CN218163021U - Composite flexible circuit substrate based on stainless steel metal - Google Patents
Composite flexible circuit substrate based on stainless steel metal Download PDFInfo
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- CN218163021U CN218163021U CN202221669401.2U CN202221669401U CN218163021U CN 218163021 U CN218163021 U CN 218163021U CN 202221669401 U CN202221669401 U CN 202221669401U CN 218163021 U CN218163021 U CN 218163021U
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Abstract
The utility model discloses a combined type flexible circuit base plate based on stainless steel metal, include: the resin-coated copper foil layer comprises a copper foil layer and an insulating layer which are mutually jointed, and the insulating layer of the resin-coated copper foil layer is jointed with the stainless steel metal base layer through an insulating adhesive layer; a stainless steel metal substrate bonded to one or both of the resin coated copper foil layers; the surface roughness Ra of one side of the stainless steel metal base layer in contact with the insulating adhesive layer is greater than or equal to 50um, and the thermal expansion coefficient of the stainless steel metal base layer is less than 16 x 10 ‑6 m/mk. The utility model provides an use PET silver thick liquid technology or flexibility in the production of the base plate of electronic product at presentThe production of the ink for the copper foil substrate attaching cover film leads to the problems of complex production process, large material size expansion and shrinkage and low product yield.
Description
Technical Field
The utility model relates to a combined type flexible circuit substrate based on stainless steel metal.
Background
With the vigorous development of the global electronic industry, the industry scale of the core component printed circuit board has broken through $ 650 million, the design trend is towards the ultra-fine circuit board (IC carrier or similar carrier), the high-reliability circuit board (power device substrate), and the demand of the three-dimensional circuit board (wearable, ultra-thin electronic product) is increasing, and the technical trend is also towards the direction of lightness, thinness, high reliability, high precision, and integration of structure and electronics.
At present, the development trend of the global electronic industry is toward the development of light, thin, short, high heat resistance, multiple functions, high density, high reliability and low cost, so that how to select the substrate of the electronic product becomes an important influencing factor. The good substrate must have the material characteristics of high thermal conductivity, high dimensional stability, high color-shielding effect, high heat dissipation, high heat resistance, and low thermal expansion coefficient. Especially, the notebook computer industry is gradually developing to be lighter, thinner and higher performance due to the objective market demand.
The production of using PET (polyethylene terephthalate) silver paste technology or flexible copper foil substrate laminating cover film printing ink exists in the production of the substrate of the electronic product at present, the production process is complicated, the material size is greatly expanded and contracted, and the yield of the product is not high.
Therefore, a new technical scheme of a flexible circuit substrate is needed to solve the problems of complicated production procedures, large material size expansion and shrinkage and low product yield caused by the production of using a PET silver paste process or a flexible copper foil substrate laminating cover film ink in the production of a substrate of an electronic product at present.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a combined type flexible circuit substrate based on stainless steel metal, has solved and has used PET silver thick liquid technology or flexible copper foil substrate laminating to cover membrane printing ink production in the production of the base plate of present electronic product, leads to the production processes complicated, and the material size harmomegathus is big partially, the problem that the yields of product is not high.
The embodiment of the application provides a combined type flexible circuit substrate based on stainless steel metal, includes: a stainless steel metal substrate and a resin-coated copper foil layer bonded to each other, wherein,
the resin-coated copper foil layer comprises a copper foil layer and an insulating layer which are mutually jointed, wherein the resin-coated copper foil layer is jointed with the stainless steel metal base layer through an insulating adhesive layer;
wherein, a stainless steel metal substrate is jointed with one or two resin-coated copper foil layers; with insulating adhesive layerThe stainless steel metal substrate has a surface roughness Ra of 50um or more on one side thereof, and a thermal expansion coefficient of 16 x 10 or less -6 m/mk。
Furthermore, the composite flexible circuit substrate can also comprise a heat conducting part which is of a columnar structure; one end of the columnar structure of the heat conducting part is contacted with the contact position of the copper foil layer and the heat source; the other end of the columnar structure of the heat conducting part is contacted with the contact position of the stainless steel metal base layer and the insulating adhesive layer.
Further, the composite flexible circuit substrate may further include:
the heat conduction material of the heat conduction part comprises silver, copper or aluminum, and the heat conduction part is one or more.
Further, the composite flexible circuit substrate may further include:
the stainless steel metal base layer is also provided with a heat-conducting structural member which is not in contact with the resin-coated copper foil layer.
Further, the composite flexible circuit substrate may further include:
the insulating layer includes: a polyimide film, a polyester film, a polynaphthalene film or a liquid crystal polymer film, and the insulating layer has a thickness of 5 to 100um.
Further, the composite flexible circuit substrate may further include:
the copper foil layer includes: rolled copper foil, electrolytic copper foil or highly ductile copper foil; the thickness of the copper foil layer is 3um to 70um.
Further, the composite flexible circuit substrate may further include:
the insulating adhesive layer includes: epoxy glue, acrylate glue, polyester glue, polyurethane glue or polyimide glue, and the thickness of the insulating binder layer is 5um to 50um.
Further, the composite flexible circuit substrate may further include:
the stainless steel metal substrate comprises a ferritic stainless steel foil or an austenitic stainless steel foil.
Further, the composite flexible circuit substrate may further include:
the stainless steel metal base layer comprises a ferritic stainless steel foil with a heat dissipation coefficient higher than 16W or an austenitic stainless steel foil with a heat dissipation coefficient higher than 16W.
Further, the composite flexible circuit substrate may further include:
a stainless steel metal substrate is bonded to a resin-coated copper foil layer through an insulating adhesive layer, and is bonded to an insulating resin layer having a thickness of 5 to 100um on the surface of the other side of the stainless steel metal substrate which is not in contact with the insulating adhesive layer; the insulating resin layer includes: a polyimide film, a polyester film, a polynaphthalene film, or a liquid crystal polymer film.
In the embodiment of the application, the composite flexible circuit substrate based on stainless steel metal has the following advantages:
1. extremely low dimensional shrinkage: because the stainless steel foil with extremely low expansion coefficient (less than one ten thousand) is used as the substrate, and the ultrathin PI insulating layer with 8um and the ultrathin insulating binder layer with 10um are realized by the ultrathin coating process, the expansion and shrinkage influence caused by the shrinkage of the PI insulating layer and the insulating binder layer is greatly reduced. By using the composite flexible circuit substrate based on stainless steel metal, excellent dimensional stability can be kept in the production process, high precision of the position of a circuit pattern bonding pad and the position of a hole is ensured, and the yield is greatly improved.
2. High heat dissipation: because the stainless steel foil with high heat dissipation coefficient (higher than 16W) is used as the substrate, the composite flexible circuit substrate based on the stainless steel metal has the characteristics of high heat dissipation and high heat load.
3. The electron and the structure are integrated: because the stainless steel metal base layer with good stretchability and plasticity is adopted as the substrate and the high-tensile PI insulating layer and the high-tensile insulating binder are matched, the composite flexible circuit substrate based on the stainless steel metal can be produced into the unique stainless steel base three-dimensional circuit board through the punching and bending process, the production process of the three-dimensional circuit board is greatly simplified, and the cost is reduced.
4. Light and thin: the flexible production of the rollable type, have good hardness and rigidity, easy mass production, reduce cost;
5. the structure combination is flexible: the composite flexible circuit substrate based on the stainless steel metal can be realized on a single surface, and the composite flexible circuit substrate based on the stainless steel metal can also be realized on a double surface; and used as a multilayer board core material.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following descriptions are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram of a composite flexible circuit substrate based on stainless steel metal according to an exemplary embodiment;
fig. 2 is a schematic diagram of a composite flexible circuit substrate including a thermal conductive portion and a thermal conductive structure according to an exemplary embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
Fig. 1 is a schematic structural diagram of a composite flexible circuit substrate based on stainless steel metal according to an exemplary embodiment, and as shown in fig. 1, the composite flexible circuit substrate based on stainless steel metal includes: a stainless steel metal base layer 10 and a resin-coated copper foil layer 20 bonded to each other, wherein,
the resin-coated copper foil layer 20 comprises a copper foil layer 201 and an insulating layer 202 bonded to each other, wherein the insulating layer 202 of the resin-coated copper foil layer 20 is in contact with the stainless steel metal substrate 10 through an insulating adhesive layer 12;
wherein, a stainless steel metal substrate is jointed with one or two resin-coated copper foil layers; the surface roughness Ra value of one side of the stainless steel metal base layer contacted with the insulating adhesive layer is more than or equal to 50um, and the thermal expansion coefficient of the stainless steel metal base layer is less than 16 x 10-6m/mk.
In practical test, the surface of one side of the stainless steel metal base layer in contact with the insulating adhesive layer is processed, so that the surface roughness Ra value of one side of the stainless steel metal base layer in contact with the insulating adhesive layer is more than or equal to 50 micrometers, the stainless steel metal base layer and the resin-coated copper foil layer are more favorably jointed, a hot pressing mode can be adapted, and the yield of products is improved.
In practical test, this application is through adopting the stainless steel metal substrate that thermal expansion coefficient is less than 16 x 10-6m/mk, can make the stainless steel metal substrate adapt to the mode of hot pressing, both can guarantee the rigidity of combined type flexible circuit board, can realize 8um ultra-thin PI insulating layer and 10um ultra-thin insulating binder layer through ultra-thin coating process again, the harmomegathus influence that PI insulating layer and insulating binder layer shrink brought has greatly been reduced, make insulating layer and insulating binder layer reach close thermal expansion coefficient, combine stainless steel metal substrate and coating resin copper foil layer into the material of integration, thereby form a flexible circuit board material of wholeness, extremely low size harmomegathus rate. Meanwhile, the toughness and plasticity of the stainless steel metal base layer can also keep a three-dimensional structure after punching, and the requirements of product design and assembly are enriched.
Stainless steel metal substrate: mainly stainless steel metal; a resin coated copper foil layer (RCC) including a copper foil layer and an insulation layer; an insulating adhesive layer (wherein the insulating adhesive includes coating type and pressable type insulating adhesives).
Taking a traditional notebook backlight flexible board as an example, the traditional notebook backlight flexible board is produced by laminating a cover film and printing ink on a PET silver paste or flexible copper foil substrate, the production process is complex, the material size is greatly expanded and contracted, the yield of products is low, and the production process can be greatly simplified, the production efficiency is improved, and the yield is improved through a composite flexible circuit substrate based on stainless steel metal; in an actual test, the thermal expansion coefficient of the insulating layer and the insulating adhesive layer is close to that of the insulating adhesive layer by adjusting the formula of the colloid and the rigidity of the stainless steel metal base layer, so that the flexible circuit board material with integrity and extremely low size expansion and contraction rate is formed; through the toughness and plasticity of the stainless steel metal base layer, the three-dimensional structure can be kept after punching, and the requirements of product design and assembly are enriched.
To sum up, the combined type flexible circuit substrate based on stainless steel metal of this application has following effect advantage:
1. by using the flexible stainless steel metal base layer, the production procedures are reduced, the product design is thinned, and the production cost is saved;
2. the yield of product production is improved, and the application range of the product is expanded;
3. extremely low dimensional shrinkage, high thermal conductivity, and dimensional plasticity.
Further, a stainless steel metal base layer is bonded to a resin-coated copper foil layer through an insulating adhesive layer, and is bonded to an insulating resin layer having a thickness of 5um to 100um on the surface of the other side of the stainless steel metal base layer which is not in contact with the insulating adhesive layer. An insulating resin layer is coated on the surface of the stainless steel metal base layer which is not subjected to surface treatment operation in an ultrathin coating mode, so that the thickness of the insulating resin layer reaches 5um to 100um. Wherein the insulating resin layer includes: a polyimide film, a polyester film, a polynaphthalene film, or a liquid crystal polymer film. The polyimide film is preferred, the product is mature, and the cost is lower; simultaneously the setting of the thickness of the insulating resin layer of this application can make the insulating resin layer be adapted to the mode coating of online coating on stainless steel metal substrate, and the large-scale production of being convenient for has improved the efficiency of production more greatly.
And carrying out curing treatment operation on the insulating resin layer so as to prevent the insulating resin layer from being adhered to each other during rolling, and achieving component reaction curing through a subsequent baking process. Through coating an insulating resin layer, can prevent that static from going on the harm to combined type flexible circuit substrate through stainless steel metal-based layer, prolonged combined type flexible circuit substrate's life-span, brought good user experience.
As shown in fig. 2, the heat conducting member 30 is further included, and the heat conducting member 30 has a columnar structure; one end of the columnar structure of the heat conduction portion 30 is in contact with a contact position of the copper foil layer 201 and the heat source R; the other end of the columnar structure of the thermal conduction portion 30 is in contact with the contact position of the stainless steel metal base layer 10 and the insulating adhesive layer 12. The heat conduction material of heat conduction portion 30 includes silver, copper or aluminium (the heat conduction material can include silver, copper or aluminium, and this application is not limited to above-mentioned heat conduction material, and any good heat conduction effect's material all is adapted to this application, and in the in-service use can adopt the copper facing mode to tamp the copper in the cavity of heat conduction portion, and such mode is with low costs, and the operation of being convenient for does benefit to extensive generation), heat conduction portion 30 is one or more, and the quantity that the heat conduction portion set up suits with the quantity that needs radiating position, the heat dissipation of being convenient for that can be better. The stainless steel metal base layer 10 is further provided with a heat conduction structural member 101, the heat conduction structural member is an independent structure, and the heat conduction structural member 101 is not in contact with the resin-coated copper foil layer 20.
In practical tests, when the composite flexible circuit substrate based on the stainless steel metal foil needs heat conduction output, the insulating layer and the insulating binder layer in the heat conduction contact area can be etched in a laser etching mode to form a columnar cavity structure, so that the stainless steel metal layer directly contacts the contact position of the copper foil layer and a heat source through the heat conduction part, and the heat is conducted and dissipated through the heat conduction structural part, and the optimal heat dissipation effect can be achieved. Meanwhile, the heat source can be directly conducted to the stainless steel metal layer at the edge of the heat source device of the stainless steel flexible circuit board in a mode of filling the heat-conducting metal material in the columnar cavity structure of the heat-conducting column, and then the heat source is absorbed and conducted to the heat-conducting structural member by the stainless steel metal layer. Due to good heat dissipation, the temperature of the composite flexible circuit substrate is greatly reduced, the performance of equipment adopting the composite flexible circuit substrate is improved, and the service life of the equipment is prolonged.
The insulating layer includes a Polyimide (PI) film, a polyester film, a polynaphthalene film, or a liquid crystal polymer film, and the insulating layer may have a thickness of 5um to 100um. The polyimide film is preferred, the product is mature, and the cost is lower; meanwhile, the thickness of the insulating layer is set so that the insulating layer can be coated on the copper foil layer in an online coating mode, large-scale production is facilitated, and production efficiency is improved greatly.
The copper foil layer comprises a rolled copper foil, an electrolytic copper foil or a high-ductility copper foil; the thickness of copper foil layer is 3um to 70um for the thickness of copper foil layer. The thickness of the copper foil layer is set to be suitable for reelable flexible production, and production efficiency is improved greatly.
The insulating binder layer includes that epoxy glues, acrylic acid ester glue, polyester glue, polyurethane glue or polyimide glue, and the thickness on insulating binder layer is 5um to 50um. The flexible circuit board material achieves the thermal expansion coefficient close to that of the insulating layer and the insulating binder layer by adjusting the formula of the colloid and the rigidity of the stainless steel metal base layer, so that the flexible circuit board material with the integrity and the extremely low size expansion and contraction rate is formed. Simultaneously the setting of the thickness on this application's insulating binder layer can make insulating binder layer through the mode coating on line on the insulating layer of coating resin copper foil layer, the large-scale production of being convenient for has improved the efficiency of production more greatly.
The stainless steel metal substrate comprises a ferritic stainless steel foil or an austenitic stainless steel foil.
Wherein the ferritic stainless steel foil is a stainless steel foil which is mainly in a ferritic structure in a use state, contains 11 to 30 percent of chromium and has a body-centered cubic crystal structure. The steel does not generally contain nickel, sometimes contains a small amount of Mo, ti, nb and other elements, and has the characteristics of large heat conductivity coefficient, small expansion coefficient, good oxidation resistance, excellent stress corrosion resistance and the like.
The austenitic stainless steel foil means a stainless steel foil having an austenitic structure at normal temperature. The austenitic stainless steel has a stable austenitic structure when it contains about 18% Cr, 8% to 25% Ni, and about 0.1% C. The austenitic stainless steel generally refers to stainless steel containing Cr and Ni, such as 304 steel, 316 steel and the like, the cost of the stainless steel is low, the large-scale production is facilitated, meanwhile, the stainless steel generally has no magnetism, has good corrosion resistance, cannot be strengthened by heat treatment, and can generate certain magnetism after being processed.
The stainless steel metal base layer comprises a ferritic stainless steel foil with the heat dissipation coefficient higher than 16W or an austenitic stainless steel foil with the heat dissipation coefficient higher than 16W. By adopting the ferritic stainless steel foil with the heat dissipation coefficient higher than 16W or the austenitic stainless steel foil with the heat dissipation coefficient higher than 16W, the composite flexible circuit substrate based on the stainless steel metal has the characteristics of high heat dissipation and high heat load.
The present application is further described below with reference to specific embodiments.
First embodiment:
the method comprises the following steps: single-sided adhesive-free copper foil substrate: the copper foil layer is coated on the insulating layer on one side of the copper foil layer; laminating the copper foil substrate: the insulating layer is coated on one side of the copper foil layer, and the insulating adhesive layer or the pressable insulating adhesive layer is coated on one side of the insulating layer; stainless steel metal substrate: a stainless steel metal base layer subjected to surface treatment.
The specific process is as follows: mixing and dissolving required components by using an organic solvent to form a liquid dispersion of an insulating polymer base layer, coating the liquid insulating polymer base layer on a copper foil layer by using online coating production equipment, so that the coated insulating layer passes through an online drying oven, removing the contained organic solvent and achieving curing so as to prevent mutual adhesion during rolling, and achieving component reaction curing by using a subsequent baking process to form a single-sided adhesive-free copper foil substrate;
the required components are mixed through an organic solvent to form a liquid dispersion of the insulating glue layer, the liquid dispersion of the insulating layer is coated on one side of the rough surface of the copper foil layer by using online coating production equipment, and the organic solvent contained in the liquid dispersion is removed through baking of an online drying oven, so that the insulating colloid reaches a semi-flowing semi-cured state.
The copper foil layer with one surface coated with glue is thermally cured and combined with the stainless steel metal base layer in an online coating or hot pressing mode.
In a second embodiment, the results of the dimensional shrinkage and expansion test are as follows:
can find out through above test result, the combined type flexible circuit substrate based on stainless steel metal of this application has characteristics such as extremely low size harmomegathus rate, high heat conductivity and three-dimensional plasticity, can solve present keyboard flexible printed circuit that is shaded and use PET silver thick liquid technology or flexible copper foil substrate laminating to cover membrane printing ink production, leads to production processes complicated, and the material size harmomegathus is bigger partially, the not high problem of yields of product.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (10)
1. A composite flexible circuit substrate based on stainless steel metal is characterized in that,
the method comprises the following steps: a stainless steel metal substrate and a resin-coated copper foil layer bonded to each other, wherein,
the resin-coated copper foil layer comprises a copper foil layer and an insulating layer which are mutually jointed, wherein the insulating layer of the resin-coated copper foil layer is jointed with the stainless steel metal base layer through an insulating adhesive layer;
wherein, a stainless steel metal substrate is jointed with one or two resin-coated copper foil layers; the surface roughness Ra of one side of the stainless steel metal base layer in contact with the insulating adhesive layer is greater than or equal to 50um, and the thermal expansion coefficient of the stainless steel metal base layer is less than 16 x 10 -6 m/mk。
2. The stainless steel metal-based composite flexible circuit substrate of claim 1,
the heat conduction part is of a columnar structure; one end of the columnar structure of the heat conduction part is contacted with the contact position of the copper foil layer and the heat source; the other end of the columnar structure of the heat conducting part is contacted with the contact position of the stainless steel metal base layer and the insulating adhesive layer.
3. The stainless steel metal-based composite flexible circuit substrate of claim 2, further comprising:
the heat conduction material of the heat conduction part comprises silver, copper or aluminum, and the heat conduction part is one or more.
4. The stainless steel metal-based composite flexible circuit substrate of claim 2 or 3, further comprising:
the stainless steel metal base layer is also provided with a heat-conducting structural member which is not in contact with the resin-coated copper foil layer.
5. The stainless steel metal-based composite flexible circuit substrate of claim 4, further comprising:
the insulating layer includes: a polyimide film, a polyester film, a polynaphthalene film or a liquid crystal polymer film, and the thickness of the insulating layer is 5um to 100um.
6. The stainless steel metal-based composite flexible circuit substrate of claim 4, further comprising:
the copper foil layer includes: rolled copper foil, electrolytic copper foil or highly ductile copper foil; the thickness of the copper foil layer is 3um to 70um.
7. The stainless steel metal-based composite flexible circuit substrate of claim 4, further comprising:
the insulating adhesive layer includes: epoxy glue, acrylate glue, polyester glue, polyurethane glue or polyimide glue, and the thickness of the insulating binder layer is 5um to 50um.
8. The stainless steel metal-based composite flexible circuit substrate of claim 4, further comprising:
the stainless steel metal base layer comprises a ferritic stainless steel foil or an austenitic stainless steel foil.
9. The stainless steel metal-based composite flexible circuit substrate of claim 8, further comprising:
the stainless steel metal base layer comprises a ferritic stainless steel foil with a heat dissipation coefficient higher than 16W or an austenitic stainless steel foil with a heat dissipation coefficient higher than 16W.
10. The stainless steel metal-based composite flexible circuit substrate of claim 9, further comprising:
a stainless steel metal substrate is bonded to a resin-coated copper foil layer through an insulating adhesive layer, and is bonded to an insulating resin layer having a thickness of 5 to 100um on the surface of the other side of the stainless steel metal substrate not in contact with the insulating adhesive layer; the insulating resin layer includes: a polyimide film, a polyester film, a polynaphthalene film, or a liquid crystal polymer film.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2024002227A1 (en) * | 2022-06-30 | 2024-01-04 | 上海合域电子科技有限公司 | Configuration method for stainless steel metal-based composite flexible circuit substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2024002227A1 (en) * | 2022-06-30 | 2024-01-04 | 上海合域电子科技有限公司 | Configuration method for stainless steel metal-based composite flexible circuit substrate |
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