CN115287125A - Photosensitive chip cleaning solution and preparation method and application thereof - Google Patents
Photosensitive chip cleaning solution and preparation method and application thereof Download PDFInfo
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- CN115287125A CN115287125A CN202210674968.7A CN202210674968A CN115287125A CN 115287125 A CN115287125 A CN 115287125A CN 202210674968 A CN202210674968 A CN 202210674968A CN 115287125 A CN115287125 A CN 115287125A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 83
- 238000002360 preparation method Methods 0.000 title abstract description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000003153 chemical reaction reagent Substances 0.000 claims abstract description 30
- 239000004094 surface-active agent Substances 0.000 claims abstract description 27
- 239000002904 solvent Substances 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 20
- 230000000149 penetrating effect Effects 0.000 claims abstract description 20
- 239000002131 composite material Substances 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000008367 deionised water Substances 0.000 claims abstract description 8
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 235000019441 ethanol Nutrition 0.000 claims description 42
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 33
- 238000006243 chemical reaction Methods 0.000 claims description 29
- 238000003756 stirring Methods 0.000 claims description 17
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 15
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 15
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 14
- 238000002156 mixing Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 238000002791 soaking Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 claims description 6
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 claims description 6
- XTDYIOOONNVFMA-UHFFFAOYSA-N dimethyl pentanedioate Chemical compound COC(=O)CCCC(=O)OC XTDYIOOONNVFMA-UHFFFAOYSA-N 0.000 claims description 6
- 230000035484 reaction time Effects 0.000 claims description 5
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 4
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 48
- 150000001875 compounds Chemical class 0.000 description 8
- 241000519995 Stachys sylvatica Species 0.000 description 7
- 239000003344 environmental pollutant Substances 0.000 description 6
- 231100000719 pollutant Toxicity 0.000 description 6
- 238000011282 treatment Methods 0.000 description 5
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 4
- 229910052938 sodium sulfate Inorganic materials 0.000 description 4
- 235000011152 sodium sulphate Nutrition 0.000 description 4
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 3
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 3
- 235000011130 ammonium sulphate Nutrition 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011550 stock solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
- C11D1/29—Sulfates of polyoxyalkylene ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/83—Mixtures of non-ionic with anionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2093—Esters; Carbonates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/40—Specific cleaning or washing processes
- C11D2111/46—Specific cleaning or washing processes applying energy, e.g. irradiation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Detergent Compositions (AREA)
Abstract
The invention provides a photosensitive chip cleaning solution, a preparation method and an application thereof, wherein the photosensitive chip cleaning solution comprises the following raw materials in parts by weight: 50-60 parts of DBE solvent, 5-8 parts of penetrating agent, 4-6 parts of surfactant and 15-20 parts of composite alcohol reagent. The photosensitive chip cleaning solution is environment-friendly, pollution-free and low in volatilization loss, after cleaning is finished, the chip is not required to be rinsed by using acetone, and only by using deionized water for rinsing, the cleaning solution is harmless to the environment and a human body, has excellent cleaning performance, can obtain excellent cleaning effect, and is free from corrosion to the chip.
Description
Technical Field
The invention belongs to the technical field of chip cleaning, and particularly relates to a photosensitive chip cleaning solution, and a preparation method and application thereof.
Background
In the module assembling process, the photosensitive chip of the image photosensitive sensor has 0.3-0.5% of white point pollution (namely, pollutants such as dust fall, fingerprint, oil stain, residual glue and the like) in the manufacturing process, the pollutants are difficult to remove, and then the problem of bad dirty points of the module is directly caused.
Disclosure of Invention
The invention aims to provide a cleaning solution for a photosensitive chip, which can at least solve part of defects in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a photosensitive chip cleaning solution comprises the following raw materials in parts by weight: 50-60 parts of DBE solvent, 5-8 parts of penetrating agent, 4-6 parts of surfactant and 15-20 parts of composite alcohol reagent.
Further, the DBE solvent comprises dimethyl succinate, dimethyl glutarate and dimethyl adipate.
Further, the penetrant adopts a JFC series penetrant.
Further, the surfactant is at least one of fatty alcohol-polyoxyethylene ether sodium sulfate, fatty alcohol-polyoxyethylene ether ammonium sulfate and nonylphenol polyoxyethylene ether.
Further, the composite alcohol reagent is a mixture of diethylene glycol and isomeric alcohol, and the mass ratio of the diethylene glycol to the isomeric alcohol is 1.5-2:1.
In addition, the invention also provides a preparation method of the photosensitive chip cleaning solution, which comprises the following steps:
1) Mixing a penetrating agent, a surfactant and a composite alcohol reagent for chemical reaction, and controlling the reaction temperature to be 50-60 ℃;
2) Adding a DBE solvent into a stirring tank, adding a material obtained by the reaction into the stirring tank after the reaction in the step 1) is finished, and mixing and stirring the material and the DBE solvent to obtain the photosensitive chip cleaning solution.
Further, the reaction time of the penetrating agent, the surfactant and the compound alcohol reagent in the step 1) is 30min.
Further, the mixing and stirring time in the step 2) is 20min.
The invention also provides a using method of the photosensitive chip cleaning solution, which comprises the steps of soaking or wiping the photosensitive chip by using the stock solution of the photosensitive chip cleaning solution, and rinsing by using deionized water or absolute ethyl alcohol after soaking or wiping.
The invention also provides a using method of the photosensitive chip cleaning solution, the photosensitive chip cleaning solution and pure water are mixed according to the mass ratio of 1:1-1:8, and the mixture is used as ultrasonic cleaning solution to carry out ultrasonic cleaning on the photosensitive chip, wherein the ultrasonic cleaning temperature is 25-50 ℃, and deionized water is adopted for rinsing after the ultrasonic cleaning is finished.
Compared with the prior art, the invention has the following beneficial effects:
the photosensitive chip cleaning solution provided by the invention is environment-friendly, pollution-free and small in volatilization loss, after cleaning is finished, the chip is not required to be rinsed by acetone, only by deionized water, and is harmless to the environment and human bodies, the cleaning performance is excellent, the excellent cleaning effect can be obtained, and the chip is not corroded.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a photosensitive chip cleaning fluid which comprises the following raw materials in parts by weight: 50-60 parts of DBE solvent, 5-8 parts of penetrating agent, 4-6 parts of surfactant and 15-20 parts of composite alcohol reagent. Wherein the DBE solvent specifically adopts a CAS number 95481-62-2 product, and comprises dimethyl succinate, dimethyl glutarate and dimethyl adipate; the penetrating agent adopts JFC series penetrating agent (polyoxyethylene ether compound); the surfactant is at least one of fatty alcohol-polyoxyethylene ether sodium sulfate, fatty alcohol-polyoxyethylene ether ammonium sulfate and nonylphenol polyoxyethylene ether; the composite alcohol reagent adopts a mixture of diethylene glycol and isomeric alcohol, and the mass ratio of the diethylene glycol to the isomeric alcohol is 1.5.
The method for cleaning the photosensitive chip by adopting the photosensitive chip cleaning solution has two methods, one method is to directly adopt the stock solution of the photosensitive chip cleaning solution to soak or wipe the photosensitive chip, and deionized water or absolute ethyl alcohol is adopted for rinsing after soaking or wiping; and the other method is ultrasonic cleaning, specifically, mixing the photosensitive chip cleaning solution with pure water according to the mass ratio of 1:1-1:8, and performing ultrasonic cleaning on the photosensitive chip as an ultrasonic cleaning solution, wherein the ultrasonic cleaning temperature is 25-50 ℃, and rinsing with deionized water after the ultrasonic cleaning is finished. Of course, for stubborn contaminants on the photosensitive chip, the two cleaning modes can also be combined for use, such as soaking and then ultrasonic cleaning.
The performance of the cleaning solution for a photosensitive chip of the present invention will be described with reference to specific examples.
Example 1:
the embodiment provides a photosensitive chip cleaning solution which comprises the following raw materials in parts by weight: 50 parts of DBE solvent, 5 parts of penetrating agent, 6 parts of surfactant and 15 parts of composite alcohol reagent. The DBE solvent specifically adopts a CAS number 95481-62-2 product, and comprises dimethyl succinate, dimethyl glutarate and dimethyl adipate, the penetrating agent adopts fatty alcohol-polyoxyethylene ether, the surfactant adopts fatty alcohol-polyoxyethylene ether sodium sulfate (AES), and the compound alcohol reagent adopts a mixture of diethylene glycol and isomeric alcohol in a mass ratio of 2:1.
The preparation process of the photosensitive chip cleaning solution comprises the following steps: firstly, mixing a penetrating agent, a surfactant and a compound alcohol reagent for chemical reaction, and controlling the reaction temperature to be 50 ℃ and the reaction time to be 30min; and adding the DBE solvent into a stirring tank, after the reaction is finished, adding the material obtained by the reaction into the stirring tank, mixing and stirring the material with the DBE solvent for 20min, and obtaining the photosensitive chip cleaning solution.
Through detection, the specific gravity of the cleaning solution for the photosensitive chip prepared by the embodiment is 0.93, and the appearance of the cleaning solution is light yellow; observing the stability of the cleaning solution in a standing state, wherein the cleaning solution does not have a layering phenomenon after standing; the cleaning effect is tested by adopting a soaking mode, and stubborn white spots on the photosensitive chip can be dissolved by the photosensitive chip cleaning solution.
Example 2:
the embodiment provides a photosensitive chip cleaning solution which comprises the following raw materials in parts by weight: 55 parts of DBE solvent, 7 parts of penetrating agent, 5 parts of surfactant and 18 parts of composite alcohol reagent. The DBE solvent specifically adopts a CAS number 95481-62-2 product, and comprises dimethyl succinate, dimethyl glutarate and dimethyl adipate, the penetrating agent adopts fatty alcohol-polyoxyethylene ether, the surfactant adopts fatty alcohol-polyoxyethylene ether ammonium sulfate (AESA), and the compound alcohol reagent adopts a mixture of diethylene glycol and isomeric alcohol in a mass ratio of 2:1.
The preparation process of the photosensitive chip cleaning solution comprises the following steps: firstly, mixing a penetrating agent, a surfactant and a composite alcohol reagent for chemical reaction, and controlling the reaction temperature to be 55 ℃ and the reaction time to be 30min; and adding the DBE solvent into a stirring tank, after the reaction is finished, adding the material obtained by the reaction into the stirring tank, mixing and stirring the material with the DBE solvent for 20min, and obtaining the photosensitive chip cleaning solution.
Through detection, the specific gravity of the cleaning solution for the photosensitive chip prepared by the embodiment is 0.94, and the appearance of the cleaning solution is light yellow; observing the stability of the cleaning solution in a standing state, wherein the cleaning solution does not have a layering phenomenon after standing; the cleaning effect is tested by adopting a soaking mode, and stubborn white spots on the photosensitive chip can be dissolved by the photosensitive chip cleaning solution.
Example 3:
the embodiment provides a photosensitive chip cleaning solution which comprises the following raw materials in parts by weight: 60 parts of DBE solvent, 8 parts of penetrating agent, 4 parts of surfactant and 20 parts of composite alcohol reagent. The DBE solvent is specifically a CAS number 95481-62-2 product and comprises dimethyl succinate, dimethyl glutarate and dimethyl adipate, the penetrating agent is fatty alcohol-polyoxyethylene ether, the surfactant is a mixture of fatty alcohol-polyoxyethylene ether sodium sulfate and nonylphenol polyoxyethylene ether in a mass ratio of 1:1, and the composite alcohol reagent is a mixture of diethylene glycol and isomeric alcohol in a mass ratio of 1.5.
The preparation process of the photosensitive chip cleaning solution comprises the following steps: firstly, mixing a penetrating agent, a surfactant and a composite alcohol reagent for chemical reaction, and controlling the reaction temperature to be 60 ℃ and the reaction time to be 30min; and adding the DBE solvent into a stirring tank, after the reaction is finished, adding the material obtained by the reaction into the stirring tank, mixing and stirring the material with the DBE solvent for 20min, and obtaining the photosensitive chip cleaning solution.
Through detection, the specific gravity of the cleaning solution for the photosensitive chip prepared by the embodiment is 0.95, and the appearance of the cleaning solution is light yellow; observing the stability of the cleaning solution in a standing state, wherein the cleaning solution does not have a layering phenomenon after standing; the cleaning effect is tested by adopting a soaking mode, and stubborn white spots on the photosensitive chip can be dissolved by the photosensitive chip cleaning solution.
Example 4:
in this embodiment, the influence of the reaction temperature during the reaction of the penetrant, the surfactant and the complex alcohol reagent on the product performance is examined, three groups A, B, C are designed for comparative experiments, and three groups A, B, C are all substantially the same as those in the above embodiment 2, except that: the chemical reaction temperature of the penetrant, the surfactant and the compound alcohol reagent in the group A is 55 ℃ (namely the above example 2); the chemical reaction temperature of the penetrating agent, the surfactant and the compound alcohol reagent in the group B is 70 ℃; the chemical reaction temperature of the penetrating agent, the surfactant and the compound alcohol reagent in the group C is 40 ℃. In this embodiment A, B, C, the preparation process of the cleaning solution for three groups of photosensitive chips is the same as that in embodiment 2.
Taking the same amount of the cleaning solution for the photosensitive chips prepared in the A, B, C groups, and simultaneously respectively placing the three same photosensitive chips with white spot pollution into A, B, C three groups of cleaning solutions for soaking for 15min. The test result shows that white point pollutants on the photosensitive chips of the cleaning treatment of the group A are completely dissolved, and partial residues of the white point pollutants on the photosensitive chips of the cleaning treatment of the group B and the cleaning treatment of the group C exist.
Through analysis, if the reaction temperature is too high (as in the above group B experiment), on one hand, the complex alcohol reagent is volatilized, and on the other hand, the cloud point of the surfactant can be exceeded, so that the surfactant is incompletely dissolved, the reaction is incomplete, the purity of the finally obtained product is influenced, and the cleaning effect of the product is greatly reduced; after many experimental analyses, the reaction temperature is not suitable to exceed 60 ℃.
Example 5:
in this embodiment, the influence of the choice of the alcohol reagent on the product performance in the reaction process of the penetrant, the surfactant and the complex alcohol reagent is examined, three groups A, B, C are designed for comparative experiments, and three groups A, B, C are all substantially the same as those in the above embodiment 2, except that: the alcohol reagent in the group A adopts a mixture of diethylene glycol and isomeric alcohol with the mass ratio of 2:1 (namely, the above example 2); the alcohol reagent in the group B adopts single diethylene glycol; the alcohol reagent in the group C adopts single isomeric alcohol. In this embodiment A, B, C, the preparation process of the cleaning solution for three groups of photosensitive chips is the same as that in embodiment 2.
Taking the same amount of photosensitive chip cleaning solution prepared by A, B, C three groups, and simultaneously respectively placing the three same photosensitive chips with white spot pollution in A, B, C three groups of photosensitive chip cleaning solution for soaking for 15min. The test results show that white spot pollutants on the photosensitive chips of the group A cleaning treatment are completely dissolved, and partial residues of the white spot pollutants on the photosensitive chips of the group B and the group C cleaning treatments exist.
The above examples are merely illustrative of the present invention and should not be construed as limiting the scope of the invention, which is intended to be covered by the claims and any design similar or equivalent to the scope of the invention.
Claims (10)
1. The photosensitive chip cleaning solution is characterized by comprising the following raw materials in parts by weight: 50-60 parts of DBE solvent, 5-8 parts of penetrating agent, 4-6 parts of surfactant and 15-20 parts of composite alcohol reagent.
2. The photosensitive chip cleaning solution according to claim 1, wherein the DBE solvent comprises dimethyl succinate, dimethyl glutarate, and dimethyl adipate.
3. The photosensitive chip cleaning solution according to claim 1, wherein the penetrant is a JFC series penetrant.
4. The cleaning solution for cleaning a photosensitive chip according to claim 1, wherein the surfactant is at least one of sodium alcohol ether sulfate, ammonium alcohol ether sulfate and nonylphenol polyoxyethylene ether.
5. The cleaning solution for photosensitive chips according to claim 1, wherein said complex alcohol reagent is a mixture of diethylene glycol and an isomeric alcohol, and the mass ratio of diethylene glycol to the isomeric alcohol is 1.5.
6. The method for preparing a cleaning solution for a photosensitive chip according to any one of claims 1 to 5, comprising the steps of:
1) Mixing a penetrating agent, a surfactant and a composite alcohol reagent for chemical reaction, and controlling the reaction temperature to be 50-60 ℃;
2) Adding the DBE solvent into a stirring tank, adding the material obtained by the reaction into the stirring tank after the reaction in the step 1) is finished, and mixing and stirring the material and the DBE solvent to obtain the photosensitive chip cleaning solution.
7. The method for preparing a cleaning solution for a photosensitive chip according to claim 6, wherein the reaction time of the penetrant, the surfactant and the complex alcohol reagent in the step 1) is 30min.
8. The method for preparing a cleaning solution for a photosensitive chip according to claim 6, wherein the mixing and stirring time in the step 2) is 20min.
9. The method for using the cleaning solution for the photosensitive chip according to any one of claims 1 to 5, wherein the raw solution of the cleaning solution for the photosensitive chip according to any one of claims 1 to 5 is used to soak or wipe the photosensitive chip, and after soaking or wiping, the photosensitive chip is rinsed with deionized water or absolute ethyl alcohol.
10. The use method of the cleaning solution for the photosensitive chip according to any one of claims 1 to 5, characterized in that the cleaning solution for the photosensitive chip according to any one of claims 1 to 5 is mixed with pure water according to a mass ratio of 1:1 to 1:8, and is used as an ultrasonic cleaning solution to carry out ultrasonic cleaning on the photosensitive chip, wherein the ultrasonic cleaning temperature is 25 to 50 ℃, and deionized water is used for rinsing after the ultrasonic cleaning is finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210674968.7A CN115287125A (en) | 2022-06-15 | 2022-06-15 | Photosensitive chip cleaning solution and preparation method and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210674968.7A CN115287125A (en) | 2022-06-15 | 2022-06-15 | Photosensitive chip cleaning solution and preparation method and application thereof |
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|---|---|
| CN115287125A true CN115287125A (en) | 2022-11-04 |
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| CN202210674968.7A Pending CN115287125A (en) | 2022-06-15 | 2022-06-15 | Photosensitive chip cleaning solution and preparation method and application thereof |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4934391A (en) * | 1988-02-08 | 1990-06-19 | 501 Petroleum Fermentations N.V. | Dibasic esters for cleaning electronic circuits |
| US5741368A (en) * | 1996-01-30 | 1998-04-21 | Silicon Valley Chemlabs | Dibasic ester stripping composition |
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Application publication date: 20221104 |