CN115312436A - 一种自动上料的晶圆清洗装置 - Google Patents
一种自动上料的晶圆清洗装置 Download PDFInfo
- Publication number
- CN115312436A CN115312436A CN202210968590.1A CN202210968590A CN115312436A CN 115312436 A CN115312436 A CN 115312436A CN 202210968590 A CN202210968590 A CN 202210968590A CN 115312436 A CN115312436 A CN 115312436A
- Authority
- CN
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- Prior art keywords
- wafer
- plate
- cleaning
- connecting plate
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000004140 cleaning Methods 0.000 title claims abstract description 104
- 239000000463 material Substances 0.000 title claims abstract description 10
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 238000002347 injection Methods 0.000 claims abstract description 20
- 239000007924 injection Substances 0.000 claims abstract description 20
- 238000001035 drying Methods 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims description 48
- 239000002699 waste material Substances 0.000 claims description 26
- 239000002274 desiccant Substances 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 23
- 238000007599 discharging Methods 0.000 claims 1
- 230000009471 action Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 230000008878 coupling Effects 0.000 description 10
- 238000010168 coupling process Methods 0.000 description 10
- 238000005859 coupling reaction Methods 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 210000004209 hair Anatomy 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210968590.1A CN115312436B (zh) | 2022-08-12 | 2022-08-12 | 一种自动上料的晶圆清洗装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210968590.1A CN115312436B (zh) | 2022-08-12 | 2022-08-12 | 一种自动上料的晶圆清洗装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN115312436A true CN115312436A (zh) | 2022-11-08 |
CN115312436B CN115312436B (zh) | 2023-09-05 |
Family
ID=83863712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210968590.1A Active CN115312436B (zh) | 2022-08-12 | 2022-08-12 | 一种自动上料的晶圆清洗装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115312436B (zh) |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5317778A (en) * | 1991-07-31 | 1994-06-07 | Shin-Etsu Handotai Co., Ltd. | Automatic cleaning apparatus for wafers |
CN101231945A (zh) * | 2007-01-24 | 2008-07-30 | 恩益禧电子股份有限公司 | 制造半导体器件的方法 |
US20120135610A1 (en) * | 2010-11-25 | 2012-05-31 | Lapis Semiconductor Co., Ltd. | System and method for processing substrate |
CN202443959U (zh) * | 2012-02-27 | 2012-09-19 | 中芯国际集成电路制造(上海)有限公司 | 晶圆清洗刷和晶圆清洗装置 |
KR20140000506A (ko) * | 2012-06-22 | 2014-01-03 | 에스브이에스 주식회사 | 반도체 웨이퍼 제조장치 및 그 방법 |
CN111112208A (zh) * | 2019-12-24 | 2020-05-08 | 荆门微田智能科技有限公司 | 一种链式晶圆清洗干燥机器人整机 |
CN112117218A (zh) * | 2020-09-22 | 2020-12-22 | 苏州思达优科技有限公司 | 一种晶圆清洗设备及使用方法 |
CN113097121A (zh) * | 2021-03-30 | 2021-07-09 | 上海华力微电子有限公司 | 一种晶圆清洗装置及清洗方法 |
CN113345821A (zh) * | 2021-08-06 | 2021-09-03 | 杭州众硅电子科技有限公司 | 一种晶圆清洗干燥方法及机构 |
CN114472332A (zh) * | 2022-01-21 | 2022-05-13 | 智程半导体设备科技(昆山)有限公司 | 一种浸泡式去胶清洗、干燥一体机 |
CN114724992A (zh) * | 2022-04-11 | 2022-07-08 | 深圳市锐博自动化设备有限公司 | 一种晶圆清洗上料装置 |
-
2022
- 2022-08-12 CN CN202210968590.1A patent/CN115312436B/zh active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5317778A (en) * | 1991-07-31 | 1994-06-07 | Shin-Etsu Handotai Co., Ltd. | Automatic cleaning apparatus for wafers |
CN101231945A (zh) * | 2007-01-24 | 2008-07-30 | 恩益禧电子股份有限公司 | 制造半导体器件的方法 |
US20120135610A1 (en) * | 2010-11-25 | 2012-05-31 | Lapis Semiconductor Co., Ltd. | System and method for processing substrate |
CN202443959U (zh) * | 2012-02-27 | 2012-09-19 | 中芯国际集成电路制造(上海)有限公司 | 晶圆清洗刷和晶圆清洗装置 |
KR20140000506A (ko) * | 2012-06-22 | 2014-01-03 | 에스브이에스 주식회사 | 반도체 웨이퍼 제조장치 및 그 방법 |
CN111112208A (zh) * | 2019-12-24 | 2020-05-08 | 荆门微田智能科技有限公司 | 一种链式晶圆清洗干燥机器人整机 |
CN112117218A (zh) * | 2020-09-22 | 2020-12-22 | 苏州思达优科技有限公司 | 一种晶圆清洗设备及使用方法 |
CN113097121A (zh) * | 2021-03-30 | 2021-07-09 | 上海华力微电子有限公司 | 一种晶圆清洗装置及清洗方法 |
CN113345821A (zh) * | 2021-08-06 | 2021-09-03 | 杭州众硅电子科技有限公司 | 一种晶圆清洗干燥方法及机构 |
CN114472332A (zh) * | 2022-01-21 | 2022-05-13 | 智程半导体设备科技(昆山)有限公司 | 一种浸泡式去胶清洗、干燥一体机 |
CN114724992A (zh) * | 2022-04-11 | 2022-07-08 | 深圳市锐博自动化设备有限公司 | 一种晶圆清洗上料装置 |
Non-Patent Citations (1)
Title |
---|
陈平;舒福璋;段成龙;郑佳晶;: "旋转式晶圆自动干燥装置的设计与研究", 科技创新与应用, no. 05 * |
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Publication number | Publication date |
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CN115312436B (zh) | 2023-09-05 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 215316 room 3, No. 299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Applicant before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
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CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215316 Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 215316 room 3, No. 299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |
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CP03 | Change of name, title or address |