CN115485421A - 用于在薄衬底搬运期间防止碎裂的混合式接触指 - Google Patents

用于在薄衬底搬运期间防止碎裂的混合式接触指 Download PDF

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Publication number
CN115485421A
CN115485421A CN202180032145.8A CN202180032145A CN115485421A CN 115485421 A CN115485421 A CN 115485421A CN 202180032145 A CN202180032145 A CN 202180032145A CN 115485421 A CN115485421 A CN 115485421A
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CN
China
Prior art keywords
contact
contact fingers
substrate
fingers
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180032145.8A
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English (en)
Chinese (zh)
Inventor
斯蒂芬·J·巴尼克
约翰·弗洛伊德·奥斯特罗夫斯基
布莱恩·巴卡柳
罗伯特·拉什
孟·伟·爱德温·吴
桑托斯·库马尔
弗雷德里克·迪恩·威尔莫特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN115485421A publication Critical patent/CN115485421A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
CN202180032145.8A 2020-04-30 2021-04-12 用于在薄衬底搬运期间防止碎裂的混合式接触指 Pending CN115485421A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063018039P 2020-04-30 2020-04-30
US63/018,039 2020-04-30
PCT/US2021/026782 WO2021221887A1 (fr) 2020-04-30 2021-04-12 Doigts de contact mixtes pour éviter les craquelures pendant une manipulation de substrat mince

Publications (1)

Publication Number Publication Date
CN115485421A true CN115485421A (zh) 2022-12-16

Family

ID=78373849

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180032145.8A Pending CN115485421A (zh) 2020-04-30 2021-04-12 用于在薄衬底搬运期间防止碎裂的混合式接触指

Country Status (6)

Country Link
US (1) US20230175161A1 (fr)
JP (1) JP2023524488A (fr)
KR (1) KR20230005910A (fr)
CN (1) CN115485421A (fr)
TW (1) TW202208698A (fr)
WO (1) WO2021221887A1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6802947B2 (en) * 2001-10-16 2004-10-12 Applied Materials, Inc. Apparatus and method for electro chemical plating using backside electrical contacts
US8172992B2 (en) * 2008-12-10 2012-05-08 Novellus Systems, Inc. Wafer electroplating apparatus for reducing edge defects
CN104272438B (zh) * 2012-03-28 2018-01-12 诺发系统公司 用于清洁电镀衬底保持器的方法和装置
US10113245B2 (en) * 2016-03-24 2018-10-30 Applied Materials, Inc. Electroplating contact ring with radially offset contact fingers
CN208869693U (zh) * 2018-08-22 2019-05-17 深圳市创智成功科技有限公司 导电环、基于其的供电装置及基于供电装置的电镀治具

Also Published As

Publication number Publication date
KR20230005910A (ko) 2023-01-10
TW202208698A (zh) 2022-03-01
US20230175161A1 (en) 2023-06-08
WO2021221887A9 (fr) 2022-12-01
WO2021221887A1 (fr) 2021-11-04
JP2023524488A (ja) 2023-06-12

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