CN213733795U - Copper-clad plate and copper-clad plate hot pressing assembly - Google Patents
Copper-clad plate and copper-clad plate hot pressing assembly Download PDFInfo
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- CN213733795U CN213733795U CN202020844911.3U CN202020844911U CN213733795U CN 213733795 U CN213733795 U CN 213733795U CN 202020844911 U CN202020844911 U CN 202020844911U CN 213733795 U CN213733795 U CN 213733795U
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Abstract
The utility model relates to a circuit board processing technology field particularly, relates to a copper-clad plate and copper-clad plate hot pressing subassembly. The copper-clad plate comprises a copper foil, a resistance layer, a dielectric layer, a resistance layer and a copper foil which are sequentially stacked, wherein the thickness of the resistance layer is 0.01-2 mu m, and the square resistance of the resistance layer is 10-100 omega/cm2. The resistor layer is formed below the copper foil of the copper-clad plate, so that a resistor structure can be formed after the resistor layer and the copper foil layer are etched, and chip parts related to the resistor are replaced, so that the problem that discontinuity occurs on the bonding surface in the installation process of chip resistor parts to cause signal loss or the long-term reliability of the bonding surface is solved.
Description
Technical Field
The utility model relates to a circuit board processing technology field particularly, relates to a copper-clad plate and copper-clad plate hot pressing subassembly.
Background
With the development of the industry, miniaturization based on the chip of many electronic components has led to the miniaturization and high performance of the entire electronic product. The resistor is one of passive elements, and can be used for realizing impedance adjustment so as to achieve the purposes of distributing electric quantity and power consumption. Due to the supply of the chip components themselves, the assembly process, and the bonding and assembly process on the printed circuit board, signal flow discontinuities and failures of the long term reliability of the joints may occur.
If chip-like resistive components are used, additional component costs are incurred and processing is added. In addition, discontinuity occurs on the adhesive surface during the mounting of the chip-type resistor part, thereby causing a signal loss or a problem in long-term reliability of the adhesive surface, and an additional lamination process is impossible due to the use of the chip-type resistor part, so that a size of the printed circuit board needs to be further increased during the design process.
In order to improve this, it is necessary to provide a structure that can replace the chip components related to the resistors during the process of manufacturing the printed circuit board.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a copper-clad plate and copper-clad plate hot pressing subassembly.
In order to achieve the above object, according to one aspect of the present invention, there is provided a copper-clad plate, which includes a copper foil, a resistance layer, a dielectric layer, a resistance layer and a copper foil, which are sequentially stacked, wherein the thickness of the resistance layer is 0.01 μm to 2 μm, and the sheet resistance of the resistance layer is 10 to 100 Ω/cm 2.
Furthermore, the resistance layer is made of at least one of nickel, carbon, phosphorus and chromium or a compound thereof.
Further, the dielectric layer is at least one of phenol resin, epoxy resin, fluorine resin, silicone resin, polyamide resin and butadiene rubber, and the copper foil is an electrolytic copper foil or a rolled copper foil.
In order to achieve the above object, according to a second aspect of the present technical solution, the present technical solution further discloses a copper-clad plate hot-pressing assembly, which includes a reinforcing member and a lamination structure body, wherein the copper-clad plate lamination structure body is sandwiched between two layers of the reinforcing member, the reinforcing member includes an aluminum foil, a graphite plate and an aluminum foil which are sequentially stacked, and the lamination structure body includes a copper foil, a resistance layer, a dielectric layer, a resistance layer and a copper foil which are sequentially stacked.
Furthermore, the thickness of each layer of aluminum foil is 0.1mm-2mm, and the thickness of the graphite plate is 0.05mm-0.3 mm.
The embodiment of the utility model provides a technical scheme compares with prior art has following beneficial effect: the resistance layer is formed below the copper foil of the copper-clad plate, so that the resistance structure can be formed according to the remaining circuit form after the resistance layer and the copper foil layer are etched in the processing process of the printed circuit substrate, and finally chip parts related to resistance are replaced in the structures of the copper-clad plate and the printed circuit board, so that the problem that discontinuity occurs on the bonding surface in the installation process of chip type resistance parts to cause signal loss or the long-term reliability of the bonding surface is solved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and further features, objects, and advantages of the invention will become apparent. The drawings of the illustrative embodiments and their description are provided to explain the present invention and do not constitute an undue limitation on the invention. In the drawings:
fig. 1 schematically shows a structural reference diagram of a copper-clad plate according to an embodiment of the present invention;
fig. 2 schematically shows a structural schematic diagram of a reinforcing member provided by an embodiment of the present invention;
fig. 3 is a schematic diagram showing a reference diagram of arrangement of the structures in the hot press molding process according to the embodiment of the present invention;
fig. 4-6 schematically show the structure reference diagram of the copper-clad plate in each stage of etching the printed circuit board according to the embodiment of the present invention.
In the figure:
1. copper foil; 2. a resistive layer; 3. a dielectric layer; 4. aluminum foil; 5. a graphite plate; 6. and (5) protecting the film.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances for purposes of describing the embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail with reference to the following examples.
The embodiment of the utility model provides a copper-clad plate manufacturing approach is mainly in order to replace the chip spare part of resistance class in the course of working of printed circuit substrate. In the technical scheme of the prior art that a resistor chip part is attached to a substrate, due to the characteristics of the chip part and the bonding and assembling processes on a printed circuit substrate, a discontinuous surface is generated in a bonding surface, so that the discontinuity of signal flow is caused, and the long-term reliability of a bonding part is also caused to be problematic.
Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the drawings, the thicknesses of layers and regions are exaggerated for convenience of description, and the sizes shown do not represent actual sizes. Although these figures do not reflect the actual dimensions of the device exactly, they do reflect the mutual positions of the regions and the constituent structures, in particular the upper and lower and adjacent relationships between the constituent structures. The reference figures are schematic illustrations of idealized embodiments of the present invention which should not be construed as limited to the particular shapes of regions illustrated in the figures, but are to include resulting shapes and deviations that result from manufacturing.
Based on the above facts, the embodiment of the present invention provides a manufacturing method of a copper-clad plate containing a resistance layer, including the following steps:
step 1: a resistance layer is formed on one surface of the copper foil. The resistance layer is used for forming a circuit structure of the printed circuit board after being etched, impedance is matched through the resistance layer, and the resistance layer replaces a chip resistor used in the prior art, and the resistance layer needs to have a certain square resistor to show resistance characteristics on a circuit formed after being etched. The copper foil can be electrolytic copper foil manufactured by electrolytic gold plating process or rolled copper foil manufactured by rolling process. According to the specific requirement of the copper-clad plate, a copper foil with the thickness of 0.017-0.070 mm can be used.
Step 2: and laminating copper foils with the resistance layers formed on the surfaces on two sides of the dielectric layer to form a copper-clad laminate structure, wherein the resistance layers are positioned between the dielectric layer and the copper foils. The dielectric layer can be made of various dielectric materials suitable for manufacturing the copper-clad plate in the prior art, including but not limited to phenol resin, epoxy resin, fluorine resin, silicone resin, polyamide resin, butadiene rubber and the like, the specific selection principle can be specifically determined according to the molding conditions of the copper-clad plate to be prepared, and the characteristics of the dielectric used, such as the glass transition temperature, the fluidity (flow rate) and other characteristics of the dielectric material, need to be considered according to the prior art.
And step 3: and carrying out hot press molding on the laminated structure body to obtain the copper-clad plate. In the specific hot press molding process, the laminated structure body can be placed between two hot plates of a hot press, and hot press molding is carried out at high temperature and high pressure in a vacuum environment, wherein the temperature of the hot press molding is preferably 200-360 ℃, and the pressure is preferably 500-800 psi.
Fig. 1 shows a schematic structural diagram of a copper-clad plate according to an embodiment of the present invention, which includes a copper foil 1, a resistance layer 2, a dielectric layer 3, a resistance layer 2 and a copper foil 1. The copper-clad plate prepared by the lamination structure body through hot press molding in the step 3 in the embodiment can form the resistance structure according to the remaining circuit form after the resistance layer 2 and the copper foil 1 on the copper-clad plate are etched in the processing process of the printed circuit substrate by forming the resistance layer 2 below the copper foil 1, and finally, chip parts related to resistance are replaced in the structures of the copper-clad plate and the printed circuit board, so that the problem that signal loss or long-term reliability of the bonding surface is caused by discontinuity in the installation process of chip resistance parts is solved. And because the use of chip-type resistor parts is avoided, an additional laminating process can be carried out, and the size of the printed circuit board is less limited in the design process.
The resistance layer 2 in the embodiment of the present invention is made of a material different from the copper foil with a very small resistance value, and is made of one of nickel, carbon, phosphorus, chromium, etc., or an alloy thereof, or a compound thereof, and the thickness of the resistance layer is preferably 0.01 μm to 2 μm, and the square resistance of the resistance layer is preferably 10 to 100 Ω/cm2For example, 10. omega./cm can be selected2、25Ω/cm2、50Ω/cm2、100Ω/cm2The resistance layer can be formed on the surface of the copper foil by electroplating, electroless plating, chemical vapor deposition and the like.
Among them, the resistance of the printed circuit board obtained on the basis of the copper-clad board in the embodiment of the present invention is determined by the thickness of the resistance layer corresponding to the signal passing height, and the relationship between the thickness of the resistance layer and the sheet resistance is as shown in table 1. The resistance layer adopted is an alloy of nickel and phosphorus, the use ratio of the nickel and the phosphorus is 7:3, and the nickel and the phosphorus are respectively formed by hot pressing conditions of 500psi pressure at the temperature of 200 ℃ and 800psi pressure at the temperature of 360 ℃, as can be seen from the table 1, the square resistance value of the resistance layer is related to the thickness of the resistance layer on one hand, and is also related to the temperature during hot pressing forming in the step 3, and the square resistance value is in positive correlation with the thickness of the resistance layer and the hot pressing temperature.
TABLE 1 relationship between thickness of resistive layer and sheet resistance value
| Thickness of resistance layer | Square resistance value (@200 deg.C) | Square resistance (@360 deg.C) |
| 1.00μm | 10Ω/cm2 | 11Ω/cm2 |
| 0.40μm | 25Ω/cm2 | 28Ω/cm2 |
| 0.25μm | 40Ω/cm2 | 48Ω/cm2 |
| 0.20μm | 50Ω/cm2 | 62Ω/cm2 |
| 0.10μm | 100Ω/cm2 | 148Ω/cm2 |
| 0.05μm | 250Ω/cm2 | 378Ω/cm2 |
Engineering deviation always occurs in the manufacturing process, production workshops try to reduce the deviation all the time, and in the actual production, the deviation of the square resistance value also occurs under the condition that the hot-pressing condition of a substrate is determined in the copper-clad plate subjected to hot-pressing forming by a hot press, so that the power transmission quantity is reduced. The skilled person has found that this deviation can be effectively reduced by uniformly dispersing the heat and pressure in the hot pressing process at high temperature and high pressure. Therefore, the embodiment of the utility model provides a reinforcing part, this reinforcing part's structure is as shown in fig. 2, and it includes aluminium foil 4, graphite plate 5 and the aluminium foil 4 that stack gradually the setting, and every layer the thickness of aluminium foil 4 is 0.1mm-2mm, the thickness of graphite plate 5 is 0.05mm-0.3 mm. In the hot briquetting in-process, the lamination structure clamp that is used for the hot pressing to form the copper-clad plate forms copper-clad plate hot pressing subassembly between two-layer reinforcement, and aluminium foil 4 and graphite plate 5 in the reinforcement have excellent heat conductivity, can improve the homogeneity of temperature, under the high pressure condition, have very strong buffering nature and play the effect that improves pressure homogeneity to effectual reduction square resistance's deviation, the setting of aluminium foil can also prevent to cause the pollution to the copper foil in addition.
The utility model discloses create the embodiment and still disclose a printed circuit board and manufacturing method thereof, this manufacturing method goes on the basis of the manufacturing method of copper-clad plate in above-mentioned embodiment, and is concrete, after obtaining the copper-clad plate through step 1-3 preparation among the copper-clad plate manufacturing method, carries out the sculpture to the copper-clad plate, on the copper-clad plate form the circuit after resistance layer and the sculpture of copper foil, obtain required printed circuit board. Impedance is matched through the shape of a circuit formed after etching, and the specific impedance matching relationship is suitable for the prior art and is not described herein any more.
As shown in the figure, an optional processing method for manufacturing a copper-clad plate with a resistance layer into a printed circuit board is provided, which specifically comprises the following steps:
the first etching is carried out using a common etching solution, such as copper chloride (CuCl)2) Solutions or ferrous chloride (FeCl)2) The solution, which is used for etching only the copper foil 1, can cover the protective film 6 on the part of the copper foil 1 to be preserved, and then the protective film is etched by the etching solutionEtching off the part of the copper foil not covered by the protective film to expose the resistance layer to obtain the structure shown in the figure;
and etching the exposed part of the resistance layer for the second time by using sulfuric acid as an etching solution, wherein the part of the resistance layer etched away can expose the lower dielectric layer.
And etching for the third time, wherein the adopted etching solution is an alkaline solution, and the etching section can be carried out on the copper foil part again only, so that the resistance layer cannot be removed, and only the copper foil can be removed. Different from the first etching, the first etching only removes the copper foil except the circuit part, the rest part is a visible resistance layer, and the part of the resistance layer is removed in the second etching; in the third etching, only the copper foil is removed, but the resistive layer is not further removed, and if an acidic etching solution is used in the third etching, a small margin is left on the resistive layer, which oxidizes the resistive layer and affects the characteristics thereof, so that an alkaline etching solution is required for the third etching.
The etching process described above is merely an example of an option and those skilled in the art may adjust and modify the prior art as necessary to obtain the desired circuit on the printed circuit board.
In order to verify the beneficial effects of the utility model, use epoxy and fluorine series resin (PTFE) as the dielectric layer respectively, through the utility model discloses the copper-clad plate that the method that provides prepared to have the resistance layer is as base plate for the printed circuit board, determines the square resistance value of resistance layer, wherein, the material that the resistance layer adopted is the combined material alloy of nickel and phosphorus, and the quality ratio of nickel and phosphorus is 7:3, and thickness is 0.2 mu m, and other control parameter and test result refer to table 2, wherein experiment 1-experiment 5 are respectively for sampling 5 detection position at random on the copper-clad plate, determine the resistance value square of every detection position of resistance layer. Wherein, the strengthening process is used in the processes of the embodiment 2 and the embodiment 4, in particular, in the hot-press molding process, a strengthening piece is arranged between a hot plate of a hot press and a laminated structure body, and the strengthening piece is implemented by sequentially laminating 0.5mm aluminum foil, 0.2mm graphite plate and 0.5mm aluminum foilExamples 1 and 3 were carried out without the above reinforcing process, and the unit of the block resistance in Table 2 was Ω/cm2。
TABLE 2 Square resistance of the resistive layer under different conditions
| Example 1 | Example 2 | Example 3 | Example 4 | |
| Dielectric layer | Epoxy resin | Epoxy resin | Fluorine-based resin | Fluorine-based resin |
| Dielectric layer thickness | 0.508 | 0.508 | 0.508 | 0.508 |
| Thickness of copper foil | 18um | 18um | 18um | 18um |
| Thickness of resistance layer | 0.2um | 0.2um | 0.2um | 0.2um |
| Hot press forming temperature | 200℃ | 200℃ | 360℃ | 360℃ |
| Pressure of hot press forming | 500psi | 500psi | 800psi | 800psi |
| Process for the preparation of a coating | Without using reinforcement processes | By using reinforcing processes | Without using reinforcement processes | By using reinforcing |
| Experiment | ||||
| 1 | 48.2 | 48.8 | 63.5 | 62.2 |
| |
47.9 | 49.4 | 60.6 | 61.6 |
| |
50.3 | 50.8 | 59.8 | 62.7 |
| |
50.8 | 50.9 | 62.2 | 63.5 |
| |
50.4 | 49.6 | 64.3 | 61.3 |
| Mean value of | 49.5 | 49.9 | 62.1 | 62.3 |
| Maximum-minimum | 2.9 | 2.1 | 4.5 | 2.2 |
| Variance (variance) | 1.847 | 0.84 | 3.587 | 0.773 |
As can be seen from the results in table 2, the block resistance values were different depending on the temperature of the hot press molding, and a high block resistance value was obtained under the high-temperature molding conditions. In addition, adopt the utility model provides a strengthening technology that the reinforcement that graphite cake and aluminum plate formed goes on has obvious effect in the aspect of the deviation that reduces the square resistance value under the fashioned condition of high temperature.
According to the utility model discloses copper-clad plate, printed circuit board and preparation technology thereof can also include other necessary subassemblies, structure or step to the corresponding position of arranging, relation of connection and preparation technology all can refer to the structure and the technology of printed circuit board and copper-clad plate among the prior art, and the relation of connection, operation, technology step and the theory of operation that each did not describe the structure are known to the ordinary technical person in this field, do not describe in detail here.
Some embodiments in this specification are described in a progressive or parallel manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
The foregoing is merely a detailed description of the invention that enables those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (4)
1. The copper-clad plate is characterized by comprising a copper foil, a resistance layer, a dielectric layer, the resistance layer and the copper foil which are sequentially stacked, wherein the thickness of the resistance layer is 0.01-2 mu m.
2. The copper-clad plate according to claim 1, wherein the electricity isThe square resistance of the resistance layer is 10-100 omega/cm2。
3. The utility model provides a copper-clad plate hot pressing subassembly which characterized in that, includes reinforcement and lamination structure, the lamination structure presss from both sides two-layerly between the reinforcement, the reinforcement is including the aluminium foil, graphite plate and the aluminium foil that stack gradually the setting, the lamination structure is including the copper foil, the resistance layer, the dielectric layer, the resistance layer and the copper foil that stack gradually the setting.
4. The copper-clad plate hot-pressing assembly of claim 3, wherein the thickness of each layer of aluminum foil is 0.1mm-2mm, and the thickness of the graphite plate is 0.05mm-0.3 mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020844911.3U CN213733795U (en) | 2020-05-19 | 2020-05-19 | Copper-clad plate and copper-clad plate hot pressing assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020844911.3U CN213733795U (en) | 2020-05-19 | 2020-05-19 | Copper-clad plate and copper-clad plate hot pressing assembly |
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| CN213733795U true CN213733795U (en) | 2021-07-20 |
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Effective date of registration: 20211130 Address after: 223001 No.11, No.14 and No.15 workshops of Zhongxin Hua Electronic Industrial Park Development (Lianshui) Co., Ltd., Xingsheng Road, Lianshui Economic Development Zone, Huai'an City, Jiangsu Province Patentee after: Jiangsu ainuoxin Circuit Technology Co.,Ltd. Address before: 266000 No.1, Shanchuan Road, Binhai sub district office, Huangdao District, Qingdao City, Shandong Province Patentee before: Qingdao Zero Frequency New Materials Technology Co.,Ltd. |
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