CN109913819A - Coldplate, evaporation coating device and display panel - Google Patents

Coldplate, evaporation coating device and display panel Download PDF

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Publication number
CN109913819A
CN109913819A CN201910249109.1A CN201910249109A CN109913819A CN 109913819 A CN109913819 A CN 109913819A CN 201910249109 A CN201910249109 A CN 201910249109A CN 109913819 A CN109913819 A CN 109913819A
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CN
China
Prior art keywords
coldplate
substrate
metal film
display panel
cooling
Prior art date
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Pending
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CN201910249109.1A
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Chinese (zh)
Inventor
沐俊应
李们在
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN201910249109.1A priority Critical patent/CN109913819A/en
Publication of CN109913819A publication Critical patent/CN109913819A/en
Pending legal-status Critical Current

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Abstract

The embodiment of the invention discloses a kind of coldplate, evaporation coating device and display panels.The coldplate includes coldplate main body, has the cooling surface of cooling effect in the coldplate main body, is provided with netted protrusion on the cooling surface.Pass through the netted protrusion of the reticular structure for the connection being arranged on coldplate in the embodiment of the present invention, more rapidly carry out heat transfer, the heat accumulated during vapor deposition can be taken away from substrate more in time by coldplate, weaken non-uniform temperature on substrate, the degree of temperature gradient, improve because of the Mura that non-uniform temperature generates in coating process on substrate, simultaneously netted protrusion can be formed in display panel common cathode layer metallic film surface, display device metal film conductivity can be improved, improve voltage drop.

Description

Coldplate, evaporation coating device and display panel
Technical field
The present invention relates to technical field of semiconductors, and in particular to a kind of coldplate, evaporation coating device and display panel.
Background technique
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display technology is compared with current main-stream LCD technology, there is outstanding advantages of contrast is high, colour gamut is wide, flexible, frivolous, energy saving.OLED shows skill in recent years Art gradually the flexible wearables equipment such as the mobile devices such as smart phone and tablet computer, smartwatch, large scale curved surface TV, The fields such as white-light illuminating equipment are universal, and growth momentum is powerful.
OLED display technology mainly includes small-molecule OLED technology based on vacuum evaporation technology and with solution process Based on macromolecule OLED technology.Evaporator is the capital equipment of the small molecule OLED device production of current volume production, is set Standby core is evaporation source, is divided into an evaporation source, line evaporation source, face evaporation source etc..Line evaporation source is current important OLED volume production technology is broadly divided into integral type line evaporation source and conveying-type line evaporation source.
In general, evaporator positioning mechanism includes that the Mask being placed on mask stage (Mask Stage) (steams Plating mask plate), the substrate (Substrate) that is placed on substrate objective table (Substrate Stage), be placed on substrate Coldplate (Cooling Plate).
Common plane type coldplate is directly in contact with substrate, it may occur however that substrate sticks together on the cooling plate, plated film knot It can not be separated after beam;And the coldplate that the prior art is attached to protrusion is in contact with substrate by the dot bulge object incidentally dispersed, It can effectively avoid the problem of substrate sticks together on the cooling plate.But for the plated film of the materials such as metal, source temperature is high, passes The defeated heat on substrate, it is difficult to be taken away from substrate in time by coldplate, cause substrate temperature higher.Substrate is convex at this time Play that the portion temperature that is in contact with substrate of object is relatively low, ambient temperature is higher, along dot bulge object formation temperature gradient, by temperature ladder The influence of degree, protrusion corresponding position vapor particles aggregate amount is more on plated film initial stage substrate;In plated film latter stage, substrate is convex It is higher to play object corresponding position film thickness, forms thickness gradient, forms Mura in protrusion corresponding position.
Summary of the invention
The embodiment of the present invention provides a kind of coldplate, evaporation coating device and display panel, can be more in time from base by coldplate The heat accumulated during vapor deposition is taken away on plate, is weakened non-uniform temperature on substrate, the degree of temperature gradient, is improved because on substrate The Mura that non-uniform temperature generates in coating process, while netted protrusion can be formed in substrate surface, display can be improved Part metal film conductivity improves voltage drop.
To solve the above problems, in a first aspect, a kind of coldplate of the application present invention, the coldplate includes coldplate master Body is provided with netted protrusion on the cooling surface with the cooling surface of cooling effect in the coldplate main body.
Further, the netted protrusion includes cross one another lateral projection line and longitudinally convex line.
Further, the coldplate main body is conductive material, and the coldplate main body is grounded.
Further, the conductive material is copper.
Second aspect, the application provide a kind of evaporation coating device, and the evaporation coating device includes as described in any in first aspect Coldplate.
The third aspect, the application provide a kind of display panel, and the display panel includes substrate and is formed in the substrate The common cathode layer of top, the part or all of metallic film surface of common cathode layer form netted protrusion.
Further, the netted protrusion includes cross one another lateral projection line and longitudinally convex line.
Further, the lateral projection line and the longitudinally convex line include bottom metal film, convex in the transverse direction The cross-point locations of initial line and the longitudinally convex line form the metal film protuberance for being higher than the bottom metal film.
Further, the upper surface far from the substrate of metal film protuberance is curved surface.
Further, the metal film protuberance is hemisphere, and the curved surface in the hemisphere is arranged far from the substrate.
Further, the metal film protuberance is semicolumn, and the semicolumn short transverse is parallel to the substrate, institute The curved surface stated in semicolumn is arranged far from the substrate.
Further, the metal film protuberance is the vaulted structure of tool.
Coldplate includes coldplate main body in the embodiment of the present invention, with the cooling of cooling effect in the coldplate main body Face is provided with netted protrusion on the cooling surface.By the reticular structure for the connection being arranged on coldplate in the embodiment of the present invention Netted protrusion, more rapidly carry out heat transfer, by coldplate can be taken away from substrate more in time vapor deposition during accumulate heat Amount weakens non-uniform temperature on substrate, the degree of temperature gradient, improves because non-uniform temperature generates in coating process on substrate Mura, while netted protrusion can be formed in display panel common cathode layer metallic film surface, display device metal can be improved Film conductivity improves voltage drop.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached Figure.
Fig. 1 is the structural schematic diagram of evaporation coating device positioning mechanism;
Fig. 2 is the structural schematic diagram of evaporation coating device vapor deposition process;
Fig. 3 is for the plate structure of cooling schematic diagram of existing dot bulge object;
Fig. 4 is one embodiment structural schematic diagram of the coldplate provided in the embodiment of the present invention;
Fig. 5 is that lateral projection line or longitudinally convex line are cut in metal film in the display panel provided in the embodiment of the present invention Face schematic diagram.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, those skilled in the art's every other implementation obtained without making creative work Example, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", The instruction such as " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention and simplification retouch It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation, Therefore it is not considered as limiting the invention.In addition, term " first ", " second " are used for description purposes only, and cannot understand For indication or suggestion relative importance or implicitly indicate the quantity of indicated technical characteristic.Define as a result, " first ", The feature of " second " can explicitly or implicitly include one or more feature.In the description of the present invention, " more It is a " it is meant that two or more, unless otherwise specifically defined.
In this application, " exemplary " word is used to indicate " being used as example, illustration or explanation ".Described herein as Any embodiment of " exemplary " is not necessarily to be construed as or more advantage more more preferable than other embodiments.In order to appoint this field What technical staff can be realized and use the present invention, gives and is described below.In the following description, it arranges for purposes of explanation Details is gone out.It should be appreciated that those skilled in the art will realize that the case where not using these specific details Under the present invention also may be implemented.In other examples, well known structure and process will not be described in detail, to avoid need not The details wanted makes description of the invention become obscure.Therefore, the present invention be not intended to be limited to shown in embodiment, but with meet The widest scope of principle and feature disclosed in the present application is consistent.
As shown in Figure 1, the structural schematic diagram of evaporation coating device (such as evaporator) positioning mechanism, which includes being placed in Vapor deposition mask plate 105 (mask) on mask plate microscope carrier 106, the substrate being placed on baseplate carrier (Mask Stage) 104 103, coldplate 102 and magnetic sheet 101 etc., cooling device (such as cooling medium pipeline) built in coldplate (Cooling plate) It further include contraposition detecting mechanism and position adjusting mechanism etc. Deng, evaporation coating device positioning mechanism, wherein contraposition detecting mechanism is for detecing It surveys to the relative position on vapor deposition mask plate and substrate (Substrate).Position adjusting mechanism is used for according to contraposition detecting structure Vapor deposition mask plate and substrate relative position are corrected, until reaching contraposition specification.It is right after vapor deposition mask plate is bonded with substrate When position detecting mechanism detecting vapor deposition mask plate (mask) 105 and 103 relative position of substrate still exceed specification, mask plate 105 is deposited It is separated with substrate 103, repeats to correct vapor deposition mask plate 105 and 103 relative position of substrate, until reaching contraposition specification The step of;When aligning in specification, contraposition is completed.Magnetic sheet (Magnet) 101 drops to setting position, by vapor deposition mask plate absorption On substrate, so far, vapor deposition mask plate, substrate, coldplate three are attached onto, and start the vacuum evaporation of film.
It is usually provided in coldplate cooling tube (being not shown in Fig. 4), the both ends of the cooling tube are respectively water inlet and go out The mouth of a river, and the external cold water reservoir of water inlet of the cooling tube, and the external rhone of water outlet.In coldplate work, in cold water reservoir Cooling water enter in coldplate from the water inlet of cooling tube, and during flow of cooling water absorb coldplate heat, Subsequent cooling water is discharged into rhone from the water outlet of cooling tube.
As shown in Fig. 2, common plane type coldplate 201 is directly contacted with substrate 202, evaporation source 203 passes through Steam area 204, it transmits on heat to substrate, it may occur however that substrate 202 sticks together on coldplate 201, can not separate after plated film, such as schemes Shown in 3, the coldplate 301 that the prior art is attached to protrusion passes through the dot bulge object 302 incidentally dispersed and is in contact with substrate, and can have Effect avoids the problem that substrate sticks together on the cooling plate.But for the plated film of the materials such as metal, source temperature is high, is transferred to Heat on substrate, it is difficult to be taken away from substrate in time by coldplate, cause substrate temperature higher.Protrusion on substrate at this time The portion temperature being in contact with substrate is relatively low, ambient temperature is higher, along dot bulge object formation temperature gradient.By temperature gradient It influences, protrusion corresponding position vapor particles aggregate amount is more on plated film initial stage substrate;In plated film latter stage, protrusion on substrate Corresponding position film thickness is higher, forms thickness gradient, forms Mura in protrusion corresponding position.
A kind of coldplate, evaporation coating device and display panel are provided based on this, in the embodiment of the present invention, carried out individually below detailed It describes in detail bright.
Firstly, providing a kind of coldplate in the embodiment of the present invention, the coldplate includes coldplate main body, the coldplate There is the cooling surface of cooling effect in main body, be provided with netted protrusion on the cooling surface.
As shown in figure 4, for one embodiment structural schematic diagram of coldplate in the embodiment of the present invention, the coldplate includes Coldplate main body 401 is provided with netted with the cooling surface of cooling effect in the coldplate main body 401 on the cooling surface Protrusion 402.
When substrate is superimposed with the coldplate contraposition in Fig. 4, the spatial position of the adjustable coldplate of staff makes Netted raised 402 on the coldplate are in contact with substrate.
By netted raised the 402 of the reticular structure for the connection being arranged on coldplate in the embodiment of the present invention, more rapidly into Row heat transfer, by coldplate can be taken away from substrate more in time vapor deposition during accumulate heat, weaken substrate on temperature not Uniformly, the degree of temperature gradient, improve because of the Mura that non-uniform temperature generates in coating process on substrate, while can be in substrate Surface forms netted protrusion, can improve display device metal film conductivity, improves voltage drop.
As shown in figure 4, described netted raised 402 include cross one another lateral projection line 4021 and longitudinally convex line 4022.It wherein, may include a plurality of equidistant lateral projection line in lateral projection line 4021, longitudinally convex line 4022 can wrap A plurality of longitudinally convex line at equal intervals is included, the intersecting angle of lateral projection line 4021 and longitudinally convex line 4022 can be right angle, It is understood that in other embodiments of the invention, the intersecting angle of lateral projection line 4021 and longitudinally convex line 4022 It is also possible to other angles, such as 75 °, this is not limited here.
It further, is the section of lateral projection line described in coldplate in the embodiment of the present invention or the longitudinally convex line Schematic diagram, the lateral projection line and the longitudinally convex line may each comprise the bottom metal film of bottom, convex in the transverse direction The cross-point locations of initial line and the longitudinally convex line form the metal film protuberance for being higher than the bottom metal film, wherein bottom Metal film and metal film protuberance can be integrally formed.
In some embodiment of the invention, it can be curved surface that the metal film, which swells the surface far from cooling surface,.Metal film Swelling the surface far from cooling surface can be hemisphere face, and in practical applications, metal film, which swells the surface far from cooling surface, may be used also To be other kinds of curved surface, such as ellipsoid, paraboloid or curved-line surface of revolution undeveloped curved surface, be also possible to cylinder or The developable surfaces such as the conical surface can also be continuous curved surface or irregular curved surface etc., be not construed as limiting in the embodiment of the present invention to this.
In embodiments of the present invention in a kind of embodiment, metal film protuberance can be hemisphere, and the curved surface in hemisphere is remote Shape from cooling surface setting namely metal film protuberance is hemispherical.In practical application, the shape of metal film protuberance can be it His shape, such as spherical, cylindric, plate, prism-shaped or irregular shape.
By substrate and coldplate contraposition superposition during, due to metal film swell far from cooling surface surface (namely Metal film swells the surface being in contact with substrate) further subtract for a part of spherical surface so that metal film swells and substrate point contact The small contact area of coldplate and substrate.
In embodiments of the present invention in another embodiment, the shape of metal film protuberance can be semicolumn, and partly Cylinder height is oriented parallel to cooling surface, and the curved surface in semicolumn is arranged far from cooling surface.Substrate is being superimposed with coldplate pair It is circle since metal film swells the surface (namely metal film swells the surface being in contact with substrate) far from cooling surface during position A part of column side, so that metal film protuberance and plate line contact, further reduce the contact area of coldplate and substrate.
In embodiments of the present invention in another embodiment, metal film protuberance can also be the vaulted structure of tool. Exemplary, metal film protuberance is that a bottom surface of cylinder is become the structure obtained after dome, and another bottom of the cylinder Face is arranged on cooling surface.
Optionally, coldplate main body, metal film described in above-described embodiment and metal film protuberance are conductive material, and Coldplate main body can be grounded.When the coldplate of substrate and ground connection is aligned superposition, generated on metal film protuberance in coldplate Electrostatic the earth can be transmitted to by coldplate main body, and then eliminate the electrostatic adsorption force of coldplate and substrate.Optionally, Coldplate main body and the material of metal film protuberance all can be copper in above-described embodiment.It is being the cold of copper by glass substrate and material But when plate contraposition superposition, copper can be accelerated to eliminate the speed of electrostatic on coldplate as the better material of electric conductivity.
In order to more preferably implement coldplate in the embodiment of the present invention, on coldplate basis, also mentioned in the embodiment of the present invention For a kind of evaporation coating device, the evaporation coating device includes the coldplate as described in any in first aspect.
By using coldplate described in embodiment as above, the performance of the evaporation coating device is further improved.
Netted bulge-structure setting is described on the cooling plate in above-described embodiment, in the embodiment of the present invention, netted protrusion knot Structure can also be arranged on the metal film of display panel common cathode layer.
Therefore, in order to more preferably implement the embodiment of the present invention, a kind of display panel in the embodiment of the present invention, above-mentioned display panel Including substrate and the common cathode layer being formed in above the substrate, the part or all of metallic film surface shape of common cathode layer Reticulate protrusion.
It should be noted that only describing aforesaid substrate and common cathode layer, Ke Yili in above-mentioned display panel embodiment Solution, in addition to the foregoing structure, in display panel of the embodiment of the present invention, some other necessity structure is not retouched specifically It states, such as the various necessary film layer structures such as anode layer, it is, of course, also possible to as needed include any other necessary structure, Such as buffer layer, interlayer dielectric layer (ILD) etc. do not describe in detail specifically herein.
In the embodiment of the present invention, netted protrusion is formed in display panel common cathode layer metallic film surface, can be improved aobvious Show device metal film conductivity, improves voltage drop.
Further, similarly with coldplate in Fig. 4 embodiment, the netted protrusion equally may include intersecting Lateral projection line and longitudinally convex line.It wherein, may include a plurality of equidistant lateral projection line in lateral projection line, it is longitudinal Salient line may include a plurality of longitudinally convex line at equal intervals, and the intersecting angle of lateral projection line and longitudinally convex line can be directly Angle, it is to be understood that in other embodiments of the invention, the intersecting angle of lateral projection line and longitudinally convex line can also be with It is other angles, such as 75 °, this is not limited here.
As shown in figure 5, for lateral projection line described in coldplate in the embodiment of the present invention or section of the longitudinally convex line Face schematic diagram, the lateral projection line and the longitudinally convex line may each comprise bottom metal film 501, in the lateral projection The cross-point locations of line and the longitudinally convex line form the metal film protuberance 502 for being higher than the bottom metal film 501, wherein Bottom metal film 501 and metal film protuberance 502 can be integrally formed.
In some embodiment of the invention, it can be curved surface that the metal film, which swells 502 surfaces far from cooling surface,.Metal It can be hemisphere face that film, which swells 502 surfaces far from cooling surface, and in practical applications, metal film protuberance 502 is far from cooling surface Surface can also be other kinds of curved surface, such as ellipsoid, paraboloid or curved-line surface of revolution undeveloped curved surface, can also be with It is the developable surfaces such as cylinder or the conical surface, can also be continuous curved surface or irregular curved surface etc., to this in the embodiment of the present invention It is not construed as limiting.
In embodiments of the present invention in a kind of embodiment, metal film protuberance 502 can be hemisphere, and the curved surface in hemisphere Shape far from cooling surface setting namely metal film protuberance 502 is hemispherical.In practical application, the shape of metal film protuberance 502 It can be other shapes, such as spherical, cylindric, plate, prism-shaped or irregular shape.
By substrate and coldplate contraposition superposition during, due to metal film protuberance 502 far from cooling surface surface ( That is 502 surfaces that are in contact with substrate of metal film protuberance) be spherical surface a part so that metal film protuberance 502 and substrate point contact, Further reduce the contact area of coldplate and substrate.
In embodiments of the present invention in another embodiment, the shape of metal film protuberance 502 can be semicolumn, and Semicolumn short transverse is parallel to cooling surface, and the curved surface in semicolumn is arranged far from cooling surface.Substrate is being superimposed with coldplate During contraposition, surface due to metal film protuberance 502 far from cooling surface (namely metal film protuberance 502 is in contact with substrate Surface) be cylindrical side a part so that metal film protuberance 502 and plate line contact, further reduce coldplate and base The contact area of plate.
In embodiments of the present invention in another embodiment, metal film protuberance 502 can also be the vaulted knot of tool Structure.Exemplary, a bottom surface of cylinder is is become the structure obtained after dome by metal film protuberance 502, and the cylinder is another One bottom surface is arranged on cooling surface.
Optionally, coldplate main body, metal film described in above-described embodiment and metal film protuberance 502 are conductor material Matter, and coldplate main body can be grounded.When the coldplate of substrate and ground connection is aligned superposition, metal film protuberance in coldplate The electrostatic generated on 502 can be transmitted to the earth by coldplate main body, and then eliminate the Electrostatic Absorption of coldplate and substrate Power.Optionally, coldplate main body and the material of metal film protuberance 502 all can be copper in above-described embodiment.By glass substrate When aligning superposition with material for the coldplate of copper, copper can accelerate to eliminate electrostatic on coldplate as the better material of electric conductivity Speed.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, there is no the portion being described in detail in some embodiment Point, it may refer to the detailed description above with respect to other embodiments, details are not described herein again.
It is provided for the embodiments of the invention a kind of coldplate, evaporation coating device and display panel above and has carried out detailed Jie It continues, used herein a specific example illustrates the principle and implementation of the invention, and the explanation of above embodiments is only It is to be used to help understand method and its core concept of the invention;Meanwhile for those skilled in the art, according to the present invention Thought, there will be changes in the specific implementation manner and application range, in conclusion the content of the present specification should not be construed as Limitation of the present invention.

Claims (10)

1. a kind of coldplate, which is characterized in that the coldplate includes coldplate main body, has cooling in the coldplate main body The cooling surface of effect is provided with netted protrusion on the cooling surface.
2. coldplate according to claim 1, which is characterized in that the netted protrusion includes cross one another lateral projection Line and longitudinally convex line.
3. a kind of evaporation coating device, which is characterized in that the evaporation coating device includes the cooling as described in any in claims 1 or 2 Plate.
4. a kind of display panel, which is characterized in that the display panel includes substrate and is formed in public above the substrate Cathode layer, the part or all of metallic film surface of common cathode layer form netted protrusion.
5. display panel according to claim 4, the netted protrusion includes cross one another lateral projection line and longitudinal direction Salient line.
6. display panel according to claim 5, which is characterized in that the lateral projection line and the longitudinally convex line are equal Including bottom metal film, is formed in the cross-point locations of the lateral projection line and the longitudinally convex line and be higher than the bottom gold Belong to the metal film protuberance of film.
7. display panel according to claim 6, which is characterized in that the upper table far from the substrate of metal film protuberance Face is curved surface.
8. display panel according to claim 7, which is characterized in that metal film protuberance is hemisphere, in the hemisphere Curved surface be arranged far from the substrate.
9. display panel according to claim 6, which is characterized in that metal film protuberance is semicolumn, and described half Cylinder height is oriented parallel to the substrate, and the curved surface in the semicolumn is arranged far from the substrate.
10. display panel according to claim 6, which is characterized in that the metal film protuberance is the vaulted structure of tool.
CN201910249109.1A 2019-03-29 2019-03-29 Coldplate, evaporation coating device and display panel Pending CN109913819A (en)

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115369358A (en) * 2021-09-08 2022-11-22 广东聚华印刷显示技术有限公司 Vapor deposition apparatus and vapor deposition substrate separation method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201621623U (en) * 2009-12-11 2010-11-03 深圳市建滔科技有限公司 Light guide plate and light emitting device
CN203746831U (en) * 2014-03-03 2014-07-30 京东方科技集团股份有限公司 Flexible display
CN106893982A (en) * 2017-03-30 2017-06-27 京东方科技集团股份有限公司 A kind of coldplate and evaporation coating device
CN107740048A (en) * 2017-10-27 2018-02-27 京东方科技集团股份有限公司 Coldplate and evaporation coating device
CN107979962A (en) * 2018-01-09 2018-05-01 无锡巨日电子科技有限公司 Water-cooled circuit plate heat dissipating device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201621623U (en) * 2009-12-11 2010-11-03 深圳市建滔科技有限公司 Light guide plate and light emitting device
CN203746831U (en) * 2014-03-03 2014-07-30 京东方科技集团股份有限公司 Flexible display
CN106893982A (en) * 2017-03-30 2017-06-27 京东方科技集团股份有限公司 A kind of coldplate and evaporation coating device
CN107740048A (en) * 2017-10-27 2018-02-27 京东方科技集团股份有限公司 Coldplate and evaporation coating device
CN107979962A (en) * 2018-01-09 2018-05-01 无锡巨日电子科技有限公司 Water-cooled circuit plate heat dissipating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115369358A (en) * 2021-09-08 2022-11-22 广东聚华印刷显示技术有限公司 Vapor deposition apparatus and vapor deposition substrate separation method
CN115369358B (en) * 2021-09-08 2023-12-05 广东聚华印刷显示技术有限公司 Vapor deposition device and vapor deposition substrate separation method

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Application publication date: 20190621