CN115362356A - 一种应变传感膜、压力传感器、应变感测系统 - Google Patents
一种应变传感膜、压力传感器、应变感测系统 Download PDFInfo
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- CN115362356A CN115362356A CN202180018123.6A CN202180018123A CN115362356A CN 115362356 A CN115362356 A CN 115362356A CN 202180018123 A CN202180018123 A CN 202180018123A CN 115362356 A CN115362356 A CN 115362356A
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- 239000012528 membrane Substances 0.000 title abstract description 17
- 239000004065 semiconductor Substances 0.000 claims abstract description 97
- 230000035945 sensitivity Effects 0.000 claims abstract description 46
- 239000010408 film Substances 0.000 claims description 97
- 239000010409 thin film Substances 0.000 claims description 75
- 239000000758 substrate Substances 0.000 claims description 25
- 238000012545 processing Methods 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 239000005083 Zinc sulfide Substances 0.000 claims description 6
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 6
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000012937 correction Methods 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 3
- 230000008859 change Effects 0.000 abstract description 20
- 238000012360 testing method Methods 0.000 abstract description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 2
- 238000005259 measurement Methods 0.000 abstract description 2
- 238000005452 bending Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000009530 blood pressure measurement Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000002277 temperature effect Effects 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011094 fiberboard Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 210000003491 skin Anatomy 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
- G01L1/2293—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
- G01L1/148—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors using semiconductive material, e.g. silicon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/225—Measuring circuits therefor
- G01L1/2262—Measuring circuits therefor involving simple electrical bridges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2268—Arrangements for correcting or for compensating unwanted effects
- G01L1/2281—Arrangements for correcting or for compensating unwanted effects for temperature variations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/20—Resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/8605—Resistors with PN junctions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
本申请公开一种应变传感膜、压力传感器、应变感测系统,其中,应变传感膜包括半导体薄膜(20),通过在半导体薄膜(20)内设置温度传感器(203),获得更精确的传感膜的温度,并结合校准测试得到的有效灵敏度系数与温度关系表对应变传感膜的灵敏度进行修正,实现更好的有效灵敏度系数补偿,可以充分利用半导体薄膜应变片的高灵敏度,可以广泛应用于需要测量局部应变或者应变变化、力或力变化、压力或压力变化、位移、变形、弯曲或弯曲的应用场景中。
Description
PCT国内申请,说明书已公开。
Claims (19)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US202062992000P | 2020-03-19 | 2020-03-19 | |
US62/992,000 | 2020-03-19 | ||
US202063064086P | 2020-08-11 | 2020-08-11 | |
US63/064,086 | 2020-08-11 | ||
PCT/CN2021/075912 WO2021185000A1 (zh) | 2020-03-19 | 2021-02-08 | 一种应变传感膜、压力传感器、应变感测系统 |
Publications (1)
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CN115362356A true CN115362356A (zh) | 2022-11-18 |
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Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180018123.6A Pending CN115362356A (zh) | 2020-03-19 | 2021-02-08 | 一种应变传感膜、压力传感器、应变感测系统 |
CN202180018300.0A Pending CN115362346A (zh) | 2020-03-19 | 2021-02-08 | 一种应变感测膜、压力传感器、混合应变感测系统 |
CN202180018343.9A Pending CN115210892A (zh) | 2020-03-19 | 2021-02-08 | 一种压力感应装置及压力感应设备 |
CN202180018080.1A Pending CN115605984A (zh) | 2020-03-19 | 2021-02-08 | 一种应变感应膜的制备方法、应变感应膜以及压力传感器 |
CN202180018324.6A Pending CN115210682A (zh) | 2020-03-19 | 2021-02-08 | 压力感应式结构及电子产品 |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
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CN202180018300.0A Pending CN115362346A (zh) | 2020-03-19 | 2021-02-08 | 一种应变感测膜、压力传感器、混合应变感测系统 |
CN202180018343.9A Pending CN115210892A (zh) | 2020-03-19 | 2021-02-08 | 一种压力感应装置及压力感应设备 |
CN202180018080.1A Pending CN115605984A (zh) | 2020-03-19 | 2021-02-08 | 一种应变感应膜的制备方法、应变感应膜以及压力传感器 |
CN202180018324.6A Pending CN115210682A (zh) | 2020-03-19 | 2021-02-08 | 压力感应式结构及电子产品 |
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US (6) | US20230127473A1 (zh) |
CN (5) | CN115362356A (zh) |
WO (6) | WO2021185002A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020124477A1 (zh) * | 2018-12-20 | 2020-06-25 | 深圳纽迪瑞科技开发有限公司 | 压力感应装置、压力感应方法及电子终端 |
US11650110B2 (en) * | 2020-11-04 | 2023-05-16 | Honeywell International Inc. | Rosette piezo-resistive gauge circuit for thermally compensated measurement of full stress tensor |
CN117147023B (zh) * | 2023-11-01 | 2024-02-13 | 合肥美镓传感科技有限公司 | 氮化镓压力传感器及其制作方法 |
CN117613033A (zh) * | 2023-11-23 | 2024-02-27 | 中国工程物理研究院电子工程研究所 | 一种含温度和应变传感的硅基微模组结构及制备方法 |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4556115A (en) * | 1983-06-17 | 1985-12-03 | Hottinger Baldwin Measurement, Inc. | Method and means for equalizing the measuring sensitivity of a plurality of strain gage transducers |
EP0195232B1 (en) * | 1985-03-20 | 1991-12-11 | Hitachi, Ltd. | Piezoresistive strain sensing device |
CN1024842C (zh) * | 1989-08-25 | 1994-06-01 | 株式会社长野计器制作所 | 应变检测元件及使用它的压力变换器 |
DE69334194T2 (de) * | 1992-04-22 | 2008-12-04 | Denso Corp., Kariya-shi | Verfahren zum Erzeugen einer Halbleitervorrichtung |
JPH06302835A (ja) * | 1993-04-15 | 1994-10-28 | Toyota Motor Corp | 半導体センサ |
US6660565B1 (en) | 2000-08-17 | 2003-12-09 | St Assembly Test Services Pte Ltd. | Flip chip molded/exposed die process and package structure |
DE502004011268D1 (de) * | 2004-09-24 | 2010-07-22 | Grundfos As | Drucksensor |
JP4697004B2 (ja) * | 2006-03-29 | 2011-06-08 | 株式会社日立製作所 | 力学量測定装置 |
JP2007281051A (ja) * | 2006-04-04 | 2007-10-25 | Miraial Kk | 半導体ウエハのチップ加工方法 |
CN101526411A (zh) * | 2009-01-19 | 2009-09-09 | 中国电子科技集团公司第四十八研究所 | 带自补偿网络的薄膜压力传感器芯体 |
JP5693047B2 (ja) * | 2009-06-01 | 2015-04-01 | 株式会社デンソー | 力学量センサ素子、およびその製造方法 |
CN101639391B (zh) * | 2009-09-07 | 2012-07-04 | 哈尔滨工业大学 | 带温度传感器的多晶硅纳米膜压力传感器及其制作方法 |
CN101719482A (zh) * | 2009-11-25 | 2010-06-02 | 中国电子科技集团公司第二十四研究所 | 单片集成压力传感器的制造方法 |
CN101807531A (zh) * | 2010-03-30 | 2010-08-18 | 上海凯虹电子有限公司 | 一种超薄芯片的封装方法以及封装体 |
WO2011127306A1 (en) * | 2010-04-07 | 2011-10-13 | Sensortech Corporation | Contact sensors, force/pressure sensors, and methods for making same |
US9470593B2 (en) * | 2013-09-12 | 2016-10-18 | Honeywell International Inc. | Media isolated pressure sensor |
CN105895540A (zh) * | 2015-01-09 | 2016-08-24 | 特科芯有限公司 | 晶圆背面印胶的封装方法 |
CN105895587A (zh) * | 2015-01-09 | 2016-08-24 | 特科芯有限公司 | Daf与低粗糙度硅片结合性来克服基板与芯片分层方法 |
CN204652340U (zh) * | 2015-06-05 | 2015-09-16 | 深圳纽迪瑞科技开发有限公司 | 压力感应按键结构及具有该压力感应按键结构的终端设备 |
CN106301324B (zh) * | 2015-06-05 | 2023-05-09 | 深圳纽迪瑞科技开发有限公司 | 压力感应按键结构及具有该压力感应按键结构的终端设备 |
US9612170B2 (en) * | 2015-07-21 | 2017-04-04 | Apple Inc. | Transparent strain sensors in an electronic device |
CN105241369B (zh) * | 2015-08-17 | 2018-02-09 | 王文 | 一种mems应变计芯片及其制造工艺 |
CN105224129B (zh) * | 2015-09-01 | 2018-06-22 | 宸鸿科技(厦门)有限公司 | 一种压力感测输入装置 |
JP2017067764A (ja) * | 2015-09-29 | 2017-04-06 | ミネベアミツミ株式会社 | ひずみゲージ、荷重センサ、及びひずみゲージの製造方法 |
WO2017056673A1 (ja) * | 2015-09-30 | 2017-04-06 | 日立オートモティブシステムズ株式会社 | 力学量測定装置 |
CN106855756A (zh) * | 2015-12-09 | 2017-06-16 | 雅士晶业股份有限公司 | 功能玻璃罩盖 |
WO2017133017A1 (zh) * | 2016-02-06 | 2017-08-10 | 深圳纽迪瑞科技开发有限公司 | 压力传感器、电子设备及该压力传感器的制作方法 |
US10352799B2 (en) * | 2016-02-06 | 2019-07-16 | Shenzhen New Degree Technology Co., Ltd. | Pressure sensor, electronic device, and method for manufacturing pressure sensor |
US10379654B2 (en) * | 2016-07-12 | 2019-08-13 | Advense Technology Inc. | Nanocomposite sensing material |
US10012553B2 (en) | 2016-08-12 | 2018-07-03 | The Hong Kong Polytechnic University | Coated nanofiller/polymer composite sensor network for guided-wave-based structural health monitoring |
CN110192172B (zh) * | 2017-01-21 | 2022-10-14 | 深圳纽迪瑞科技开发有限公司 | 压力感应式结构及电子产品 |
US10879449B2 (en) * | 2017-05-11 | 2020-12-29 | Nihat Okulan | Semiconductor strain gauge and method of manufacturing same |
US11248967B2 (en) * | 2017-06-13 | 2022-02-15 | New Degree Technology, LLC | Dual-use strain sensor to detect environmental information |
US10935443B2 (en) * | 2017-07-19 | 2021-03-02 | Shenzhen New Degree Technology Co., Ltd. | Pressure sensing device and pressure sensing apparatus |
CN108037844B (zh) * | 2017-11-09 | 2021-02-09 | 厦门天马微电子有限公司 | 触控显示面板和触控显示装置 |
CN108365021A (zh) * | 2018-02-06 | 2018-08-03 | 无锡元创华芯微机电有限公司 | 一种红外探测器晶圆封装方法 |
CN108917587B (zh) * | 2018-05-17 | 2019-08-09 | 大连理工大学 | 一种基于惠斯通全桥原理的电阻应变式曲率传感器 |
CN109238525A (zh) * | 2018-08-28 | 2019-01-18 | 西安航天动力研究所 | 金属薄膜式压力-温度复合传感器及其制作方法 |
CN109781314A (zh) * | 2018-12-24 | 2019-05-21 | 清华大学 | 复合功能材料、压力传感装置以及智能温控系统 |
CN209264161U (zh) * | 2019-01-16 | 2019-08-16 | 深圳纽迪瑞科技开发有限公司 | 应变感应组件及设备 |
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2021
- 2021-02-08 WO PCT/CN2021/075914 patent/WO2021185002A1/zh active Application Filing
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- 2021-02-08 CN CN202180018123.6A patent/CN115362356A/zh active Pending
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- 2021-02-08 WO PCT/CN2021/075912 patent/WO2021185000A1/zh active Application Filing
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- 2021-02-08 WO PCT/CN2021/075915 patent/WO2021185003A1/zh active Application Filing
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- 2021-02-08 US US17/912,832 patent/US20230144931A1/en active Pending
- 2021-03-18 US US17/205,860 patent/US11796405B2/en active Active
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Also Published As
Publication number | Publication date |
---|---|
WO2021185002A1 (zh) | 2021-09-23 |
CN115210892A (zh) | 2022-10-18 |
US20230146214A1 (en) | 2023-05-11 |
US20230144931A1 (en) | 2023-05-11 |
WO2021185004A1 (zh) | 2021-09-23 |
US20230141257A1 (en) | 2023-05-11 |
WO2021185003A1 (zh) | 2021-09-23 |
WO2021185000A1 (zh) | 2021-09-23 |
CN115362346A (zh) | 2022-11-18 |
WO2021185001A1 (zh) | 2021-09-23 |
CN115210682A (zh) | 2022-10-18 |
CN115605984A (zh) | 2023-01-13 |
US20230127473A1 (en) | 2023-04-27 |
WO2021188799A1 (en) | 2021-09-23 |
US20230138119A1 (en) | 2023-05-04 |
US20210293633A1 (en) | 2021-09-23 |
US11796405B2 (en) | 2023-10-24 |
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