CN115369358A - Vapor deposition apparatus and vapor deposition substrate separation method - Google Patents
Vapor deposition apparatus and vapor deposition substrate separation method Download PDFInfo
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- CN115369358A CN115369358A CN202111049322.1A CN202111049322A CN115369358A CN 115369358 A CN115369358 A CN 115369358A CN 202111049322 A CN202111049322 A CN 202111049322A CN 115369358 A CN115369358 A CN 115369358A
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- 239000000758 substrate Substances 0.000 title claims abstract description 143
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 46
- 238000000926 separation method Methods 0.000 title claims description 11
- 230000007246 mechanism Effects 0.000 claims abstract description 151
- 238000001704 evaporation Methods 0.000 claims abstract description 113
- 230000008020 evaporation Effects 0.000 claims abstract description 108
- 238000001816 cooling Methods 0.000 claims abstract description 102
- 230000003068 static effect Effects 0.000 claims abstract description 87
- 238000001179 sorption measurement Methods 0.000 claims abstract description 37
- 230000005611 electricity Effects 0.000 claims abstract description 33
- 230000008030 elimination Effects 0.000 claims description 48
- 238000003379 elimination reaction Methods 0.000 claims description 48
- 238000001514 detection method Methods 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000009834 vaporization Methods 0.000 claims description 4
- 230000008016 vaporization Effects 0.000 claims description 4
- 238000012546 transfer Methods 0.000 description 11
- 238000007738 vacuum evaporation Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/584—Non-reactive treatment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/04—Carrying-off electrostatic charges by means of spark gaps or other discharge devices
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- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a vapor deposition device, comprising: evaporating a cooling plate; the first supporting mechanism is arranged below the evaporation cooling plate and used for supporting a substrate and driving the substrate to move towards or away from the evaporation cooling plate; the second supporting mechanism is arranged below the first supporting mechanism and used for supporting the mask and driving the mask to move towards or away from the evaporation cooling plate; the adsorption mechanism is arranged above the evaporation cooling plate and used for adsorbing the mask plate so as to enable the evaporation cooling plate, the substrate and the mask plate to be sequentially attached; and a static electricity eliminating mechanism for eliminating static electricity on the substrate. The invention can solve the problem that the substrate is stuck when the substrate is separated after the evaporation.
Description
Technical Field
The present invention relates to the field of display device technology, and in particular, to an evaporation apparatus and an evaporation substrate separation method.
Background
The vacuum evaporation method is a method of heating an evaporation material by a heating evaporation source in a vacuum evaporation chamber, evaporating atoms or molecules of the solid evaporation material from the surface of the evaporation material to escape to form gas, passing the gas through an evaporation mask plate, and finally forming a solid film layer on a substrate to be evaporated. At present, the vacuum evaporation technology is widely applied to the preparation process of display devices, and when evaporation is carried out through a vacuum evaporation device, a substrate and a mask plate need to be accurately positioned and tightly attached. However, after the evaporation device finishes the evaporation of the substrate, when the substrate is separated, the substrate is often stuck on the evaporation device, so that the risk of damaging the substrate exists, and the normal operation of the vacuum evaporation device is further influenced.
Disclosure of Invention
Accordingly, it is necessary to provide a vapor deposition apparatus and a vapor deposition substrate separation method that can solve the problem that a substrate is stuck when the substrate is separated after completion of vapor deposition.
The invention provides a vapor deposition apparatus, comprising:
evaporating a cooling plate;
the first support mechanism is arranged below the evaporation cooling plate, and is used for supporting a substrate and driving the substrate to move towards or away from the evaporation cooling plate;
the second supporting mechanism is arranged below the first supporting mechanism and used for supporting the mask and driving the mask to move towards or away from the evaporation cooling plate;
the adsorption mechanism is arranged above the evaporation cooling plate and used for adsorbing the mask plate so as to enable the evaporation cooling plate, the substrate and the mask plate to be sequentially attached; and
a static electricity eliminating mechanism for eliminating static electricity on the substrate.
In one embodiment, the first supporting mechanism is further configured to drive the substrate to move in a horizontal plane; and/or
The second supporting mechanism is also used for driving the mask plate to move in a horizontal plane; and/or
The adsorption mechanism is also used for moving towards or away from the evaporation cooling plate; and/or
The evaporation cooling plate is also used for moving towards or away from the first supporting mechanism.
In one embodiment, the static elimination mechanism comprises:
the static elimination head is arranged on the evaporation cooling plate and is used for contacting with the substrate;
and the control device is connected with the static elimination head and is used for detecting the electrical property of the charges carried by the substrate and providing the charges with opposite electrical properties.
In one embodiment, the evaporation cooling plate is provided with a step hole extending along the thickness direction, the step hole is provided with an upper step hole section and a lower step hole section which are connected, the inner diameter of the upper step hole section is larger than that of the lower step hole section, an opening on one side of the lower step hole section, which is far away from the upper step hole section, penetrates through the lower surface of the evaporation cooling plate, the static elimination head is movably limited in the step hole, and at least one part of the static elimination head can extend out of the lower surface of the evaporation cooling plate.
In one embodiment, the static elimination head is provided with a head part and a contact part which are connected, and the inner diameter of the upper section of the stepped hole is larger than the outer diameter of the head part and larger than the inner diameter of the lower section of the stepped hole is larger than the outer diameter of the contact part;
the thickness of the static elimination head is less than or equal to that of the evaporation cooling plate;
the thickness of the head part is smaller than the depth of the upper section of the stepped hole, and the thickness of the contact part is larger than or equal to the depth of the lower section of the stepped hole.
In one embodiment, the contact part has conductivity with the contact surface of the substrate, and the surface of the electrostatic elimination head except the contact surface is wrapped by an insulating layer.
In one embodiment, there are a plurality of the static elimination heads, and the plurality of the static elimination heads are arranged on the evaporation cooling plate at intervals and connected with the control device in parallel.
In one embodiment, the evaporation apparatus further includes:
the driving device is connected with at least one of the first supporting mechanism, the second supporting mechanism, the evaporation cooling plate and the adsorption mechanism;
and the alignment detection device is used for detecting the relative position between the substrate and the mask.
In one embodiment, the evaporation apparatus further includes:
the substrate conveying mechanism is connected with the first supporting mechanism and is used for conveying the substrate to the first supporting mechanism;
and the mask plate transmission mechanism is connected with the second supporting mechanism and is used for transmitting the mask plate to the second supporting mechanism.
The invention also provides a separation method of the evaporation substrate, which uses the evaporation device in any embodiment and comprises the following steps:
the first supporting mechanism, the second supporting mechanism and the adsorption mechanism are controlled to move towards the evaporation cooling plate respectively, and the mask plate, the substrate and the evaporation cooling plate are sequentially attached under the magnetic adsorption action of the adsorption mechanism;
carrying out evaporation treatment on the substrate based on the mask plate;
control first supporting mechanism second supporting mechanism and adsorption mechanism keeps away from respectively the coating by vaporization cooling plate removes, makes the mask plate the base plate coating by vaporization cooling plate and adsorption mechanism separates each other, and during the separation, static elimination mechanism with base plate contact site detects whether there is static in the base plate, if there is static, static elimination mechanism through detecting out the electrical property of the electric charge on the base plate to the electric charge of the opposite electrical property of base plate transmission.
The invention discloses a vacuum evaporation coating device, which is characterized in that a substrate and a mask plate are required to be tightly attached during vacuum evaporation coating, and the substrate, the mask plate and an evaporation coating device are required to be separated from each other after evaporation coating. Therefore, the invention provides the evaporation device, which is provided with the static elimination mechanism, when the substrate is charged with static electricity and cannot be safely separated, the static elimination mechanism provides the charge with the electric property opposite to that of the substrate, so that the static electricity on the substrate is eliminated, and the safe separation of the substrate and the evaporation device is realized.
Drawings
Fig. 1 is a schematic structural diagram of an evaporation apparatus according to an embodiment before performing alignment operation.
Fig. 2 is a schematic structural view of the vapor deposition device of fig. 1 during alignment operation.
Fig. 3 is a schematic structural view of the static eliminating mechanism of fig. 1 during static eliminating operation.
Fig. 4 is a schematic structural diagram of the static eliminating mechanism of fig. 1 after completing the static eliminating operation.
Fig. 5 is a schematic structural view of the electrostatic discharge head of fig. 1.
Fig. 6 is a schematic view showing the distribution of the plurality of static elimination heads of fig. 1 on the evaporation cooling plate.
Reference numerals:
10: an evaporation device; 110: a first support mechanism; 120: a second support mechanism; 130: evaporating a cooling plate; 131: a stepped bore; 140: an adsorption mechanism; 150: a static electricity eliminating mechanism; 151: a static eliminating head; 151a: a head portion; 151b: a contact portion; 152: a control device; 160: a limiting member; 170: an alignment detection device; 180: a mask plate transmission mechanism; 20: a substrate; 30: and (5) masking a mask.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will recognize without departing from the spirit and scope of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 and fig. 2, an exemplary embodiment of the present invention provides a vapor deposition device 10, which includes a first supporting mechanism 110, a second supporting mechanism 120, a vapor deposition cooling plate 130, an adsorption mechanism 140, and a static elimination mechanism 150.
The first supporting mechanism 110 is disposed below the evaporation cooling plate 130, and is used for supporting the substrate 20 and driving the substrate 20 to move toward or away from the evaporation cooling plate 130. The second supporting mechanism 120 is disposed below the first supporting mechanism 110, and is used for supporting the mask 30 and driving the mask 30 to move toward or away from the evaporation cooling plate 130. The adsorption mechanism 140 is provided above the vapor deposition cooling plate 130, and adsorbs the mask 30 to bond the vapor deposition cooling plate 130, the substrate 20, and the mask 30 in this order.
Before the evaporation starts, the first supporting mechanism 110 drives the substrate 20 to move towards the evaporation cooling plate 130 to make the evaporation cooling plate 130 adhere to the substrate 20, then the second supporting mechanism 120 drives the mask plate 30 to move towards the evaporation cooling plate 130 to make the substrate 20 adhere to the mask plate 30, and finally the adsorption mechanism 140 adsorbs the mask plate 30 through magnetic force to further strengthen the adhesion force among the evaporation cooling plate 130, the substrate 20 and the mask plate 30.
After the vapor deposition cooling plate 130, the substrate 20, and the mask 30 are closely attached to each other, the substrate 20 is vapor deposited on the basis of the mask 30.
After the evaporation, the adsorption mechanism 140 releases the magnetic adsorption on the mask 30 and moves away from the evaporation cooling plate 130, the second support mechanism 120 drives the mask 30 to move away from the evaporation cooling plate 130 to separate the mask 30 from the substrate 20, and the first support mechanism 110 drives the substrate 20 to move away from the evaporation cooling plate 130 to separate the substrate 20 from the evaporation cooling plate 130.
Optionally, the adsorption mechanism 140 is also used to move toward or away from the evaporation cooling plate 130. The adsorption mechanism 140 can be moved closer to or farther from the evaporation cooling plate 130, thereby improving the adsorption or desorption capacity between the adsorption mechanism 140 and the mask 30.
Optionally, the evaporation cooling plate 130 is also used to move toward or away from the first support mechanism 110. The evaporation cooling plate 130 can also move close to or away from the first supporting mechanism 110, so that the bonding or separation efficiency of the evaporation cooling plate 130, the substrate 20 and the mask plate 30 is improved.
Further, the first supporting mechanism 110 may be configured to drive the substrate 20 to move in the horizontal plane and/or the second supporting mechanism 120 may be configured to drive the mask 30 to move in the horizontal plane, so as to achieve accurate positioning by continuously adjusting the relative position of the substrate 20 and the mask 30.
However, the inventors have found that, in the process of precisely aligning the substrate 20 and the mask 30 before the vapor deposition, friction occurs due to relative movement between the substrate 20 and the vapor deposition cooling plate 130, and static electricity is generated on the substrate 20 due to the friction, and when the substrate 20 and the vapor deposition cooling plate 130 are separated from each other after the vapor deposition is completed, the substrate 20 and the vapor deposition cooling plate 130 are stuck due to the static electricity, and the substrate 20 cannot be separated from the vapor deposition cooling plate 130. Therefore, the vapor deposition device 10 provided by the present inventors further includes a static electricity eliminating mechanism 150, and the static electricity eliminating mechanism 150 is configured to eliminate static electricity on the substrate 20. Specifically, when the substrate 20 is separated from the vapor deposition cooling plate 130 after completion of the vapor deposition, the portion of the static electricity eliminating mechanism 150 that is in contact with the substrate 20 detects whether or not the substrate 20 is charged with static electricity, and when the substrate 20 is detected to be charged with static electricity, the substrate 20 is supplied with electric charges opposite to the electric charges charged to the substrate 20, so that the static electricity on the substrate 20 is eliminated, and the substrate 20 is safely separated from the vapor deposition cooling plate 130.
As shown in fig. 3, 4, and 5, the static elimination mechanism 150 includes a static elimination head 151 and a control device 152.
The static elimination head 151 is provided on the evaporation cooling plate 130 for contact with the substrate 20. It is understood that the electrostatic discharge head 151 may be disposed at any other position capable of contacting the substrate 20, and is not limited to the above-described embodiment. For example, the first support mechanism 110 may be provided, or may be provided below the substrate 20.
The control device 152 is connected to the electrostatic discharge head 151, and is configured to detect an electrical property of the substrate 20 and provide an electrical property opposite to the electrical property. The control device 152 includes a charge detection module, a charge control module, and a bonding sensing module.
The charge detection module is used for detecting the electrical property of the charges carried on the substrate 20, and the charge control module is respectively connected with the charge detection module and the electrostatic elimination head 151 to provide the electrostatic elimination head 151 with charges of opposite electrical property according to the electrical property detected by the charge detection module. It is understood that if the charge detection module detects that the substrate 20 has positive charges, the charge control module provides negative charges to the electrostatic discharge head 151 according to the detection result of the charge detection module; if the charge detection module detects that the substrate 20 has negative charges, the charge control module provides positive charges to the electrostatic discharge head 151 according to the detection result of the charge detection module. The adhesion sensing module is connected to the electrostatic discharge head 151, the charge detection module, and the charge control module, respectively, and if the adhesion sensing module senses that the substrate 20 is adhered to the evaporation cooling plate 130, the control device 152 starts the charge detection module to detect the electrical property of the charges on the substrate 20, and provides opposite charges to the electrostatic discharge head 151 through the charge control module.
Further, a step hole 131 extending in the thickness direction is provided in the vapor deposition cooling plate 130, the step hole 131 has an upper section of the step hole 131 and a lower section of the step hole 131 connected to each other, the inner diameter of the upper section of the step hole 131 is larger than the inner diameter of the lower section of the step hole 131, an opening on the side of the lower section of the step hole 131 away from the upper section of the step hole 131 penetrates through the lower surface of the vapor deposition cooling plate 130, and during vapor deposition, the lower surface of the vapor deposition cooling plate 130 abuts against the back surface of the substrate 20. The static elimination head 151 is movably limited in the stepped hole 131 and at least a part of the static elimination head can extend out from the lower surface of the evaporation cooling plate 130. Before the start of vapor deposition, the electrostatic discharge head 151 is pushed back into the stepped hole 131 by the substrate 20 as the vapor deposition cooling plate 130 and the substrate 20 approach each other, and the vapor deposition cooling plate 130 and the substrate 20 can be brought into close contact with each other. After the evaporation, when the evaporation cooling plate 130 is separated from the substrate 20, the static elimination head 151 can extend out of the lower surface of the evaporation cooling plate 130 under the action of no magnetic force and gravity, so that the contact effect between the static elimination head 151 and the substrate 20 is further enhanced, and the static electricity on the substrate 20 can be eliminated.
Furthermore, a limiting member 160 may be further disposed at a position where the top of the evaporation cooling plate 130 extends to the step hole 131, the static elimination head 151 may be prevented from being exposed out of the top of the evaporation cooling plate 130 by the limiting member 160, and the static elimination head 151 may be fixed in the step hole 131 of the evaporation cooling plate 130. The number of the limiting members 160 may be one or more.
It can be understood that the static elimination head 151 has a head portion 151a and a contact portion 151b connected, and the inner diameter of the upper section of the stepped hole 131 > the outer diameter of the head portion 151a > the inner diameter of the lower section of the stepped hole 131 > the outer diameter of the contact portion 151 b. Wherein, the difference between the inner diameter of the lower section of the stepped hole 131 and the outer diameter of the contact part 151b is 0.8 mm-1.6 mm.
It can be understood that the thickness of the static elimination head 151 is less than or equal to the thickness of the evaporation cooling plate 130, wherein the thickness of the head 151a is less than the depth of the upper section of the stepped hole 131, and the thickness of the contact 151b is greater than or equal to the depth of the lower section of the stepped hole 131. Wherein, the thickness of the head 151a is 1 mm-2 mm different from the depth of the upper section of the stepped hole 131. The electrostatic elimination head 151 can move freely in the step hole 131, which is not only beneficial to avoiding affecting the effect of vapor deposition alignment, but also beneficial to improving the electrostatic elimination efficiency of the electrostatic elimination mechanism 150.
In a specific example, the contact portion 151b has conductivity with the contact surface of the substrate 20, and the surface of the electrostatic discharge head 151 other than the contact surface is covered with an insulating layer. When the substrate 20 and the deposition cooling plate 130 are stuck to each other, the charge supplied from the control device 152 of the static eliminating mechanism 150 is transferred to the substrate 20 through the contact surface of the static eliminating head 151 having conductivity, so that the static on the substrate 20 is eliminated. The other surfaces not in contact with the substrate 20 are covered with an insulating layer, which can prevent the charges from passing to other parts of the evaporation device 10 and reduce the effect of removing the static electricity on the substrate 20 due to the charge loss. The static elimination head 151 may be a metal or an alloy having a good conductive property, such as a titanium alloy. The insulating layer may be an insulating material having good insulating properties, such as an insulating paste.
As shown in fig. 6, in a specific example, there are a plurality of static elimination heads 151, and the plurality of static elimination heads 151 are disposed on the evaporation cooling plate 130 at intervals and connected to the control device 152 in parallel. Understandably, providing a plurality of static elimination heads 151 can improve the ability of the static elimination mechanism 150 to detect static electricity and eliminate static electricity. The plurality of electrostatic discharge heads 151 and the control device 152 are connected in parallel, which is advantageous to more precisely discharge the static electricity from the electrostatic discharge area of the substrate 20. Further, the plurality of static elimination heads 151 may be equally spaced on the evaporation cooling plate 130.
Alternatively, the vapor deposition device 10 further includes a driving device (not shown) and an alignment detection device 170. A driving device (not shown) is connected to at least one of the first supporting mechanism 110, the second supporting mechanism 120, the evaporation cooling plate 130 and the adsorption mechanism 140 for controlling the respective mechanisms to act, for example, to approach or move away from each other; the alignment detection device 170 is used to detect the relative position between the substrate 20 and the mask 30, and the alignment detection device 170 can detect whether the substrate 20 and the mask 30 are accurately aligned, and if not, the driving device (not shown) can control the first supporting mechanism 110 and the second supporting mechanism 120 to move relatively until the alignment detection device 170 detects the accurate alignment.
Optionally, the evaporation apparatus 10 further includes a substrate transfer mechanism (not shown) and a mask transfer mechanism 180, the substrate transfer mechanism (not shown) is connected to the first support mechanism 110 for transferring the substrate 20 onto the first support mechanism 110, and the mask transfer mechanism 180 is connected to the second support mechanism 120 for transferring the mask 30 onto the second support mechanism 120. Further, the substrate transfer mechanism (not shown) may move in a vertical and/or horizontal direction, and the substrate transfer mechanism (not shown) may move in a vertical and/or horizontal direction after receiving the substrate 20, and may transfer the substrate 20 onto the first support mechanism 110 when it is aligned with the top horizontal position of the first support mechanism 110. The reticle transfer mechanism 180 is movable in a vertical direction and/or a horizontal direction, and the reticle 30 is received by the reticle transfer mechanism 180 and then moved in the vertical direction and/or the horizontal direction, and the reticle 30 is transferred to the second support mechanism 120 when the reticle is aligned with the top horizontal position of the second support mechanism 120.
The present invention also provides a method for separating a deposition substrate 20, using the deposition apparatus 10 according to any of the above examples, comprising the steps of:
controlling the first support mechanism 110, the second support mechanism 120 and the adsorption mechanism 140 to move towards the evaporation cooling plate 130 respectively, and sequentially attaching the mask plate 30, the substrate 20 and the evaporation cooling plate 130 under the magnetic adsorption action of the adsorption mechanism 140;
performing evaporation treatment on the substrate 20 based on the mask plate 30;
the first support mechanism 110, the second support mechanism 120 and the adsorption mechanism 140 are controlled to move away from the evaporation cooling plate 130 respectively, so that the mask plate 30, the substrate 20, the evaporation cooling plate 130 and the adsorption mechanism 140 are separated from each other, when the separation is performed, the contact part of the static electricity eliminating mechanism 150 and the substrate 20 detects whether static electricity exists on the substrate 20, and if the static electricity exists, the static electricity eliminating mechanism 150 transmits the opposite electric charges to the substrate 20 according to the electric property of the detected electric charges on the substrate 20.
Specifically, the method for separating the evaporation substrate 20 includes the steps of:
the substrate 20 is placed on the first support mechanism 110. Further, the substrate 20 is placed on a substrate transfer mechanism (not shown), and the substrate 20 is transferred to the first support mechanism 110 by the substrate transfer mechanism (not shown).
The reticle 30 is placed on the second support mechanism 120. Further, the mask plate 30 is placed on the mask plate transmission mechanism 180, and then the mask plate 30 is transferred to the second support mechanism 120 by the mask plate transmission mechanism 180.
The first supporting mechanism 110, the second supporting mechanism 120 and the adsorbing mechanism 140 are controlled by a driving device (not shown) to move towards the evaporation cooling plate 130 respectively, the mask plate 30, the substrate 20 and the evaporation cooling plate 130 are attached in sequence under the magnetic adsorption action of the adsorbing mechanism 140, and the alignment condition of the substrate 20 and the mask plate 30 is detected by the alignment detection mechanism 170, so that the substrate 20 and the mask plate 30 are accurately positioned. The adsorption mechanism 140 applies a magnetic force of 200-450 gauss to adhere the mask 30, the substrate 20, and the vapor deposition cooling plate 130 to each other. Since the evaporation cooling plate 130 abuts on the back surface of the substrate 20, the electrostatic discharge head 151 is raised and positioned in the stepped hole 131 of the evaporation cooling plate 130.
After the alignment, the substrate 20 is subjected to vapor deposition processing using the mask 30.
After the evaporation is finished, the first supporting mechanism 110, the second supporting mechanism 120 and the adsorption mechanism 140 are controlled to move away from the evaporation cooling plate 130, so that the mask plate 30, the substrate 20, the evaporation cooling plate 130 and the adsorption mechanism 140 are separated from each other. When separating, the static electricity eliminating head 151 contacts with the substrate 20, the control device 152 detects whether static electricity exists on the substrate 20, if the static electricity exists, the control device 152 provides charges with opposite electric property to the static electricity eliminating head 151 according to the electric property of the detected charges on the substrate 20, and the charges with opposite electric property are transmitted to the substrate 20 through the contact surface of the static electricity eliminating head 151 and the substrate 20, so that the static electricity on the substrate 20 is eliminated, and the safe separation of the evaporation cooling plate 130 and the substrate 20 is realized.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An evaporation apparatus, comprising:
evaporating a cooling plate;
the first support mechanism is arranged below the evaporation cooling plate, and is used for supporting a substrate and driving the substrate to move towards or away from the evaporation cooling plate;
the second supporting mechanism is arranged below the first supporting mechanism and used for supporting the mask and driving the mask to move towards or away from the evaporation cooling plate;
the adsorption mechanism is arranged above the evaporation cooling plate and used for adsorbing the mask plate so as to enable the evaporation cooling plate, the substrate and the mask plate to be sequentially attached; and
a static electricity eliminating mechanism for eliminating static electricity on the substrate.
2. The evaporation device according to claim 1, wherein the first support mechanism is further configured to drive the substrate to move in a horizontal plane; and/or
The second supporting mechanism is also used for driving the mask plate to move in a horizontal plane; and/or
The adsorption mechanism is also used for moving towards or away from the evaporation cooling plate; and/or
The evaporation cooling plate is also used for moving towards or away from the first supporting mechanism.
3. The vapor deposition apparatus according to claim 1, wherein the static elimination mechanism comprises:
the static elimination head is arranged on the evaporation cooling plate and is used for contacting with the substrate;
and the control device is connected with the static elimination head and is used for detecting the electrical property of the charges carried by the substrate and providing the charges with opposite electrical properties.
4. The vapor deposition device according to claim 3, wherein the vapor deposition cooling plate has a stepped hole extending in a thickness direction, the stepped hole has an upper stepped hole section and a lower stepped hole section connected to each other, an inner diameter of the upper stepped hole section is larger than an inner diameter of the lower stepped hole section, an opening on a side of the lower stepped hole section remote from the upper stepped hole section penetrates through a lower surface of the vapor deposition cooling plate, the static elimination head is movably limited in the stepped hole, and at least a part of the static elimination head can protrude from the lower surface of the vapor deposition cooling plate.
5. The vapor deposition apparatus according to claim 4, wherein the static elimination head has a head portion and a contact portion connected to each other, and wherein an inner diameter of an upper section of the stepped hole > an outer diameter of the head portion > an inner diameter of a lower section of the stepped hole > an outer diameter of the contact portion;
the thickness of the static elimination head is less than or equal to that of the evaporation cooling plate;
the thickness of the head part is smaller than the depth of the upper section of the stepped hole, and the thickness of the contact part is larger than or equal to the depth of the lower section of the stepped hole.
6. The evaporation apparatus according to claim 5, wherein a contact surface of the contact portion and the substrate is conductive, and a surface of the electrostatic discharge head other than the contact surface is covered with an insulating layer.
7. The vapor deposition apparatus according to any one of claims 3 to 6, wherein a plurality of the static elimination heads are provided at intervals on the vapor deposition cooling plate, and are connected in parallel to the control device.
8. The vapor deposition device according to any one of claims 2 to 6, further comprising:
the driving device is connected with at least one of the first supporting mechanism, the second supporting mechanism, the evaporation cooling plate and the adsorption mechanism;
and the alignment detection device is used for detecting the relative position between the substrate and the mask.
9. The vapor deposition device according to any one of claims 2 to 6, further comprising:
the substrate conveying mechanism is connected with the first supporting mechanism and is used for conveying the substrate to the first supporting mechanism;
and the mask plate transmission mechanism is connected with the second supporting mechanism and is used for transmitting the mask plate to the second supporting mechanism.
10. A method for separating a deposition substrate using the deposition apparatus according to any one of claims 1 to 9, comprising:
the first supporting mechanism, the second supporting mechanism and the adsorption mechanism are controlled to move towards the evaporation cooling plate respectively, and the mask plate, the substrate and the evaporation cooling plate are sequentially attached under the magnetic adsorption action of the adsorption mechanism;
carrying out evaporation treatment on the substrate based on the mask;
control first supporting mechanism second supporting mechanism and adsorption mechanism keeps away from respectively the coating by vaporization cooling plate removes, makes the mask plate the base plate coating by vaporization cooling plate and adsorption mechanism separates each other, and during the separation, static elimination mechanism with base plate contact site detects whether there is static in the base plate, if there is static, static elimination mechanism through detecting out the electrical property of the electric charge on the base plate to the electric charge of the opposite electrical property of base plate transmission.
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