CN107904566A - One kind evaporation support plate and evaporation coating device - Google Patents
One kind evaporation support plate and evaporation coating device Download PDFInfo
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- CN107904566A CN107904566A CN201711347135.5A CN201711347135A CN107904566A CN 107904566 A CN107904566 A CN 107904566A CN 201711347135 A CN201711347135 A CN 201711347135A CN 107904566 A CN107904566 A CN 107904566A
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- Prior art keywords
- evaporation
- substrate
- deposited
- supporting block
- support plate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the present invention provides a kind of evaporation support plate and evaporation coating device, and for evaporation coating technique field, it is abnormal to solve the problems, such as that substrate to be deposited white point occurs when lighting.The evaporation support plate is used to carry substrate to be deposited, and the substrate to be deposited includes more height evaporation substrate, and the evaporation support plate includes：Bottom plate and it is arranged on multiple separately positioned supporting blocks on the bottom plate, one supporting block corresponds to a sub- evaporation substrate, the display area of orthographic projection of the supporting block on the substrate to be deposited sub- evaporation substrate corresponding with the supporting block is overlapping, and overlapping area is more than the 1/3 of the display area area, less than the area of the sub- evaporation substrate；Wherein, the surface that the supporting block is used to contact with the substrate to be deposited is plane or is to the cambered surface away from the bottom plate side protrusion.For being deposited in process.
Description
Technical field
The present invention relates to evaporation coating technique field, more particularly to a kind of evaporation support plate and evaporation coating device.
Background technology
Vacuum vapour deposition is that evaporation material is heated by evaporation source in vacuum evaporation room, makes the original of evaporation material
Son or molecule form steam stream from the gasification effusion of its surface, by the pattern on mask plate, are finally condensed on substrate to be deposited,
The method for forming patterned film.At present, vacuum vapour deposition is widely used to the preparation of OLED device.
Carry out vacuum evaporation using evaporation coating device, be generally provided with evaporation coating device evaporation support plate (Touch Plate,
Abbreviation TP), carry substrate to be deposited using support plate is deposited, the side that evaporation support plate is used to carrying substrate to be deposited is set up and is equipped with
Multiple protrusions, due in substrate to be deposited with the position of projection contacts of support plate is deposited and the temperature of other positions and is subject to
Stress differs, thus when forming evaporation film layer on substrate to be deposited, after ultimately forming display panel, display panel is being lighted
When with the position of raised face white point exception occurs, so as to have impact on the performance of display panel.
The content of the invention
The embodiment of the present invention provides a kind of evaporation support plate and evaporation coating device, solves substrate to be deposited and occurs when lighting
The problem of white point is abnormal.
To reach above-mentioned purpose, the embodiment of the present invention adopts the following technical scheme that：
On the one hand, there is provided one kind evaporation support plate, for carrying substrate to be deposited, the substrate to be deposited is steamed including more height
Plated substrate, the evaporation support plate include：Bottom plate and it is arranged on multiple separately positioned supporting blocks on the bottom plate, a branch
Bracer corresponds to a sub- evaporation substrate, orthographic projection of the supporting block on the substrate to be deposited and the supporting block pair
The display area for the sub- evaporation substrate answered is overlapping, and overlapping area is more than the 1/3 of the display area area, less than described
The area of son evaporation substrate；Wherein, the supporting block be used for the surface that is contacted with the substrate to be deposited be plane or be to
Cambered surface away from the bottom plate side protrusion.
Preferably, orthographic projection of the supporting block on the substrate to be deposited sub- steaming corresponding with the supporting block
The display area of plated substrate is completely overlapped.
Preferably, the surface that the supporting block is used to contact with the substrate to be deposited is to convex away from the bottom plate side
The cambered surface risen, the radian of the cambered surface is 0~π/36.
Preferably, the cambered surface is centrosymmetric.
Preferably, the material of the supporting block is magnetic material.
Preferably, the side of the supporting block is provided with the lug being fixedly connected with the supporting block；The evaporation support plate
Fixed component is further included, the fixed component fixes the lug and the bottom plate, the supporting block is fixed on described
On bottom plate.
It is further preferred that the fixed component is bolt or screw.
Preferably, the material of the supporting block is nonmagnetic substance.
Preferably, the surface that the supporting block is used to contact with the substrate to be deposited is to convex away from the bottom plate side
The cambered surface risen, the supporting block include the flatness layer and lug boss being stacked；The flatness layer is leaned on relative to the lug boss
The nearly bottom plate.
It is further preferred that the lug is arranged at the side of the flatness layer.
Preferably, the curved surface that the surface that multiple supporting blocks are used to contact with the substrate to be deposited is formed is spherical crown.
On the other hand, there is provided a kind of evaporation coating device, including above-mentioned evaporation support plate.
Preferably, the evaporation coating device, which further includes, is arranged on magnetic sheet or multiple magnetic patch of the bottom plate away from supporting block side, institute
State magnetic patch or the magnetic sheet is used to adsorb mask plate.
The embodiment of the present invention provides a kind of evaporation support plate and evaporation coating device, and evaporation support plate includes bottom plate and is arranged on bottom plate
Multiple supporting blocks, due to the viewing area of orthographic projection of the supporting block on substrate to be deposited sub- evaporation substrate corresponding with supporting block
Domain is overlapping, and overlapping area is more than the 1/3 of display area area, less than the area of sub- evaporation substrate, due to relative to related skill
Protrusion in art, the size increase of supporting block, thus the Temperature Distribution of son evaporation substrate display area is evenly, and the steaming formed
The stress distribution being subject in film plating layer positioned at the part of son evaporation substrate display area evenly, therefore the evaporation film layer formed
In positioned at the part of son evaporation substrate display area performance evenly, the evaporation film layer middle position such as formed is shown in sub- evaporation substrate
Show the resistance of the part in region evenly, such group evaporation substrate forms display panel, after display panel is lit, display surface
The light that plate is sent is uniform, is not in white point phenomenon, considerably improve display panel display performance such as luminous efficiency,
Brightness or excitation purity etc..
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 (a) is the side structure schematic view of a kind of evaporation support plate that correlation technique provides and substrate to be deposited；
Fig. 1 (b) is the overlooking the structure diagram of a kind of evaporation support plate that correlation technique provides and substrate to be deposited；
Fig. 2 (a) is a kind of side structure schematic view one that support plate and substrate to be deposited is deposited provided in an embodiment of the present invention；
Fig. 2 (b) is a kind of side structure schematic view two that support plate and substrate to be deposited is deposited provided in an embodiment of the present invention；
Fig. 2 (c) is a kind of overlooking the structure diagram that support plate and substrate to be deposited is deposited provided in an embodiment of the present invention；
Fig. 3 (a) is a kind of force structure schematic diagram one that film layer is deposited provided in an embodiment of the present invention；
Fig. 3 (b) is a kind of force structure schematic diagram two that film layer is deposited provided in an embodiment of the present invention；
Fig. 4 (a) is a kind of structure diagram one that support plate is deposited and is fixed with supporting block provided in an embodiment of the present invention；
Fig. 4 (b) is a kind of structure diagram two that support plate is deposited and is fixed with supporting block provided in an embodiment of the present invention；
Fig. 5 is a kind of structure diagram of supporting block provided in an embodiment of the present invention；
Fig. 6 is a kind of structure diagram that support plate is deposited provided in an embodiment of the present invention；
Fig. 7 is a kind of structure diagram that support plate and substrate to be deposited is deposited provided in an embodiment of the present invention；
Fig. 8 is a kind of structure diagram of evaporation coating device provided in an embodiment of the present invention.
Reference numeral：
Support plate is deposited in 01-；10- bottom plates；20- is raised；30- substrates to be deposited；301- evaporation substrates；40- supporting blocks；
401- flatness layers；402- lug bosses；Film layer is deposited in 50-；60- lugs；70- fixed components；80- baffles；90- magnetic patch.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, belongs to the scope of protection of the invention.
When carrying out vacuum evaporation using evaporation coating device, relevant evaporation coating device is in evaporation, evaporation support plate, base to be deposited
Plate, mask plate (Mask) and evaporation source are set gradually.Since evaporation support plate and substrate to be deposited can often be inhaled under vacuum conditions
It is attached to together, is not readily separated, in order to solve this problem, relevant evaporation support plate 01 is frequently with as shown in Fig. 1 (a) and Fig. 1 (b)
Structure, evaporation support plate 01 include bottom plate 10 and are arranged on multiple protrusion (Embosss) 20 of the bottom plate 10 close to evaporation source side, treat
The every height evaporation substrate 301 being deposited on substrate 30 is corresponding with multiple raised 20, so, since evaporation support plate 01 is steamed with waiting
The contact area of plated substrate 30 reduces, thus after the completion of evaporation, evaporation support plate 01 is easily isolated with substrate 30 to be deposited.
However, due to the position contacted in substrate 30 to be deposited with the protrusion 20 of evaporation support plate 01 and the temperature of other positions
And the stress being subject to differs, thus the conduction that the position contacted in substrate to be deposited 30 with protrusion 20 and other positions are formed
Evaporation film layer it is variant, protrusion 20 contact positions evaporation film layers resistance be less than other positions evaporation film layer resistance, this
After sample group evaporation substrate 301 forms display panel, white point exception, i.e., substrate 30 to be deposited occur when lighting for display panel
In the brightness of positions that is contacted with protrusion 20 be more than other regions, so as to have impact on the performance of display panel.
Based on a kind of above-mentioned, evaporation support plate 01 of offer of the embodiment of the present invention, for carrying substrate 30 to be deposited, base to be deposited
Plate 30 includes more height evaporation substrate 301, and as shown in Fig. 2 (a), Fig. 2 (b) and Fig. 2 (c), evaporation support plate 01 includes：Bottom plate 10
Be arranged on multiple separately positioned supporting blocks (Emboss) 40 on bottom plate 10, a supporting block 40 corresponds to a son evaporation substrate
301, the display area weight of orthographic projection of the supporting block 40 on substrate 30 to be deposited sub- evaporation substrate 301 corresponding with supporting block 40
It is folded, and overlapping area is more than the 1/3 of display area area, less than the area of sub- evaporation substrate 301；Wherein, supporting block 40 is used for
The surface such as Fig. 2 (a) contacted with substrate 30 to be deposited show plane or as Fig. 2 (b) is shown to away from 10 side of bottom plate
Raised cambered surface.
It should be noted that first, substrate 30 to be deposited is a motherboard, including more height evaporation substrate 301, is waiting to steam
Film layer is deposited on plated substrate 30 to be allowed to after forming display panel motherboard, display panel motherboard is cut, can be obtained more
A display panel.Usually, a substrate 30 to be deposited includes 100 multiple sub- evaporation substrates 301.
Second, the display area of sub- evaporation substrate 301 is that son evaporation substrate 301 forms display panel after display panel
Display area.
3rd, for bottom plate 10 material without limit, can be organic material, or inorganic material.Example
, the material of bottom plate 10 is glass or metal.
On this basis, for bottom plate 10 thickness without limit, the thickness of preferable bottom plate 10 is 0~10mm, into
One step is preferable, and the thickness of bottom plate 10 is 2mm.
4th, for supporting block 40 material without limit, be subject to certain hardness.In addition, supporting block 40
Material can be with the material identical of bottom plate 10, can not also be identical.
Herein, when the surface that supporting block 40 is used to contact with substrate 30 to be deposited is to away from bottom plate as shown in Fig. 2 (b)
During the cambered surface of 10 sides protrusion, for cambered surface radian without limit, can be according to sub- 301 display area area of evaporation substrate
Size and substrate to be deposited 30 accordingly set because of the degree of gravity deformation.On this basis, multiple supporting blocks 40
The radian of cambered surface can also be identical or different.
In addition, when the surface that supporting block 40 is used to contact with substrate 30 to be deposited is raised to the side away from bottom plate 10
During cambered surface, due to the presence of cambered surface radian and gravity, substrate to be deposited at the position that substrate 30 to be deposited is contacted with supporting block 40
The distribution of frictional force between 30 and cambered surface is weaker than the distribution of the frictional force between substrate 30 to be deposited and plane, is so conducive to
Reduce substrate 30 to be deposited and the electrostatic that the separation of support plate 01 produces is deposited.On this basis, substrate 30 to be deposited and supporting block 40
During contact, cambered surface improves the Temperature Distribution on sub- 301 surface of evaporation substrate, advantageously forms temperature gradient, so that son steams
The resistance of the evaporation film layer 50 formed on plated substrate 301 evenly, thus the preferred supporting block 40 of the embodiment of the present invention be used for treating
It is the cambered surface to the side protrusion away from bottom plate 10 that the surface that substrate 30 contacts, which is deposited,.
5th, bottom plate 10 and supporting block 40 can be fixed together by integrally formed mode, can also be passed through
Fixed component or other means etc. is fixed together, to this without limiting.
The internal stress being subject to below to film layer 50 is deposited during evaporation is analyzed, as shown in Fig. 3 (a), base to be deposited
After plate 30 is bonded with the supporting block 40 on evaporation support plate 01, due to the support of supporting block 40, thus substrate to be deposited 30 is with propping up
The stress that the position that bracer 40 contacts is subject to (as shown in arrow in Fig. 3 (a)), after evaporation, as shown in Fig. 3 (b), is treated outwardly
Evaporation substrate 30 can recover to planarize again, and under the action of stress, evaporation film layer 50 is assembled to centre, add evaporation film layer 50
Compactness.If supporting block 40 is undersized, the area that supporting block 40 is contacted with substrate 30 to be deposited is smaller, is so treating
The evaporation that the position after evaporation formation evaporation film layer 50, contacted on substrate 30 in substrate 30 to be deposited with supporting block 40 is formed is deposited
The stress that film layer 50 is subject to can be very big, so that the evaporation film that the position contacted with substrate 30 to be deposited and other positions are formed
The structure of layer 50 has very big difference.Precisely due to the protrusion 20 set on bottom plate 10 is point-like in correlation technique, size is smaller,
The evaporation film layer 50 of the positions formation thus contact with protrusion 20 on substrate 30 to be deposited since the stress being subject to is big, and with protrusion
20 contacts cause temperature relatively low, therefore the property of the position contacted in the evaporation film layer 50 formed on substrate to be deposited 30 with protrusion 20
There can be the position contacted in the evaporation film layer 50 formed in very big difference, such as substrate to be deposited 30 with protrusion 20 with other positions
The resistance put is less than the resistance of other positions.
Based on above-mentioned, the embodiment of the present invention provides a kind of evaporation support plate 01, and evaporation support plate 01 includes bottom plate 10 and is arranged on
Multiple supporting blocks 40 on bottom plate 10, due to orthographic projection of the supporting block 40 on substrate 30 to be deposited and 40 corresponding son of supporting block
The display area of evaporation substrate 301 is overlapping, and overlapping area is more than the 1/3 of display area area, less than sub- evaporation substrate 301
Area, after evaporation film layer 50 is formed on substrate 30 to be deposited, evaporation film layer 50 is answered with what 40 corresponding part of supporting block was subject to
Power is larger, and since the size of supporting block 40 is big, thus evaporation film layer 50 of the embodiment of the present invention is located at the part of display area and is subject to
The larger area increase of stress, and in the evaporation film layer 50 formed in correlation technique only with raised 20 positions contacted
The stress being subject to is larger, therefore is located at display area in the evaporation film layer 50 formed relative to correlation technique, the embodiment of the present invention
The stress distribution that is subject to of part evenly.In addition, supporting block 40 can reduce the temperature for the substrate to be deposited 30 being in contact with it,
Due to increasing relative to supporting block in correlation technique 40 and the contact area of 301 display area of son evaporation substrate, thus son evaporation
The part increase that the temperature of the display area of substrate 301 reduces so that the Temperature Distribution of the display area of sub- evaporation substrate 301 is more
Uniformly.Due to sub- 301 display area of evaporation substrate Temperature Distribution evenly, and formed evaporation film layer 50 in positioned at son evaporation
The stress distribution that the part of 301 display area of substrate is subject to evenly, thus is deposited in the evaporation film layer 50 formed positioned at son
Evenly, 301 viewing area of substrate is deposited positioned at son in the evaporation film layer 50 such as formed in the performance of the part of 301 display area of substrate
Evenly, such group evaporation substrate 301 forms display panel, after display panel is lit, display surface to the resistance of the part in domain
The light that plate is sent is uniform, is not in white point phenomenon, considerably improve display panel display performance such as luminous efficiency,
Brightness or excitation purity etc..
Preferably, orthographic projection of the supporting block 40 on substrate 30 to be deposited sub- evaporation substrate corresponding with the supporting block 40
301 display area is completely overlapped.
The embodiment of the present invention, due to orthographic projection of the supporting block 40 on substrate 30 to be deposited and the 40 corresponding son of supporting block
It is completely overlapped that the display area of substrate 301 is deposited, thus when forming evaporation film layer 50 on substrate 30 to be deposited, film layer 50 is deposited
The stress distribution being subject to positioned at the part of the display area of sub- evaporation substrate 301 is all uniform, and film layer 50 is so deposited and is located at
The performance of the part of 301 display area of son evaporation substrate is all identical, so as to be used to form display surface in substrate 30 to be deposited
During plate, the uniformity of display panel performance is improved.
When the surface that supporting block 40 is used to contact with substrate 30 to be deposited is the cambered surface to remote 10 side of bottom plate protrusion,
If the radian of cambered surface is too small, the contact with substrate 30 to be deposited of supporting block 40 is point contact, can so make substrate 30 to be deposited
The Stress non-homogeneity being subject to, and the temperature distributing disproportionation on substrate to be deposited 30 is even, so that in sub- 301 display area of evaporation substrate
The performance of the evaporation film layer 50 of formation is uneven；If the radian of cambered surface is too big, supporting block 40 is contacted with substrate 30 to be deposited
Area is too big, thus is unfavorable for substrate 30 to be deposited with the separation of support plate 01 is deposited.Based on this, the preferred cambered surface of the embodiment of the present invention
Radian be 0~π/36.
It is further preferred that the surface that supporting block 40 is used to contact with substrate 30 to be deposited is to convex away from 10 side of bottom plate
The cambered surface risen, cambered surface are centrosymmetric.
The embodiment of the present invention, since cambered surface is centrosymmetric, thus after substrate to be deposited 30 is contacted with supporting block 40, is steaming
During plating, the stress that substrate 30 to be deposited is subject to is uniform, ensures that the stress that evaporation film layer 50 is subject to is also equal
It is even, improve the performance uniformity of substrate 30 to be deposited.
The embodiment of the present invention, due to orthographic projection of the supporting block 40 on substrate 30 to be deposited sub- steaming corresponding with supporting block 40
The display area of plated substrate 301 is overlapping, and overlapping area is more than the 1/3 of display area area, less than the face of sub- evaporation substrate 301
Product, when the size or shape of the son evaporation substrate 301 in substrate 30 to be deposited change, in order to improve in substrate to be deposited
The performance uniformity of the evaporation film layer 50 formed on 30, thus evaporation support plate 01 can be generally replaced, and replace in evaporation coating device and steam
The time that the process of plating support plate 01 is extremely complex, expends is also longer, serious influence industrial production, therefore the embodiment of the present invention is excellent
Choosing, is deposited 01 bottom plate 10 of support plate and supporting block 40 is detachably connected, so when the son evaporation substrate 301 in substrate 30 to be deposited
Size or shape when changing, taken out without support plate 01 will entirely be deposited from evaporation coating device, it is only necessary to replace supporting block
40, so as to save process, improve production efficiency.
When 01 bottom plate 10 of support plate being deposited and supporting block 40 is detachably connected, two kinds of concrete implementation sides presented below
Formula.
The first, the material of supporting block 40 is magnetic material
In evaporation coating device, evaporation support plate 01, substrate to be deposited 30, mask plate and evaporation source set gradually and are steamed
Plating.Wherein, in order to fix substrate 30 and mask plate to be deposited, often magnetic patch or magnetic sheet (Magnet) is set on evaporation support plate 01
Mask plate is adsorbed, substrate 30 to be deposited and mask plate can so be fixed with evaporation support plate 01.And when the material of supporting block 40
Expect for magnetic material when, magnetic patch or magnetic sheet can adsorbent support block 40, so as to so that supporting block 40 is fixed on bottom plate 10.It is based on
This, the material of the preferred supporting block 40 of the embodiment of the present invention is magnetic material, more preferably soft magnetic material.
The embodiment of the present invention, when the material of supporting block 40 is magnetic material, supporting block 40 can be by being arranged on evaporation
The magnetic-adsorption that magnetic patch or magnetic sheet on support plate 01 produce is on bottom plate 10, when 30 neutron of substrate to be deposited evaporation substrate 301
When size or shape change, it is only necessary to replace corresponding supporting block 40, so bottom plate 10 can be enable to be suitable for
The son evaporation substrate 301 of different sizes and shapes.
Second, as shown in Fig. 4 (a) and Fig. 4 (b), the side of supporting block 40 is provided with what is be fixedly connected with supporting block 40
Lug 60；Evaporation support plate further includes fixed component 70, and lug 60 and bottom plate 10 are fixed, supporting block 40 consolidated by fixed component 70
It is scheduled on bottom plate 10.
Wherein, the side of supporting block 40 refer in supporting block 40 except the face that is contacted with bottom plate 10 and for base to be deposited
Other faces beyond the face that plate 30 contacts.Lug 60 and supporting block 40 can be fixedly connected by being integrally formed or
Linked together by other connecting components, to this without limiting.
Herein, for fixed component 70 type without limit, being subject to can be fixed on supporting block 40 on bottom plate 10.
Exemplary, fixed component 70 is bolt or screw.
The embodiment of the present invention, since supporting block 40 and bottom plate 10 are fixed by fixed component 70, thus when to be deposited
When the size or shape of 30 neutron of substrate evaporation substrate 301 change, it is only necessary to replace corresponding supporting block 40, so
Bottom plate 10 can be enable to be suitable for the son evaporation substrate 301 of different sizes and shapes.
Based on above-mentioned, since supporting block 40 and bottom plate 10 are fixed by fixed component 70, thus the material of supporting block 40
Material can be magnetic material, or nonmagnetic substance.When substrate 30 to be deposited and mask plate are by being arranged on evaporation support plate
When magnetic patch or magnetic sheet on 01 are fixed on evaporation support plate 01, in order to avoid the magnetic field that supporting block 40 produces influences magnetic patch or magnetic sheet
The magnetic field of generation, thus the material of the preferred supporting block 40 of the embodiment of the present invention is nonmagnetic substance.It is exemplary, the material of supporting block 40
Expect for that can be aluminium (Al), copper (Cu), titanium (Ti) etc..
Preferably, as shown in figure 5, the surface that supporting block 40 is used to contact with substrate 30 to be deposited is to away from bottom plate 10 1
The cambered surface of side protrusion, supporting block 40 include the flatness layer 401 and lug boss 402 being stacked；Flatness layer 401 is relative to lug boss
402 close to bottom plate 10.
Wherein, the flatness layer 401 of supporting block 40 and lug boss 402 can be formed at the same time by integral forming process；Also may be used
To be initially formed flatness layer 401, then lug boss 402 is formed on flatness layer 401, but flatness layer 401 and lug boss 402 are to connect at this time
It is connected together.
Herein, for flatness layer 401 thickness without limit, it is preferred that the thickness of flatness layer 401 is 0~5mm, into
One step is preferable, and the thickness of flatness layer 401 is 1.5mm.
On this basis, when supporting block 40 includes flatness layer 401 and lug boss 402, the preferred lug of the embodiment of the present invention
60 are arranged at the side of flatness layer 401.
On the one hand the embodiment of the present invention, since supporting block 40 includes flatness layer 401 and lug boss 402, thus, is conducive to
The side of flatness layer 401 sets lug 60；On the other hand, lug boss 402 is only included relative to supporting block 40, supporting block 40 includes
Flatness layer 401 and lug boss 402 can make the distance increase of substrate 30 to be deposited and bottom plate 10, avoid substrate 30 to be deposited from bending
Degree is excessive to be contacted with bottom plate 10.
When per height, the size and dimension of evaporation substrate 301 determines in substrate 30 to be deposited, supporting block 40 is in bottom plate 10
What the position of upper setting was also to determine, when supporting block 40 is fixed on bottom plate 10 by fixed component 70, for the ease of support
40 exactitude position of block, supporting block 40 accurately is fixed on corresponding position on bottom plate 10, thus the embodiment of the present invention is preferably such as
Shown in Fig. 6, baffle 80 is set at the edge of bottom plate 10.
Preferably, as shown in fig. 7, the curved surface that the surface that multiple supporting blocks 40 are used to contact with substrate 30 to be deposited is formed is
Spherical crown.
Wherein, spherical crown refers to that a sphere cuts rear remaining curved surface by plane.
Herein, for spherical crown radian without limiting, case of bending that can be according to substrate 30 to be deposited under gravity
Carry out respective design.
The embodiment of the present invention, when substrate 30 to be deposited is contacted with evaporation support plate 01, power bag that substrate 30 to be deposited is subject to
Including support force of the gravity, evaporation support plate 01 of itself to substrate 30 to be deposited, (evaporation support plate 01 is with substrate 30 to be deposited by setting
Put when the magnetic patch on support plate 01 is deposited or magnetic sheet are fixed, support force is magnetic force), in order to avoid substrate 30 to be deposited is in these power
Under the action of be deformed into wavy, thus preferably multiple supporting blocks 40 of the embodiment of the present invention are used to contact with substrate 30 to be deposited
The curved surface that surface is formed is spherical crown, so, when the surface that multiple supporting blocks 40 are used to contact with substrate 30 to be deposited is with treating
When the contact of substrate 30 is deposited, the case of bending of spherical crown is the most similar to the case of bending of substrate 30 to be deposited and mask plate, so that
The evaporation film layer 50 for avoiding the uneven caused formation of deformation of mask plate is uneven.Further, since multiple supporting blocks 40 are used
It is cambered surface in the surface contacted with substrate 30 to be deposited, thus substrate to be deposited 30 is easily isolated with evaporation support plate 01, and can be kept away
Exempt from substrate 30 to be deposited and completely attach to the electrostatic problem brought with support plate 01 is deposited.
The embodiment of the present invention also provides a kind of evaporation coating device, including above-mentioned evaporation support plate 01.
Wherein, evaporation coating device further includes evaporation source in addition to including evaporation support plate 01.Substrate 30 and mask plate to be deposited are set
Between evaporation support plate 01 and evaporation source, mask plate substrate 30 relatively to be deposited is close to evaporation source.
Herein, substrate 30 and mask plate to be deposited can be fixed on evaporation support plate 01 by magnetic field or fixing piece such as card slot etc.
On.
The embodiment of the present invention provides a kind of evaporation coating device, and evaporation coating device includes above-mentioned evaporation support plate 01, due to relative to
The protrusion 20 of correlation technique, the size increase of supporting block 40, thus the Temperature Distribution of 301 display area of son evaporation substrate is more equal
It is even, and the stress distribution that the part for being located at 301 display area of son evaporation substrate in the evaporation film layer 50 formed is subject to is evenly,
Therefore in the evaporation film layer 50 formed positioned at the part of son evaporation substrate 301 display area performance evenly, such as steaming of formation
In film plating layer 50 positioned at the part of son evaporation substrate 301 display area resistance evenly, such group evaporation substrate 301 is formed
Display panel, after display panel is lit, the light that display panel is sent is uniform, is not in white point phenomenon, significantly carries
High the display performance such as luminous efficiency, brightness or excitation purity etc. of display panel.
Preferably, as shown in figure 8, evaporation coating device, which further includes, is arranged on multiple magnetic patch of the bottom plate 10 away from 40 side of supporting block
90 or magnetic sheet (being illustrated in attached drawing 8 by taking magnetic patch 90 as an example), magnetic patch 90 or magnetic sheet are used to adsorb mask plate.
The embodiment of the present invention, evaporation coating device further include be arranged on multiple magnetic patch 90 of the bottom plate 10 away from 40 side of supporting block or
Magnetic sheet, since magnetic patch 90 or magnetic sheet can be used for adsorbing mask plate, and substrate to be deposited 30 be located at mask plate and be deposited support plate 01 it
Between, thus substrate to be deposited 30 and mask plate can be fixed on evaporation under the action of the magnetic field of the generation of magnetic patch 90 or magnetic sheet and carry
On plate 01.
The above description is merely a specific embodiment, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (13)
1. one kind evaporation support plate, for carrying substrate to be deposited, the substrate to be deposited includes more height evaporation substrate, its feature
It is, the evaporation support plate includes：Bottom plate and it is arranged on multiple separately positioned supporting blocks on the bottom plate, a support
Block corresponds to a sub- evaporation substrate, and orthographic projection of the supporting block on the substrate to be deposited is corresponding with the supporting block
The sub- evaporation substrate display area it is overlapping, and overlapping area be more than the display area area 1/3, less than the son
The area of substrate is deposited；
Wherein, the surface that the supporting block is used to contact with the substrate to be deposited is plane or is to away from the bottom plate one
The cambered surface of side protrusion.
2. evaporation support plate according to claim 1, it is characterised in that the supporting block on the substrate to be deposited just
The display area of the projection sub- evaporation substrate corresponding with the supporting block is completely overlapped.
3. evaporation support plate according to claim 1, it is characterised in that the supporting block is used to connect with the substrate to be deposited
Tactile surface is that the radian of the cambered surface is 0~π/36 to the cambered surface away from the bottom plate side protrusion.
4. evaporation support plate according to claim 3, it is characterised in that the cambered surface is centrosymmetric.
5. support plate is deposited according to claim 1-4 any one of them, it is characterised in that the material of the supporting block is magnetic material
Material.
6. evaporation support plate according to claim 1, it is characterised in that the side of the supporting block is provided with and the support
The lug that block is fixedly connected；
The evaporation support plate further includes fixed component, and the fixed component fixes the lug and the bottom plate, by described in
Supporting block is fixed on the bottom plate.
7. evaporation support plate according to claim 6, it is characterised in that the fixed component is bolt or screw.
8. the evaporation support plate according to claim 6 or 7, the material of the supporting block is nonmagnetic substance.
9. evaporation support plate according to claim 6, it is characterised in that the supporting block is used to connect with the substrate to be deposited
Tactile surface is to the cambered surface away from the bottom plate side protrusion, and the supporting block includes flatness layer and the protrusion being stacked
Portion；The flatness layer is relative to the lug boss close to the bottom plate.
10. evaporation support plate according to claim 9, it is characterised in that the lug is arranged at the side of the flatness layer.
11. support plate is deposited according to claim 1-4 any one of them, it is characterised in that multiple supporting blocks are used for and institute
The curved surface for stating the surface composition of substrate contact to be deposited is spherical crown.
12. a kind of evaporation coating device, it is characterised in that support plate is deposited including claim 1-11 any one of them.
13. evaporation coating device according to claim 12, it is characterised in that the evaporation coating device further includes that to be arranged on bottom plate remote
Magnetic sheet or multiple magnetic patch from supporting block side, the magnetic patch or the magnetic sheet are used to adsorb mask plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711347135.5A CN107904566A (en) | 2017-12-15 | 2017-12-15 | One kind evaporation support plate and evaporation coating device |
| PCT/CN2018/121006 WO2019114806A1 (en) | 2017-12-15 | 2018-12-14 | Deposition carrier board and deposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711347135.5A CN107904566A (en) | 2017-12-15 | 2017-12-15 | One kind evaporation support plate and evaporation coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107904566A true CN107904566A (en) | 2018-04-13 |
Family
ID=61869849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711347135.5A Pending CN107904566A (en) | 2017-12-15 | 2017-12-15 | One kind evaporation support plate and evaporation coating device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107904566A (en) |
| WO (1) | WO2019114806A1 (en) |
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| WO2019114806A1 (en) * | 2017-12-15 | 2019-06-20 | 京东方科技集团股份有限公司 | Deposition carrier board and deposition equipment |
| CN115369358A (en) * | 2021-09-08 | 2022-11-22 | 广东聚华印刷显示技术有限公司 | Vapor deposition apparatus and vapor deposition substrate separation method |
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| US11189516B2 (en) | 2019-05-24 | 2021-11-30 | Applied Materials, Inc. | Method for mask and substrate alignment |
| WO2020242611A1 (en) | 2019-05-24 | 2020-12-03 | Applied Materials, Inc. | System and method for aligning a mask with a substrate |
| US11196360B2 (en) | 2019-07-26 | 2021-12-07 | Applied Materials, Inc. | System and method for electrostatically chucking a substrate to a carrier |
| US11756816B2 (en) | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
| US10916464B1 (en) | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
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| WO2019114806A1 (en) | 2019-06-20 |
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