CN115362356A - 一种应变传感膜、压力传感器、应变感测系统 - Google Patents

一种应变传感膜、压力传感器、应变感测系统 Download PDF

Info

Publication number
CN115362356A
CN115362356A CN202180018123.6A CN202180018123A CN115362356A CN 115362356 A CN115362356 A CN 115362356A CN 202180018123 A CN202180018123 A CN 202180018123A CN 115362356 A CN115362356 A CN 115362356A
Authority
CN
China
Prior art keywords
strain sensing
thin film
film
resistors
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180018123.6A
Other languages
English (en)
Inventor
余锦波
陈之昀
朱长锋
李灏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen New Degree Technology Co Ltd
Original Assignee
Shenzhen New Degree Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen New Degree Technology Co Ltd filed Critical Shenzhen New Degree Technology Co Ltd
Publication of CN115362356A publication Critical patent/CN115362356A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/20Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • G01L1/2293Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/14Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G01L1/148Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors using semiconductive material, e.g. silicon
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/20Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/225Measuring circuits therefor
    • G01L1/2262Measuring circuits therefor involving simple electrical bridges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/20Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2268Arrangements for correcting or for compensating unwanted effects
    • G01L1/2281Arrangements for correcting or for compensating unwanted effects for temperature variations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/20Resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/8605Resistors with PN junctions
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/18Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

本申请公开一种应变传感膜、压力传感器、应变感测系统,其中,应变传感膜包括半导体薄膜(20),通过在半导体薄膜(20)内设置温度传感器(203),获得更精确的传感膜的温度,并结合校准测试得到的有效灵敏度系数与温度关系表对应变传感膜的灵敏度进行修正,实现更好的有效灵敏度系数补偿,可以充分利用半导体薄膜应变片的高灵敏度,可以广泛应用于需要测量局部应变或者应变变化、力或力变化、压力或压力变化、位移、变形、弯曲或弯曲的应用场景中。

Description

PCT国内申请,说明书已公开。

Claims (19)

  1. PCT国内申请,权利要求书已公开。
CN202180018123.6A 2020-03-19 2021-02-08 一种应变传感膜、压力传感器、应变感测系统 Pending CN115362356A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202062992000P 2020-03-19 2020-03-19
US62/992,000 2020-03-19
US202063064086P 2020-08-11 2020-08-11
US63/064,086 2020-08-11
PCT/CN2021/075912 WO2021185000A1 (zh) 2020-03-19 2021-02-08 一种应变传感膜、压力传感器、应变感测系统

Publications (1)

Publication Number Publication Date
CN115362356A true CN115362356A (zh) 2022-11-18

Family

ID=77747826

Family Applications (5)

Application Number Title Priority Date Filing Date
CN202180018123.6A Pending CN115362356A (zh) 2020-03-19 2021-02-08 一种应变传感膜、压力传感器、应变感测系统
CN202180018300.0A Pending CN115362346A (zh) 2020-03-19 2021-02-08 一种应变感测膜、压力传感器、混合应变感测系统
CN202180018343.9A Pending CN115210892A (zh) 2020-03-19 2021-02-08 一种压力感应装置及压力感应设备
CN202180018080.1A Pending CN115605984A (zh) 2020-03-19 2021-02-08 一种应变感应膜的制备方法、应变感应膜以及压力传感器
CN202180018324.6A Pending CN115210682A (zh) 2020-03-19 2021-02-08 压力感应式结构及电子产品

Family Applications After (4)

Application Number Title Priority Date Filing Date
CN202180018300.0A Pending CN115362346A (zh) 2020-03-19 2021-02-08 一种应变感测膜、压力传感器、混合应变感测系统
CN202180018343.9A Pending CN115210892A (zh) 2020-03-19 2021-02-08 一种压力感应装置及压力感应设备
CN202180018080.1A Pending CN115605984A (zh) 2020-03-19 2021-02-08 一种应变感应膜的制备方法、应变感应膜以及压力传感器
CN202180018324.6A Pending CN115210682A (zh) 2020-03-19 2021-02-08 压力感应式结构及电子产品

Country Status (3)

Country Link
US (6) US20230127473A1 (zh)
CN (5) CN115362356A (zh)
WO (6) WO2021185002A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020124477A1 (zh) * 2018-12-20 2020-06-25 深圳纽迪瑞科技开发有限公司 压力感应装置、压力感应方法及电子终端
US11650110B2 (en) * 2020-11-04 2023-05-16 Honeywell International Inc. Rosette piezo-resistive gauge circuit for thermally compensated measurement of full stress tensor
CN117147023B (zh) * 2023-11-01 2024-02-13 合肥美镓传感科技有限公司 氮化镓压力传感器及其制作方法
CN117613033A (zh) * 2023-11-23 2024-02-27 中国工程物理研究院电子工程研究所 一种含温度和应变传感的硅基微模组结构及制备方法

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4556115A (en) * 1983-06-17 1985-12-03 Hottinger Baldwin Measurement, Inc. Method and means for equalizing the measuring sensitivity of a plurality of strain gage transducers
EP0195232B1 (en) * 1985-03-20 1991-12-11 Hitachi, Ltd. Piezoresistive strain sensing device
CN1024842C (zh) * 1989-08-25 1994-06-01 株式会社长野计器制作所 应变检测元件及使用它的压力变换器
DE69334194T2 (de) * 1992-04-22 2008-12-04 Denso Corp., Kariya-shi Verfahren zum Erzeugen einer Halbleitervorrichtung
JPH06302835A (ja) * 1993-04-15 1994-10-28 Toyota Motor Corp 半導体センサ
US6660565B1 (en) 2000-08-17 2003-12-09 St Assembly Test Services Pte Ltd. Flip chip molded/exposed die process and package structure
DE502004011268D1 (de) * 2004-09-24 2010-07-22 Grundfos As Drucksensor
JP4697004B2 (ja) * 2006-03-29 2011-06-08 株式会社日立製作所 力学量測定装置
JP2007281051A (ja) * 2006-04-04 2007-10-25 Miraial Kk 半導体ウエハのチップ加工方法
CN101526411A (zh) * 2009-01-19 2009-09-09 中国电子科技集团公司第四十八研究所 带自补偿网络的薄膜压力传感器芯体
JP5693047B2 (ja) * 2009-06-01 2015-04-01 株式会社デンソー 力学量センサ素子、およびその製造方法
CN101639391B (zh) * 2009-09-07 2012-07-04 哈尔滨工业大学 带温度传感器的多晶硅纳米膜压力传感器及其制作方法
CN101719482A (zh) * 2009-11-25 2010-06-02 中国电子科技集团公司第二十四研究所 单片集成压力传感器的制造方法
CN101807531A (zh) * 2010-03-30 2010-08-18 上海凯虹电子有限公司 一种超薄芯片的封装方法以及封装体
WO2011127306A1 (en) * 2010-04-07 2011-10-13 Sensortech Corporation Contact sensors, force/pressure sensors, and methods for making same
US9470593B2 (en) * 2013-09-12 2016-10-18 Honeywell International Inc. Media isolated pressure sensor
CN105895540A (zh) * 2015-01-09 2016-08-24 特科芯有限公司 晶圆背面印胶的封装方法
CN105895587A (zh) * 2015-01-09 2016-08-24 特科芯有限公司 Daf与低粗糙度硅片结合性来克服基板与芯片分层方法
CN204652340U (zh) * 2015-06-05 2015-09-16 深圳纽迪瑞科技开发有限公司 压力感应按键结构及具有该压力感应按键结构的终端设备
CN106301324B (zh) * 2015-06-05 2023-05-09 深圳纽迪瑞科技开发有限公司 压力感应按键结构及具有该压力感应按键结构的终端设备
US9612170B2 (en) * 2015-07-21 2017-04-04 Apple Inc. Transparent strain sensors in an electronic device
CN105241369B (zh) * 2015-08-17 2018-02-09 王文 一种mems应变计芯片及其制造工艺
CN105224129B (zh) * 2015-09-01 2018-06-22 宸鸿科技(厦门)有限公司 一种压力感测输入装置
JP2017067764A (ja) * 2015-09-29 2017-04-06 ミネベアミツミ株式会社 ひずみゲージ、荷重センサ、及びひずみゲージの製造方法
WO2017056673A1 (ja) * 2015-09-30 2017-04-06 日立オートモティブシステムズ株式会社 力学量測定装置
CN106855756A (zh) * 2015-12-09 2017-06-16 雅士晶业股份有限公司 功能玻璃罩盖
WO2017133017A1 (zh) * 2016-02-06 2017-08-10 深圳纽迪瑞科技开发有限公司 压力传感器、电子设备及该压力传感器的制作方法
US10352799B2 (en) * 2016-02-06 2019-07-16 Shenzhen New Degree Technology Co., Ltd. Pressure sensor, electronic device, and method for manufacturing pressure sensor
US10379654B2 (en) * 2016-07-12 2019-08-13 Advense Technology Inc. Nanocomposite sensing material
US10012553B2 (en) 2016-08-12 2018-07-03 The Hong Kong Polytechnic University Coated nanofiller/polymer composite sensor network for guided-wave-based structural health monitoring
CN110192172B (zh) * 2017-01-21 2022-10-14 深圳纽迪瑞科技开发有限公司 压力感应式结构及电子产品
US10879449B2 (en) * 2017-05-11 2020-12-29 Nihat Okulan Semiconductor strain gauge and method of manufacturing same
US11248967B2 (en) * 2017-06-13 2022-02-15 New Degree Technology, LLC Dual-use strain sensor to detect environmental information
US10935443B2 (en) * 2017-07-19 2021-03-02 Shenzhen New Degree Technology Co., Ltd. Pressure sensing device and pressure sensing apparatus
CN108037844B (zh) * 2017-11-09 2021-02-09 厦门天马微电子有限公司 触控显示面板和触控显示装置
CN108365021A (zh) * 2018-02-06 2018-08-03 无锡元创华芯微机电有限公司 一种红外探测器晶圆封装方法
CN108917587B (zh) * 2018-05-17 2019-08-09 大连理工大学 一种基于惠斯通全桥原理的电阻应变式曲率传感器
CN109238525A (zh) * 2018-08-28 2019-01-18 西安航天动力研究所 金属薄膜式压力-温度复合传感器及其制作方法
CN109781314A (zh) * 2018-12-24 2019-05-21 清华大学 复合功能材料、压力传感装置以及智能温控系统
CN209264161U (zh) * 2019-01-16 2019-08-16 深圳纽迪瑞科技开发有限公司 应变感应组件及设备

Also Published As

Publication number Publication date
WO2021185002A1 (zh) 2021-09-23
CN115210892A (zh) 2022-10-18
US20230146214A1 (en) 2023-05-11
US20230144931A1 (en) 2023-05-11
WO2021185004A1 (zh) 2021-09-23
US20230141257A1 (en) 2023-05-11
WO2021185003A1 (zh) 2021-09-23
WO2021185000A1 (zh) 2021-09-23
CN115362346A (zh) 2022-11-18
WO2021185001A1 (zh) 2021-09-23
CN115210682A (zh) 2022-10-18
CN115605984A (zh) 2023-01-13
US20230127473A1 (en) 2023-04-27
WO2021188799A1 (en) 2021-09-23
US20230138119A1 (en) 2023-05-04
US20210293633A1 (en) 2021-09-23
US11796405B2 (en) 2023-10-24

Similar Documents

Publication Publication Date Title
CN115362356A (zh) 一种应变传感膜、压力传感器、应变感测系统
CN108603799B (zh) 压力传感器、电子设备及该压力传感器的制作方法
US10585456B2 (en) Flexible display device having bending sensing device
US10678363B2 (en) Pressure sensor and display device
US10564744B2 (en) Flexible display device
US7973274B2 (en) Tactile sensor module with a flexible substrate adapted for use on a curved surface and method of a mounting tactile sensor
US7721610B2 (en) Rotating body dynamic quantity measuring device and system
CN108604149B (zh) 压力传感器、电子设备及该压力传感器的制作方法
WO2017201721A1 (zh) 曲率半径测量器、电子设备及曲率半径测量器的制作方法
CN113984255A (zh) 一种自带温度补偿的压力传感器芯片的封装结构
KR102398725B1 (ko) 반도체형 풀 브리지 스트레인 게이지 모듈 및 이를 적용한 로드셀
CN107688405B (zh) 触摸压力感测装置及电子产品
KR102293761B1 (ko) 반도체형 풀 브리지 스트레인 게이지를 이용한 필압 측정모듈 및 이를 적용한 전자펜
CN213715902U (zh) 压力触摸板
WO2021035741A1 (zh) 力感应装置、力感应方法及设备
CN113242965B (zh) 压力传感器及电子终端
CN116113913A (zh) 梁式压力传感器、压力传感装置以及电子设备
WO2021035742A1 (zh) 压力感应组件、压力感应方法及设备
CN117168546A (zh) 温压复合式传感器及其制备方法、封装结构
CN116301205A (zh) 电子设备
CN114812881A (zh) 柔性压力传感器及其制作方法
CN113137910A (zh) 复合式薄膜传感器

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination