driving element 22. The surfaces of the metal substrate 23 are in electrical contact and are electrically connected. The side of the flexible circuit board away from the piezoelectric driving element 22 and the metal substrate 23 is an insulating structure, which can prevent the circuit short circuit caused by the liquid leakage of the liquid storage chamber 11 . The above-mentioned solution can replace the traditional local welding process, so as to avoid the existence of welding spots to change the performance parameters of the piezoelectric driving element 22 and affect the vibration mode. In addition, it can also avoid the local high temperature generated at the welding point under the condition of energization, which will affect the use of the piezoelectric driving element 22 .

In this embodiment, the first flexible connecting member 21 is bonded to the surface of the piezoelectric driving element 22 away from the metal substrate 23, and the second flexible connecting member 24 is bonded to the surface of the metal substrate 23 facing away from the piezoelectric driving element 22. The electric driving element 22 and the metal substrate 23 are bonded and fixed. Wherein, the bonding process between the first flexible connecting member 21 and the second flexible connecting member 24 and the piezoelectric driving element 22 and the metal substrate 23 respectively can adopt the same bonding process as that between the piezoelectric driving element 22 and the metal substrate 23 process to ensure the bonding stability between the parts of the ultrasonic atomization assembly 20. It can be understood that the flexible printed circuit (Flexible Printed Circuit referred to as FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. The specific ways in which the flexible circuit board is attached to the piezoelectric driving element 22 and/or the metal substrate 23 through an adhesive may include: conductive glue can be used to coat the bonding surface, and non-conductive glue can also be used to coat the non-conductive glue. The bonding surface of the conductor part.

Referring to FIG. 6 , it is an ultrasonic atomization assembly 20 provided in the second embodiment of the present application.

Wherein, the ultrasonic atomization assembly 20 provided by the second embodiment is basically the same as the ultrasonic atomization assembly 20 provided by the first embodiment, and the flexible connection part 201 only includes the first flexible connection part 21 . Specifically, in this embodiment, the ultrasonic atomization assembly 2 is the first flexible connector 21, the piezoelectric driving element 22, and the metal substrate 23 in the order of lamination; and the corresponding first through hole 221, micro The hole area 231 and the second through hole 213 . Wherein, the difference between the ultrasonic atomization assembly 20 provided in the second embodiment and the ultrasonic atomization assembly 20 provided in the first embodiment is that in this embodiment, the ultrasonic atomization assembly 20 is not provided with the second flexible connecting member 24 . Specifically, since the metal substrate 23 is conductive and compatible with the conductive function of the second flexible connector 24, the metal substrate 23 can be electrically connected to the power supply assembly 30 through an external wire, while the first flexible connector 21 is connected to the power supply assembly 30. Electrically connected, so that the first flexible connecting member 21, the piezoelectric driving element 22 and the metal substrate 23 form a conductive loop under the condition of being energized. In this embodiment, the first annular body portion 211 of the first flexible connector 21 is stacked on the surface of the piezoelectric driving element 22 facing away from the metal substrate 23 , and the metal substrate 23 is electrically connected to the power supply assembly 30 through external wires. Compared with the traditional local electrode welding method, it can significantly reduce the impact on the vibration mode of the piezoelectric driving element 22 during operation, prevent local high temperature, and improve the atomization performance.

In this embodiment, the first flexible connecting member 21 is a flexible circuit board. The first flexible connecting member 21 is bonded to the surface of the piezoelectric driving element 22 away from the metal substrate 23 .

Among them, in order to make the piezoelectric driving element 22 generate an optimal vibration mode during operation. The metal substrate 23 is circular, the piezoelectric driving element 22, the part of the metal substrate 23 except the microporous area 231 and the first annular body part 211 are all annular and coaxially arranged, and the microporous area 231 is circular.

Further, the first flexible connector 21 also includes a first extension part 212, one end of the first extension part 212 is connected to the edge of the first annular body part 211, and the other end extends out of the piezoelectric driving element 22, and is electrically connected to the power supply assembly 30 , the metal substrate 23 is electrically connected to the power supply assembly 30 through external wires. In some optional manners, the connection manner of the external wires to the metal substrate 23 may be welding or bonding.

In a specific embodiment, the edge of the metal substrate 23 has a lug 232 extending out from the piezoelectric driving element 22 , one end of the external wire is welded to the lug 232 , and the other end is electrically connected to the power supply assembly 30 by welding. In this way, it is avoided that solder joints directly disposed on the metal substrate 23 affect the performance of the metal substrate 23 .

Referring to FIG. 7 , it is an ultrasonic atomization assembly 20 provided in the third embodiment of the present application.

Wherein, the ultrasonic atomization assembly 20 provided by the third embodiment is basically the same as the ultrasonic atomization assembly 20 provided by the first embodiment, and the flexible circuit board 201 only includes the second flexible circuit board 203 . Specifically, in this embodiment, the ultrasonic atomization assembly 20 is sequentially stacked with piezoelectric drive elements 22, metal substrates 23, and second flexible connectors 24; The hole area 231 and the third through hole 243 . Wherein, the difference between the ultrasonic atomization assembly 20 provided in the third embodiment and the ultrasonic atomization assembly 20 provided in the first embodiment is that in this embodiment, the ultrasonic atomization assembly 20 is not provided with the first flexible connecting member 21 . Specifically, the piezoelectric driving element 22 can be electrically connected to the power supply assembly 30 through an external wire, and at the same time, the second flexible connector 24 is electrically connected to the power supply assembly 30, so that the second flexible connecting member 24, the piezoelectric driving element 22 and the metal base Sheet 23 forms a conductive loop under energized condition.

Among them, the piezoelectric drive element 22, the metal substrate 23 and the second flexible connector 24 in the ultrasonic atomization assembly 20 in the third embodiment can be compared with the ultrasonic atomization assembly 20 provided in the first embodiment and the second embodiment. Each of the structures is the same and will not be repeated here.

Referring to FIG. 8 and FIG. 9 , the present application also provides an ultrasonic atomization assembly 20 with a temperature measurement function. Specifically, on the basis of the ultrasonic atomization assembly 20 provided in the above-mentioned embodiments of the present application, the ultrasonic atomization assembly 20 also includes a temperature measuring element 25, which is arranged on the first flexible connector 21 and connected to the piezoelectric driving element 22 The surface contact is used to detect the temperature on the piezoelectric driving element 22 when the ultrasonic atomization assembly 20 is working. The temperature measuring element 25 may be directly attached to the surface of the first flexible connecting member 21 close to the piezoelectric driving element 22 . Alternatively, the temperature measuring element 25 may be disposed in the through hole of the first flexible connecting member 21 and be in contact with the surface of the piezoelectric driving element 22 . Of course, in some other embodiments, the temperature measuring element 25 can also be arranged on the second flexible connector 24 and be in contact with the surface of the metal substrate 23, so as to detect the temperature on the metal substrate 23 when the ultrasonic atomization assembly 20 is working. temperature.

Wherein, the temperature measuring element 25 may be a temperature sensor or a thermistor, for example, the temperature measuring element 25 is a conductor having a temperature coefficient of resistance (TCR) characteristic and is electrically connected to a temperature measuring wire on the first extension part 212 . It can be understood that in this embodiment, the first flexible connector 21 is integrated with the temperature measuring element 25 , and the electrode connecting wires of the two can also share the first extension 212 , that is, the first extension 212 integrates multiple electrode lines.

Different from the prior art, the ultrasonic atomization assembly 20, the ultrasonic atomization assembly 2 and the ultrasonic atomization device provided by the present application include stacked piezoelectric drive elements 22, metal substrates 23 and flexible connectors 201, wherein the flexible The connecting member 201 is stacked on the surface of the piezoelectric driving element 22 away from the metal substrate 23 and/or the surface of the metal substrate 23 away from the piezoelectric driving element 22, for connecting with the piezoelectric driving element 22 and/or the metal substrate 23 is electrically connected, which can significantly reduce the impact on the vibration mode of the piezoelectric driving element 22 during operation, prevent local high temperature, and improve the atomization performance of the ultrasonic atomization component 20 . In addition, the flexible connecting piece 201 is bonded to the piezoelectric driving element 22 and the metal substrate 23 by bonding, instead of the traditional local welding method, so as to avoid the existence of solder joints to change the performance parameters of the piezoelectric driving element 22, The vibration mode of the piezoelectric drive element 22 is affected and local high temperatures are generated. In addition, the present application also provides an ultrasonic atomization assembly 20 with a temperature measurement function, which can detect the temperature on the piezoelectric driving element 22 when the ultrasonic atomization assembly 20 is working.

The above is only the implementation mode of this application, and does not limit the scope of patents of this application. Any equivalent structure or equivalent process transformation made by using the contents of this application specification and drawings, or directly or indirectly used in other related technical fields, All are included in the scope of patent protection of the present application in the same way.

Claims

An ultrasonic atomization component, including:

The piezoelectric driving element has a first through hole;

A metal substrate is stacked with the piezoelectric driving element, and the metal substrate is provided with a microhole area corresponding to the position of the first through hole;

The flexible connector is stacked on the surface of the piezoelectric driving element away from the metal substrate and/or the surface of the metal substrate away from the piezoelectric driving element, for connecting with the piezoelectric driving element and/or Or the metal substrate is electrically connected.
The ultrasonic atomization assembly according to claim 1, wherein the flexible connector comprises a first flexible connector disposed on the piezoelectric driving element and a second flexible connector disposed on the metal substrate;

The first flexible connector includes a first annular body portion, and the first annular body portion has a second through hole at a position corresponding to the microporous area;

The second flexible connector includes a second annular body portion; and the second annular body portion has a third through hole at a position corresponding to the microporous area.
The ultrasonic atomization assembly according to claim 2, wherein the first flexible connecting member further comprises a first extension, one end of the first extension is connected to the edge of the first annular body part, and the other end extending out of the piezoelectric driving element; the second annular body portion is electrically connected to the first extension portion through a wire; or,

The second flexible connector further includes a second extension part, one end of the second extension part is connected to the edge of the second annular body part, and the other end extends out of the piezoelectric driving element; the first annular The main body part is electrically connected to the second extension part through a wire; or,

The first flexible connector further includes the first extension part, one end of the first extension part is connected to the edge of the first annular body part, and the other end extends out of the piezoelectric driving element; the first extension part The second flexible connecting piece further includes the second extension part, one end of the second extension part is connected to the edge of the second annular body part, and the other end extends out of the piezoelectric driving element.
The ultrasonic atomization assembly according to claim 3, wherein the diameter of the first through hole is greater than or equal to the diameter of the micropore area; the diameter of the second through hole is greater than or equal to the diameter of the first through hole ; The diameter of the third through hole is greater than or equal to the diameter of the micropore area.
The ultrasonic atomization assembly according to claim 2, wherein the first annular body portion is bonded to the surface of the piezoelectric driving element away from the metal substrate; or,

The second annular body portion is bonded to the surface of the metal substrate facing away from the piezoelectric driving element; or,

The piezoelectric driving element is bonded and fixed to the metal substrate.
The ultrasonic atomization assembly according to claim 1, wherein the flexible connecting member comprises a first flexible connecting member disposed on the piezoelectric driving element; the edge of the metal substrate has a lug.
The ultrasonic atomization assembly according to claim 6, wherein the first flexible connecting member further comprises a first annular body part and a first extension part, one end of the first extension part is connected to the first annular body part The edge is connected, and the other end extends out of the piezoelectric driving element.
The ultrasonic atomization assembly according to claim 2, wherein the metal substrate is circular; the piezoelectric driving element is circular.
The ultrasonic atomization assembly according to claim 1, wherein the flexible connector is a flexible circuit board.
The ultrasonic atomization assembly according to claim 1, wherein the flexible connecting member includes a surface disposed on the surface of the piezoelectric driving element away from the metal substrate and/or the metal substrate is away from the piezoelectric driver An annular body portion of the surface of the element, and an extension electrically connected to said annular body portion.
The ultrasonic atomization assembly according to claim 10, wherein the annular body part and the extension part are integrally formed.
The ultrasonic atomization assembly according to claim 10, wherein the annular body part is in the shape of a ring.
The ultrasonic atomization assembly according to claim 10, wherein the flexible connecting member is a half-surface conductive contact structure; wherein, the surface of the flexible connecting member facing the piezoelectric driving element and the surface facing the metal substrate There are exposed contacts for contacting and electrically connecting with the piezoelectric driving element and/or the metal substrate.
The ultrasonic atomization assembly according to claim 1, further comprising a temperature measuring element, which is arranged on the surface of the flexible connector facing the piezoelectric driving element or the surface facing the metal substrate, and is connected with the Piezoelectric drive element contacts.
An ultrasonic atomization device, including:

The housing has a liquid storage chamber;

An ultrasonic atomization component, which is used to atomize the aerosol-generating substrate from the liquid storage chamber when energized; the ultrasonic atomization component is the ultrasonic atomization component according to any one of claims 1-14;

The power supply component is electrically connected with the ultrasonic atomization component and is used to control the operation of the ultrasonic atomization component.