CN115500011A - Positioning method for DPC ceramic substrate processing - Google Patents
Positioning method for DPC ceramic substrate processing Download PDFInfo
- Publication number
- CN115500011A CN115500011A CN202211366644.3A CN202211366644A CN115500011A CN 115500011 A CN115500011 A CN 115500011A CN 202211366644 A CN202211366644 A CN 202211366644A CN 115500011 A CN115500011 A CN 115500011A
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- Prior art keywords
- exposure
- substrate processing
- positioning
- ceramic substrate
- positioning method
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Abstract
The invention discloses a positioning method for DPC ceramic substrate processing, relates to the field of semiconductor processing, and aims to solve the problem of no-mark point positioning during secondary exposure, and the technical scheme key points are as follows: a positioning method for DPC ceramic substrate processing comprises the following steps: a. punching a positioning hole on the ceramic chip; b. pasting a dry film on the ceramic chip; c. carrying out first exposure according to the positioning hole; d. standing for 15min after exposure for development; e. marking points are left after the development is finished; f. carrying out pattern electroplating and film removing etching; g. carrying out secondary exposure according to the left mark points and carrying out film pasting and selective exposure on the places needing thickening; h. after the exposure is finished, standing for 15 minutes again for development; i. and electroplating and thickening the exposed area after developing. The positioning method for DPC ceramic substrate processing can realize accurate positioning of secondary exposure and has good identification effect.
Description
Technical Field
The invention relates to the field of DPC ceramic substrate processing, in particular to a positioning method for DPC ceramic substrate processing.
Background
DPC is also called Direct Plated Copper ceramic substrate (Direct Plated coater). The LED heat dissipation substrate is mainly applied to semiconductor refrigerators, optical communication modules, LED heat dissipation substrates, solar cell modules and the like. The process comprises the steps of firstly, preprocessing and cleaning a ceramic substrate, depositing a Ti/Cu layer on the surface of the substrate by a vacuum sputtering mode to be used as a seed layer, then, completing circuit manufacturing by photoetching, developing and etching processes, finally, increasing the thickness of a circuit by an electroplating mode, and completing substrate manufacturing after photoresist is removed.
The package substrate is a key link for connecting the internal and external heat dissipation paths, and can provide the effects of electric connection, protection, support, heat dissipation, assembly and the like for the chip. With the technology upgrading in recent years, the input power of the chip is higher and higher, and for high power products, the package substrate of the DPC ceramic substrate is required to have the characteristics of high electrical insulation, high thermal conductivity, thermal expansion coefficient matching with the chip, and the like, and the DPC ceramic substrate meets the requirement. First, the base material ceramic: compared with other metal materials or resin materials, the ceramic has the characteristics of good corrosion resistance, high mechanical strength, strong insulating property, simple processing technology and the like; in addition, the DPC adopts a special manufacturing process of magnetron sputtering and pattern electroplating: can realize a fine circuit with a diameter of 50 μm or less, and can achieve both precision and performance.
The existing DPC process is basically mature, but some industrial problems still exist, wherein the phenomenon of secondary exposure alignment dislocation is obvious, and aiming at the problem, the existing method is to grab the mark points after primary exposure after secondary film pasting, but because the surface of the product after primary exposure does not have the mark points, the alignment exposure cannot be carried out, the method is not suitable for the requirement of large-scale mass production, and the process is difficult to avoid to become the bottleneck of the whole process.
Therefore, a new solution is needed to solve this problem.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a positioning method for DPC ceramic substrate processing, which can perform mark point positioning through an initially arranged positioning hole during secondary exposure by adding a step of punching the positioning hole before pasting, and has high identification efficiency.
The technical purpose of the invention is realized by the following technical scheme: a positioning method for DPC ceramic substrate processing is characterized by comprising the following steps:
a. punching a positioning hole on the ceramic chip;
b. sticking a dry film on the ceramic chip;
c. carrying out first exposure according to the positioning hole;
d. standing for 15min after exposure for development;
e. marking points are left after the development is finished;
f. carrying out pattern electroplating and film removing etching;
g. carrying out secondary exposure according to the left mark points and carrying out film pasting and selective exposure on the places needing thickening;
h. after the exposure is finished, standing for 15 minutes again for development;
i. and electroplating and thickening the exposed area after development.
By adopting the technical scheme, the process of punching the positioning holes on the ceramic chip is added before the dry film is pasted on the ceramic chip, the positioning holes are arranged at four corners of the ceramic chip, each corner can be provided with two positioning holes, a punching drawing can be selected for punching the positioning holes before pretreatment, the positioning holes are used as mark points for first exposure after pretreatment, the phenomenon that the whole deviation of a graph area occurs, normal follow current is generated after the process, the mark points left by first exposure and development are used as references for grabbing when the secondary film pasting exposure is carried out after film stripping and etching, and the positioning is accurate.
The invention is further configured to: after the step a, punching a positioning hole, and filling rubber materials into the hole.
By adopting the technical scheme, the rubber material is filled in the positioning hole so as to avoid the shielding of the positioning hole in the subsequent step, and the mark point can not be identified with probability during the secondary exposure, so that the positioning hole can be prevented from being covered by the filling of the rubber material, and the rubber material can not be influenced by the subsequent process.
The invention is further configured to: the color of the rubber material is different from that of the ceramic chip.
By adopting the technical scheme, the color of the rubber material is set to be different from that of the ceramic chip mainly for distinguishing, if the colors are similar, the situation that the rubber material cannot be identified can still occur, so that the different colors are set for conveniently identifying the positioning holes as the marking points, the identification efficiency is improved, and the color which is greatly different from that of the ceramic chip is preferably adopted.
The invention is further configured to: the rubber material is red or black.
By adopting the technical scheme, the rubber material is ideally set to be red or black, and the red and black light reflecting effects are good and can be identified more easily; of course, other colors having high reflectivity may be used.
The invention is further configured to: after the step a, punching a positioning hole, and filling a soluble material in the hole.
Through adopting above-mentioned technical scheme, after having beaten the locating hole, at downthehole filling solubility material that can be heated, the solubility material is in order can stably fill in the locating hole when filling the locating hole, and when the material in the locating hole was got rid of to needs, can dissolve solubility material through the dissolving mode, just so can be very convenient get rid of the material in the locating hole, the solubility material can choose for use to be heated to melt or vaporize, perhaps can dissolve the reagent that runs off through chemical reagent.
The invention is further configured to: the soluble material is paraffin.
By adopting the technical scheme, the soluble material is selected as the paraffin mainly because the paraffin can not cause physical or chemical damage to the ceramic chip when filling the positioning hole, and meanwhile, when the ceramic chip is cleaned at the later stage, the paraffin can be directly dissolved and washed away by higher water temperature, so that the method is very convenient and trouble-saving.
The invention is further configured to: the color of the paraffin is red.
By adopting the technical scheme, the color of the paraffin is set to be red, which is mainly convenient to be used as a mark point for identification, and the red paraffin is easy to obtain, so that the cost is saved.
The invention is further configured to: and c, completely covering the positioning hole when the dry film is pasted in the step b.
By adopting the technical scheme, the positioning hole is completely covered when the dry film is adhered in the step b, so that the filled material can be retained in the positioning hole until the material is removed when the material is finally required to be removed.
The invention is further configured to: and (4) manually removing residues in the positioning holes after the step i.
By adopting the technical scheme, the positioning holes can be cleaned manually after the ceramic chip is processed, so that products which meet the requirements and are required by production can be obtained.
In conclusion, the invention has the following beneficial effects: through increase the step of making the locating hole before the paster, can carry out mark point location through the locating hole of initial setting when the secondary exposure, recognition efficiency is high, and pack corresponding material in this locating hole, avoid the locating hole to be covered or fuzzification when adding man-hour, no matter the material in the locating hole is rubber material or soluble material paraffin simultaneously, can not cause physics or chemical damage to the ceramic chip, simultaneously the homoenergetic enough very convenient quilt is taken out, moreover, the steam generator is simple in structure, and convenient for operation, counterpoint exposure efficiency is high like this, can accord with the demand of extensive volume production.
Detailed Description
The present invention will be described in detail with reference to examples.
The first embodiment is as follows: a positioning method for DPC ceramic substrate processing is characterized by comprising the following steps:
a. punching a positioning hole on the ceramic chip;
b. sticking a dry film on the ceramic chip;
c. carrying out first exposure according to the positioning hole;
d. standing for 15min after exposure for development;
e. marking points are left after the development is finished;
f. carrying out pattern electroplating and film removing etching;
g. carrying out secondary exposure according to the left mark points and carrying out film pasting and selective exposure on the places needing thickening;
h. after the exposure is finished, standing for 15 minutes again for development;
i. and electroplating and thickening the exposed area after developing.
The method is characterized in that a process of punching positioning holes in the ceramic chip is added before a dry film is pasted on the ceramic chip, the positioning holes are formed in four corners of the ceramic chip, two positioning holes can be formed in each corner, a punching drawing can be selected for punching the positioning holes before pretreatment, the positioning holes are used as mark points for first exposure after pretreatment, integral deviation of a graphic area is avoided, normal follow current is carried out in the later process, the mark points left by first exposure and development are used as reference for grabbing when secondary film pasting exposure is carried out after film stripping and etching, and positioning is accurate.
After the step a, punching the positioning hole, and filling a rubber material into the positioning hole, so that the rubber material is filled into the positioning hole to avoid the shielding of the positioning hole in the subsequent step, and thus, the mark point cannot be identified in the secondary exposure, so that the positioning hole can be prevented from being covered by the filling of the rubber material, and the rubber material cannot be influenced by the subsequent process; the rubber material can be red or black, and the ideal scheme is to set the rubber material to be red or black, so that the red and black light reflecting effects are good, and the rubber material is easier to identify; of course, other colors with high reflectivity can be adopted;
and completely covering the positioning hole when the dry film is pasted in the step b; b, completely covering the positioning hole when the dry film is pasted in the step b, so that the filled material can be retained in the positioning hole and removed until the material is finally removed; and (5) simultaneously, manually removing residues in the positioning holes after the step i, and cleaning the positioning holes manually after the ceramic chips are processed, so that products meeting the requirements required by production are obtained.
More than through increase the step of beating the locating hole before the paster, can carry out mark point location through the locating hole of initial setting when the secondary exposure, recognition efficiency is high, and pack corresponding material in this locating hole, avoid the locating hole to be covered or fuzzification when adding man-hour, the material in the locating hole is rubber materials simultaneously, can not cause physics or chemical damage to the ceramic chip, the quilt that the while homoenergetic is very convenient is taken out, moreover, the steam generator is simple in structure, and convenient for operation, it is efficient to counterpoint exposure like this, can accord with the demand of extensive volume production.
The second embodiment: a positioning method for DPC ceramic substrate processing is characterized by comprising the following steps:
a. punching a positioning hole on the ceramic chip;
b. sticking a dry film on the ceramic chip;
c. carrying out first exposure according to the positioning hole;
d. standing for 15min after exposure for development;
e. marking points are left after the development is finished;
f. carrying out pattern electroplating and film removing etching;
g. carrying out secondary exposure according to the left mark points and carrying out film pasting and selective exposure on the places needing thickening;
h. after the exposure is finished, standing for 15 minutes again for development;
i. and electroplating and thickening the exposed area after developing.
The process for punching the positioning holes in the ceramic chip is added before the ceramic chip is pasted with the dry film, the positioning holes are formed in four corners of the ceramic chip, each corner can be provided with two positioning holes, a punching drawing can be selected for punching the positioning holes before pretreatment, the positioning holes are used as mark points for first exposure after pretreatment, the phenomenon that a graphic area is wholly deviated is avoided, normal follow current is carried out in the later process, the mark points left by first exposure and development are used as references for grabbing during the second film pasting exposure after film stripping and etching, and the positioning is accurate.
After the step a, punching a positioning hole, and filling a soluble material in the hole; after the positioning hole is punched, a material which can be heated and dissolved is filled in the hole, the soluble material is used for being stably filled in the positioning hole when the positioning hole is filled, and when substances in the positioning hole need to be removed, the soluble material can be dissolved in a dissolving mode, so that the substances in the positioning hole can be conveniently removed, and the soluble material can be selected from a reagent which is heated to be melted or vaporized or can be dissolved and lost through a chemical reagent; of course the soluble material may be chosen to be paraffin; the paraffin does not cause physical or chemical damage to the ceramic chip when filling the positioning hole, and meanwhile, the paraffin can be directly dissolved and washed away by higher water temperature when the ceramic chip is cleaned at the later stage, so that the method is very convenient and trouble-saving; the color of the paraffin wax may be chosen to be red; the method is mainly convenient to be used as a mark point for identification, red paraffin is easy to obtain, cost is obtained, and meanwhile, the positioning hole is completely covered when the dry film is pasted in the step b; the filled material can be remained in the positioning hole until being removed finally, and the residue in the positioning hole is manually removed after the step i, so that the positioning hole is cleaned manually, and the product meeting the requirements required by production is obtained.
More than through increase the step of making the locating hole before the paster, can mark the point location through the locating hole of initial setting when the secondary exposure, recognition efficiency is high, and pack corresponding material in this locating hole, avoid the locating hole to be covered or fuzzification when adding man-hour, material dissolubility material paraffin in the locating hole simultaneously, can not cause physics or chemical damage to the ceramic chip, simultaneously homoenergetic enough very convenient quilt is taken out, moreover, the steam generator is simple in structure, and convenient for operation, counterpoint exposure efficiency is high like this, can accord with the demand of extensive volume production.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to those skilled in the art without departing from the principles of the present invention should also be considered as within the scope of the present invention.
Claims (9)
1. A positioning method for DPC ceramic substrate processing is characterized by comprising the following steps:
a. punching a positioning hole on the ceramic chip;
b. sticking a dry film on the ceramic chip;
c. carrying out first exposure according to the positioning hole;
d. after exposure, standing for 15min for development;
e. marking points are left after the development is finished;
f. carrying out pattern electroplating and film removing etching;
g. carrying out secondary exposure according to the left mark points and carrying out film pasting and selective exposure on the places needing to be thickened;
h. after the exposure is finished, standing for 15 minutes again for development;
i. and electroplating and thickening the exposed area after developing.
2. The positioning method for DPC ceramic substrate processing according to claim 1, wherein: after the step a, punching a positioning hole, and filling rubber materials in the hole.
3. The positioning method for DPC ceramic substrate processing according to claim 2, wherein: the color of the rubber material is different from that of the ceramic chip.
4. The positioning method for DPC ceramic substrate processing according to claim 3, wherein: the rubber material is red or black.
5. The positioning method for DPC ceramic substrate processing according to claim 1, wherein: after the step a, punching a positioning hole, and filling a soluble material in the hole.
6. The positioning method for DPC ceramic substrate processing according to claim 5, wherein: the soluble material is paraffin.
7. The positioning method for DPC ceramic substrate processing according to claim 6, wherein: the paraffin wax is red in color.
8. The positioning method for DPC ceramic substrate processing according to claim 2 or 5, wherein: and c, completely covering the positioning hole when the dry film is pasted in the step b.
9. The positioning method for DPC ceramic substrate processing according to claim 8, wherein: and (3) manually removing residues in the positioning holes after the step i.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211366644.3A CN115500011B (en) | 2022-11-03 | 2022-11-03 | Positioning method for DPC ceramic substrate processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211366644.3A CN115500011B (en) | 2022-11-03 | 2022-11-03 | Positioning method for DPC ceramic substrate processing |
Publications (2)
| Publication Number | Publication Date |
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| CN115500011A true CN115500011A (en) | 2022-12-20 |
| CN115500011B CN115500011B (en) | 2023-02-03 |
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| CN202211366644.3A Active CN115500011B (en) | 2022-11-03 | 2022-11-03 | Positioning method for DPC ceramic substrate processing |
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| Publication number | Publication date |
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| CN115500011B (en) | 2023-02-03 |
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