CN115427184A - 加工系统以及测量构件 - Google Patents

加工系统以及测量构件 Download PDF

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Publication number
CN115427184A
CN115427184A CN202080099822.3A CN202080099822A CN115427184A CN 115427184 A CN115427184 A CN 115427184A CN 202080099822 A CN202080099822 A CN 202080099822A CN 115427184 A CN115427184 A CN 115427184A
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CN
China
Prior art keywords
processing
light
light receiving
processing system
energy beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080099822.3A
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English (en)
Chinese (zh)
Inventor
江上茂树
立崎阳介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
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Nikon Corp
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Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN115427184A publication Critical patent/CN115427184A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CN202080099822.3A 2020-04-15 2020-04-15 加工系统以及测量构件 Pending CN115427184A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/016604 WO2021210104A1 (ja) 2020-04-15 2020-04-15 加工システム及び計測部材

Publications (1)

Publication Number Publication Date
CN115427184A true CN115427184A (zh) 2022-12-02

Family

ID=78084451

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080099822.3A Pending CN115427184A (zh) 2020-04-15 2020-04-15 加工系统以及测量构件

Country Status (5)

Country Link
US (1) US20230133779A1 (https=)
EP (1) EP4137261A4 (https=)
JP (3) JP7485014B2 (https=)
CN (1) CN115427184A (https=)
WO (1) WO2021210104A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7713645B2 (ja) * 2022-02-18 2025-07-28 パナソニックＩｐマネジメント株式会社 レーザ溶接装置及びレーザ光の照射位置ずれの補正方法
WO2024105851A1 (ja) * 2022-11-17 2024-05-23 株式会社ニコン 加工システム
CN116858496B (zh) * 2023-05-05 2024-08-13 中国科学院高能物理研究所 一种基于多刃边扫描的波前检测方法及装置
WO2025079245A1 (ja) * 2023-10-13 2025-04-17 株式会社ニコン 加工システム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1307510A (zh) * 1998-06-29 2001-08-08 自动化焊接系统公司 激光焊接拼板的方法
US20140132751A1 (en) * 2012-11-12 2014-05-15 Samsung Display Co., Ltd. Laser induced thermal imaging apparatus and laser induced thermal imaging method
CN104400217A (zh) * 2014-10-17 2015-03-11 中国电子科技集团公司第二十九研究所 一种全自动激光焊接方法及装置
CN105499806A (zh) * 2016-01-28 2016-04-20 中国科学院上海光学精密机械研究所 透明材料中环状波导的飞秒激光直写装置和方法
WO2019236616A1 (en) * 2018-06-05 2019-12-12 Electro Scientific Industries, Inc. Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same
CN110709205A (zh) * 2017-05-01 2020-01-17 株式会社尼康 加工装置及加工方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763923B2 (ja) * 1989-12-15 1995-07-12 富士電機株式会社 Ｎｃ加工装置における原点補正方法
JP2817583B2 (ja) * 1993-08-25 1998-10-30 日立電線株式会社 光ファイバケーブル用配線切替盤
JP3349818B2 (ja) * 1994-02-28 2002-11-25 株式会社ワコム 座標検出装置
JP2811538B2 (ja) * 1994-07-12 1998-10-15 住友重機械工業株式会社 レーザ加工装置
JP2001319871A (ja) * 2000-02-29 2001-11-16 Nikon Corp 露光方法、濃度フィルタの製造方法、及び露光装置
JP3686317B2 (ja) 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
JP2006289443A (ja) * 2005-04-11 2006-10-26 Hikari Physics Kenkyusho:Kk レーザ加工装置
JP2008119716A (ja) * 2006-11-10 2008-05-29 Marubun Corp レーザ加工装置およびレーザ加工装置における焦点維持方法
US20140209576A1 (en) * 2013-01-31 2014-07-31 Kazim Ozbaysal Use of elevated pressures for reducing cracks in superalloy welding and cladding
US10258982B2 (en) 2014-04-23 2019-04-16 Japan Science And Technology Agency Combined-blade open flow path device and joined body thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1307510A (zh) * 1998-06-29 2001-08-08 自动化焊接系统公司 激光焊接拼板的方法
US20140132751A1 (en) * 2012-11-12 2014-05-15 Samsung Display Co., Ltd. Laser induced thermal imaging apparatus and laser induced thermal imaging method
CN103811679A (zh) * 2012-11-12 2014-05-21 三星显示有限公司 激光诱导热成像设备和激光诱导热成像方法
CN104400217A (zh) * 2014-10-17 2015-03-11 中国电子科技集团公司第二十九研究所 一种全自动激光焊接方法及装置
CN105499806A (zh) * 2016-01-28 2016-04-20 中国科学院上海光学精密机械研究所 透明材料中环状波导的飞秒激光直写装置和方法
CN110709205A (zh) * 2017-05-01 2020-01-17 株式会社尼康 加工装置及加工方法
WO2019236616A1 (en) * 2018-06-05 2019-12-12 Electro Scientific Industries, Inc. Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same

Also Published As

Publication number Publication date
US20230133779A1 (en) 2023-05-04
JP2024096206A (ja) 2024-07-12
JPWO2021210104A1 (https=) 2021-10-21
JP7790470B2 (ja) 2025-12-23
EP4137261A1 (en) 2023-02-22
JP7485014B2 (ja) 2024-05-16
EP4137261A4 (en) 2024-01-03
JP2026031671A (ja) 2026-02-24
WO2021210104A1 (ja) 2021-10-21

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