CN115368826B - 基于类球形氧化铈磨粒的抛光液及其制备方法、应用 - Google Patents
基于类球形氧化铈磨粒的抛光液及其制备方法、应用 Download PDFInfo
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- CN115368826B CN115368826B CN202211030992.3A CN202211030992A CN115368826B CN 115368826 B CN115368826 B CN 115368826B CN 202211030992 A CN202211030992 A CN 202211030992A CN 115368826 B CN115368826 B CN 115368826B
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- cerium oxide
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- 239000002245 particle Substances 0.000 title claims abstract description 89
- 238000005498 polishing Methods 0.000 title claims abstract description 64
- 229910000420 cerium oxide Inorganic materials 0.000 title claims abstract description 53
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000004094 surface-active agent Substances 0.000 claims abstract description 14
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims abstract description 10
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims abstract description 10
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims abstract description 10
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical group [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims abstract description 5
- 239000000243 solution Substances 0.000 claims description 43
- 239000000725 suspension Substances 0.000 claims description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- 239000008367 deionised water Substances 0.000 claims description 22
- 229910021641 deionized water Inorganic materials 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 10
- 239000000047 product Substances 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 7
- 229910017604 nitric acid Inorganic materials 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000001291 vacuum drying Methods 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 238000001354 calcination Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 239000002244 precipitate Substances 0.000 claims description 3
- 150000004677 hydrates Chemical class 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 claims 1
- 238000009826 distribution Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 8
- 230000003746 surface roughness Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 4
- 238000004729 solvothermal method Methods 0.000 abstract description 3
- 238000004381 surface treatment Methods 0.000 abstract description 3
- 238000005054 agglomeration Methods 0.000 abstract description 2
- 230000002776 aggregation Effects 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract description 2
- HFQQZARZPUDIFP-UHFFFAOYSA-M sodium;2-dodecylbenzenesulfonate Chemical compound [Na+].CCCCCCCCCCCCC1=CC=CC=C1S([O-])(=O)=O HFQQZARZPUDIFP-UHFFFAOYSA-M 0.000 abstract 1
- 238000002835 absorbance Methods 0.000 description 16
- 239000002202 Polyethylene glycol Substances 0.000 description 15
- 229920001223 polyethylene glycol Polymers 0.000 description 15
- 239000006185 dispersion Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical group [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 10
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 10
- 239000006061 abrasive grain Substances 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000003760 magnetic stirring Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- QQZMWMKOWKGPQY-UHFFFAOYSA-N cerium(3+);trinitrate;hexahydrate Chemical compound O.O.O.O.O.O.[Ce+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O QQZMWMKOWKGPQY-UHFFFAOYSA-N 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000005304 optical glass Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 238000010532 solid phase synthesis reaction Methods 0.000 description 2
- 239000012695 Ce precursor Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 241000722270 Regulus Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000001027 hydrothermal synthesis Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
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CN115960540A (zh) * | 2022-12-23 | 2023-04-14 | 昂士特科技(深圳)有限公司 | 具有改进颗粒的化学机械抛光组合物 |
CN116004122A (zh) * | 2022-12-27 | 2023-04-25 | 嘉庚创新实验室 | 一种二氧化铈抛光液及制备方法 |
Citations (8)
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JP2004128511A (ja) * | 1996-02-07 | 2004-04-22 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤、半導体チップおよび半導体装置、それらの製造法、ならびに、基板の研磨法 |
CN101264922A (zh) * | 2008-04-21 | 2008-09-17 | 上海大学 | 氧化铈菱形纳米片状材料的制备方法 |
CN102796493A (zh) * | 2012-08-24 | 2012-11-28 | 内蒙古大学 | 一种球形单分散高铈抛光粉及其制备方法 |
CN103086417A (zh) * | 2013-01-25 | 2013-05-08 | 吴江创源新材料科技有限公司 | 形貌控制的氧化铈颗粒和制备方法及其应用 |
CN105480999A (zh) * | 2015-12-22 | 2016-04-13 | 南昌大学 | 多级结构纳米氧化铈八面体的制备方法 |
CN107129762A (zh) * | 2017-05-12 | 2017-09-05 | 江南大学 | 一种碳化硅化学机械抛光用的抛光液及其制备方法 |
CN111592030A (zh) * | 2020-06-10 | 2020-08-28 | 中南大学 | 形貌均匀粒度可控的球形氧化铈粉末及其制备方法和应用 |
CN114790367A (zh) * | 2022-04-28 | 2022-07-26 | 广东粤港澳大湾区黄埔材料研究院 | 一种用于单晶硅和多晶硅的纳米类球形氧化铈抛光液和应用 |
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US20070049180A1 (en) * | 2005-08-24 | 2007-03-01 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices |
CA2936498C (en) * | 2014-02-06 | 2021-11-30 | Asahi Kasei Kogyo Co., Ltd. | Abrasive particle, manufacturing method of the same, polishing method, polishing device, and slurry |
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Patent Citations (8)
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JP2004128511A (ja) * | 1996-02-07 | 2004-04-22 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤、半導体チップおよび半導体装置、それらの製造法、ならびに、基板の研磨法 |
CN101264922A (zh) * | 2008-04-21 | 2008-09-17 | 上海大学 | 氧化铈菱形纳米片状材料的制备方法 |
CN102796493A (zh) * | 2012-08-24 | 2012-11-28 | 内蒙古大学 | 一种球形单分散高铈抛光粉及其制备方法 |
CN103086417A (zh) * | 2013-01-25 | 2013-05-08 | 吴江创源新材料科技有限公司 | 形貌控制的氧化铈颗粒和制备方法及其应用 |
CN105480999A (zh) * | 2015-12-22 | 2016-04-13 | 南昌大学 | 多级结构纳米氧化铈八面体的制备方法 |
CN107129762A (zh) * | 2017-05-12 | 2017-09-05 | 江南大学 | 一种碳化硅化学机械抛光用的抛光液及其制备方法 |
CN111592030A (zh) * | 2020-06-10 | 2020-08-28 | 中南大学 | 形貌均匀粒度可控的球形氧化铈粉末及其制备方法和应用 |
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