JPWO2021210104A1 - - Google Patents

Info

Publication number
JPWO2021210104A1
JPWO2021210104A1 JP2022514927A JP2022514927A JPWO2021210104A1 JP WO2021210104 A1 JPWO2021210104 A1 JP WO2021210104A1 JP 2022514927 A JP2022514927 A JP 2022514927A JP 2022514927 A JP2022514927 A JP 2022514927A JP WO2021210104 A1 JPWO2021210104 A1 JP WO2021210104A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022514927A
Other languages
Japanese (ja)
Other versions
JP7485014B2 (ja
JPWO2021210104A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021210104A1 publication Critical patent/JPWO2021210104A1/ja
Publication of JPWO2021210104A5 publication Critical patent/JPWO2021210104A5/ja
Priority to JP2024070686A priority Critical patent/JP7790470B2/ja
Application granted granted Critical
Publication of JP7485014B2 publication Critical patent/JP7485014B2/ja
Priority to JP2025225872A priority patent/JP2026031671A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2022514927A 2020-04-15 2020-04-15 加工システム及び計測部材 Active JP7485014B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024070686A JP7790470B2 (ja) 2020-04-15 2024-04-24 加工システム及び計測部材
JP2025225872A JP2026031671A (ja) 2020-04-15 2025-12-03 加工システム及び計測部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/016604 WO2021210104A1 (ja) 2020-04-15 2020-04-15 加工システム及び計測部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024070686A Division JP7790470B2 (ja) 2020-04-15 2024-04-24 加工システム及び計測部材

Publications (3)

Publication Number Publication Date
JPWO2021210104A1 true JPWO2021210104A1 (https=) 2021-10-21
JPWO2021210104A5 JPWO2021210104A5 (https=) 2023-03-23
JP7485014B2 JP7485014B2 (ja) 2024-05-16

Family

ID=78084451

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022514927A Active JP7485014B2 (ja) 2020-04-15 2020-04-15 加工システム及び計測部材
JP2024070686A Active JP7790470B2 (ja) 2020-04-15 2024-04-24 加工システム及び計測部材
JP2025225872A Pending JP2026031671A (ja) 2020-04-15 2025-12-03 加工システム及び計測部材

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024070686A Active JP7790470B2 (ja) 2020-04-15 2024-04-24 加工システム及び計測部材
JP2025225872A Pending JP2026031671A (ja) 2020-04-15 2025-12-03 加工システム及び計測部材

Country Status (5)

Country Link
US (1) US20230133779A1 (https=)
EP (1) EP4137261A4 (https=)
JP (3) JP7485014B2 (https=)
CN (1) CN115427184A (https=)
WO (1) WO2021210104A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7713645B2 (ja) * 2022-02-18 2025-07-28 パナソニックＩｐマネジメント株式会社 レーザ溶接装置及びレーザ光の照射位置ずれの補正方法
JPWO2023228401A1 (https=) * 2022-05-27 2023-11-30
WO2024105851A1 (ja) * 2022-11-17 2024-05-23 株式会社ニコン 加工システム
CN116858496B (zh) * 2023-05-05 2024-08-13 中国科学院高能物理研究所 一种基于多刃边扫描的波前检测方法及装置
WO2025079245A1 (ja) * 2023-10-13 2025-04-17 株式会社ニコン 加工システム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0825071A (ja) * 1994-07-12 1996-01-30 Sumitomo Heavy Ind Ltd レーザ加工装置
US20140132751A1 (en) * 2012-11-12 2014-05-15 Samsung Display Co., Ltd. Laser induced thermal imaging apparatus and laser induced thermal imaging method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763923B2 (ja) * 1989-12-15 1995-07-12 富士電機株式会社 Ｎｃ加工装置における原点補正方法
JP2817583B2 (ja) * 1993-08-25 1998-10-30 日立電線株式会社 光ファイバケーブル用配線切替盤
JP3349818B2 (ja) * 1994-02-28 2002-11-25 株式会社ワコム 座標検出装置
CA2242139A1 (en) * 1998-06-29 1999-12-29 Automated Welding Systems Incorporated Method of laser welding tailored blanks
JP2001319871A (ja) * 2000-02-29 2001-11-16 Nikon Corp 露光方法、濃度フィルタの製造方法、及び露光装置
JP3686317B2 (ja) 2000-08-10 2005-08-24 三菱重工業株式会社 レーザ加工ヘッド及びこれを備えたレーザ加工装置
JP2006289443A (ja) * 2005-04-11 2006-10-26 Hikari Physics Kenkyusho:Kk レーザ加工装置
JP2008119716A (ja) * 2006-11-10 2008-05-29 Marubun Corp レーザ加工装置およびレーザ加工装置における焦点維持方法
US20140209576A1 (en) * 2013-01-31 2014-07-31 Kazim Ozbaysal Use of elevated pressures for reducing cracks in superalloy welding and cladding
JP6244017B2 (ja) 2014-04-23 2017-12-06 国立研究開発法人科学技術振興機構 ブレード複合型開放流路装置およびその接合体
CN104400217A (zh) * 2014-10-17 2015-03-11 中国电子科技集团公司第二十九研究所 一种全自动激光焊接方法及装置
CN105499806B (zh) * 2016-01-28 2018-04-13 中国科学院上海光学精密机械研究所 透明材料中环状波导的飞秒激光直写装置和方法
JP7014226B2 (ja) * 2017-05-01 2022-02-01 株式会社ニコン 加工装置
CN116275467A (zh) * 2018-06-05 2023-06-23 伊雷克托科学工业股份有限公司 激光加工设备、其操作方法以及使用其加工工件的方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0825071A (ja) * 1994-07-12 1996-01-30 Sumitomo Heavy Ind Ltd レーザ加工装置
US20140132751A1 (en) * 2012-11-12 2014-05-15 Samsung Display Co., Ltd. Laser induced thermal imaging apparatus and laser induced thermal imaging method

Also Published As

Publication number Publication date
EP4137261A1 (en) 2023-02-22
JP2026031671A (ja) 2026-02-24
JP2024096206A (ja) 2024-07-12
CN115427184A (zh) 2022-12-02
US20230133779A1 (en) 2023-05-04
JP7485014B2 (ja) 2024-05-16
JP7790470B2 (ja) 2025-12-23
WO2021210104A1 (ja) 2021-10-21
EP4137261A4 (en) 2024-01-03

Similar Documents

Publication Publication Date Title
BR112023005462A2 (https=)
BR112023012656A2 (https=)
BR112021014123A2 (https=)
BR112023009656A2 (https=)
BR112022009896A2 (https=)
JPWO2021210104A1 (https=)
BR112021017747A2 (https=)
BR112022024743A2 (https=)
BR112022026905A2 (https=)
BR112023011738A2 (https=)
BR112023004146A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR102021007058A2 (https=)
BR102020022030A2 (https=)
BR112023016292A2 (https=)
BR112023011539A2 (https=)
BR112023011610A2 (https=)
BR112023008976A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230314

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230314

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231024

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20231222

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240208

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240402

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240415

R150 Certificate of patent or registration of utility model

Ref document number: 7485014

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150