CN218605090U - Micro-grid atomizing sheet without welding electrode - Google Patents

Abstract

The utility model discloses a welding electrode-free micro-grid atomizing sheet, which relates to the technical field of atomizing sheets, and comprises a first conducting sheet, piezoelectric ceramics and a conducting layer which are distributed from top to bottom, wherein the piezoelectric ceramics is provided with an A-surface electrode and a B-surface electrode, the A-surface electrode is electrically laminated with the plane of the first conducting sheet, and the B-surface electrode is electrically laminated with the plane of the conducting layer; the first conducting strip is electrically connected with a first lead, the conducting layer is electrically connected with a second lead, and the first lead and the second lead both extend out of the atomizing sheet; the surface A electrode is electrically attached to the plane of the first conducting sheet, and the surface B electrode is electrically attached to the plane of the conducting layer; the first conducting wire is electrically connected with the first conducting strip, and the second conducting wire is electrically connected with the conducting layer; the damage to the piezoelectric ceramics during welding is avoided, the surface of the piezoelectric ceramics is smooth, and the limitation of the welding spot position on the structural design is avoided.

Description

Micro-grid atomizing sheet without welding electrode

Technical Field

The utility model belongs to the technical field of the atomizing piece technique and specifically relates to indicate a welding electrode's microgrid atomizing piece exempts from.

Background

The micro-grid atomization technology is rapidly popularized to various different industries, and due to the fact that different use environments have higher and higher requirements for the size of a micro-grid atomization sheet, a more miniaturized micro-grid atomization sheet is needed, wires need to be welded on the micro-grid atomization sheet manufactured based on the traditional process, a large and protruding soldering tin protrusion is formed on piezoelectric ceramics of the micro-grid atomization sheet, local high temperature can change the characteristics of the piezoelectric ceramics during welding, the local piezoelectric ceramics are enabled to lose polarization, the protrusion caused by the soldering tin brings inconvenience for structural design, the position and the size of a welding point cannot be accurately controlled in the soldering tin process, a larger flexible space needs to be reserved in the structural design, the unevenness of the water tightness of the atomization sheet is prone to occur after treatment, the problems are caused due to the fact that the pressure of sealing materials is uneven, water leakage is prone to be caused very easily, the problems are more and more prominent under the condition that the size of the atomization sheet is further reduced, meanwhile, the welding is a tedious process, and therefore the atomization sheet without welding electrode is needed, and the requirements for actual use are met.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention provides a micro-grid atomizing sheet without welding electrode, which is electrically bonded to a first conductive sheet plane through an a-side electrode, and electrically bonded to a conductive layer plane through a B-side electrode; the first conducting wire is electrically connected with the first conducting strip, and the second conducting wire is electrically connected with the conducting layer; the damage to the piezoelectric ceramics during welding is avoided, the surface of the piezoelectric ceramics is smooth, and the limitation of the welding spot position on the structural design is avoided.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a micro-grid atomizing sheet without welding electrodes comprises a first conducting strip, piezoelectric ceramics and a conducting layer which are distributed from top to bottom, wherein the piezoelectric ceramics are provided with an A-surface electrode and a B-surface electrode, the A-surface electrode is electrically attached to the plane of the first conducting strip, and the B-surface electrode is electrically attached to the plane of the conducting layer; the first conducting strip is electrically connected with a first lead, the conducting layer is electrically connected with a second lead, and the first lead and the second lead both extend out of the atomizing sheet.

As a preferred embodiment: the micro-grid atomization sheet free of welding electrodes further comprises a first cover film, a first adhesive film, a second cover film and a second adhesive film which are sequentially attached from top to bottom, wherein the second adhesive film is attached to the upper surface of the first conductive sheet; a conductive adhesive film is provided between the first conductive sheet and the piezoelectric ceramic.

As a preferred scheme: the conducting layer is a conductive adhesive tape, a connecting part is integrally extended from the edge of the conductive adhesive tape, and the connecting part is electrically connected with the second lead.

As a preferred embodiment: the conducting layer is a second conducting strip which is electrically connected with a second wire, an insulating connecting strip is arranged at the edge of the second conducting strip and the edge of the first conducting strip, and the second conducting strip is flexibly connected with the first conducting strip through the insulating connecting strip.

As a preferred scheme: the second cover film is integrally and flexibly connected with a bottom cover film, and the second adhesive film is integrally and flexibly connected with a bottom adhesive film; and the bottom adhesive film and the bottom cover film are sequentially attached below the second conducting strip from top to bottom.

As a preferred embodiment: the first conducting wire and the second conducting wire are distributed side by side, and the front end of the first conducting wire and the front end of the second conducting wire are combined to form a joint.

As a preferred scheme: the first conducting strip is attached to the whole surface of the electrode on the surface A, and the conducting layer is attached to the whole surface of the electrode on the surface B.

As a preferred embodiment: an insulating sheet is arranged between the first lead and the second lead.

As a preferred embodiment: and an avoidance notch for avoiding the second wire is arranged at the edge of the first conducting strip.

As a preferred embodiment: and the second lead is coated with an insulating layer, and the insulating layer is positioned between the avoiding notch and the front end of the second lead.

As a preferred scheme: and a reinforcing sheet for increasing the hardness is arranged on the joint.

As a preferred embodiment: an etching area is arranged at the central position of the first conducting plate, and a through hole with the area smaller than that of the etching area is arranged at the central position of the corresponding etching area on the second covering film; the first cover film is provided with atomization micropores corresponding to the through holes.

As a preferred scheme: the atomizing micropores are in a conical structure, the aperture of each atomizing micropore is gradually reduced from the first covering film to the conducting layer, and the small end of each atomizing micropore faces the first conducting strip; the aperture of the atomization micropore is micron-sized.

As a preferred embodiment: and the second cover film, the second adhesive film and the first conducting strip which are sequentially attached from top to bottom are overlapped to form the FPC flexible circuit board.

As a preferred embodiment: the first conducting sheet and the second conducting sheet are made of copper foils or stainless steel sheets.

Compared with the prior art, the utility model has obvious advantages and beneficial effects, concretely, according to the technical scheme, the A-side electrode is electrically jointed with the first conducting strip plane, and the B-side electrode is electrically jointed with the conducting layer plane; the first conducting wire is electrically connected with the first conducting strip, and the second conducting wire is electrically connected with the conducting layer; the damage to the piezoelectric ceramics during welding is avoided, so that the surface of the piezoelectric ceramics is smooth, and the limitation of the welding spot position on the structural design is avoided; the micro-grid atomizing sheet is high in sealing performance and uniform in stress, and water leakage is prevented; the connection point of the power supply input does not need to be specially manufactured, and the connection with the power supply is simple and easy to assemble; the B-surface electrode of the piezoelectric ceramic is covered by the whole conductive layer and is not contacted with air completely, so that the B-surface electrode of the piezoelectric ceramic is prevented from being oxidized, and the service life of the micro-grid atomization sheet is greatly prolonged; the manufacturing process is extremely simplified, and the large-scale manufacturing is convenient.

To illustrate the structural features and functions of the present invention more clearly, the following detailed description is given with reference to the accompanying drawings and specific embodiments.

Drawings

Fig. 1 is a flow chart of a manufacturing process of a micro-grid atomizing sheet of a welding-free electrode according to the present invention;

fig. 2 is a schematic perspective view of a micro-grid atomizing plate without a welding electrode according to embodiment 1 of the present invention;

fig. 3 is a cross-sectional view of a micro-grid atomizing plate without a welding electrode according to embodiment 1 of the present invention;

fig. 4 is an enlarged view of the position M in fig. 3 according to the present invention;

fig. 5 is an exploded view of a micro-grid atomizing plate without a welding electrode according to embodiment 1 of the present invention;

fig. 6 is a schematic perspective view of a micro-grid atomizing plate without a welding electrode according to embodiment 2 of the present invention;

fig. 7 is a cross-sectional view of a micro-grid atomizing sheet without a welding electrode according to embodiment 2 of the present invention;

fig. 8 is an enlarged view of the position N in fig. 7 according to the present invention;

fig. 9 is an exploded view of a micro-grid atomizing plate without a welding electrode according to embodiment 2 of the present invention;

fig. 10 is a schematic view of a partially developed structure of a micro-grid atomizing plate without a welding electrode according to embodiment 2 of the present invention;

fig. 11 is an exploded view of a part of a micro-grid atomizing plate without a welding electrode according to embodiment 2 of the present invention.

The attached drawings indicate the following:

in the figure: 10. a first cover film; 11. atomizing micropores; 20. a first adhesive film; 30. a second cover film; 31. a bottom cover film; 32. a through hole; 40. a second adhesive film; 41. a bottom adhesive film; 50. a first conductive sheet; 51. etching the area; 52. a second conductive sheet; 53. an insulating connecting strip; 54. avoiding the gap; 60. a conductive adhesive film; 70. piezoelectric ceramics; 71. an A-side electrode; 72. a B-side electrode; 80. a first conductive line; 81. a second conductive line; 82. an insulating sheet; 83. a reinforcing sheet; 84. a joint; 90. a conductive adhesive tape; 91. a connecting portion; 92. a conductive adhesive layer; 100. and (4) protruding.

Detailed Description

The utility model discloses as shown in fig. 1 to 11, a exempt from welding electrode's microgrid atomizing piece, it includes from last to covering membrane 10, first glued membrane 20, the second that laminates in proper order down and covering membrane 30, second glued membrane 40, first conducting strip 50, electrically conductive glued membrane 60, piezoceramics 70 and conducting layer, wherein:

an etching area 51 is arranged at the center of the first conductive sheet 50, and a through hole 32 with an area smaller than that of the etching area 51 is arranged at the center of the second cover film 30 corresponding to the etching area 51; the first cover film 10 is covered on the upper surface of the second cover film 30 through the first adhesive film 20, and the first cover film 10 is provided with atomizing micropores 11 corresponding to the positions of the through holes 32; the piezoelectric ceramic 70 has an a-side electrode 71 and a B-side electrode 72, the a-side electrode 71 is electrically attached to the first conductive sheet 50 plane, and the B-side electrode 72 is electrically attached to the conductive layer plane; a first wire 80 is electrically connected to the edge of the first conductive sheet 50, and a second wire 81 is electrically connected to the edge of the conductive layer; the first wire 80 and the second wire 81 extend out of the atomizing plate; the front end of the first wire 80 and the front end of the second wire 81 are combined to form a joint 84.

The distribution range of the atomizing micropores 11 is smaller than that of the corresponding area of the through holes 32; the distribution range of the atomizing micropores 11 is smaller than the area of the through holes 32 corresponding to the first cover film 10, so that it is possible to ensure that the liquid does not come into contact with any material other than the material of the first cover film 10.

The conductive layer is a conductive tape 90, a connection portion 91 is integrally extended from an edge of the conductive tape 90, and the connection portion 91 is electrically connected to the second conductive line 81.

The conductive layer is a second conductive sheet 52, the second conductive sheet 52 is electrically connected to a second wire 81, an insulating connecting strip 53 is disposed at the edge of the second conductive sheet 52 and the first conductive sheet 50, and the second conductive sheet 52 is flexibly connected to the first conductive sheet 50 through the insulating connecting strip 53.

The second cover film 30 is integrally flexibly connected with a bottom cover film 31, and the second adhesive film 40 is integrally flexibly connected with a bottom adhesive film 41; a conductive adhesive layer 92 is disposed on the lower surface of the B-side electrode 72, the second conductive sheet 52 is attached to the lower surface of the B-side electrode 72 through the conductive adhesive layer 92, and the bottom adhesive film 41 and the bottom cover film 31 are sequentially attached to the lower portion of the second conductive sheet 52 from top to bottom.

The first conductive sheet 50 is bonded to the entire surface of the a-side electrode 71, and the conductive layer is bonded to the entire surface of the B-side electrode 72.

An insulating sheet 82 is provided between the first lead 80 and the second lead 81.

The edge of the first conductive sheet 50 is provided with an avoidance notch 54 for avoiding the second wire 81.

An insulating layer is coated on the second lead 81 and is positioned between the avoidance gap 54 and the front end of the second lead 81; i.e. the second wire 81 between the outside of the relief notch 54 and the contact 84 is coated with an insulating layer.

The joint 84 is provided with a reinforcing piece 83 for increasing the rigidity; the reinforcing sheet 83 can enhance the rigidity and strength of the connector 84, and facilitate the connection of the connector 84 with an external power supply.

The second cover film 30, the second adhesive film 40 and the first conductive sheet 50 which are sequentially attached from top to bottom are superposed to form the FPC flexible circuit board; both the first adhesive film 20 and the second adhesive film 40 may employ a glue film.

The first cover film 10 and the second cover film 30 both adopt a complete PI film (polyimide film) plane, and the micro-holes are processed at the central position of the first cover film 10; the adhesive layer between the first conductive sheet 50 and the second cover film 30 is referred to as a second adhesive film 40; first conductive sheet 50: as a metal supporting layer, the conductive layer also plays a role in electric conduction; conductive adhesive film 60: the function of connecting the piezoelectric ceramic 70 and electrically connecting the a-side electrode 71 of the piezoelectric ceramic 70 and the first conductive sheet 50 to conduct electricity requires the use of an adhesive having conductive properties, and the conductive adhesive film 60 may be a conductive adhesive film.

The manufacturing process of the micro-grid atomizing sheet without welding electrodes comprises the following steps:

s1: etching the center of the first conductive sheet 50 to form an etched area 51, performing electroplating treatment on the exposed area of the first conductive sheet 50 corresponding to the a-surface electrode, exposing the second adhesive film 40 in the etched area 51, and forming an avoiding notch 54 for avoiding the second lead 81 at the edge of the first conductive sheet 50; an insulating layer is coated on the second lead 81 between the outside of the avoidance gap 54 and the contact 84; the film can be PI film or silk-screen insulating oil;

s2: removing the second adhesive film 40 and the second cover film 30 at the center of the etched area 51 to form a through hole 32, wherein the area of the through hole 32 is smaller than that of the etched area 51, the integrity of the electroplated layer is ensured in the process of removing the second adhesive film 40 and the second cover film 30 to form the through hole 32, and the through hole 32 is formed in a stamping or laser cutting mode; the first conductive sheet 50 needs to be plated; maintaining the integrity of the plating of the first conductive sheet 50 when the first conductive sheet 50 and the second adhesive film 40 are removed in S2; the exposed first conductive sheet 50 needs to be plated with gold, the implementation mode of the specific plating layer is not required, and other material plating layers can be adopted to improve the corrosion resistance of the material, so that the overall service life of the micro-grid atomization sheet is prolonged.

S3: coating the periphery of a through hole 32 on the outer side surface of the second cover film 30 with the first adhesive film 20, wherein the area of the through hole 32 is prevented from being coated with adhesive; the first adhesive film 20 in S3 is an organic polymer film; the first adhesive film 20 is an epoxy resin; the first adhesive film 20 meets the temperature use range requirement of-30 ℃ to 150 ℃ or above 150 ℃; the glue has conductivity, and the temperature application range meets minus 30 ℃ to 150 ℃ or above 150 ℃;

s4: attaching the first cover film 10 to the first adhesive film 20 such that the first cover film 10 completely covers the through-hole 32 area;

s5: placing the conductive adhesive film 60 on the piezoelectric ceramic 70, and placing the product formed in S4 on the conductive adhesive film 60;

s6: electrically attaching the A-side electrode 71 to the plane of the first conductive sheet 50, and electrically attaching the B-side electrode 72 to the plane of the conductive layer; a first conductive sheet 50 electrically connected to a first wire 80 at an edge thereof, and a second conductive sheet 81 at an edge thereof; the first conductive line 80 and the second conductive line 81 are arranged side by side; an insulating sheet 82 is provided between the first lead 80 and the second lead 81;

in S6, the planar electrical connection between the B-side electrode 72 and the conductive layer is divided into two embodiments:

the conductive layer in S6 is the conductive adhesive tape 90 or the second conductive sheet 52, the edge of the conductive adhesive tape 90 integrally extends to form a connection portion 91, and the connection portion 91 is electrically connected to the second wire 81; the second conductive sheet 52 is electrically connected to the second conductive wire 81, the insulating connecting bar 53 is disposed at the edge of the second conductive sheet 52 and the first conductive sheet 50, and the second conductive sheet 52 is flexibly connected to the first conductive sheet 50 through the insulating connecting bar 53.

The first embodiment is as follows: the conductive layer is a conductive tape 90, a connection portion 91 is integrally extended from an edge of the conductive tape 90, and the connection portion 91 is electrically connected to the second conductive line 81.

The A-side electrode 71 is electrically attached to the first conducting strip 50, and the B-side electrode 72 is electrically attached to the conducting adhesive fabric 90; the first wire 80 is electrically connected to the first conductive sheet 50, and the second wire 81 is electrically connected to the conductive tape 90; the conductive layer is attached to the whole surface of the B-surface electrode 72, that is, the conductive adhesive tape 90 is attached to the whole surface of the B-surface electrode 72, so that the whole surface covering of the B-surface electrode 72 of the piezoelectric ceramic 70 is realized, and point contact can be adopted if necessary, but because the whole surface covering can also protect the B-surface electrode 72 of the piezoelectric ceramic 70, the B-surface electrode 72 is prevented from oxidation reaction, the service life of the microgrid atomizing sheet is greatly prolonged, and therefore, the whole surface covering mode is preferably used for connecting the B-surface electrode 72 of the piezoelectric ceramic 70.

In an embodiment, the welding-free electrode micro-grid atomizing sheet includes a first cover film, a first adhesive film, a second cover film, a second adhesive film, a first conductive sheet, a conductive adhesive film, a piezoelectric ceramic, and a conductive adhesive tape, which are sequentially attached from top to bottom.

Example two: in S6, the conductive layer is a second conductive sheet 52, the second conductive sheet 52 is electrically connected to the second wire 81, an insulating connecting strip 53 is disposed at the edge of the second conductive sheet 52 and the first conductive sheet 50, and the second conductive sheet 52 is connected to the first conductive sheet 50 through the insulating connecting strip 53; the second cover film 30 is integrally connected with a bottom cover film 31, and the second adhesive film 40 is integrally connected with a bottom adhesive film 41; a conductive adhesive layer 92 is disposed on the lower surface of the B-side electrode 72, and the second conductive sheet 52, the bottom adhesive film 41 and the bottom cover film 31 are sequentially attached to the lower surface of the B-side electrode 72 from top to bottom through the conductive adhesive layer 92; the conductive adhesive layer 92 and the conductive adhesive film 60 may be made of the same conductive adhesive material, such as conductive adhesive.

The surface a electrode 71 is electrically attached to the first conductive sheet 50, and the surface B electrode 72 is electrically attached to the second conductive sheet 52 through the conductive adhesive layer 92; the first conductive trace 80 is electrically connected to the first conductive sheet 50, and the second conductive trace 81 is electrically connected to the second conductive sheet 52.

The conductive layer is attached to the whole surface of the B-surface electrode 72, that is, the second conductive sheet 52 is attached to the whole surface of the B-surface electrode 72, so that the whole surface of the B-surface electrode 72 of the piezoelectric ceramic 70 is covered, and if necessary, point contact can be adopted, but because the whole surface covering can also protect the B-surface electrode 72 of the piezoelectric ceramic 70, the B-surface electrode 72 is not contacted with air at all, the B-surface electrode 72 is prevented from being oxidized, the service life of the microgrid atomizing sheet is greatly prolonged, and therefore, the whole surface covering mode is preferably used for connecting the B-surface electrode 72 of the piezoelectric ceramic 70.

An avoidance notch 54 for avoiding the second lead 81 is arranged at the edge of the first conducting strip 50; the side wall of the first conducting strip 50 is electrically connected with a first lead 80, the side wall of the conducting layer is electrically connected with a second lead 81, after all layers of the atomizing sheet are superposed and attached, the second lead 81 is positioned at the position of the avoidance gap 54, the avoidance gap 54 ensures the compactness of the superposition and attachment of all layers of the atomizing sheet, and the condition of untight attachment caused by the position interference of the second lead 81 is avoided; the second wire 81 is coated with an insulating layer, and the insulating layer is positioned between the avoidance gap 54 and the front end of the second wire 81; namely, an insulating layer is coated on the second lead 81 between the outside of the avoidance gap 54 and the joint 84; the second wire 81 between the avoiding gap 54 and the joint 84 is coated with an insulating layer in the manufacturing process, so that the A-surface electrode 71 and the B-surface electrode 72 are prevented from being short-circuited, but insulating paint does not need to be coated at the avoiding gap 54 and the joint 84, and the connection is convenient.

In the second embodiment, the micro-mesh atomization sheet without the welding electrode comprises a first cover film, a first adhesive film, a second cover film, a second adhesive film, a first conductive sheet, a conductive adhesive film, piezoelectric ceramics, a conductive adhesive layer, a second conductive sheet, a bottom adhesive film and a bottom cover film which are sequentially attached from top to bottom.

The micro-grid atomizing sheet manufactured by the traditional process needs to adopt a welding mode to electrically connect the second lead 81 with the B-surface electrode 72 of the piezoelectric ceramic 70, the A-surface electrode 71 is electrically jointed with the plane of the first conducting sheet 50, and the B-surface electrode 72 is electrically jointed with the plane of the conducting layer; the first wire 80 is electrically connected to the first conductive sheet 50, and the second wire 81 is electrically connected to the conductive layer; the first lead 80 and the second lead 81 are respectively led out from the A-surface electrode 71 and the B-surface electrode 72 of the piezoelectric ceramic 70 in a corresponding mode by adopting a laminating mode, the second lead 81 is prevented from being directly welded on the B-surface electrode 72 of the piezoelectric ceramic 70, the surface flatness of the piezoelectric ceramic 70 is ensured, the piezoelectric ceramic 70 cannot be damaged by using the laminating mode, the piezoelectric ceramic 70 is prevented from being damaged by welding, and the micro-grid atomization sheet does not need to avoid welding spots in structural design.

S7: a joint 84 is formed at the front end of the first lead 80 and the front end of the second lead 81; a reinforcing piece 83 for increasing the rigidity is arranged on the joint 84; the reinforcing sheet 83 can enhance the rigidity and strength of the connector 84, and facilitate the connection of the connector 84 with an external power supply.

The first lead 80 is electrically connected with the first conducting strip 50, and the first conducting strip 50 is electrically attached to the plane of the A-side electrode 71; the second lead 81 is electrically connected with the conductive layer, and the conductive layer is electrically attached to the plane of the B-side electrode 72; the first lead 80 and the second lead 81 are both connected with a joint 84, and the joint 84 is connected with an external power supply to supply power to the micro-grid atomizing sheet; forming a joint 84 at the front end of the first lead 80 and the front end of the second lead 81, and manufacturing two connection points on the joint 84 to form a male head of a connector as a whole; the joint 84 is provided with two connection points in total, one connection point corresponds to the A-surface electrode 71 of the piezoelectric ceramic 70, the other connection point corresponds to the B-surface electrode 72 of the piezoelectric ceramic 70, and generally, the number of the connectors is at least four, but the connector can be used only by two, and the connector is manufactured in a mode of four connection points in order to improve fault tolerance, but the two middle connection points are left empty, and the connectors with 0.5mm intervals are used for connecting the connector with the corresponding connector female seats, so that power supply to the atomization micro-grid piece is realized; other interfaces which can be easily plugged and unplugged can be used to connect the power input, and the connector has the simplest manufacturing process for the product, so the connector is recommended to be used, but can be changed into any other connection mode with the same function as the process needs.

The high-frequency driving power supply of the piezoelectric ceramic 70 can be directly welded on the FPC flexible circuit board, so that integration of the micro-grid atomizing sheet and the driving power supply can be realized, only a DC input power supply needs to be provided, and the atomizing module containing the micro-grid atomizing sheet driving power supply can be manufactured; if necessary, the driving power supply of the piezoelectric ceramic 70 can be directly integrated, so that the integration level of the product is greatly improved, and the volume of the final product of the micro-grid atomizer is further reduced.

S8: putting the product formed in the step S7 into a press machine, simultaneously heating the press machine to 80-150 ℃ under the pressure of 6-15 MPa to press the product, and continuing for 100-300 seconds; the first cover film 10, the first adhesive film 20, the second cover film 30, the second adhesive film 40, and the first conductive sheet 50 each have a protrusion 100 formed at a central position thereof toward the conductive adhesive film 60; the protrusions 100 of the first conductive sheet 50 can provide better supporting function, and the first cover film 10 and the second cover film 30 are prevented from rebounding; the height of the protrusions 100 is 0.5 times of the total thickness of the micro-mesh atomizing sheet.

Specifically, placing a silica gel gasket on the upper side and the lower side of the product obtained in the step S7, then placing the product into a press machine, heating the product to 80-150 ℃ at the same time by the press machine under the pressure of 6-15 MPa, and pressing the product for 100-300 seconds; the protrusions 100 give surface tension to the first cover film 10 and the second cover film 30 so that resonance efficiency is effectively improved, thereby improving resonance uniformity.

A bulge 100 is formed in the middle of the micro-grid atomizing sheet after hot pressing under the action of extrusion force, the height of the bulge 100 is 0.5 times of the total thickness of the micro-grid atomizing sheet, the bulge 100 deforms and stretches the PI film, so that the self elastic modulus of the PI film is consumed due to over-stretching, at the moment, the ultrasonic wave of the piezoelectric ceramic 70 forms a surface tension wave with a sine wave shape on the surface of the film, the wave shape wavelength is equal to the transmission speed of the ultrasonic wave in the PI material divided by the oscillation frequency of the piezoelectric ceramic 70, and the amplitude is 1/2 of the wavelength, so that the resonance efficiency is improved; the coupling state of the PI film plane without the shape is loose, the energy of ultrasonic waves is consumed and converted into heat because of the elastic modulus of the PI film, so that the energy of the ultrasonic waves is not effectively utilized, only a few excess energy exceeding the deformation energy of the elastic modulus can form surface tension waves, the amplitude of the waveform is extremely low, the atomizing holes cannot effectively compress liquid, even tension waves can not be generated on the PI film of the micro-grid atomizing sheet at the discrete error part, namely the waveform of ultrasonic vibration is completely converted into heat by the elastic modulus of the PI film, and finally, defective products are generated, so that the extrusion filling of the silica gel gasket in the hot pressing process is very important for shaping the first conducting sheet 50 and the PI film.

S9: uniformly drilling a plurality of atomization micropores 11 on the first covering film 10 by using a laser machine for the product pressed in the step S8;

s10: and (5) carrying out power-on detection on the product obtained in the step (S9) to obtain a qualified product.

The first cover film 10 and the second cover film 30 are both PI films; the PI film is a polyimide film.

The aperture of the atomization micropores 11 is micron-sized; the micron-sized pores have a conical structure (trumpet-shaped), such as a cone shape, the pore diameter of the atomizing micropores gradually decreases from the first cover film to the conductive layer, and the small surface of the atomizing micropores 11 faces the direction of the piezoelectric ceramic 70.

The through hole 32 is formed by removing the second adhesive film 40 and the second cover film 30 from the center of the etched area 51, the through hole 32 area of the second cover film 30 is not covered by the second adhesive film 40, the first cover film 10 and the second cover film 30 are independent, and no material is in contact with the first adhesive film 20 and the second adhesive film 40 in the through hole 32 areas of the piezoelectric ceramic 70, the conductive adhesive film 60 and the first conductive sheet 50, so that liquid is not in contact with any material except the material of the first cover film 10, and the defect of rough surface of the micro-grid atomized sheet can be improved by adding the first cover film 10.

The usage method and the principle of the micro-grid atomizing sheet without the welding electrode are as follows:

the piezoelectric ceramic is provided with an A-surface electrode and a B-surface electrode, the A-surface electrode is electrically attached to the plane of the first conducting sheet, and the B-surface electrode is electrically attached to the plane of the conducting layer; the edge of the first conducting strip is electrically connected with a first lead, and the edge of the conducting layer is electrically connected with a second lead; the first conducting wire and the second conducting wire are distributed side by side; the high-frequency alternating voltage is connected between the electrode on the surface A and the electrode on the surface B of the piezoelectric ceramic, the frequency and the peak value of the alternating voltage are adjusted according to the working performance of the piezoelectric ceramic, the piezoelectric ceramic is controlled by an external electric field to generate regular deformation consistent with the input frequency, the first conducting plate and the PI film are pressed into a whole, therefore, the deformation energy of the copper foil is concentrated on the PI film, the center of the PI film is provided with a bulge, the processed micron-sized small holes 4 are all in the bulge area, the bulge area generates reciprocating motion consistent with the input frequency at the moment, the motion direction is vertical to the surface of the micro-grid atomizing sheet, the upper surface (namely, the surface far away from the first conducting plate) of the organic polymer film is contacted with the liquid to be atomized, and the liquid is sprayed along the positions of the holes under the condition of being extruded by the organic polymer film; liquid removes to first conducting strip direction by organic polymer membrane promptly, because the micron order aperture is the toper structure, this atomizing micropore aperture is reduced to the conducting layer direction by first cover film gradually, and the little one end in this atomizing micropore aperture is towards piezoceramics direction, therefore liquid more toward the lower surface of organic polymer membrane (be close to first conducting strip one side promptly) the motion the extrusion force that receives more big more, liquid also passes through the micron order aperture on the organic polymer membrane more easily to form water smoke.

The design of the utility model is characterized in that, according to the technical scheme, the A-side electrode is electrically attached to the plane of the first conducting strip, and the B-side electrode is electrically attached to the plane of the conducting layer; the first conducting wire is electrically connected with the first conducting strip, and the second conducting wire is electrically connected with the conducting layer; the damage to the piezoelectric ceramics during welding is avoided, so that the surface of the piezoelectric ceramics is smooth, and the limitation of the welding spot position on the structural design is avoided; the micro-grid atomizing sheet is high in sealing performance and uniform in stress, and water leakage is prevented; the connection point of the power supply input does not need to be specially manufactured, and the connection with the power supply is simple and easy to assemble; the B-surface electrode of the piezoelectric ceramic is covered by the whole conductive layer and is not contacted with air completely, so that the B-surface electrode of the piezoelectric ceramic is prevented from being oxidized, and the service life of the micro-grid atomization sheet is greatly prolonged; the manufacturing process is extremely simplified, and the large-scale manufacturing is convenient.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modification, equivalent change and modification made to the above embodiments by the technical essence of the present invention are all within the scope of the technical solution of the present invention.

Claims (15)

1. A micro-grid atomizing sheet without welding electrodes is characterized in that; the piezoelectric ceramic comprises a first conducting strip, piezoelectric ceramic and a conducting layer which are distributed from top to bottom, wherein the piezoelectric ceramic is provided with an A-surface electrode and a B-surface electrode, the A-surface electrode is electrically attached to the plane of the first conducting strip, and the B-surface electrode is electrically attached to the plane of the conducting layer; the first conducting strip is electrically connected with a first lead, the conducting layer is electrically connected with a second lead, and the first lead and the second lead extend out of the atomizing sheet.

2. The micro-grid atomizing patch without a welding electrode as set forth in claim 1, wherein: the first cover film, the first adhesive film, the second cover film and the second adhesive film are sequentially attached from top to bottom, and the second adhesive film is attached to the upper surface of the first conducting strip; a conductive adhesive film is provided between the first conductive sheet and the piezoelectric ceramic.

3. The micro-grid atomizing patch without a welding electrode as set forth in claim 2, wherein: the conducting layer is a conducting adhesive tape, the edge of the conducting adhesive tape integrally extends to form a connecting part, and the connecting part is electrically connected with the second lead.

4. The micro-grid atomizing patch without a welding electrode as set forth in claim 2, wherein: the conducting layer is a second conducting strip which is electrically connected with the second conducting wire, an insulating connecting strip is arranged at the edge of the second conducting strip and the edge of the first conducting strip, and the second conducting strip is flexibly connected with the first conducting strip through the insulating connecting strip.

5. The welding-free electrode microgrid atomizing plate of claim 4, characterized in that: the second cover film is integrally and flexibly connected with a bottom cover film, and the second adhesive film is integrally and flexibly connected with a bottom adhesive film; and a conductive adhesive layer is arranged on the lower surface of the B-surface electrode, the second conductive sheet is attached to the lower surface of the B-surface electrode through the conductive adhesive layer, and the bottom adhesive film and the bottom cover film are sequentially attached to the lower part of the second conductive sheet from top to bottom.

6. The micro-grid atomizing patch without a welding electrode as set forth in claim 1, wherein: the first conducting wire and the second conducting wire are distributed side by side, and the front end of the first conducting wire and the front end of the second conducting wire are combined to form a joint.

7. The micro-grid atomizing patch without a welding electrode as set forth in claim 1, wherein: the first conducting strip is attached to the whole surface of the electrode on the surface A, and the conducting layer is attached to the whole surface of the electrode on the surface B.

8. The welding-electrode-free micro-grid atomization sheet as claimed in claim 1, wherein: an insulating sheet is arranged between the first lead and the second lead.

9. The welding-free electrode microgrid atomizing plate of claim 4, characterized in that: and an avoidance notch for avoiding the second wire is arranged at the edge of the first conducting strip.

10. The welding electrode-free microgrid atomizing plate of claim 9, wherein: and the second lead is coated with an insulating layer, and the insulating layer is positioned between the avoiding notch and the front end of the second lead.

11. The welding-electrode-free micro-grid atomization sheet as claimed in claim 6, wherein: and a reinforcing sheet for increasing the hardness is arranged on the joint.

12. The micro-grid atomizing patch without a welding electrode as set forth in claim 2, wherein: an etching area is arranged at the central position of the first conducting strip, and a through hole with the area smaller than that of the etching area is arranged at the central position of the corresponding etching area on the second covering film; the first cover film is provided with atomization micropores corresponding to the through holes.

13. The welding-electrode-free microgrid atomizing plate of claim 12, wherein: the atomizing micropores are in a conical structure, the aperture of each atomizing micropore is gradually reduced from the first covering film to the conducting layer, and the small end of each atomizing micropore faces the first conducting strip; the aperture of the atomization micropore is micron-sized.

14. The micro-grid atomizing patch without a welding electrode as set forth in claim 2, wherein: and the second cover film, the second adhesive film and the first conducting strip which are sequentially attached from top to bottom are overlapped to form the FPC flexible circuit board.

15. The welding-free electrode microgrid atomizing plate of claim 4, characterized in that: the first conducting sheet and the second conducting sheet are made of copper foils or stainless steel sheets.

Images