CN115298364A - 电镀装置和电镀方法 - Google Patents
电镀装置和电镀方法 Download PDFInfo
- Publication number
- CN115298364A CN115298364A CN202080098522.3A CN202080098522A CN115298364A CN 115298364 A CN115298364 A CN 115298364A CN 202080098522 A CN202080098522 A CN 202080098522A CN 115298364 A CN115298364 A CN 115298364A
- Authority
- CN
- China
- Prior art keywords
- substrate
- plating
- holding module
- substrate holding
- recited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 255
- 238000000034 method Methods 0.000 title claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 313
- 238000009713 electroplating Methods 0.000 claims abstract description 86
- 238000001465 metallisation Methods 0.000 claims abstract description 32
- 239000007788 liquid Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000012546 transfer Methods 0.000 abstract description 10
- 238000007654 immersion Methods 0.000 abstract description 4
- 239000002184 metal Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000000654 additive Substances 0.000 description 14
- 238000013019 agitation Methods 0.000 description 13
- 239000012528 membrane Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 8
- 238000009826 distribution Methods 0.000 description 7
- 230000005684 electric field Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012876 topography Methods 0.000 description 3
- 230000002596 correlated effect Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/080622 WO2021189181A1 (en) | 2020-03-23 | 2020-03-23 | Plating apparatus and plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115298364A true CN115298364A (zh) | 2022-11-04 |
Family
ID=77890826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080098522.3A Pending CN115298364A (zh) | 2020-03-23 | 2020-03-23 | 电镀装置和电镀方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230374691A1 (ko) |
| JP (1) | JP2023522576A (ko) |
| KR (1) | KR20230041647A (ko) |
| CN (1) | CN115298364A (ko) |
| TW (1) | TW202136593A (ko) |
| WO (1) | WO2021189181A1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024120301A1 (zh) * | 2022-12-08 | 2024-06-13 | 盛美半导体设备(上海)股份有限公司 | 电镀设备的减震控制方法、装置及电子设备 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114277427B (zh) * | 2022-01-19 | 2024-03-12 | 东莞市丰卓自动化科技有限公司 | 一种电镀设备 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69929967T2 (de) * | 1998-04-21 | 2007-05-24 | Applied Materials, Inc., Santa Clara | Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten |
| US6610189B2 (en) * | 2001-01-03 | 2003-08-26 | Applied Materials, Inc. | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature |
| WO2012174732A1 (en) * | 2011-06-24 | 2012-12-27 | Acm Research (Shanghai) Inc. | Methods and apparatus for uniformly metallization on substrates |
| WO2014172837A1 (en) * | 2013-04-22 | 2014-10-30 | Acm Research (Shanghai) Inc. | Method and apparatus for uniformly metallization on substrate |
| US20170260641A1 (en) * | 2014-11-25 | 2017-09-14 | Acm Research (Shanghai) Inc. | Apparatus and method for uniform metallization on substrate |
| CN105986290B (zh) * | 2015-02-17 | 2020-04-24 | 盛美半导体设备(上海)股份有限公司 | 在基板上均匀金属化的装置及方法 |
-
2020
- 2020-03-23 JP JP2022558193A patent/JP2023522576A/ja active Pending
- 2020-03-23 KR KR1020227036161A patent/KR20230041647A/ko active Search and Examination
- 2020-03-23 US US17/907,053 patent/US20230374691A1/en active Pending
- 2020-03-23 CN CN202080098522.3A patent/CN115298364A/zh active Pending
- 2020-03-23 WO PCT/CN2020/080622 patent/WO2021189181A1/en active Application Filing
-
2021
- 2021-01-15 TW TW110101746A patent/TW202136593A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024120301A1 (zh) * | 2022-12-08 | 2024-06-13 | 盛美半导体设备(上海)股份有限公司 | 电镀设备的减震控制方法、装置及电子设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023522576A (ja) | 2023-05-31 |
| US20230374691A1 (en) | 2023-11-23 |
| TW202136593A (zh) | 2021-10-01 |
| KR20230041647A (ko) | 2023-03-24 |
| WO2021189181A1 (en) | 2021-09-30 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |