CN115458263A - Coating device for wrapping layer of chip of piezoresistor - Google Patents
Coating device for wrapping layer of chip of piezoresistor Download PDFInfo
- Publication number
- CN115458263A CN115458263A CN202211114846.9A CN202211114846A CN115458263A CN 115458263 A CN115458263 A CN 115458263A CN 202211114846 A CN202211114846 A CN 202211114846A CN 115458263 A CN115458263 A CN 115458263A
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- 239000011248 coating agent Substances 0.000 title claims abstract description 56
- 238000000576 coating method Methods 0.000 title claims abstract description 56
- 239000000725 suspension Substances 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000001035 drying Methods 0.000 claims description 13
- 238000012546 transfer Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims 10
- 238000010168 coupling process Methods 0.000 claims 10
- 238000005859 coupling reaction Methods 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000002390 adhesive tape Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 16
- 238000000926 separation method Methods 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 6
- 238000010030 laminating Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention belongs to the technical field of a piezoresistor chip, and particularly relates to a coating device for a wrapping layer of a piezoresistor chip, which comprises a suspension conveying frame, an annular operating platform, a coating groove, a fixing plate and a placing plate, wherein the suspension conveying frame is provided with a conveying belt; the method comprises the following steps that a mechanical arm or a manual worker is used for placing a piezoresistor chip into a placing groove of a placing plate, so that pins of the piezoresistor chip are upward, the pins of the piezoresistor chip are blocked by the side wall of the placing groove, the middle parts of the pins of the piezoresistor chip are close, the top ends of the pins of the piezoresistor chip are located in the opening range of the placing groove, a sliding frame of a suspension conveying frame drives a fixed plate to operate, the fixed plate descends to coincide with the placing plate, and a clamping structure clamps and fixes the pins of the piezoresistor chip; because the pins of the piezoresistor chip are not fixed by using adhesive tapes, the cleanness degree of the pins of the piezoresistor chip is improved, and the production quality of the piezoresistor chip is improved.
Description
Technical Field
The invention belongs to the technical field of piezoresistor chips, and particularly relates to a coating device for wrapping layers of piezoresistor chips.
Background
The voltage dependent resistor chip is a resistor device with nonlinear volt-ampere characteristics, and is used for clamping voltage when a circuit bears overvoltage and absorbing redundant current to protect a sensitive device; the surface of the piezoresistor chip is coated with a protective coating in order to protect the internal body element, and the conventional coating mode is to adhere the piezoresistor chip to a fixed plate by using an adhesive tape and then perform coating operation.
For example, a patent application with publication number CN106782953A discloses a varistor and a manufacturing process thereof, wherein the varistor is composed of a ceramic substrate, a lead terminal, an electrode layer and an insulating layer, and the specific process of manufacturing the varistor is as follows: 1. preparing piezoresistor ceramic powder; 2. stamping and forming a raw sheet of the piezoresistor; 3. sintering the green sheet; 4. cleaning and drying; 5. selecting a mask plate; 6. sputtering an electrode; 7. connecting the leading-out terminal; 8. coating an insulating layer, namely coating the piezoresistor connected with the leading-out end with the insulating layer, wherein the piezoresistor is insulated from the outside except the part led out by the leading-out end; 9. and printing and testing the mark.
When the existing piezoresistor chip is coated, the piezoresistor chip is required to be adhered to a fixing plate by using an adhesive tape, after the coating is finished, when the piezoresistor chip is taken down, glue of the adhesive tape can be remained on the surface of a pin of the piezoresistor chip, the residual glue can cause poor contact of the pin of the piezoresistor chip, and the normal work of the piezoresistor chip is influenced.
Therefore, the invention provides a coating device for a wrapping layer of a chip of a piezoresistor.
Disclosure of Invention
To remedy the deficiencies of the prior art, at least one of the technical problems set forth in the background is addressed.
The technical scheme adopted by the invention for solving the technical problem is as follows: the coating device for the wrapping layer of the piezoresistor chip comprises a hanging conveying frame, an annular operating platform, a coating groove, a fixing plate, a fixing groove, a placing plate and a placing groove, wherein the hanging conveying frame is arranged on the upper surface of the hanging conveying frame; an annular operating platform is arranged on the outer ring of the hanging and conveying frame, a coating groove is formed in the middle of one side of the annular operating platform, resin solution is filled in the coating groove, a fixing plate is hung at the lower end of a sliding frame of the hanging and conveying frame, a plurality of fixing grooves are uniformly formed in the bottom surface of the fixing plate, a clamping structure is arranged in the fixing groove, a placing plate is arranged at one end of the top surface of the annular operating platform, and a plurality of placing grooves are uniformly formed in the top surface of the placing plate; the placing groove is a deep groove with an arc-shaped bottom, and the opening size of the placing groove is matched with the body element of the piezoresistor chip; when the clamping device works, a piezoresistor chip is placed inside a placing groove of a placing plate by a manipulator or manually, so that pins of the piezoresistor chip are upward, the pins of the piezoresistor chip are blocked by the side wall of the placing groove, the middle parts of the pins of the piezoresistor chip are close, the top ends of the pins of the piezoresistor chip are positioned in the opening range of the placing groove, a sliding frame of a suspension conveying frame drives a fixed plate to operate, when the fixed plate operates on the top surface of the placing plate, the fixed plate descends and is overlapped with the placing plate, so that the pins of the piezoresistor chip are inserted into a fixed groove of the fixed plate, a clamping structure clamps and fixes the pins of the piezoresistor chip, the fixed plate ascends to clamp and lift the piezoresistor chip, the sliding frame of the suspension conveying frame operates above the placing groove, the fixed plate descends, a body element of the piezoresistor chip is immersed under the liquid level of a resin solution in the coating groove, the surface of the body element of the piezoresistor chip is coated with resin, and the coating work of a coating layer of the piezoresistor chip is finished; because the pins of the piezoresistor chip are not fixed by using adhesive tapes, the cleanness degree of the pins of the piezoresistor chip is improved, and the production quality of the piezoresistor chip is improved.
Preferably, the clamping structure comprises a first hydraulic cylinder, a push rod, an insert, a separating plate, a transmission rod, a fixed rod, a first spring and a second spring; the top of the fixing plate is provided with a plurality of sliding holes, one end of each sliding hole penetrates through one side of the fixing plate, a plurality of inner grooves are uniformly formed in the bottom surface of each sliding hole, each inner groove is positioned at the top of each fixing groove, a push rod is slidably mounted inside each sliding hole, a hydraulic cylinder is fixedly connected to one side, close to the opening of each sliding hole, of the top surface of the fixing plate, a piston rod of the hydraulic cylinder is fixedly connected with the end of each push rod, a plurality of insert blocks are fixedly connected to the bottom surface of each push rod, the outer walls of the insert blocks are in sliding fit with the inner walls of the inner grooves, a separating plate is fixedly connected to the middle of the top surface of each fixing groove, a vertical groove is formed in the middle of the top surface of each separating plate, the top end of each vertical groove is communicated with the inner grooves, and a transmission rod is slidably mounted inside each vertical groove, the top end of the transmission rod and the bottom surface of the insert are both provided with cambered surfaces, the top end cambered surface of the transmission rod is in sliding fit with the bottom side cambered surface of the insert, a plurality of notches are uniformly formed in two sides of the transmission rod, the top of each notch is provided with a cambered surface, mounting holes are uniformly formed in two sides of the separating plate, a fixing rod is slidably mounted in each mounting hole, the section of each fixing rod is T-shaped, one side, close to the transmission rod, of each fixing rod is a cambered surface, one side, close to the transmission rod, of each fixing rod is in sliding fit with the inner wall of each notch, a first spring is arranged between the lower end of the transmission rod and the lower end of each vertical groove, and a plurality of second springs are arranged between each fixing rod and each mounting hole; when the fixing plate is lowered and overlapped with the placing plate during working, pins of the piezoresistor chip are inserted into the fixing groove of the fixing plate, and the pins of the piezoresistor chip are blocked by the separating plate, so that the pins of the piezoresistor chip are unfolded towards two sides, and the pins of the piezoresistor chip are close to the inner walls of the two sides of the fixing groove; at the moment, the first hydraulic cylinder pushes the push rod to slide into the inside of the sliding hole to drive the insert block to be in the inside of the inner groove, the transmission rod is pushed to slide downwards into the inside of the vertical groove, so that the first spring is compressed, meanwhile, the notches formed in the two sides of the transmission rod push the fixed rod to slide towards the two sides along the mounting hole so that the second spring is compressed, and the fixed rod is matched with the inner wall of the fixed groove to clamp and fix the pins of the piezoresistor chip, so that the clamping work of the piezoresistor chip is completed; after the completion is to piezo-resistor chip parcel layer application work, the inside roll-off of slide opening is followed to the pneumatic cylinder drive push rod, drive the top that the drive is inserted and is broken away from the transfer line, make the pressure that the transfer line received disappear, spring return, promote the transfer line and upwards slide, make the notch remove the position of dead lever, spring return No. two, the inner wall of the end laminating notch of promotion dead lever, the dead lever slides to the inside of erecting the groove along the mounting hole, make the pin release of dead lever with the piezo-resistor chip, thereby make the piezo-resistor chip drop from the bottom of fixed plate, the staff's of being convenient for collection work.
Preferably, one side of the fixed rod, which is far away from the transmission rod, is provided with a sawtooth-shaped raised line, two sides of the fixed groove are fixedly connected with rubber pads, the bottom of each rubber pad is an arc surface, and the lower end of each rubber pad is overlapped with the edge of an opening at the bottom of the fixed groove; during operation, the pin of piezo-resistor chip receives blockking of separator, make the pin of piezo-resistor chip expand to both sides, the surface of the pin laminating rubber pad of piezo-resistor chip, during the pin of dead lever extrusion piezo-resistor chip, make the pin of piezo-resistor chip be absorbed in the surface of rubber pad, the damage to piezo-resistor chip pin has been reduced, and simultaneously, the dead lever releases the pin of piezo-resistor chip, the rubber pad resets, the pin that promotes the piezo-resistor chip is bounced, the probability of the pin of piezo-resistor chip gluing on the fixed slot inner wall has been reduced.
Preferably, the section of the separation plate is conical, the lower end of the separation plate is arc-shaped, and the length of the section of the separation plate is greater than the depth of the fixing groove; when the fixing plate is lowered and overlapped with the placing plate during working, pins of the piezoresistor chip are inserted into the fixing groove of the fixing plate, and the pins of the piezoresistor chip are blocked by the separating plate, so that the pins of the piezoresistor chip are unfolded towards two sides, and the pins of the piezoresistor chip are close to the inner walls of the two sides of the fixing groove; simultaneously, the low side of separator inserts the middle part of standing groove earlier, struts the pin of piezo-resistor chip to both sides, has reduced the pin of piezo-resistor chip and has too close to, causes the crooked probability of damaging of pin of piezo-resistor chip.
Preferably, a base is arranged at one end of the annular operating platform, a disc is rotatably mounted on the top surface of the base, the top surface of the disc and the operating surface of the annular operating platform are horizontally overlapped, a first motor is arranged in the base, a rotating shaft of the first motor is fixedly connected with the middle of the bottom surface of the disc, a plurality of mounting grooves are uniformly formed in the outer ring of the top surface of the disc in a surrounding manner, and a placing plate is bolted in the mounting grooves; during operation, the manipulator or the manual work place the piezo-resistor chip the inside of placing the standing groove of board, and a motor drive disc is at the uniform velocity rotatory for a plurality of boards of placing are at the uniform velocity through annular operation panel, and a plurality of fixed plates of being convenient for coincide with placing the board in proper order, snatch the piezo-resistor chip, thereby are convenient for carry out automatic assembly line formula processing production.
Preferably, an upright post is bolted at the lower end of a sliding frame of the suspension conveying frame, four sides of an outer ring of the upright post are respectively provided with a sliding arm in a sliding manner, the bottom surfaces of the sliding arms at the four sides are fixedly connected with a connecting plate, the middle part of the upright post is provided with a second hydraulic cylinder, and the lower end of a piston rod of the second hydraulic cylinder is fixedly connected with the top surface of the connecting plate; when the lifting mechanism works, the second hydraulic cylinder pushes the sliding arm to slide along the outer ring of the upright post, so that the lifting and descending movement of the fixing plate is realized; the stand column is wrapped by the four sliding arms to slide, the probability of shaking of the sliding arms in the sliding process is reduced, and the movement stability of the fixing plate is improved, so that the firm degree of grabbing the piezoresistor chip is improved, and meanwhile, the coating accuracy of the piezoresistor chip is reduced.
Preferably, a ring seat is fixedly connected to the middle of the top surface of the fixed plate, a connecting rod is rotatably mounted in the middle of the ring seat, the top end of the connecting rod is fixedly connected to the middle of the bottom surface of the connecting plate, a toothed ring is fixedly connected to the outer ring of the top surface of the ring seat, a second motor is fixedly connected to the bottom surface of the connecting plate, a gear is fixedly connected to a rotating shaft of the second motor, and the gear is meshed with the toothed ring; during operation, when the fixed plate removed when placing the board top, no. two motor drive gear rotated, and the ring gear of drive and meshing with it rotated, and it is rotatory along the connecting rod to drive the fixed plate for the fixed plate with place the board coincidence, reduced the fixed plate and place the probability that the board takes place the dislocation, improved the accuracy degree that snatchs the piezo-resistor chip.
Preferably, a drying channel is fixedly connected to the top surface of the other side of the annular operating platform, and heating pipes are arranged on the inner walls of the two sides of the drying channel; when the drying device works, after coating work of the wrapping layer of the piezoresistor chip is finished, the suspension conveying frame drives the piezoresistor chip to pass through the drying channel, the heating pipe heats the drying channel, and the piezoresistor chip is dried; meanwhile, other processing equipment can be arranged on the annular operating platform to process the piezoresistor chip; thereby realizing the continuous automatic production flow of the piezoresistor chip.
Preferably, baffles are fixedly connected to two sides of the interior of the coating groove, and the top surface of one side, close to the baffles, of the two sides is in sliding fit with the outer ring of the bottom surface of the fixing plate; when the fixing plate works, when the top surface of the coating groove of the fixing plate descends, the two sides of the fixing plate are blocked by the baffle plate to limit the descending height, so that the position of the piezoresistor chip for coating is limited, and the probability that pins of the piezoresistor chip are infected with resin solution is reduced.
The invention has the following beneficial effects:
1. the coating device for the wrapping layer of the chip of the piezoresistor is provided with a suspension conveying frame, an annular operating platform, a coating groove, a fixing plate and a placing plate; placing the piezoresistor chip into the placing groove of the placing plate by using a manipulator or manually, so that the pins of the piezoresistor chip are upward, the middle parts of the pins of the piezoresistor chip are close to each other due to the fact that the pins of the piezoresistor chip are blocked by the side wall of the placing groove, and the top ends of the pins of the piezoresistor chip are located in the opening range of the placing groove; the sliding frame of the suspension conveying frame drives the fixed plate to operate, the fixed plate descends to coincide with the placing plate, and the pins of the piezoresistor chip are clamped and fixed by the clamping structure; because the pins of the piezoresistor chip are not fixed by using adhesive tapes, the cleanness degree of the pins of the piezoresistor chip is improved, and the production quality of the piezoresistor chip is improved.
2. The coating device for the wrapping layer of the chip of the piezoresistor is provided with a connecting rod, a gear ring, a second motor and a gear; when the fixed plate moved to place the board top, no. two motor drive gear rotated, and the drive rotated with it's meshed ring gear, drove the fixed plate and rotated along the connecting rod, finely tuned the fixed plate for the fixed plate with place the board coincidence, reduced the fixed plate and placed the probability that the board takes place the dislocation, improved the accuracy degree of snatching the piezo-resistor chip.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a perspective view of a first embodiment of the present invention;
FIG. 2 is a cross-sectional view of a first embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 1 at A;
FIG. 4 is a cross-sectional view of a fixation plate in accordance with an embodiment of the present invention;
FIG. 5 is a partial enlarged view of FIG. 4 at B;
FIG. 6 is a cross-sectional view of a separator plate according to an embodiment of the invention;
FIG. 7 is a cross-sectional view of a base according to an embodiment of the present invention;
FIG. 8 is a cross-sectional view of a second embodiment of the present invention;
in the figure: 1. hanging a conveying frame; 2. an annular operating table; 3. coating a groove; 4. a fixing plate; 5. a fixing groove; 6. placing a plate; 7. a placement groove; 8. a first hydraulic cylinder; 9. a push rod; 10. an insert; 11. a separation plate; 12. a transmission rod; 13. fixing the rod; 14. a first spring; 15. a second spring; 16. a slide hole; 17. an inner tank; 18. a vertical slot; 19. a notch; 20. mounting holes; 21. a rubber pad; 22. a base; 23. a disc; 24. a first motor; 25. mounting grooves; 26. a column; 27. a slide arm; 28. a connecting plate; 29. a second hydraulic cylinder; 30. a ring seat; 31. a connecting rod; 32. a toothed ring; 33. a second motor; 34. a gear; 35. a drying channel; 36. heating a tube; 37. a baffle plate; 38. a rotating rod; 39. a roller; 40. a blade.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Example one
As shown in fig. 1 to 7, the coating device for the wrapping layer of the varistor chip according to the embodiment of the present invention includes a hanging and conveying frame 1, a ring-shaped operating platform 2, a coating slot 3, a fixing plate 4, a fixing slot 5, a placing plate 6, and a placing slot 7; an annular operating platform 2 is arranged on the outer ring of the hanging and conveying frame 1, a coating groove 3 is formed in the middle of one side of the annular operating platform 2, resin solution is filled in the coating groove 3, a fixed plate 4 is hung at the lower end of a sliding frame of the hanging and conveying frame 1, a plurality of fixing grooves 5 are uniformly formed in the bottom surface of the fixed plate 4, a clamping structure is arranged in each fixing groove 5, a placing plate 6 is arranged at one end of the top surface of the annular operating platform 2, and a plurality of placing grooves 7 are uniformly formed in the top surface of the placing plate 6; the placing groove 7 is a deep groove with an arc-shaped bottom, and the opening size of the placing groove 7 is matched with the body element of the piezoresistor chip; when the coating machine works, a piezoresistor chip is placed inside a placing groove 7 of a placing plate 6 by a manipulator or manually, so that pins of the piezoresistor chip are upward, the pins of the piezoresistor chip are blocked by the side wall of the placing groove 7, the middle parts of the pins of the piezoresistor chip are close, the top ends of the pins of the piezoresistor chip are positioned in the opening range of the placing groove 7, a sliding frame of a suspension conveying frame 1 drives a fixing plate 4 to operate, when the fixing plate 4 operates on the top surface of the placing plate 6, the fixing plate 4 descends and coincides with the placing plate 6, so that the pins of the piezoresistor chip are inserted into a fixing groove 5 of the fixing plate 4, a clamping structure clamps and fixes the pins of the piezoresistor chip, the fixing plate 4 ascends to clamp the piezoresistor chip, the piezoresistor chip is lifted and is moved above the coating groove 3 along with the sliding frame 1, the fixing plate 4 descends to dip the body element of the piezoresistor chip into the liquid level of the resin solution in the coating groove 3, and the surface of the body element of the piezoresistor chip is coated with resin, and the coating layer of the piezoresistor chip is coated; because the pins of the piezoresistor chip are not fixed by using adhesive tapes, the cleanness degree of the pins of the piezoresistor chip is improved, and the production quality of the piezoresistor chip is improved.
As shown in fig. 3 to 6, the clamping structure comprises a first hydraulic cylinder 8, a push rod 9, an insert 10, a separating plate 11, a transmission rod 12, a fixed rod 13, a first spring 14 and a second spring 15; the top of the fixed plate 4 is provided with a plurality of sliding holes 16, one end of each sliding hole 16 penetrates through one side of the fixed plate 4, the bottom surface of each sliding hole 16 is uniformly provided with a plurality of inner grooves 17, each inner groove 17 is positioned at the top of the fixed groove 5, a push rod 9 is slidably mounted inside each sliding hole 16, one side, close to the opening of each sliding hole 16, of the top surface of the fixed plate 4 is fixedly connected with a first hydraulic cylinder 8, a piston rod of each first hydraulic cylinder 8 is fixedly connected with the end of each push rod 9, the bottom surface of each push rod 9 is fixedly connected with a plurality of inserts 10, the outer wall of each insert 10 is in sliding fit with the inner wall of each inner groove 17, the middle of the top surface of each fixed groove 5 is fixedly connected with a separating plate 11, the middle of the top surface of each separating plate 11 is provided with a vertical groove 18, the top end of each vertical groove 18 is communicated with each inner groove 17, and a transmission rod 12 is slidably mounted inside each vertical groove 18, the top end of the transmission rod 12 and the bottom surface of the insert 10 are both provided with cambered surfaces, the top end cambered surface of the transmission rod 12 is in sliding fit with the bottom side cambered surface of the insert 10, two sides of the transmission rod 12 are uniformly provided with a plurality of notches 19, the top of each notch 19 is provided with a cambered surface, two sides of the separating plate 11 are uniformly provided with mounting holes 20, a fixing rod 13 is slidably mounted in each mounting hole 20, the cross section of each fixing rod 13 is T-shaped, one side of each fixing rod 13, which is close to the transmission rod 12, is provided with a cambered surface, one side of each fixing rod 13, which is close to the transmission rod 12, is in sliding fit with the inner wall of each notch 19, a first spring 14 is arranged between the lower end of the transmission rod 12 and the lower end of the vertical groove 18, and a plurality of second springs 15 are arranged between the fixing rods 13 and the mounting holes 20; when the fixing plate 4 descends and is superposed with the placing plate 6 in work, the pins of the piezoresistor chip are inserted into the fixing groove 5 of the fixing plate 4 and are blocked by the separating plate 11, so that the pins of the piezoresistor chip are unfolded towards two sides, and the pins of the piezoresistor chip are close to the inner walls of the two sides of the fixing groove 5; at the moment, the first hydraulic cylinder 8 pushes the push rod 9 to slide into the sliding hole 16 to drive the insert 10 to be in the inner groove 17 and push the transmission rod 12 to slide downwards into the vertical groove 18, so that the first spring 14 is compressed, meanwhile, the notches 19 formed in the two sides of the transmission rod 12 push the fixing rod 13 to slide towards the two sides along the mounting hole 20, so that the second spring 15 is compressed, and the fixing rod 13 is matched with the inner wall of the fixing groove 5 to clamp and fix the pins of the piezoresistor chip, so that the clamping work of the piezoresistor chip is completed; after the completion is to piezo-resistor chip parcel layer application work, no. one pneumatic cylinder 8 drives push rod 9 from the inside roll-off of slide opening 16, drive the top that 10 breaks away from transfer line 12 of inserting, make the pressure that transfer line 12 received disappear, spring 14 resets, promote transfer line 12 and upwards slide, make notch 19 remove the position of dead lever 13, spring 15 resets No. two, promote the inner wall of the end laminating notch 19 of dead lever 13, dead lever 13 slides to the inside of erecting groove 18 along mounting hole 20, make dead lever 13 release the pin of piezo-resistor chip, thereby make the piezo-resistor chip drop from the bottom of fixed plate 4, be convenient for staff's collection work.
As shown in fig. 5 to 6, one side of the fixed rod 13, which is away from the transmission rod 12, is provided with a saw-toothed convex strip, two sides of the fixed slot 5 are fixedly connected with rubber pads 21, the bottom of the rubber pads 21 is an arc surface, and the lower end of the rubber pads 21 coincides with the edge of the bottom opening of the fixed slot 5; during operation, the pin of piezo-resistor chip receives blockking of separator plate 11, make the pin of piezo-resistor chip expand to both sides, the surface of pin laminating rubber pad 21 of piezo-resistor chip, when dead lever 13 extrudes the pin of piezo-resistor chip, make the pin of piezo-resistor chip be absorbed in the surface of rubber pad 21, the damage to piezo-resistor chip pin has been reduced, and simultaneously, dead lever 13 releases the pin of piezo-resistor chip, rubber pad 21 resets, the pin that promotes the piezo-resistor chip is bounced, the probability of the pin of piezo-resistor chip gluing on 5 inner walls of fixed slot has been reduced.
As shown in fig. 4 to 6, the section of the separation plate 11 is tapered, the lower end of the separation plate 11 is set to be arc-shaped, and the length of the section of the separation plate 11 is greater than the depth of the fixing groove 5; when the fixing plate 4 descends and is overlapped with the placing plate 6 in work, the pins of the piezoresistor chip are inserted into the fixing groove 5 of the fixing plate 4, and the pins of the piezoresistor chip are blocked by the separating plate 11, so that the pins of the piezoresistor chip are unfolded towards two sides, and the pins of the piezoresistor chip are close to the inner walls of the two sides of the fixing groove 5; meanwhile, the lower end of the separating plate 11 is inserted into the middle of the placing groove 7, pins of the piezoresistor chip are spread towards two sides, and the probability that the pins of the piezoresistor chip are too close to cause bending damage to the pins of the piezoresistor chip is reduced.
As shown in fig. 1 and 7, a base 22 is arranged at one end of the ring-shaped operating platform 2, a disc 23 is rotatably mounted on the top surface of the base 22, the top surface of the disc 23 is horizontally overlapped with the operating surface of the ring-shaped operating platform 2, a first motor 24 is arranged inside the base 22, the rotating shaft of the first motor 24 is fixedly connected with the middle part of the bottom surface of the disc 23, a plurality of mounting grooves 25 are uniformly formed around the outer ring of the top surface of the disc 23, and a placing plate 6 is bolted inside the mounting grooves 25; during operation, the manipulator or the manual work place the piezo-resistor chip to the inside of placing groove 7 of placing board 6, and a motor 24 drive disc 23 does at the uniform velocity rotatory for a plurality of places 6 at the uniform velocity through annular operation panel 2, be convenient for a plurality of fixed plates 4 in proper order with place board 6 and carry out the coincidence, snatch the piezo-resistor chip, thereby be convenient for carry out automatic pipelined processing and production.
As shown in fig. 3 to 4, an upright post 26 is bolted to the lower end of the carriage of the suspension transportation frame 1, four sides of the outer ring of the upright post 26 are all slidably provided with slide arms 27, the bottom surfaces of the four sides of the slide arms 27 are fixedly connected with a connecting plate 28, the middle part of the upright post 26 is provided with a second hydraulic cylinder 29, and the lower end of the piston rod of the second hydraulic cylinder 29 is fixedly connected with the top surface of the connecting plate 28; during operation, the second hydraulic cylinder 29 pushes the slide arm 27 to slide along the outer ring of the upright post 26, so that the ascending and descending movement of the fixed plate 4 is realized; the upright post 26 is wrapped by the four sliding arms 27 to slide, so that the probability of shaking of the sliding arms 27 in the sliding process is reduced, the movement stability of the fixing plate 4 is improved, the firm grabbing degree of the piezoresistor chip is improved, and meanwhile, the coating accuracy of the piezoresistor chip is reduced.
As shown in fig. 3 to 4, a ring seat 30 is fixedly connected to the middle of the top surface of the fixing plate 4, a connecting rod 31 is rotatably installed at the middle of the ring seat 30, the top end of the connecting rod 31 is fixedly connected to the middle of the bottom surface of the connecting plate 28, a toothed ring 32 is fixedly connected to the outer ring of the top surface of the ring seat 30, a second motor 33 is fixedly connected to the bottom surface of the connecting plate 28, a gear 34 is fixedly connected to the rotating shaft of the second motor 33, and the gear 34 is meshed with the toothed ring 32; during operation, when fixed plate 4 removed when placing 6 tops of board, no. two motor 33 drive gear 34 rotated, and the drive rotates with its meshed ring gear 32, drives fixed plate 4 and rotates along connecting rod 31, finely tunes fixed plate 4 for fixed plate 4 with place 6 coincidences of board, reduced fixed plate 4 and the probability of placing 6 emergence dislocations of board, improved the accuracy degree of snatching the piezo-resistor chip.
As shown in fig. 1 to fig. 2, a drying channel 35 is fixedly connected to the top surface of the other side of the annular operating platform 2, and heating pipes 36 are arranged on the inner walls of the two sides of the drying channel 35; during work, after finishing coating the wrapping layer of the piezoresistor chip, the suspension conveying frame 1 drives the piezoresistor chip to pass through the drying channel 35, the heating pipe 36 heats the drying channel 35, and the piezoresistor chip is dried; meanwhile, other processing equipment can be arranged on the annular operating platform 2 to process the piezoresistor chip; thereby realizing the continuous automatic production flow of the piezoresistor chip.
As shown in fig. 2, two sides of the interior of the coating groove 3 are fixedly connected with baffles 37, and the top surface of the side close to the baffles 37 on the two sides is in sliding fit with the outer ring of the bottom surface of the fixing plate 4; when the coating device works, when the top surface of the coating groove 3 of the fixing plate 4 descends, the two sides of the fixing plate 4 are blocked by the baffle 37 to limit the descending height, so that the coating position of the piezoresistor chip is limited, and the probability that pins of the piezoresistor chip are stained with resin solution is reduced.
Example two
As shown in fig. 8, a first comparative example, in which another embodiment of the present invention is: a plurality of rotating rods 38 are rotatably mounted in the middle of the baffle 37, the rotating rods 38 penetrate through the baffle 37, rollers 39 are fixedly connected to the top ends of the rotating rods 38, the outer rings of the rollers 39 are in sliding fit with the side faces of the fixed plate 4, and a plurality of paddles 40 are fixedly connected to the outer ring of the bottom of the rotating rods 38; during operation, fixed plate 4 descends and contacts behind baffle 37, and fixed plate 4 slides along baffle 37, and gyro wheel 39 slides along the side of fixed plate 4, drives bull stick 38 and rotates, and drive paddle 40 is rotatory for the resin solution of coating groove 3 inside carries out slow motion, has reduced resin solution and has taken place to deposit the probability of solidifying, simultaneously, has reduced the probability that resin solution splashes.
When in work: placing the piezoresistor chip into the placing groove 7 of the placing plate 6 by using a manipulator or manually, so that the pins of the piezoresistor chip are upward, the middle parts of the pins of the piezoresistor chip are close to each other due to the blockage of the pins of the piezoresistor chip by the side wall of the placing groove 7, and the top ends of the pins of the piezoresistor chip are positioned in the opening range of the placing groove 7; a first motor 24 drives the disc 23 to rotate at a constant speed, so that the plurality of placing plates 6 pass through the annular operating table 2 at a constant speed; the second hydraulic cylinder 29 pushes the slide arm 27 to slide along the outer ring of the upright post 26, so that the ascending and descending movement of the fixed plate 4 is realized;
the sliding frame of the suspension conveying frame 1 drives the fixed plate 4 to run, when the fixed plate 4 runs to the top surface of the placing plate 6, the second motor 33 drives the gear 34 to rotate, the gear ring 32 meshed with the gear ring is driven to rotate, the fixed plate 4 is driven to rotate along the connecting rod 31, and fine adjustment is carried out on the fixed plate 4, so that the fixed plate 4 and the placing plate 6 are overlapped;
the fixed plate 4 descends, the lower end of the separating plate 11 is firstly inserted into the middle of the placing groove 7, pins of the piezoresistor chip are spread towards two sides, the pins of the piezoresistor chip are inserted into the fixing groove 5 of the fixed plate 4, the pins of the piezoresistor chip are blocked by the separating plate 11, the pins of the piezoresistor chip are spread towards two sides, and the pins of the piezoresistor chip approach to the inner walls of the two sides of the fixing groove 5; at the moment, the first hydraulic cylinder 8 pushes the push rod 9 to slide into the slide hole 16 to drive the insert 10 to be in the inner groove 17, and pushes the transmission rod 12 to slide downwards into the vertical groove 18, so that the first spring 14 is compressed, meanwhile, the notches 19 formed in the two sides of the transmission rod 12 push the fixing rod 13 to slide towards the two sides along the mounting hole 20, so that the second spring 15 is compressed, and the fixing rod 13 is matched with the inner wall of the fixing groove 5 to clamp and fix the pin of the piezoresistor chip;
the fixing plate 4 rises to hold and take up the piezoresistor chip, the fixing plate 4 descends along with the running of the sliding frame of the suspension conveying frame 1 to the upper part of the coating groove 3, and the body element of the piezoresistor chip is immersed under the liquid level of the resin solution in the coating groove 3, so that the surface of the body element of the piezoresistor chip is coated with resin, and the coating work of the wrapping layer of the piezoresistor chip is finished; because the pins of the piezoresistor chip are not fixed by using adhesive tapes, the cleanness degree of the pins of the piezoresistor chip is improved, and the production quality of the piezoresistor chip is improved.
The front, the back, the left, the right, the upper and the lower are all based on figure 1 in the attached drawings of the specification, according to the standard of the observation angle of a person, the side of the device facing an observer is defined as the front, the left side of the observer is defined as the left, and the like.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are merely intended to facilitate the description of the present invention and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the scope of the present invention.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The utility model provides a piezo-resistor chip parcel layer application device which characterized in that: comprises a suspension conveying frame (1), an annular operating platform (2), a coating groove (3), a fixing plate (4), a fixing groove (5), a placing plate (6) and a placing groove (7); the outer lane of hanging carriage (1) is provided with annular operation panel (2), coating groove (3) have been seted up at one side middle part of annular operation panel (2), the inside filling in coating groove (3) has resin solution, the balladeur train low side of hanging carriage (1) is hung and is carried fixed plate (4), a plurality of fixed slots (5) have evenly been seted up to the bottom surface of fixed plate (4), the inside of fixed slot (5) is provided with clamping structure, the top surface one end of annular operation panel (2) is provided with places board (6), a plurality of standing grooves (7) have evenly been seted up to the top surface of placing board (6).
2. The coating device for the wrapping layer of the piezoresistor chip as claimed in claim 1, wherein: the clamping structure comprises a first hydraulic cylinder (8), a push rod (9), an insert (10), a separating plate (11), a transmission rod (12), a fixed rod (13), a first spring (14) and a second spring (15); the top of the fixing plate (4) is provided with a plurality of sliding holes (16), one end of each sliding hole (16) penetrates through one side of the fixing plate (4), the bottom surface of each sliding hole (16) is uniformly provided with a plurality of inner grooves (17), each inner groove (17) is positioned at the top of each fixing groove (5), a push rod (9) is slidably mounted inside each sliding hole (16), one side, close to the opening of each sliding hole (16), of the top surface of the fixing plate (4) is fixedly connected with a first hydraulic cylinder (8), a piston rod of each first hydraulic cylinder (8) is fixedly connected with the end of each push rod (9), a plurality of inserts (10) are fixedly connected to the bottom surface of each push rod (9), the outer wall of each insert (10) is in sliding fit with the inner wall of each inner groove (17), a separating plate (11) is fixedly connected to the middle of the top surface of each fixing groove (5), a vertical groove (18) is formed in the middle of the top surface of each separating plate (11), the top end of each vertical groove (18) is communicated with each inner groove (17), a transmission rod (12) is slidably mounted inside each vertical groove (18), the top end of each transmission rod (12) is uniformly matched with the bottom surface of each insert (10), the bottom surface of each insert (19), and the transmission rod (19) is arranged between the top end of each arc surface (12), the top of notch (19) sets up to the cambered surface, mounting hole (20) have evenly been seted up to the both sides of separator plate (11), the inside slidable mounting of mounting hole (20) has dead lever (13), the cross-section of dead lever (13) is the T shape, one side that dead lever (13) are close to transfer line (12) is the cambered surface, one side cambered surface that dead lever (13) are close to transfer line (12) and the inner wall sliding fit of notch (19), be provided with spring (14) between the low side of transfer line (12) and the low side of erecting groove (18), be provided with a plurality of No. two springs (15) between dead lever (13) and mounting hole (20).
3. The coating device for the wrapping layer of the piezoresistor chip as claimed in claim 2, wherein: one side of the fixed rod (13) far away from the transmission rod (12) is provided with a sawtooth-shaped convex strip, two sides of the fixed groove (5) are fixedly connected with rubber pads (21), the bottoms of the rubber pads (21) are cambered surfaces, and the lower ends of the rubber pads (21) coincide with the opening edges of the bottoms of the fixed groove (5).
4. The coating device for the wrapping layer of the chip of the piezoresistor as claimed in claim 2, wherein: the section of the separating plate (11) is conical, the lower end of the separating plate (11) is arc-shaped, and the length of the section of the separating plate (11) is larger than the depth of the fixing groove (5).
5. The coating device for the wrapping layer of the piezoresistor chip as claimed in claim 1, wherein: the one end of annular operation panel (2) is provided with base (22), the top surface of base (22) is rotated and is installed disc (23), the operating surface of the top surface of disc (23) and annular operation panel (2) keeps the level coincidence, the inside of base (22) is provided with a motor (24), the pivot of a motor (24) and the bottom surface middle part rigid coupling of disc (23), a plurality of mounting grooves (25) have evenly been seted up in the top surface outer lane of disc (23) encircleing, board (6) are placed in the inside bolt joint of mounting groove (25).
6. The coating device for the wrapping layer of the chip of the piezoresistor as claimed in claim 1, wherein: the balladeur train low-end bolt of overhead conveyer (1) has connected stand (26), the equal slidable mounting in outer lane four sides of stand (26) has cursor slide (27), four sides the bottom surface rigid coupling of cursor slide (27) has connecting plate (28), the middle part of stand (26) is provided with No. two pneumatic cylinders (29), the piston rod low side of No. two pneumatic cylinders (29) and the top surface rigid coupling of connecting plate (28).
7. The coating device for the wrapping layer of the piezoresistor chip as claimed in claim 6, wherein: the top surface middle part rigid coupling of fixed plate (4) has ring seat (30), the mid-rotation of ring seat (30) installs connecting rod (31), the top of connecting rod (31) and the bottom surface middle part rigid coupling of connecting plate (28), the top surface outer lane rigid coupling of ring seat (30) has ring gear (32), the bottom surface rigid coupling of connecting plate (28) has No. two motor (33), the pivot rigid coupling of No. two motor (33) has gear (34), gear (34) and ring gear (32) meshing.
8. The coating device for the wrapping layer of the chip of the piezoresistor as claimed in claim 1, wherein: and a drying channel (35) is fixedly connected to the top surface of the other side of the annular operating platform (2), and heating pipes (36) are arranged on the inner walls of the two sides of the drying channel (35).
9. The coating device for the wrapping layer of the chip of the piezoresistor as claimed in claim 1, wherein: the inner two sides of the coating groove (3) are fixedly connected with baffle plates (37), and the top surfaces of the two sides, close to each other, of the baffle plates (37) are in sliding fit with the outer ring of the bottom surface of the fixing plate (4).
10. The coating device for the wrapping layer of the chip of the piezoresistor as claimed in claim 9, wherein: the utility model discloses a novel fixing device for the automobile engine, including baffle (37), runner (38), top rigid coupling of runner (38), the side sliding fit of the outer lane of gyro wheel (39) and fixed plate (4), the bottom outer lane rigid coupling of runner (38) has a plurality of paddles (40).
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| CN202211114846.9A CN115458263B (en) | 2022-09-14 | 2022-09-14 | Coating device for coating layers of varistor chips |
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| CN202211114846.9A CN115458263B (en) | 2022-09-14 | 2022-09-14 | Coating device for coating layers of varistor chips |
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| CN115458263B CN115458263B (en) | 2024-09-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117637267A (en) * | 2023-12-13 | 2024-03-01 | 玮晶科技(泰州)有限公司 | NTC chip assembly device |
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| US20070102931A1 (en) * | 2004-11-04 | 2007-05-10 | Mitsubishi Denki Kabushiki Kaisha | Automotive alternator voltage control apparatus |
| CN210245196U (en) * | 2019-08-20 | 2020-04-03 | 深圳市芯驰科技有限公司 | Coating device for wrapping layer of piezoresistor chip |
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| CN115458263B (en) | 2024-09-10 |
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