CN115478263A - 一种气相生长装置 - Google Patents
一种气相生长装置 Download PDFInfo
- Publication number
- CN115478263A CN115478263A CN202211145287.8A CN202211145287A CN115478263A CN 115478263 A CN115478263 A CN 115478263A CN 202211145287 A CN202211145287 A CN 202211145287A CN 115478263 A CN115478263 A CN 115478263A
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- CN
- China
- Prior art keywords
- bearing
- space
- ring
- reaction cavity
- phase growth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001947 vapour-phase growth Methods 0.000 title claims abstract description 23
- 238000001816 cooling Methods 0.000 claims description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 34
- 238000003825 pressing Methods 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 19
- 239000011553 magnetic fluid Substances 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 18
- 230000008569 process Effects 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 10
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 24
- 239000007789 gas Substances 0.000 description 18
- 239000011261 inert gas Substances 0.000 description 12
- 239000006096 absorbing agent Substances 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211145287.8A CN115478263B (zh) | 2022-09-20 | 2022-09-20 | 一种气相生长装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211145287.8A CN115478263B (zh) | 2022-09-20 | 2022-09-20 | 一种气相生长装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN115478263A true CN115478263A (zh) | 2022-12-16 |
CN115478263B CN115478263B (zh) | 2023-06-30 |
Family
ID=84392678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202211145287.8A Active CN115478263B (zh) | 2022-09-20 | 2022-09-20 | 一种气相生长装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115478263B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118028784A (zh) * | 2024-04-09 | 2024-05-14 | 陛通半导体设备(苏州)有限公司 | 晶圆加热盘及半导体设备 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101660139A (zh) * | 2008-06-27 | 2010-03-03 | 东京毅力科创株式会社 | 膜沉积设备及方法、基片处理设备及计算机可读存储介质 |
CN101685791A (zh) * | 2008-09-25 | 2010-03-31 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 基片支承装置及其静电释放方法 |
US20190035647A1 (en) * | 2017-07-31 | 2019-01-31 | Asm Ip Holding B.V. | Substrate processing device |
US20210005419A1 (en) * | 2019-07-02 | 2021-01-07 | Semes Co., Ltd. | Support unit and substrate treating apparatus including the same |
CN113088933A (zh) * | 2020-12-14 | 2021-07-09 | 芯三代半导体科技(苏州)有限公司 | 旋转装置 |
CN213925011U (zh) * | 2020-12-14 | 2021-08-10 | 芯三代半导体科技(苏州)有限公司 | 旋转装置 |
CN216025216U (zh) * | 2021-07-09 | 2022-03-15 | 谷励健康管理(上海)有限公司 | 一种自冷却磨粉机构 |
WO2022089320A1 (zh) * | 2020-10-26 | 2022-05-05 | 北京北方华创微电子装备有限公司 | 晶圆承载机构及半导体工艺设备 |
CN115044971A (zh) * | 2022-05-23 | 2022-09-13 | 芯三代半导体科技(苏州)有限公司 | 一种用于气相生长装置的晶圆承载装置及控制方法 |
-
2022
- 2022-09-20 CN CN202211145287.8A patent/CN115478263B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101660139A (zh) * | 2008-06-27 | 2010-03-03 | 东京毅力科创株式会社 | 膜沉积设备及方法、基片处理设备及计算机可读存储介质 |
CN101685791A (zh) * | 2008-09-25 | 2010-03-31 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 基片支承装置及其静电释放方法 |
US20190035647A1 (en) * | 2017-07-31 | 2019-01-31 | Asm Ip Holding B.V. | Substrate processing device |
CN109326537A (zh) * | 2017-07-31 | 2019-02-12 | Asm知识产权私人控股有限公司 | 衬底处理装置 |
US20210005419A1 (en) * | 2019-07-02 | 2021-01-07 | Semes Co., Ltd. | Support unit and substrate treating apparatus including the same |
WO2022089320A1 (zh) * | 2020-10-26 | 2022-05-05 | 北京北方华创微电子装备有限公司 | 晶圆承载机构及半导体工艺设备 |
CN113088933A (zh) * | 2020-12-14 | 2021-07-09 | 芯三代半导体科技(苏州)有限公司 | 旋转装置 |
CN213925011U (zh) * | 2020-12-14 | 2021-08-10 | 芯三代半导体科技(苏州)有限公司 | 旋转装置 |
CN216025216U (zh) * | 2021-07-09 | 2022-03-15 | 谷励健康管理(上海)有限公司 | 一种自冷却磨粉机构 |
CN115044971A (zh) * | 2022-05-23 | 2022-09-13 | 芯三代半导体科技(苏州)有限公司 | 一种用于气相生长装置的晶圆承载装置及控制方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118028784A (zh) * | 2024-04-09 | 2024-05-14 | 陛通半导体设备(苏州)有限公司 | 晶圆加热盘及半导体设备 |
Also Published As
Publication number | Publication date |
---|---|
CN115478263B (zh) | 2023-06-30 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 215125 No. 388 Ruoshui Road, Suzhou Industrial Park, Jiangsu Province Patentee after: Suzhou Laboratory of Materials Science Country or region after: China Patentee after: Xin San Dai Semiconductor Technology (Suzhou) Co.,Ltd. Address before: 215125 No. 388 Ruoshui Road, Suzhou Industrial Park, Jiangsu Province Patentee before: Suzhou Laboratory of Materials Science Country or region before: China Patentee before: Core semiconductor technology (Suzhou) Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20240604 Address after: 215000 building s, 104 Sumu Road, Suzhou Industrial Park, Suzhou area, China (Jiangsu) pilot Free Trade Zone, Suzhou City, Jiangsu Province Patentee after: Xin San Dai Semiconductor Technology (Suzhou) Co.,Ltd. Country or region after: China Address before: 215125 No. 388 Ruoshui Road, Suzhou Industrial Park, Jiangsu Province Patentee before: Suzhou Laboratory of Materials Science Country or region before: China Patentee before: Xin San Dai Semiconductor Technology (Suzhou) Co.,Ltd. |