CN115401601A - 抛光系统、抛光垫以及半导体器件的制造方法 - Google Patents
抛光系统、抛光垫以及半导体器件的制造方法 Download PDFInfo
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- CN115401601A CN115401601A CN202210578502.7A CN202210578502A CN115401601A CN 115401601 A CN115401601 A CN 115401601A CN 202210578502 A CN202210578502 A CN 202210578502A CN 115401601 A CN115401601 A CN 115401601A
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- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 1
- 235000019404 dichlorodifluoromethane Nutrition 0.000 description 1
- 229940087091 dichlorotetrafluoroethane Drugs 0.000 description 1
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- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
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- DILRJUIACXKSQE-UHFFFAOYSA-N n',n'-dimethylethane-1,2-diamine Chemical compound CN(C)CCN DILRJUIACXKSQE-UHFFFAOYSA-N 0.000 description 1
- PMHXGHYANBXRSZ-UHFFFAOYSA-N n,n-dimethyl-2-morpholin-4-ylethanamine Chemical compound CN(C)CCN1CCOCC1 PMHXGHYANBXRSZ-UHFFFAOYSA-N 0.000 description 1
- VXPJBVRYAHYMNY-UHFFFAOYSA-N n-methyl-2-[2-(methylamino)ethoxy]ethanamine Chemical compound CNCCOCCNC VXPJBVRYAHYMNY-UHFFFAOYSA-N 0.000 description 1
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- 235000012239 silicon dioxide Nutrition 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
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- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
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- 230000008961 swelling Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
D1 | D4 | d1 | D3 | D2 | |
单位 | mm | mm | mm | mm | mm |
实施例2-1 | 32 | 20 | 0.85 | 12 | 17.5 |
实施例2-2 | 34 | 20 | 0.84 | 14 | 19.5 |
实施例2-3 | 36 | 20 | 0.86 | 16 | 21.5 |
实施例2-4 | 38 | 20 | 0.83 | 18 | 23.5 |
实施例2-5 | 32 | 20 | 0.85 | 12 | 10 |
实施例2-6 | 34 | 20 | 0.84 | 14 | 12 |
实施例2-7 | 36 | 20 | 0.86 | 16 | 14 |
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020210067538A KR102538440B1 (ko) | 2021-05-26 | 2021-05-26 | 연마 시스템, 연마 패드 및 반도체 소자의 제조방법 |
KR10-2021-0067538 | 2021-05-26 |
Publications (2)
Publication Number | Publication Date |
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CN115401601A true CN115401601A (zh) | 2022-11-29 |
CN115401601B CN115401601B (zh) | 2024-05-14 |
Family
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CN202210578502.7A Active CN115401601B (zh) | 2021-05-26 | 2022-05-25 | 抛光系统、抛光垫以及半导体器件的制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220379427A1 (zh) |
KR (1) | KR102538440B1 (zh) |
CN (1) | CN115401601B (zh) |
TW (1) | TWI830241B (zh) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010031612A1 (en) * | 2000-01-06 | 2001-10-18 | Scott Diane B. | Retention of a polishing pad on a platen |
US20030032378A1 (en) * | 2001-08-10 | 2003-02-13 | Teruhiko Ichimura | Polishing surface constituting member and polishing apparatus using the polishing surface constituting member |
JP2006346804A (ja) * | 2005-06-15 | 2006-12-28 | Toyo Tire & Rubber Co Ltd | 積層研磨パッドの製造方法 |
US20090258587A1 (en) * | 2008-04-11 | 2009-10-15 | Bestac Advanced Material Co., Ltd. | Polishing pad having groove structure for avoiding the polishing surface stripping |
US20100105303A1 (en) * | 2008-10-23 | 2010-04-29 | Allen Chiu | Polishing Pad |
US20190193238A1 (en) * | 2017-12-27 | 2019-06-27 | Samsung Electronics Co., Ltd. | Wafer polishing pad and method of wafer polishing using the same |
US20190389033A1 (en) * | 2018-06-21 | 2019-12-26 | Skc Co., Ltd. | Polishing pad with improved fluidity of slurry and process for preparing same |
KR20200139290A (ko) * | 2019-06-03 | 2020-12-14 | 손기섭 | 단위 구조를 갖는 조립식 그라인더 휠 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006346805A (ja) * | 2005-06-15 | 2006-12-28 | Toyo Tire & Rubber Co Ltd | 積層研磨パッド |
JP4884726B2 (ja) | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
JP5728026B2 (ja) * | 2009-12-22 | 2015-06-03 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨パッド及びこれの製造方法 |
JP5789870B2 (ja) | 2011-09-14 | 2015-10-07 | 東邦エンジニアリング株式会社 | 防浸構造を備えた研磨パッド用補助板および研磨装置 |
TWI769988B (zh) * | 2015-10-07 | 2022-07-11 | 美商3M新設資產公司 | 拋光墊與系統及其製造與使用方法 |
WO2018169041A1 (ja) * | 2017-03-17 | 2018-09-20 | 株式会社フジミインコーポレーテッド | 研磨パッド、研磨工具、及び研磨方法 |
US11685015B2 (en) | 2019-01-28 | 2023-06-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for performing chemical mechanical polishing |
-
2021
- 2021-05-26 KR KR1020210067538A patent/KR102538440B1/ko active IP Right Grant
-
2022
- 2022-05-25 CN CN202210578502.7A patent/CN115401601B/zh active Active
- 2022-05-25 US US17/824,086 patent/US20220379427A1/en active Pending
- 2022-05-26 TW TW111119578A patent/TWI830241B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010031612A1 (en) * | 2000-01-06 | 2001-10-18 | Scott Diane B. | Retention of a polishing pad on a platen |
US20030032378A1 (en) * | 2001-08-10 | 2003-02-13 | Teruhiko Ichimura | Polishing surface constituting member and polishing apparatus using the polishing surface constituting member |
JP2006346804A (ja) * | 2005-06-15 | 2006-12-28 | Toyo Tire & Rubber Co Ltd | 積層研磨パッドの製造方法 |
US20090258587A1 (en) * | 2008-04-11 | 2009-10-15 | Bestac Advanced Material Co., Ltd. | Polishing pad having groove structure for avoiding the polishing surface stripping |
US20100105303A1 (en) * | 2008-10-23 | 2010-04-29 | Allen Chiu | Polishing Pad |
US20190193238A1 (en) * | 2017-12-27 | 2019-06-27 | Samsung Electronics Co., Ltd. | Wafer polishing pad and method of wafer polishing using the same |
US20190389033A1 (en) * | 2018-06-21 | 2019-12-26 | Skc Co., Ltd. | Polishing pad with improved fluidity of slurry and process for preparing same |
KR20200139290A (ko) * | 2019-06-03 | 2020-12-14 | 손기섭 | 단위 구조를 갖는 조립식 그라인더 휠 |
Also Published As
Publication number | Publication date |
---|---|
KR20220159664A (ko) | 2022-12-05 |
KR102538440B1 (ko) | 2023-05-30 |
CN115401601B (zh) | 2024-05-14 |
TWI830241B (zh) | 2024-01-21 |
TW202245978A (zh) | 2022-12-01 |
US20220379427A1 (en) | 2022-12-01 |
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