CN115484756A - Setting method of MiniLED composite circuit substrate based on thick stainless steel metal - Google Patents

Setting method of MiniLED composite circuit substrate based on thick stainless steel metal Download PDF

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Publication number
CN115484756A
CN115484756A CN202210973769.6A CN202210973769A CN115484756A CN 115484756 A CN115484756 A CN 115484756A CN 202210973769 A CN202210973769 A CN 202210973769A CN 115484756 A CN115484756 A CN 115484756A
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China
Prior art keywords
layer
copper foil
stainless steel
circuit board
steel metal
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CN202210973769.6A
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Chinese (zh)
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张家文
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Shanghai Heyu Electronic Science And Technology Co ltd
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Shanghai Heyu Electronic Science And Technology Co ltd
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Priority to CN202210973769.6A priority Critical patent/CN115484756A/en
Publication of CN115484756A publication Critical patent/CN115484756A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer

Abstract

The invention discloses a setting method of a MiniLED composite circuit substrate based on thick stainless steel metal, which comprises the following steps: combining the thick stainless steel metal base layer and the resin-coated copper foil layer into a first layer of circuit board through a first insulating adhesive layer; etching the first copper foil layer; a second layer of circuit board formed by coating a second insulating layer on the second copper foil layer, and forming a MiniLED composite circuit substrate through a second insulating adhesive layer; the second insulating layer is jointed with the first copper foil layer through a second insulating adhesive layer; through the drilling operation, break through second floor circuit board and second insulating binder layer, form the through-hole, set up a metallic coating on the inner wall of through-hole, make first copper foil layer and second copper foil layer carry out the electric conduction through this metallic coating and connect, accomplish the setting. The invention solves the problems of overhigh cost, overlarge thickness, low heat dissipation capability and low yield caused by adopting a BT substrate as the substrate of the current MiniLED.

Description

Setting method of MiniLED composite circuit substrate based on thick stainless steel metal
Technical Field
The invention relates to the field of electronic manufacturing, in particular to a setting method of a MiniLED composite circuit substrate based on thick stainless steel metal.
Background
At present, the development trend of the global electronic industry is toward the development of light, thin, short, high heat resistance, multiple functions, high density, high reliability and low cost, so that how to select the substrate of the electronic product becomes an important influencing factor. The good substrate has to have material characteristics of high thermal conductivity, high dimensional stability, high color blocking effect, high heat dissipation, high heat resistance, and low thermal expansion coefficient. As the core of the next generation display technology: miniLED backlight and MiniLED direct display are absolute technical trends, and due to the miniaturization of MiniLED devices, the requirements of the MiniLED circuit board on the MiniLED circuit board are changed due to the thinning of the display screen. The core requirements are as follows: extremely low dimensional shrinkage, high heat dissipation, and lightness and thinness.
The current MiniLED display screen industry takes BT substrates as the mainstream technology. BT substrates are essentially imported materials and are highly susceptible to overseas supply chains. The BT substrate belongs to a rigid plate which can not be bent, and needs an FPC (flexible printed circuit) flat cable for hot-pressing signal transmission, so that the integral thickness is increased, and the yield is low. The BT substrate does not have heat dissipation and heat conduction functions.
Therefore, a new technical solution of the MiniLED composite circuit substrate is needed to solve the problems of excessive cost, excessive thickness, low heat dissipation capability and low yield caused by the BT substrate adopted by the MiniLED substrate.
Disclosure of Invention
The embodiment of the application provides a setting method of a MiniLED composite circuit substrate based on thick stainless steel metal, and solves the problems of overhigh cost, overlarge thickness, low heat dissipation capability and low yield caused by the fact that the conventional MiniLED substrate adopts a BT substrate.
The embodiment of the application provides a setting method of a MiniLED composite circuit substrate based on thick stainless steel metal, which comprises the following steps:
arranging a thick stainless steel metal base layer as a substrate, coating a resin-coated copper foil layer formed by coating a first insulating layer on the first copper foil layer in an ultrathin coating mode, and combining the thick stainless steel metal base layer and the resin-coated copper foil layer into a first circuit board layer through a first insulating adhesive layer; the first insulating layer of the resin-coated copper foil layer is jointed with the thick stainless steel metal base layer through a first insulating adhesive layer, and the thickness of the thick stainless steel metal base layer is more than or equal to 50 micrometers;
etching the first copper foil layer according to a preset pattern on the first layer of circuit board formed by combining the thick stainless steel metal base layer and the resin-coated copper foil layer into a whole to complete the setting of the first layer of circuit board;
coating a second insulating layer on a second copper foil layer by an ultrathin coating mode to form a second circuit board, and bonding the first circuit board and the second circuit board into a whole to form a MiniLED composite circuit substrate by a second insulating adhesive layer; wherein the second insulating layer of the second layer of circuit board is bonded to the first copper foil layer by a second insulating adhesive layer;
and drilling the second layer of circuit board and the second insulating adhesive layer connected with the second layer of circuit board to form a through hole, and arranging a metal coating on the inner wall of the through hole to ensure that the first copper foil layer and the second copper foil layer are electrically connected through the metal coating, thereby completing the arrangement of the MiniLED composite circuit substrate.
Further, the above application may further include: and (3) punching through the second layer of circuit board and the second insulating adhesive layer connected with the second layer of circuit board, wherein the number of the formed through holes is multiple, and the cross section of each through hole is polygonal, circular or oval.
Further, the above application may further include: the material of metal coating includes silver, copper or aluminium, the thickness of metal coating is less than or equal to 10um.
Further, the above application may further include: the step of etching the first copper foil layer according to the preset pattern to complete the setting of the first layer of circuit board, wherein the thick stainless steel metal base layer and the resin-coated copper foil layer are combined into a whole, and the step further comprises the following steps:
the thick stainless steel metal base layer and the resin-coated copper foil layer are combined into a first layer circuit board which is integrally formed, and the first layer circuit board is arranged by etching the first copper foil layer after exposure operation and development operation according to a preset pattern.
Further, the above application may further include: the step of perforating the second layer circuit board and the second insulating adhesive layer joined thereto by drilling operation to form a through hole further includes:
and punching the second layer of circuit board and the second insulating adhesive layer connected with the second layer of circuit board through a laser drilling or mechanical drilling mode to form a through hole.
Further, the above application may further include: the step of arranging a thick stainless steel metal base layer as a substrate, coating a resin-coated copper foil layer formed by coating a first insulating layer on the first copper foil layer in an ultrathin coating mode, and combining the thick stainless steel metal base layer and the resin-coated copper foil layer into a first-layer circuit board through a first insulating adhesive layer, further comprises:
the resin-coated copper foil layer is placed on the thick stainless steel metal base layer through the first insulating adhesive layer and is placed in a vacuum hot press, the temperature is raised to 250 ℃ from room temperature at the heating rate of 15 ℃/min, the temperature is kept for a preset time at the temperature according to a preset pressure, and then the temperature is lowered to the room temperature, so that the thick stainless steel metal base layer and the resin-coated copper foil layer are combined into a first circuit board layer, wherein the room temperature is 20 ℃ to 26 ℃.
Further, the above application may further include: the material of the coated insulating layer includes: polyimide solutions, polyester solutions, polynaphthalene solutions, or liquid crystal polymer solutions.
Further, the above application may further include: the copper foil layer includes: rolled copper foil, electrolytic copper foil or highly ductile copper foil; the thickness of the copper foil layer is 3um to 70um.
Further, the above application may further include: the material of the coated insulating adhesive layer includes: epoxy glue, acrylic ester glue, polyester glue, polyurethane glue or polyimide glue, the thickness of insulating binder layer is 5um to 50um.
Further, the above application may further include: the thick stainless steel metal base layer comprises a ferritic stainless steel foil with a heat dissipation coefficient higher than 16W or an austenitic stainless steel foil with a heat dissipation coefficient higher than 16W.
By applying the setting method of the MiniLED composite circuit substrate based on the thick stainless steel metal, the thick stainless steel metal base layer can adapt to the hot pressing mode, the rigidity of the MiniLED composite circuit substrate can be ensured, the 8um ultrathin insulating layer and the 10um ultrathin insulating binder layer can be realized through the ultrathin coating process, the expansion and contraction influence caused by the contraction of the insulating layer and the insulating binder layer is greatly reduced, and the insulating layer and the insulating binder layer reach the approximate thermal expansion coefficient. Simultaneously, the arrangement of the through holes can enable the MiniLED composite circuit substrate to achieve good heat dissipation capacity, production cost is reduced, and the yield of products is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following descriptions are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a flowchart of a method for setting a thick stainless steel metal-based MiniLED composite circuit substrate according to the present application;
fig. 2 is a schematic structural diagram of a MiniLED composite circuit substrate based on a thick stainless steel metal according to an exemplary embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
The appearance of stainless steel metal substrates makes the miniLED industry appear to be a production material with low cost and high reliability.
As shown in fig. 1, the method for setting the MiniLED composite circuit board based on the thick stainless steel metal includes the following steps:
step 110, arranging a thick stainless steel metal base layer as a substrate, coating a resin-coated copper foil layer formed by coating a first insulating layer on the first copper foil layer in an ultrathin coating mode, and combining the thick stainless steel metal base layer and the resin-coated copper foil layer into a first circuit board layer through a first insulating adhesive layer; the first insulating layer of the resin-coated copper foil layer is connected with the thick stainless steel metal base layer through a first insulating adhesive layer, and the thickness of the thick stainless steel metal base layer is more than or equal to 50 microns;
the thickness of thick stainless steel metal substrate is more than or equal to 50 um's setting, can be applicable to the circuit board that high rigidity required, has improved the adaptability of product to special requirement.
Wherein the coefficient of thermal expansion may be set to less than 16 x 10 -6 The thick stainless steel metal base layer of m/mk is used as a substrate, and the surface treatment operation can be carried out on the thick stainless steel metal base layer, so that the surface value of the thick stainless steel metal base layer after the surface treatment is more than or equal to 50um.
In practical test, the surface of one side of the thick stainless steel metal base layer in contact with the insulating adhesive layer is processed, so that the surface roughness Ra value of one side of the thick stainless steel metal base layer in contact with the insulating adhesive layer is greater than or equal to 50 micrometers, the thick stainless steel metal base layer is more favorably jointed with the resin-coated copper foil layer, the hot pressing mode can be adapted, and the yield of products is improved.
In practical test, this application is through adopting the thick stainless steel metal substrate that thermal expansion coefficient is less than 16 x 10-6m/mk, can make thick stainless steel metal substrate adapt to the mode of hot pressing, both can guarantee miniLED combined type circuit board's rigidity, can realize 8um ultra-thin insulating layer and 10um ultra-thin insulating binder layer through ultra-thin coating process again, the very big degree has reduced the harmomegathus influence that insulating layer and insulating binder layer shrink brought, make insulating layer and insulating binder layer reach close thermal expansion coefficient, combine thick stainless steel metal substrate and coating resin copper foil layer into the material of integration, thereby form a holistic, circuit board material of extremely low size harmomegathus rate.
Thick stainless steel metal base layer: mainly stainless steel metal; a resin coated copper foil layer (RCC) including a copper foil layer and an insulation layer; an insulating adhesive layer (wherein the insulating adhesive includes coating type and pressure-sensitive type insulating adhesives).
After the resin-coated copper foil layer is formed by coating the first insulating layer on the first copper foil layer in an ultrathin coating mode, curing the resin-coated copper foil layer to enable the thickness of the insulating layer in the resin-coated copper foil layer to reach 5-100 um; coating a first insulating adhesive layer on the first insulating layer of the resin-coated copper foil layer in an ultrathin coating mode to enable the thickness of the first insulating adhesive layer to reach 5-50 um, and then carrying out baking treatment operation on the resin-coated copper foil layer coated with the first insulating adhesive layer to enable the first insulating adhesive layer to reach a semi-flowing semi-cured state;
and carrying out curing treatment operation on the resin-coated copper foil layer so as to prevent mutual adhesion during rolling, and achieving component reaction curing through a subsequent baking process to form the resin-coated copper foil layer.
And baking the resin-coated copper foil layer coated with the first insulating adhesive layer to enable the first insulating adhesive layer to reach a semi-flowing semi-cured state, so that a good bonding operation effect can be ensured to be carried out on the surface of the thick stainless steel metal base layer and the first insulating adhesive layer in the next step.
The step of setting a thick stainless steel metal base layer as a substrate, coating a resin-coated copper foil layer formed by coating a first insulating layer on the first copper foil layer in an ultrathin coating mode, and combining the thick stainless steel metal base layer and the resin-coated copper foil layer into a first-layer circuit board integrally through a first insulating adhesive layer further comprises the following steps of:
placing the resin-coated copper foil layer on the thick stainless steel metal base layer through the first insulating adhesive layer, placing the thick stainless steel metal base layer into a vacuum hot press, heating the thick stainless steel metal base layer to 250 ℃ from room temperature at a heating rate of 15 ℃/min, preserving the temperature at the temperature according to a preset pressure (the preset pressure can be 0.5MPa to 2 MPa) for a preset time (the preset time can be 25 minutes to 100 minutes), and cooling the thick stainless steel metal base layer and the resin-coated copper foil layer to form an integrated first-layer circuit board, wherein the room temperature can be 20 ℃ to 26 ℃. Through the arrangement, the first layer of circuit board formed by integrally combining the thick stainless steel metal base layer and the resin-coated copper foil layer can be ensured to have good performance, meanwhile, the production time is short, the production efficiency is improved, and the requirements of large-scale production are met.
Step 120, etching the first copper foil layer according to a preset pattern on the first layer of circuit board formed by combining the thick stainless steel metal base layer and the resin-coated copper foil layer into a whole to complete the setting of the first layer of circuit board;
the step of etching the first copper foil layer according to the preset pattern to complete the setting of the first layer circuit board, which combines the thick stainless steel metal base layer and the resin-coated copper foil layer into a whole, further comprises:
and after exposure operation and development operation are carried out on the first copper foil layer according to a preset pattern, the first layer of circuit board formed by combining the thick stainless steel metal base layer and the resin-coated copper foil layer into a whole is subjected to etching operation, so that the arrangement of the first layer of circuit board is completed. Because the first layer circuit board is finally arranged inside the MiniLED composite circuit substrate, the first layer circuit board can be ensured to be arranged in advance through the operation arrangement in advance, the difficulty of subsequent production is reduced, and the production efficiency is improved.
Step 130, coating a second insulating layer on the second copper foil layer by an ultrathin coating mode to form a second circuit board, and bonding the first circuit board and the second circuit board into a whole to form a MiniLED composite circuit substrate by a second insulating adhesive layer; wherein the second insulating layer of the second layer of circuit board is bonded to the first copper foil layer by a second insulating adhesive layer;
step 140, drilling the second circuit board layer and the second insulating adhesive layer bonded thereto to form a through hole, and forming a metal plating layer on the inner wall of the through hole to electrically connect the first copper foil layer and the second copper foil layer through the metal plating layer, thereby completing the formation of the MiniLED composite circuit board.
The cross section of the through hole can be polygonal, circular or elliptical; the through holes can ensure that heat generated by the copper foil layer can be taken away by the thick stainless steel metal base layer, and the optimal heat dissipation effect is achieved.
The cross section of the first through hole is very flexible in shape, and can adapt to various production dies, so that the adaptability of products is improved.
The step of perforating the second layer circuit board and the second insulating adhesive layer joined thereto by drilling operation to form a through hole further includes:
and (3) punching through the second layer of circuit board and the second insulating adhesive layer connected with the second layer of circuit board by means of laser drilling or mechanical drilling to form a through hole. With the arrangement, the through holes can be formed in various modes, so that cost can be controlled better. Meanwhile, the laser drilling can better control the drilling precision, so that the inner wall of the through hole is smoother, and the next operation of covering the inner wall of the through hole with a metal coating is facilitated.
According to the MiniLED composite circuit substrate based on the stainless steel metal, the thick stainless steel metal foil with a high heat dissipation coefficient (higher than 16W) is used as the base, and the ultrathin insulating layer and the insulating binder layer (within 20um of the total thickness) which are precisely coated are added, so that the MiniLED composite circuit substrate based on the stainless steel metal has high heat dissipation performance, high heat load and light weight; when the miniLED composite circuit substrate based on stainless steel metal needs heat conduction output, heat generated by the copper foil layer can be directly dissipated through the thick stainless steel metal base layer through the arrangement of the two through holes, and the best heat dissipation effect is achieved.
The material of metal coating includes silver, copper or aluminium, the thickness of metal coating is for being less than or equal to 10um. The diversification of the material of the metal coating can adapt to the performance requirements of various products, and the copper material is plated on the inner wall of the through hole by adopting a chemical copper plating method, so that the technology is mature, the production cost is low, and the realization is convenient. The thickness of the metal coating is less than or equal to 10um, so that the material cost and the production time can be saved, and the requirements of large-scale production are met. In practice, the thickness of the metal coating is 1.5um, so that the optimal control of cost and performance is achieved, the material cost is low, the production time is short, and the performance is better.
This application uses the miniLED combined type circuit substrate of thick stainless steel metal-based layer production, and very low size that the matching miniLED trade needs that can be fine rises shrinkage factor, high heat dissipating, frivolousization demand, simultaneously through new technology, can realize double-deck or multilayer circuit substrate with low costs.
The material of the coated insulating layer includes: a Polyimide (PI) solution, a polyester solution, a polynaphthalene solution, or a liquid crystal polymer solution; the thickness of the insulating layer may be 5um to 100um. The polyimide film is preferred, so that the product is mature and the cost is lower; meanwhile, the insulating layer can be coated on the copper foil layer in an online coating mode due to the arrangement of the thickness of the insulating layer, large-scale production is facilitated, and the production efficiency is greatly improved.
The copper foil layer comprises a rolled copper foil, an electrolytic copper foil or a high-ductility copper foil; the thickness of copper foil layer is 3um to 70um for the thickness of copper foil layer. The thickness of the copper foil layer is set to be suitable for reelable flexible production, and production efficiency is improved greatly.
The material of the coated insulating adhesive layer includes: epoxy glue, acrylic ester glue, polyester glue, polyurethane glue or polyimide glue, the thickness on insulating binder layer is 5um to 50um. The flexible circuit board material achieves the thermal expansion coefficient close to that of the insulating layer and the insulating binder layer by adjusting the colloid formula and the rigidity of the thick stainless steel metal base layer, thereby forming the flexible circuit board material with the integrity and the extremely low size expansion and contraction rate. Meanwhile, the thickness of the insulating adhesive layer is set so that the insulating adhesive layer can be coated on the insulating layer of the resin-coated copper foil layer in an online coating mode, large-scale production is facilitated, and production efficiency is greatly improved.
The thick stainless steel metal base layer comprises a ferritic stainless steel foil or an austenitic stainless steel foil.
Wherein the ferritic stainless steel foil is a stainless steel foil which is mainly in a ferritic structure in a use state, contains 11 to 30 percent of chromium and has a body-centered cubic crystal structure. The steel does not generally contain nickel, and sometimes contains a small amount of Mo, ti, nb and other elements, and has the characteristics of large heat conductivity coefficient, small expansion coefficient, good oxidation resistance, excellent stress corrosion resistance and the like.
The austenitic stainless steel foil means a stainless steel foil having an austenitic structure at normal temperature. The austenitic stainless steel has a stable austenitic structure when it contains about 18% Cr, 8% to 25% Ni, and about 0.1% C. The austenitic stainless steel generally refers to stainless steel containing Cr and Ni, such as 304 steel, 316 steel and the like, the cost of the stainless steel is low, the large-scale production is facilitated, meanwhile, the stainless steel generally has no magnetism, has good corrosion resistance, cannot be strengthened by heat treatment, and can generate certain magnetism after being processed.
The thick stainless steel metal base layer comprises a ferritic stainless steel foil with the heat dissipation coefficient higher than 16W or an austenitic stainless steel foil with the heat dissipation coefficient higher than 16W. By adopting the ferritic stainless steel foil with the heat dissipation coefficient higher than 16W or the austenitic stainless steel foil with the heat dissipation coefficient higher than 16W, the MiniLED composite circuit substrate based on the stainless steel metal has the characteristics of high heat dissipation and high heat load.
Fig. 2 is a schematic structural diagram of a MiniLED composite circuit substrate based on a thick stainless steel metal according to an exemplary embodiment, as shown in fig. 2,
the MiniLED composite circuit substrate is a double-layer circuit board, wherein the first layer circuit board 10 includes: a thick stainless steel metal substrate 101 and a resin-coated copper foil layer 102 bonded to each other, wherein the resin-coated copper foil layer 102 includes a copper foil layer 1021 and an insulating layer 1022 bonded to each other, wherein the insulating layer 1022 of the resin-coated copper foil layer 102 is bonded to the thick stainless steel metal substrate 101 through an insulating adhesive layer 30; the second layer circuit board 20 includes: a copper foil layer 2021 and an insulating layer 2022 bonded to each other, wherein the insulating layer 2022 of the second circuit board 20 is bonded to the copper foil layer 1021 by an insulating adhesive layer 40;
the second layer circuit board 20 and the second insulating adhesive layer 40 jointed with the second layer circuit board are provided with a through hole 50, a metal plating layer 501 is arranged on the inner wall of the through hole 50, and the copper foil layer 1021 and the copper foil layer 2021 are connected through the metal plating layer 501; wherein, the thickness of thick stainless steel metal substrate 101 is more than or equal to 50um.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present application. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present application is defined by the appended claims.
Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in the figures. Each example is provided by way of explanation and is not intended to be limiting of the present application. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the present application include such modifications and variations. Examples are described using specific language that should not be construed as limiting the scope of the appended claims. The drawings are not to scale and are merely illustrative. For clarity, the same elements or manufacturing steps are indicated by the same reference numerals in the different figures, if not otherwise stated.

Claims (10)

1. A setting method of a MiniLED composite circuit substrate based on thick stainless steel metal is characterized by comprising the following steps:
arranging a thick stainless steel metal base layer as a substrate, coating a resin-coated copper foil layer formed by coating a first insulating layer on the first copper foil layer in an ultrathin coating mode, and combining the thick stainless steel metal base layer and the resin-coated copper foil layer into a first circuit board layer through a first insulating adhesive layer; the first insulating layer of the resin-coated copper foil layer is connected with the thick stainless steel metal base layer through a first insulating adhesive layer, and the thickness of the thick stainless steel metal base layer is more than or equal to 50 microns;
etching the first copper foil layer according to a preset pattern on the first layer of circuit board formed by combining the thick stainless steel metal base layer and the resin-coated copper foil layer into a whole to complete the setting of the first layer of circuit board;
coating a second insulating layer on a second copper foil layer by an ultrathin coating mode to form a second circuit board, and bonding the first circuit board and the second circuit board into a whole to form a MiniLED composite circuit substrate by a second insulating adhesive layer; wherein the second insulating layer of the second layer of circuit board is bonded to the first copper foil layer by a second insulating adhesive layer;
and drilling the second layer of circuit board and the second insulating adhesive layer connected with the second layer of circuit board to form a through hole, and arranging a metal coating on the inner wall of the through hole to ensure that the first copper foil layer and the second copper foil layer are electrically connected through the metal coating, thereby completing the arrangement of the MiniLED composite circuit substrate.
2. The setting method according to claim 1, further comprising:
and (3) punching the second layer of circuit board and the second insulating adhesive layer connected with the second layer of circuit board, wherein the number of the formed through holes is multiple, and the cross section of each through hole is polygonal, circular or elliptical.
3. The setting method according to claim 2, further comprising:
the material of metal coating includes silver, copper or aluminium, the thickness of metal coating is less than or equal to 10um.
4. The setting method according to claim 3,
the step of etching the first copper foil layer according to the preset pattern to complete the setting of the first layer of circuit board, wherein the thick stainless steel metal base layer and the resin-coated copper foil layer are combined into a whole, and the step further comprises the following steps:
the thick stainless steel metal base layer and the resin-coated copper foil layer are combined into a first layer circuit board which is integrally formed, and the first layer circuit board is arranged by etching the first copper foil layer after exposure operation and development operation according to a preset pattern.
5. The setting method according to claim 4,
the step of perforating the second layer circuit board and the second insulating adhesive layer joined thereto by drilling operation to form a through hole further includes:
and punching the second layer of circuit board and the second insulating adhesive layer connected with the second layer of circuit board through a laser drilling or mechanical drilling mode to form a through hole.
6. The setting method according to any one of claims 2 to 5,
the step of arranging a thick stainless steel metal base layer as a substrate, coating a resin-coated copper foil layer formed by coating a first insulating layer on the first copper foil layer in an ultrathin coating mode, and combining the thick stainless steel metal base layer and the resin-coated copper foil layer into a first-layer circuit board through a first insulating adhesive layer, further comprises:
the resin-coated copper foil layer is placed on the thick stainless steel metal base layer through the first insulating adhesive layer and is placed in a vacuum hot press, the temperature is raised to 250 ℃ from room temperature at the heating rate of 15 ℃/min, the temperature is kept for a preset time at the temperature according to a preset pressure, and then the temperature is lowered to the room temperature, so that the thick stainless steel metal base layer and the resin-coated copper foil layer are combined into a first circuit board layer, wherein the room temperature is 20 ℃ to 26 ℃.
7. The setting method as recited in claim 6,
the material of the coated insulating layer includes: polyimide solutions, polyester solutions, polynaphthalene solutions, or liquid crystal polymer solutions.
8. The setting method according to claim 7, further comprising:
the copper foil layer includes: rolled copper foil, electrolytic copper foil or highly ductile copper foil; the thickness of copper foil layer is 3um to 70um.
9. The setting method according to claim 8, further comprising:
the material of the coated insulating adhesive layer includes: epoxy glue, acrylic ester glue, polyester glue, polyurethane glue or polyimide glue, the thickness of insulating binder layer is 5um to 50um.
10. The setting method as recited in claim 9,
the thick stainless steel metal base layer comprises a ferritic stainless steel foil with a heat dissipation coefficient higher than 16W or an austenitic stainless steel foil with a heat dissipation coefficient higher than 16W.
CN202210973769.6A 2022-08-15 2022-08-15 Setting method of MiniLED composite circuit substrate based on thick stainless steel metal Pending CN115484756A (en)

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Application Number Priority Date Filing Date Title
CN202210973769.6A CN115484756A (en) 2022-08-15 2022-08-15 Setting method of MiniLED composite circuit substrate based on thick stainless steel metal

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