CN115534479A - 一种导热相变化复合材料结构和设备 - Google Patents
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Abstract
本发明涉及一种导热相变化复合材料结构和设备。该导热相变化复合材料结构包括第一导热材料层、高分子增强基材层和第二导热材料层。第一导热材料层、高分子增强基材层和第二导热材料层由上至下依次排布。第一导热材料层的第一面贴合高分子增强基材层的第一面,第二导热材料层的第一面贴合高分子增强基材层的第二面。这种导热相变化复合材料结构不仅可达到优异的电气绝缘、耐刺穿、贴合性强等效果,且能够有效降低接触热阻,提升热传导效率,长期使用可靠性高。
Description
技术领域
本发明涉及散热领域,更具体地说,涉及一种导热相变化复合材料结构和设备。
背景技术
一般地,电子电路中常用的功率器件,比如MOSFET管或IGBT模块等,在长期运行过程中会因自身损耗而引起结温上升,这将严重影响产品的使用寿命及其质量安全。针对此问题,传统解决办法主要有以下几种:
第一种,在MOSFET管或IGBT模块上加装散热器,选用陶瓷片和导热硅脂作为界面填充介质,并用螺丝锁固,以此达到良好导热及绝缘耐压的应用要求,但这种散热方案普遍存在几点问题:首先,在长期高温应用环境下,导热硅脂会因内部小分子硅氧烷挥发而引起表面浸润性变差,甚至最终粉化、变干,造成接触热阻增加,降低了热传导效率和使用寿命,可靠性欠佳。其次,陶瓷片一般常用的材质有氧化铝、氮化铝,其材质硬而脆,韧性较差;在锁螺丝装配过程中,会因受力过大或者受力不均而发生断裂,从而产生间隙,阻断了正常的导热通路,从而影响散热及绝缘耐压特性。
第二种,在MOSFET管或IGBT模块上加装散热器,选用导热矽胶布(业内有的称之为导热绝缘片)作为界面填充介质,最后用螺丝锁固,以此达到良好导热及绝缘耐压的应用要求,但这种散热方案同样普遍存在几点问题:首先,导热矽胶布表面无粘性且浸润性欠佳,与所接触界面间贴合性不好,界面接触热阻较大。此外,MOSFET管或IGBT模块一般都有标准封装要求,如TO220、TO247等,器件表面会有孔位,方便螺丝固定,但由于导热矽胶布表面无粘性,在装配过程中无法达到预固定的效果,易造成孔位对齐偏差,影响生产效率。其次,为解决上述表面粘性及难对位的问题,也有的尝试在导热矽胶布单面或者双面采用背胶的方式,但同样会因多附加了一层压敏胶而引起材料自身导热性能的大幅衰减,增大了热阻,不利于高效散热。
第三种,在MOSFET管或IGBT模块上加装散热器,选用导热垫片作为界面填充介质,最后用螺丝锁固,以此达到良好导热及绝缘耐压的应用要求,但这种散热方案同样普遍存在几点问题:首先,为保证功率模块与散热器的紧密接触,锁螺丝过程中所施加的扭力较大,而导热垫片硬度偏软,硬度等级一般为Shore OO(参考标准ASTM D2240),在装配过程中极易压缩变形,甚至有压烂/压破的风险,进而会影响其正常导热及绝缘耐压特性。其次,用于此应用场景下的导热垫片,其厚度一般较厚(1mm及以上),热阻较大,不利于快速散热。
发明内容
本发明要解决的技术问题在于,针对现有技术的上述传统导热材料存在的热传导效率低、接触热阻随使用时长增加、与接触界面贴合性低和可靠性低等缺陷,提供一种导热相变化复合材料结构和设备。
本发明解决其技术问题所采用的技术方案是:构造一种导热相变化复合材料结构,包括第一导热材料层、高分子增强基材层和第二导热材料层;所述第一导热材料层、所述高分子增强基材层和所述第二导热材料层由上至下依次排布;
所述第一导热材料层的第一面贴合所述高分子增强基材层的第一面,所述第二导热材料层的第一面贴合所述高分子增强基材层的第二面。
进一步,在本发明所述的导热相变化复合材料结构中,所述第一导热材料层和所述第二导热材料层为相变化导热材料层。
进一步,在本发明所述的导热相变化复合材料结构中,所述相变化导热材料层由基础聚合物、导热填料和至少一种添加剂构成;其中,所述基础聚合物包括长链高分子结构。
进一步,在本发明所述的导热相变化复合材料结构中,所述高分子增强基材层为玻璃纤维层和/或聚酰亚胺层。
进一步,在本发明所述的导热相变化复合材料结构中,所述第一导热材料层和所述第二导热材料层通过涂布方式和/或压延方式敷设在所述高分子增强基材层的表面。
进一步,在本发明所述的导热相变化复合材料结构中,所述导热相变化复合材料结构的厚度小于0.5㎜;所述导热相变化复合材料结构的厚度与热阻呈正相关关系,所述导热相变化复合材料结构的厚度与热传导效率呈反相关关系。
进一步,在本发明所述的导热相变化复合材料结构中,所述导热相变化复合材料结构还包括第一离型膜层和第二离型膜层;所述第一离型膜层附在所述第一导热材料层的第二面,所述第二离型膜层附在所述第二导热材料层的第二面。
进一步,在本发明所述的导热相变化复合材料结构中,所述离型膜层为聚乙烯离型膜层和/或聚对苯二甲酸乙二醇酯离型膜层。
另外,本发明还提供一种设备,包括功率器件、散热器和如上述的导热相变化复合材料结构;所述导热相变化复合材料结构在所述功率器件和所述散热器之间,所述导热相变化复合材料贴合所述功率器件和所述散热器。
进一步,在本发明所述的设备中,所述设备为通信基站,所述功率器件包括MOSFET管和/或IGBT模块。
实施本发明的一种导热相变化复合材料结构和设备,具有以下有益效果:
这种导热相变化复合材料结构具有优异的电气绝缘、耐刺穿、贴合性强等性能,不仅能够有效降低接触热阻,提升热传导效率,而且长期使用可靠性高。
附图说明
下面将结合附图及实施例对本发明作进一步说明,附图中:
图1是本发明导热相变化复合材料结构的结构示意图;
图2是本发明导热相变化复合材料结构的结构示意图。
具体实施方式
为了对本发明的技术特征、目的和效果有更加清楚的理解,现对照附图详细说明本发明的具体实施方式。
在一个优选实施例中,参考图1,本实施例的导热相变化复合材料结构包括第一导热材料层10、高分子增强基材层20和第二导热材料层30。第一导热材料层10、高分子增强基材层20和第二导热材料层30由上至下依次排布。第一导热材料层10的第一面贴合高分子增强基材层20的第一面,第二导热材料层30的第一面贴合高分子增强基材层20的第二面。
本实施例中,由于高分子增强基材层20保证了导热相变化复合材料结构优异的电气绝缘、耐压裂和耐刺穿等效果,导热材料层保证了导热相变化复合材料结构与功率器件和散热器之间的强贴合效果,导热相变化复合材料结构有效降低了接触热阻,提升热传导效率,且不受因长期使用导致可靠性降低的影响。
在一些实施例的导热相变化复合材料结构中,第一导热材料层10和第二导热材料层30为相变化导热材料层。
本实施例中,相变化导热材料层能够在温度上升时吸收功率器件产生的热量,在达到相变温度点后其物理形态将由固态变为黏流态,增强了导热相变化复合材料结构自身的浸润能力,使得贴合效果更佳,从而降低热阻,提升热传导效率。
在一些实施例的导热相变化复合材料结构中,相变化导热材料层由基础聚合物、导热填料和至少一种添加剂构成;其中,基础聚合物包括长链高分子结构。具体地,相变化导热材料层中的基础聚合物内部为长链高分子结构,且分子链与分子链之间高密度交联。
本实施例中,相变化导热材料层中分子链与分子链之间的高密度交联降低了小分子挥发的风险,使得导热相变化复合材料结构长期使用也不会出现类似导热硅脂粉化和变干现象,进一步提高了导热相变化复合材料结构的稳定性和可靠性。
在一些实施例的导热相变化复合材料结构中,高分子增强基材层20为玻璃纤维层和/或聚酰亚胺层。具体地,高分子增强基材层20可以由玻璃纤维或者聚酰亚胺薄膜等构成。
本实施例中,高分子增强基材层20能够有效保证导热相变化复合材料结构的电气绝缘性能和机械性能,能够有效降低器件短路风险,增强导热相变化复合材料结构在装配过程中耐压裂、耐刺穿等特性。
在一些实施例的导热相变化复合材料结构中,第一导热材料层10和第二导热材料层30通过涂布方式和/或压延方式敷设在高分子增强基材层20的表面。具体地,导热材料层可以通过包括但不限于涂布、压延的特殊加工工艺铺设在高分子增强基材层20的上下表面。
本实施例中,导热相变化复合材料结构通过采用涂布方式或者压延方式等特殊加工工艺将导热材料层和高分子增强基材层20有机整合在一起,既有利于做成片材,方便使用,还能满足不同的封装需求,提高产线生产效率。
在一些实施例的导热相变化复合材料结构中,导热相变化复合材料结构的厚度小于0.5㎜。导热相变化复合材料结构的厚度与热阻呈正相关关系,导热相变化复合材料结构的厚度与热传导效率呈反相关关系。具体地,第一导热材料层10、第二导热材料层30和高分子增强基材层20的总厚度可以为0.05㎜、0.07㎜、0.15mm或者0.2mm等。导热相变化复合材料结构的厚度越薄,相应地,热阻就越低,热传导效率就越高;反之,厚度越大,相应地,热阻越高,热传导效率越低。
本实施例中,较薄的厚度使得导热相变化复合材料结构自身热阻较低,有利于热量快速传输,提高了导热相变化复合材料结构的热传导效率。
在一些实施例的导热相变化复合材料结构中,参考图2,导热相变化复合材料结构还包括第一离型膜层40和第二离型膜层50。第一离型膜层40附在第一导热材料层10的第二面,第二离型膜层50附在第二导热材料层30的第二面。具体地,在使用导热相变化复合材料结构时,先撕掉第一离型膜层40,接着,将第一导热材料层10的第二面贴合在洁净的散热器表面,并轻轻按压第二离型膜层50,以便于导热相变化复合材料结构与散热器紧密接触并达到预固定的效果,然后,撕掉第二离型膜层50,最后,将功率器件贴在第二导热材料层30的第二面,并用螺丝将功率器件、散热器和导热相变化复合材料结构锁固。
本实施例中,由于导热材料层具有弱粘性,离型膜层不仅能够使导热相变化复合材料结构在使用上更加方便,还能够防止水汽、灰尘等污染,有效保护导热相变化复合材料结构。
在一些实施例的导热相变化复合材料结构中,离型膜层为聚乙烯离型膜层和/或聚对苯二甲酸乙二醇酯离型膜层。具体地,离型膜层可以由包括但不限于聚乙烯离型膜(PE离型膜)和/或聚对苯二甲酸乙二醇酯离型膜(PET离型膜)构成。
本实施例中,离型膜层不仅能够使导热相变化复合材料结构在使用上更加方便,还能够防止水汽、灰尘等污染,有效保护导热相变化复合材料结构。
在一个优选实施例中,本发明还提供一种设备,包括功率器件、散热器和如上述的导热相变化复合材料结构;导热相变化复合材料结构在功率器件和散热器之间,导热相变化复合材料贴合功率器件和散热器。
本实施例中,导热相变化复合材料结构作为功率器件和散热器之间的界面填充介质,在吸热达到相变温度点后,导热相变化复合材料结构的导热材料层由固态变为黏流态,这种通过改善材料自身的浸润能力,使得填补缝隙的效果更佳,导热相变化复合材料结构因而能够更好的贴合功率器件及散热器的接触界面,进而降低热阻、提升功率器件与散热器间的热传导效率。
在一些实施例的设备中,该设备为通信基站,功率器件包括MOSFET管和/或IGBT模块。
本实施例中,导热相变化复合材料结构作为通信基站中的功率器件和散热器之间的界面填充介质,在吸热达到相变温度点后,导热相变化复合材料结构的导热材料层由固态变为黏流态,这种通过改善材料自身的浸润能力,使得填补缝隙的效果更佳,导热相变化复合材料结构因而能够更好的贴合功率器件及散热器的接触界面,进而降低热阻、提升功率器件与散热器间的热传导效率。
以上实施例只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人士能够了解本发明的内容并据此实施,并不能限制本发明的保护范围。凡跟本发明权利要求范围所做的均等变化与修饰,均应属于本发明权利要求的涵盖范围。
Claims (10)
1.一种导热相变化复合材料结构,其特征在于,包括第一导热材料层(10)、高分子增强基材层(20)和第二导热材料层(30);所述第一导热材料层(10)、所述高分子增强基材层(20)和所述第二导热材料层(30)由上至下依次排布;
所述第一导热材料层(10)的第一面贴合所述高分子增强基材层(20)的第一面,所述第二导热材料层(30)的第一面贴合所述高分子增强基材层(20)的第二面。
2.根据权利要求1所述的导热相变化复合材料结构,其特征在于,所述第一导热材料层(10)和所述第二导热材料层(30)为相变化导热材料层。
3.根据权利要求2所述的导热相变化复合材料结构,其特征在于,所述相变化导热材料层由基础聚合物、导热填料和至少一种添加剂构成;其中,所述基础聚合物包括长链高分子结构。
4.根据权利要求1所述的导热相变化复合材料结构,其特征在于,所述高分子增强基材层(20)为玻璃纤维层和/或聚酰亚胺层。
5.根据权利要求1所述的导热相变化复合材料结构,其特征在于,所述第一导热材料层(10)和所述第二导热材料层(30)通过涂布方式和/或压延方式敷设在所述高分子增强基材层(20)的表面。
6.根据权利要求1所述的导热相变化复合材料结构,其特征在于,所述导热相变化复合材料结构的厚度小于0.5㎜;所述导热相变化复合材料结构的厚度与热阻呈正相关关系,所述导热相变化复合材料结构的厚度与热传导效率呈反相关关系。
7.根据权利要求1所述的导热相变化复合材料结构,其特征在于,所述导热相变化复合材料结构还包括第一离型膜层(40)和第二离型膜层(50);所述第一离型膜层(40)附在所述第一导热材料层(10)的第二面,所述第二离型膜层(50)附在所述第二导热材料层(30)的第二面。
8.根据权利要求7所述的导热相变化复合材料结构,其特征在于,所述离型膜层为聚乙烯离型膜层和/或聚对苯二甲酸乙二醇酯离型膜层。
9.一种设备,其特征在于,包括功率器件、散热器和权利要求1-6任一所述的导热相变化复合材料结构;所述导热相变化复合材料结构在所述功率器件和所述散热器之间,所述导热相变化复合材料贴合所述功率器件和所述散热器。
10.根据权利要求9所述的设备,其特征在于,所述设备为通信基站,所述功率器件包括MOSFET管和/或IGBT模块。
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CN116814225A (zh) * | 2023-08-31 | 2023-09-29 | 北京智慧能源研究院 | 适用高寒高海拔地区高导热复合结构储热材料及制备方法 |
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