JP7485014B2 - 加工システム及び計測部材 - Google Patents

加工システム及び計測部材 Download PDF

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Publication number
JP7485014B2
JP7485014B2 JP2022514927A JP2022514927A JP7485014B2 JP 7485014 B2 JP7485014 B2 JP 7485014B2 JP 2022514927 A JP2022514927 A JP 2022514927A JP 2022514927 A JP2022514927 A JP 2022514927A JP 7485014 B2 JP7485014 B2 JP 7485014B2
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Japan
Prior art keywords
processing
passing
light receiving
energy beam
light
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JP2022514927A
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English (en)
Japanese (ja)
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JPWO2021210104A5 (https=
JPWO2021210104A1 (https=
Inventor
茂樹 江上
陽介 立崎
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Nikon Corp
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Nikon Corp
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Publication of JPWO2021210104A1 publication Critical patent/JPWO2021210104A1/ja
Publication of JPWO2021210104A5 publication Critical patent/JPWO2021210104A5/ja
Priority to JP2024070686A priority Critical patent/JP7790470B2/ja
Application granted granted Critical
Publication of JP7485014B2 publication Critical patent/JP7485014B2/ja
Priority to JP2025225872A priority patent/JP2026031671A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2022514927A 2020-04-15 2020-04-15 加工システム及び計測部材 Active JP7485014B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024070686A JP7790470B2 (ja) 2020-04-15 2024-04-24 加工システム及び計測部材
JP2025225872A JP2026031671A (ja) 2020-04-15 2025-12-03 加工システム及び計測部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/016604 WO2021210104A1 (ja) 2020-04-15 2020-04-15 加工システム及び計測部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024070686A Division JP7790470B2 (ja) 2020-04-15 2024-04-24 加工システム及び計測部材

Publications (3)

Publication Number Publication Date
JPWO2021210104A1 JPWO2021210104A1 (https=) 2021-10-21
JPWO2021210104A5 JPWO2021210104A5 (https=) 2023-03-23
JP7485014B2 true JP7485014B2 (ja) 2024-05-16

Family

ID=78084451

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022514927A Active JP7485014B2 (ja) 2020-04-15 2020-04-15 加工システム及び計測部材
JP2024070686A Active JP7790470B2 (ja) 2020-04-15 2024-04-24 加工システム及び計測部材
JP2025225872A Pending JP2026031671A (ja) 2020-04-15 2025-12-03 加工システム及び計測部材

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024070686A Active JP7790470B2 (ja) 2020-04-15 2024-04-24 加工システム及び計測部材
JP2025225872A Pending JP2026031671A (ja) 2020-04-15 2025-12-03 加工システム及び計測部材

Country Status (5)

Country Link
US (1) US20230133779A1 (https=)
EP (1) EP4137261A4 (https=)
JP (3) JP7485014B2 (https=)
CN (1) CN115427184A (https=)
WO (1) WO2021210104A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023120682A (ja) * 2022-02-18 2023-08-30 パナソニックＩｐマネジメント株式会社 レーザ溶接装置及びレーザ光の照射位置ずれの補正方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024105851A1 (ja) * 2022-11-17 2024-05-23 株式会社ニコン 加工システム
CN116858496B (zh) * 2023-05-05 2024-08-13 中国科学院高能物理研究所 一种基于多刃边扫描的波前检测方法及装置
WO2025079245A1 (ja) * 2023-10-13 2025-04-17 株式会社ニコン 加工システム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140132751A1 (en) 2012-11-12 2014-05-15 Samsung Display Co., Ltd. Laser induced thermal imaging apparatus and laser induced thermal imaging method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763923B2 (ja) * 1989-12-15 1995-07-12 富士電機株式会社 Ｎｃ加工装置における原点補正方法
JP2817583B2 (ja) * 1993-08-25 1998-10-30 日立電線株式会社 光ファイバケーブル用配線切替盤
JP3349818B2 (ja) * 1994-02-28 2002-11-25 株式会社ワコム 座標検出装置
JP2811538B2 (ja) * 1994-07-12 1998-10-15 住友重機械工業株式会社 レーザ加工装置
CA2242139A1 (en) * 1998-06-29 1999-12-29 Automated Welding Systems Incorporated Method of laser welding tailored blanks
JP2001319871A (ja) * 2000-02-29 2001-11-16 Nikon Corp 露光方法、濃度フィルタの製造方法、及び露光装置
JP3686317B2 (ja) 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
JP2006289443A (ja) * 2005-04-11 2006-10-26 Hikari Physics Kenkyusho:Kk レーザ加工装置
JP2008119716A (ja) * 2006-11-10 2008-05-29 Marubun Corp レーザ加工装置およびレーザ加工装置における焦点維持方法
US20140209576A1 (en) * 2013-01-31 2014-07-31 Kazim Ozbaysal Use of elevated pressures for reducing cracks in superalloy welding and cladding
US10258982B2 (en) 2014-04-23 2019-04-16 Japan Science And Technology Agency Combined-blade open flow path device and joined body thereof
CN104400217A (zh) * 2014-10-17 2015-03-11 中国电子科技集团公司第二十九研究所 一种全自动激光焊接方法及装置
CN105499806B (zh) * 2016-01-28 2018-04-13 中国科学院上海光学精密机械研究所 透明材料中环状波导的飞秒激光直写装置和方法
WO2018203362A1 (ja) * 2017-05-01 2018-11-08 株式会社ニコン 加工装置及び加工方法
KR20250039487A (ko) * 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140132751A1 (en) 2012-11-12 2014-05-15 Samsung Display Co., Ltd. Laser induced thermal imaging apparatus and laser induced thermal imaging method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023120682A (ja) * 2022-02-18 2023-08-30 パナソニックＩｐマネジメント株式会社 レーザ溶接装置及びレーザ光の照射位置ずれの補正方法
JP7713645B2 (ja) 2022-02-18 2025-07-28 パナソニックＩｐマネジメント株式会社 レーザ溶接装置及びレーザ光の照射位置ずれの補正方法

Also Published As

Publication number Publication date
US20230133779A1 (en) 2023-05-04
JP2024096206A (ja) 2024-07-12
JPWO2021210104A1 (https=) 2021-10-21
CN115427184A (zh) 2022-12-02
JP7790470B2 (ja) 2025-12-23
EP4137261A1 (en) 2023-02-22
EP4137261A4 (en) 2024-01-03
JP2026031671A (ja) 2026-02-24
WO2021210104A1 (ja) 2021-10-21

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