CN111575655A - Cooling plate and vapor deposition apparatus - Google Patents
Cooling plate and vapor deposition apparatus Download PDFInfo
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- CN111575655A CN111575655A CN202010588182.4A CN202010588182A CN111575655A CN 111575655 A CN111575655 A CN 111575655A CN 202010588182 A CN202010588182 A CN 202010588182A CN 111575655 A CN111575655 A CN 111575655A
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- mask frame
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- 238000001816 cooling Methods 0.000 title claims abstract description 120
- 238000007740 vapor deposition Methods 0.000 title description 10
- 230000007704 transition Effects 0.000 claims abstract description 84
- 238000001704 evaporation Methods 0.000 claims abstract description 47
- 230000008020 evaporation Effects 0.000 claims abstract description 46
- 239000000463 material Substances 0.000 claims description 19
- 229920001971 elastomer Polymers 0.000 claims description 9
- 239000000806 elastomer Substances 0.000 claims description 9
- 239000004809 Teflon Substances 0.000 claims description 7
- 229920006362 Teflon® Polymers 0.000 claims description 7
- 239000013013 elastic material Substances 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000005977 Ethylene Substances 0.000 claims description 3
- 239000002216 antistatic agent Substances 0.000 claims description 3
- 125000001153 fluoro group Chemical group F* 0.000 claims description 3
- 229920001973 fluoroelastomer Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000013536 elastomeric material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 43
- 238000000576 coating method Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 238000007747 plating Methods 0.000 description 6
- 230000037303 wrinkles Effects 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 238000009834 vaporization Methods 0.000 description 5
- 230000008016 vaporization Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000037373 wrinkle formation Effects 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The embodiment of the invention relates to the technical field of evaporation, and discloses a cooling plate, which comprises: a cooling plate body including a first surface; the first surface is provided with bellying and transition portion, the transition portion be located the bellying edge with between the homonymy edge of cooling plate body, and certainly bellying edge orientation on the direction of the homonymy edge of cooling plate body, the transition portion perpendicular to the thickness of first surface reduces gradually. The cooling plate and the evaporation device provided by the invention can improve the evaporation yield.
Description
Technical Field
The embodiment of the invention relates to the technical field of evaporation, in particular to a cooling plate and an evaporation device.
Background
The evaporation coating method (vapor deposition method for short) is a method in which an evaporation material is heated by an evaporation source, atoms or molecules of the evaporation material are vaporized and released from the surface of the evaporation material to form a vapor flow, and the vapor flow is incident on the surface of a substrate to be evaporated and condensed to form a solid thin film. The evaporation method has been widely used in the manufacturing process of display devices, such as a cathode and an anode of an OLED display panel, and a light emitting material layer disposed between the cathode and the anode.
The evaporation adopts the mask to evaporate the organic light-emitting material to the assigned position of treating the evaporation plating base plate, and the relative position of mask and the base plate of treating the evaporation plating is stable very important. The cooling plate below is provided with the teflon layer bellying of preventing static, and at the coating by vaporization in-process, the edge of cooling plate body is taken at the mask frame, treats that the edge of coating by vaporization base plate is pressed from both sides between the edge of cooling plate body and mask frame, and the bellying will treat that the coating by vaporization base plate presses to the mask version in the mask frame, and the cooling plate top is provided with magnet, magnet adsorption mask version.
However, the inventors found that when the conventional cooling plate is used for vapor deposition, wrinkles appear at the edge of the substrate to be vapor deposited, resulting in a low vapor deposition yield.
Disclosure of Invention
The invention aims to provide a cooling plate and a vapor deposition device, which can improve the yield of vapor deposition.
To solve the above technical problem, an embodiment of the present invention provides a cooling plate including: a cooling plate body including a first surface; the first surface is provided with bellying and transition portion, the transition portion be located the bellying edge with between the homonymy edge of cooling plate body, and certainly bellying edge orientation on the direction of the homonymy edge of cooling plate body, the transition portion perpendicular to the thickness of first surface reduces gradually.
Additionally, the transition portion includes: a second surface distal from the cooling plate body; the second surface is a plane; or, the second surface is a curved surface; or a stepped notch is formed in one end, far away from the cooling plate body, of the second surface transition part.
In addition, the portion of the second surface near the boss is flush with the surface of the boss remote from the cooling plate body; preferably, a portion of the second surface adjacent to the boss meets the boss. According to the scheme, the height difference between the part, close to the protruding part, of the second surface and the protruding part is 0, so that the substrate to be subjected to vapor deposition, close to the mask frame, is further flattened under the support of the transition part.
In addition, a portion of the second surface remote from the boss is in contact with the first surface. According to the scheme, the height difference between the protruding part and the first surface is 0 at the edge position of the protruding part close to the mask frame, so that the substrate to be evaporated at the position close to the mask frame is further flattened under the support of the transition part.
Additionally, the transition portion is disposed around the boss. This scheme transition portion provides the support ability for treating each marginal part of coating by vaporization base plate simultaneously for treat that the coating by vaporization base plate further shakeouts under the support of transition portion.
In addition, the material of the transition portion is the same as that of the cooling plate body.
In addition, the side of the second surface, which is far away from the cooling plate body, is provided with an anti-static film layer, so that static electricity generated when the substrate to be evaporated is stripped from the transition part is avoided.
Preferably, the material of the antistatic film layer comprises teflon.
In addition, the material of the transition part is elastic material; preferably, the elastic material comprises a polyester elastomer, a propylene-based elastomer, an ethylene-based elastomer, or a fluoro/silicone elastomer; or; the transition part is made of antistatic materials; preferably, the material of the transition portion comprises teflon.
The embodiment of the invention also provides an evaporation device, which comprises a mask frame; the cooling plate is arranged on the mask frame, and the mask frame is arranged on the side, away from the cooling plate body, of the protruding part of the cooling plate.
Additionally, the transition of the cooling plate is located between an inner edge of the mask frame and the raised portion edge, the raised portion edge being on the same side of the raised portion as the inner edge of the mask frame; preferably, the thickness of the transition portion near the inner edge in a direction perpendicular to the first surface of the cooling plate body is 0.
Embodiments of the present invention provide, with respect to the prior art, a cooling plate comprising: a cooling plate body including a first surface; the first surface is provided with the bellying, and transition portion, transition portion is located between the homonymy edge of bellying edge and cooling plate body, and from the bellying edge towards the direction at the homonymy edge of cooling plate body, the thickness of transition portion perpendicular to first surface reduces gradually, transition portion can reduce the difference in height between bellying and the first surface, when the cooling plate was taken at the mask frame, make the evaporation coating substrate of treating that is close to the mask frame shakeouts under the support of transition portion, avoid treating the evaporation coating substrate and form the fold, thereby the evaporation coating yield has been improved.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
FIG. 1 is a schematic structural diagram of a prior art evaporation apparatus according to the present invention;
FIG. 2 is a schematic structural view of a cooling plate according to a first embodiment of the present invention;
FIG. 3 is a schematic structural view of a cooling plate according to a first embodiment of the present invention;
FIG. 4 is a schematic structural view of a cooling plate according to a first embodiment of the present invention;
FIG. 5 is a bottom view of a cooling plate according to a first embodiment of the present invention;
fig. 6 is a schematic structural view of a vapor deposition device according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
As shown in fig. 1, the conventional evaporation device mainly includes a mask frame 1 and a mask 11, wherein the mask 11 is fixed on the mask frame 1 by welding, and the mask 11 is used for placing a substrate 10 to be evaporated. The evaporation device also comprises an evaporator 2, a moving mechanism 3, a magnetic suction plate 4 and a cooling plate 5, wherein the cooling plate 5 is arranged above the mask frame 1, and a substrate 10 to be evaporated is clamped between the cooling plate 5 and the mask frame 1; magnetic suction plate 4 is located cooling plate 5 top, a magnetic attraction for providing and mask 11 between, mask 11 supports treats that evaporation plating base plate 10 levels, treat that evaporation plating base plate 10 intermediate position is because flagging is the biggest, at first with mask 11 contact leveling, because there is the difference in height between the lower surface that is close to mask frame 1 one side of bellying 52 (antistatic device embossing) of cooling plate 5 and cooling plate body 51, consequently, when cooling plate 5 takes mask frame 1, treat that evaporation plating base plate 10 is difficult to level out near mask frame 1 position department, form local fold easily, make the evaporation plating yield not high.
In view of the above, a first embodiment of the present invention provides a cooling plate to flatten a substrate to be evaporated at a position close to a mask frame as much as possible, so as to avoid wrinkles from forming, thereby improving the yield of evaporation.
The core of the present embodiment is that the cooling plate includes: a cooling plate body including a first surface; the first surface is provided with the bellying, and transition portion, transition portion is located between the homonymy edge of bellying edge and cooling plate body, and from the bellying edge towards the direction at the homonymy edge of cooling plate body, the thickness of transition portion perpendicular to first surface reduces gradually, transition portion can reduce the difference in height between bellying and the first surface, when the cooling plate was taken at the mask frame, make the evaporation coating substrate of treating that is close to the mask frame shakeouts under the support of transition portion, avoid treating the evaporation coating substrate and form the fold, thereby the evaporation coating yield has been improved.
The implementation details of the cooling plate of the present embodiment are described in detail below, which are provided only for the sake of understanding and are not necessary for implementing the present embodiment.
The schematic structural view of the cooling plate in the present embodiment is shown in fig. 2 to 5:
the cooling plate 5 includes: a cooling plate body 51, the cooling plate body 51 comprising a first surface 501; the first surface 501 is provided with a protruding portion 52, and the protruding portion 52 is an antistatic device to prevent static electricity from being generated when the substrate 10 to be vapor-deposited is peeled off the cooling plate 5.
The protruding portion 52 is located the middle part of the cooling plate body 51, and when the cooling plate body 51 is pressed downwards, the protruding portion 52 is sunk into the mask frame 1, and fixed with the mask plate 11 in the mask frame 1 by interaction to treat the evaporation substrate 10, thereby avoiding the evaporation substrate 10 from deviating and affecting the evaporation effect.
The first surface 501 is further provided with a transition 53, the transition 53 being located between the edge of the protrusion 52 and the edge of the cooling plate body 51, and the transition 53 having a thickness perpendicular to the first surface 501 that gradually decreases in a direction towards the edge of the cooling plate body 51. The transition portion 53 can reduce the height difference between the protruding portion 52 and the first surface 501, and when the cooling plate 5 is lapped on the mask frame 1, the substrate 10 to be evaporated, which is close to the position of the mask frame 1, is flattened under the support of the transition portion 53, so that the substrate 10 to be evaporated is prevented from being wrinkled, and the evaporation yield is improved.
Realisably, as shown in fig. 2, the transition portion 53 comprises: a second surface 502 distal from the cooling plate body 51; the second surface 502 is a plane, which facilitates the preparation of the transition portion 53; alternatively, as shown in fig. 3, the second surface 502 is a curved surface; alternatively, as shown in fig. 4, a stepped notch is formed at one end of the transition portion 53 away from the cooling plate body 51.
The second surface 502 extends towards the first surface 501 in the direction of the edge of the projection 52 towards the edge of the cooling plate body 51, wherein the edge of the projection 52 and the edge of the cooling plate body 51 are the same side edge. So that the height difference between the protruding portion 52 and the first surface 501 gradually decreases in the direction close to the edge of the cooling plate body 51, providing better supporting capability for the substrate to be evaporated 10 at the position close to the mask frame 1, and further avoiding the formation of wrinkles on the substrate to be evaporated 10. Specifically, the second surface 502 includes the three structural patterns described above.
Preferably, the portion of the second surface 502 close to the boss 52 is flush with the surface of the boss 52 away from the cooling plate body 51;
preferably, the portion of second surface 502 proximate to boss 52 meets boss 52. Specifically, the thickness of the portion of the transition portion 53 near the convex portion 52 in the direction perpendicular to the first surface 501 of the cooling plate body 51 is the same as the thickness of the convex portion 52 in the direction perpendicular to the first surface 501 of the cooling plate body 51, that is, at the position of the edge of the convex portion 52, the height difference between the second surface 502 and the convex portion 52 is 0 due to the presence of the transition portion 53, so that the substrate to be evaporated 10 at the position near the mask frame 1 is further flattened with the support of the transition portion 53.
Further, a portion of the second surface 502 remote from the boss 52 is in contact with the first surface 501.
Specifically, the thickness of the transition portion 53 in the direction perpendicular to the first surface 501 of the cooling plate body 51 is 0 in the portion of the transition portion 53 away from the protrusion portion 52, so that the transition portion 53 can gradually reduce the height difference between the protrusion portion 52 and the first surface 501 until the height difference between the protrusion portion 52 and the first surface 501 is 0, that is, at the edge position where the protrusion portion 52 is close to the mask frame 1, the substrate to be evaporated 10 at the position close to the mask frame 1 is further flattened with the support of the transition portion 53, and further, the formation of wrinkles on the substrate to be evaporated 10 is avoided.
As shown in fig. 5, the transition portion 53 may be disposed around the protrusion portion 52 in this embodiment, and can simultaneously provide a supporting capability for each edge portion of the substrate 10 to be evaporated, so that the substrate 10 to be evaporated is further flattened under the support of the transition portion 53.
As a practical matter, the material of the transition portion 53 is the same as that of the cooling plate body 51, so that the transition portion 53 can be formed on the first surface 501 of the cooling plate body 51 at the same time when the cooling plate body 51 is manufactured, thereby facilitating the manufacturing.
In order to avoid static electricity generated when the substrate 10 to be vapor-deposited is peeled off from the transition portion 53, in the present embodiment, an anti-static film layer (not shown) is provided on the side of the second surface 502 away from the cooling plate body 51, and the anti-static film layer covers the second surface 502 of the transition portion 53. Optionally, the material of the anti-static film layer comprises teflon.
As another way to realize this, the material of the transition portion 53 is an elastic material, so that when the cooling plate 5 is attached to the mask frame 1, the substrate 10 to be evaporated and the transition portion 53 are more closely attached, and the wrinkle formation of the substrate 10 to be evaporated is further avoided. Optionally, the elastic material comprises a polyester elastomer, a propylene-based elastomer, an ethylene-based elastomer, or a fluoro/silicone elastomer.
In order to avoid static electricity from being generated when the substrate 10 to be vapor-deposited is peeled off from the transition portion 53, the material of the transition portion 53 may be an antistatic material in the present embodiment. In this way, the transition portion 53 can be prepared at the same time when the protrusion portion 52 (antistatic device) below the cooling plate body 51 is prepared. Optionally, the material of the transition portion 53 comprises teflon.
Compared with the prior art, the embodiment of the present invention provides a cooling plate 5 including: a cooling plate body 51, the cooling plate body 51 comprising a first surface 501; the first surface 501 is provided with the protruding portion 52 and the transition portion 53, the transition portion 53 is located between the edge of the protruding portion 52 and the edge of the cooling plate body 51, and in the direction from the edge of the protruding portion 52 toward the edge of the cooling plate body 51, the thickness of the transition portion 53 perpendicular to the first surface 501 is gradually reduced, the transition portion 53 can reduce the height difference between the protruding portion 52 and the first surface 501, when the cooling plate 5 is lapped on the mask frame 1, so that the substrate 10 to be evaporated, which is close to the position of the mask frame 1, is flattened under the support of the transition portion 53, the substrate 10 to be evaporated is prevented from being wrinkled, and the evaporation yield is improved.
A second embodiment of the present invention relates to a vapor deposition device, as shown in fig. 6, including: a mask frame 1; on the mask frame 1, as in the cooling plate 5 of the first embodiment, the raised portion 52 of the cooling plate 5 is away from the cooling plate body 51 side of the cooling plate 5, and the transition portion 53 of the cooling plate 5 is located between the inner edge of the mask frame 1 and the edge of the raised portion 52, wherein the edge of the raised portion and the inner edge of the mask frame 1 are located on the same side of the raised portion.
Specifically, the evaporation device mainly comprises a mask frame 1 and a mask plate 11, wherein the mask plate 11 is fixed on the frame of the mask plate in a welding manner, and the mask plate 11 is used for placing a substrate 10 to be evaporated. The evaporation device also comprises an evaporator 2, a moving mechanism 3, a magnetic suction plate 4 and a cooling plate 5, wherein the cooling plate 5 is arranged above the mask frame 1, and a substrate 10 to be evaporated is clamped between the cooling plate 5 and the mask frame 1; the protruding portion 52 is located the middle part of the cooling plate body 51, and when the cooling plate body 51 is pressed downwards, the protruding portion 52 is sunk into the mask frame 1, and fixed with the mask plate 11 in the mask frame 1 by interaction to treat the evaporation substrate 10, thereby avoiding the evaporation substrate 10 from deviating and affecting the evaporation effect. The magnetic suction plate 4 is located above the cooling plate 5 and used for providing a magnetic attraction force between the magnetic suction plate and the mask plate 11, the mask plate 11 supports the evaporation substrate 10 to be flattened, and the middle position of the evaporation substrate 10 is firstly in contact with the mask plate 11 to be flattened due to the maximum sagging.
In this embodiment, the first surface 501 of the cooling plate 5 is provided with the transition portion 53, and the transition portion 53 is located between the inner edge of the mask frame 1 facing the mask frame 1 and the edge of the protrusion portion 52, that is, when the cooling plate body 51 is pressed downward, the protrusion portion 52 and the transition portion 53 are both sunk into the mask frame 1, and interact with the mask plate 11 in the mask frame 1 to fix the substrate 10 to be evaporated, because the transition portion 53 can reduce the height difference between the protrusion portion 52 and the first surface 501, when the cooling plate 5 is lapped on the mask frame 1, the substrate 10 to be evaporated close to the position of the mask frame 1 is flattened under the support of the transition portion 53, the substrate 10 to be evaporated is prevented from forming wrinkles, and the evaporation yield is improved.
Preferably, the thickness of the transition portion 53 near the inner edge is 0 in the direction perpendicular to the first surface 501 of the cooling plate body 51, so that the transition portion 53 can gradually reduce the height difference between the protrusion portion 52 and the first surface 501 until the height difference between the protrusion portion 52 and the first surface 501 is 0, and when the cooling plate 5 is lapped on the mask frame 1, the substrate to be evaporated 10 at the position near the mask frame 1 is further flattened under the support of the transition portion 53, and the formation of wrinkles on the substrate to be evaporated 10 is further avoided.
Compared with the prior art, the embodiment of the invention provides the evaporation device, by adopting the evaporation device, the substrate 10 to be evaporated at the position close to the mask frame 1 is flattened under the support of the transition part 53, the wrinkle formation of the substrate 10 to be evaporated is avoided, and the evaporation yield is improved.
It is to be understood that this embodiment is a method embodiment related to the first and second embodiments, and that this embodiment may be implemented in cooperation with the first and second embodiments. The related technical details mentioned in the first embodiment and the second embodiment are still valid in this embodiment, and are not described herein again in order to reduce repetition. Accordingly, the related-art details mentioned in the present embodiment can also be applied to the first embodiment and the second embodiment.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (10)
1. A cooling plate, comprising:
a cooling plate body including a first surface;
the first surface is provided with bellying and transition portion, the transition portion be located the bellying edge with between the homonymy edge of cooling plate body, and certainly bellying edge orientation on the direction of the homonymy edge of cooling plate body, the transition portion perpendicular to the thickness of first surface reduces gradually.
2. The cooling plate as claimed in claim 1, wherein the transition portion comprises: a second surface distal from the cooling plate body; the second surface is a plane; or, the second surface is a curved surface; or a stepped notch is formed in one end, far away from the cooling plate body, of the transition part.
3. The cooling plate as claimed in claim 1, wherein a portion of the second surface proximate the boss is flush with a surface of the boss distal from the cooling plate body;
preferably, a portion of the second surface adjacent to the boss meets the boss.
4. A cooling plate as claimed in claim 1 or 3, wherein a portion of the second surface remote from the raised portion is in contact with the first surface.
5. The cooling plate as claimed in claim 1, wherein the transition portion is disposed around the boss portion.
6. The cooling plate of claim 1, wherein the material of the transition portion is the same as the material of the cooling plate body.
7. The cooling plate according to claim 1 or 6, wherein a side of the second surface, which is away from the cooling plate body, is provided with an antistatic film layer; preferably, the material of the antistatic film layer comprises teflon.
8. A cooling plate as claimed in claim 1, wherein the material of the transition portion is an elastomeric material; preferably, the elastic material comprises a polyester elastomer, a propylene-based elastomer, an ethylene-based elastomer, or a fluoro/silicone elastomer; or; the transition part is made of antistatic materials; preferably, the material of the transition portion comprises teflon.
9. An evaporation apparatus, comprising:
a mask frame;
the cooling plate of any of claims 1 to 8 on the mask frame, the mask frame being located on a side of the raised portion of the cooling plate remote from the cooling plate body of the cooling plate.
10. The evaporation device according to claim 9, wherein the transition portion of the cooling plate is located between an inner edge of the mask frame and the protrusion edge, and the protrusion edge and the inner edge of the mask frame are located on the same side of the protrusion;
preferably, the transition portion has a thickness of 0 near the inner edge in a direction perpendicular to the first surface of the cooling plate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010588182.4A CN111575655A (en) | 2020-06-24 | 2020-06-24 | Cooling plate and vapor deposition apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010588182.4A CN111575655A (en) | 2020-06-24 | 2020-06-24 | Cooling plate and vapor deposition apparatus |
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| CN111575655A true CN111575655A (en) | 2020-08-25 |
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| CN202010588182.4A Pending CN111575655A (en) | 2020-06-24 | 2020-06-24 | Cooling plate and vapor deposition apparatus |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113388809A (en) * | 2021-06-21 | 2021-09-14 | 京东方科技集团股份有限公司 | Mask plate |
| CN115369358A (en) * | 2021-09-08 | 2022-11-22 | 广东聚华印刷显示技术有限公司 | Vapor deposition apparatus and vapor deposition substrate separation method |
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| CN113388809A (en) * | 2021-06-21 | 2021-09-14 | 京东方科技集团股份有限公司 | Mask plate |
| CN113388809B (en) * | 2021-06-21 | 2022-07-29 | 京东方科技集团股份有限公司 | Mask plate |
| CN115369358A (en) * | 2021-09-08 | 2022-11-22 | 广东聚华印刷显示技术有限公司 | Vapor deposition apparatus and vapor deposition substrate separation method |
| CN115369358B (en) * | 2021-09-08 | 2023-12-05 | 广东聚华印刷显示技术有限公司 | Vapor deposition device and vapor deposition substrate separation method |
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