CN115279825A - 含有反应性稀释剂的无硅酮热界面材料 - Google Patents
含有反应性稀释剂的无硅酮热界面材料 Download PDFInfo
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
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Abstract
为了长期耐久性,提供一种用于沿散热路径放置的无硅酮热界面。所述热界面由多组分组合物形成并原位固化以获得具有低硬度计硬度的适形涂层,该适形涂层通过由反应性稀释剂体系形成的非交联稀释剂产物来维持。
Description
技术领域
本发明总体上涉及热界面材料,并且更具体地涉及无硅酮的双组分液体可分配体系,其可原位固化成在长的时间段内具有物理柔韧性的导热涂层。
背景技术
导热材料被广泛地用作例如发热电子部件和散热器之间的界面,以允许过量热能从电子部件传递到热耦合的散热器。已经实现了用于这种热界面的多种设计和材料,其中当基本上避免了热界面和相应的热传递表面之间的间隙以促进从电子部件到散热器的传导性热传递时,实现了最高性能。因此,热界面材料优选地在机械上顺应相应部件的稍微不均匀的传热表面。因此,高性能热界面材料的一个重要物理特性是柔韧性和相对低的硬度。
一些示例性适形热界面材料包括形成填充有导热颗粒例如氧化铝和氮化硼的基质的硅酮聚合物。无论在室温和/或升高的温度下,所述材料通常足够柔韧以顺应界面表面的不规则性。然而,硅酮基材料在某些应用中可能是不相容的,例如在硅酮基材料的放气可能是不容许的情况下。替代的非硅酮聚合物体系具有限制其用在热界面应用中的缺点。表现出可接受的硬度值的一些常规非硅酮体系还表现出相对高的预固化粘度,这对分配和组装提出了挑战。其它非硅酮体系可能具有用于分配和组装的合适的预固化粘度以及可接受的后固化硬度,但通常需要可能干扰聚合物交联反应的反应性稀释剂,或倾向于迁移出热界面材料的非反应性稀释剂,这导致热界面材料的硬度和脆性随时间增加。
稀释剂通常是用作稀释试剂的物质。出于本发明的目的,稀释剂是用作粘度和硬度调节剂,特别是用作粘度和硬度降低剂的材料。如上所述,可用于导热界面的许多非硅酮聚合物体系表现出过高的预固化粘度而不容易通过标准液体分配系统分配。在预固化的聚合物体系中包含一种或多种稀释剂可有助于将粘度降低至可以通过常规液体分配设备递送的点。在交联聚合物网络中存在稀释剂还可有利地降低固化硬度参数以获得所需柔韧性。
常规使用稀释剂来降低导热交联网络的粘度和硬度遭受了在交联之后稀释剂从网络中迁移出来。这种迁移可导致附近部件的问题,并且还引起界面材料的机械、电和热性能的变化。由于颗粒填料在聚合物基质中的高比例,这些问题在导热材料中被放大。
因此,本发明的一个目的是提供一种无硅酮热界面,其由相对低粘度的液体可分配组合物形成,并且固化至随时间相对稳定的硬度计硬度。所述组合物可优选包括双组分反应性稀释剂体系,所述稀释剂体系反应以增加分子量,但不与可交联聚合物体系明显反应。
本发明的另一个目的是提供一种由双组分反应物组合物形成的无硅酮热界面,该双组分反应物组合物可通过液体分配设备递送,并且可固化成硬度计硬度相对较低的主体,该主体的硬度计硬度在长时间段内基本不变。
本发明的另一个目的是提供一种双组分反应性稀释剂,其与无硅酮聚合物基质相容,并且与其自身反应以增加分子量而不参与聚合物固化。
发明内容
通过本发明,低硬度、高热导率的无硅酮热界面可以由表现出适于通过常规液体分配设备以液体涂料的形式分配的粘度的组合物形成。本发明的热界面优选在长时间段内表现出相对稳定的后固化硬度计硬度。相对低的硬度计硬度促进热界面与涂覆的基材良好的物理适形性。在一些实施方案中,涂覆的基材可包括来自电池系统的一个或多个电池。
所述组合物通常包括三种主要组分:非硅酮可交联聚合物、导热颗粒填料和反应性稀释剂。预固化材料表现出液体可分配粘度,并且可固化以形成具有高热导率的软固体。反应性稀释剂允许材料是可分配的并保持低粘度,不过是反应性的以增加分子量,从而限制其从固化材料中迁移出来。
在一个实施方案中,热界面由双组分组合物形成,所述双组分组合物包含具有反应性官能度为1或2的第一反应物的第一组分,其中该第一组分在20℃和1s-1剪切速率下表现出小于500,000cP的粘度。该组合物还包含具有第二反应物的第二组分,所述第二反应物:
(i)在第一反应物官能度为1或2的情况下,则具有1或2的反应性官能度;以及
(ii)只有在第一反应物官能度为1的情况下,则具有3或更大的反应性官能度。
该组合物的第二组分优选在1s-1剪切速率和20℃下表现出小于500,000cP的粘度。所述组合物还包含非硅酮可交联聚合物和导热填料。第一和第二反应物可彼此反应以形成在20℃和1s-1剪切速率下具有至少1,000,000cP的粘度的产物,并且其中热界面表现出至少1W/m*K的热导率。
在一些实施方案中,聚合物和导热填料中的每一种都包含在第一组分和第二组分中的一种或多种中。第一和第二组分的第一和第二反应物可选自以下反应性组:环氧树脂、胺、丙烯酸酯、硫醇、多元醇和异氰酸酯。该组合物可以固化到小于80Shore 00、更优选20-70Shore 00的硬度。
在表面上形成热界面的方法包括提供具有粘度小于100cP的第一反应性稀释剂的第一组分、具有粘度小于100cP的第二反应性稀释剂的第二组分,其中所述第一和第二稀释剂彼此反应以形成粘度大于1000厘泊的非交联产物。该方法进一步包括提供非硅酮可固化树脂和导热填料。第一和第二组分以及树脂和填料可通过至少一个孔口分配到表面上以使第一稀释剂与第二稀释剂反应。该方法进一步包括固化所述树脂,优选固化至小于80Shore00的硬度。热界面可优选表现出至少1.0W/m*K的热导率。树脂和导热填料中的每一种都可以包含在第一和第二组分中的一种或多种中。第一组分可以作为第一液体通过第一孔口分配,以及第二组分可以作为第二液体通过第二孔口分配。
该表面可以连接到电池或电池的一部分,使得电池系统包括电池和热耦合到电池的热界面。
附图说明
图1是用于在表面上形成热界面的系统的示意图。
图2是用于在表面上形成热界面的系统的示意图。
具体实施方式
现在将根据参考附图描述的详细实施方案来呈现以上列举的目的和优点以及由本发明表示的其他目的、特征和进步。本发明的其它实施方案和方面被认为在本领域普通技术人员的掌握之内。
本发明的导热界面可形成为用于沿散热路径放置的表面上或自支撑体上的涂层,通常用于从发热电子部件去除多余的热。热界面优选是不含硅酮的并且填充有导热颗粒以实现所需的热导率,通常至少约1W/m*K。热界面优选通过表现出小于约80Shore 00的硬度计硬度而可顺应表面粗糙度。
通常,导热界面是由具有第一反应物的第一组分、具有可与第一反应物反应的第二反应物的第二组分、非硅酮可交联聚合物和导热颗粒填料的组合物形成的可固化材料。所述第一反应物和第二反应物优选为稀释剂,它们本身具有相对低的粘度,并用于降低整个预固化组合物的粘度,使得组合物可通过液体分配设备可读取地分配。因此,第一和第二反应性稀释剂可以各自表现出小于500cP的粘度。在另一个实施方案中,第一和第二反应性稀释剂可各自表现出小于100cP的粘度。在一个示例性实施方案中,第一和第二反应性稀释剂各自表现出约20cP的粘度。本文所述的定量粘度值被认为是在室温(20℃)和1s-1的剪切速率下在平行板流变仪上获得的。
第一和第二稀释剂优选彼此反应以形成具有大于1000cP的粘度的非交联产物。在一些实施方案中,第一和第二稀释剂反应物可彼此反应以形成具有至少10,000cP的粘度的产物。通过彼此可反应,第一和第二反应性稀释剂可反应形成具有增加的分子量的稀释剂产物,该产物比常规稀释剂材料更不可能从热界面迁移出。结果,由第一和第二反应性稀释剂的反应形成的稀释剂产物可以在长的时间段内继续充当热界面的硬度调节剂。然而,这种分子量的增加仅在第一和第二反应性稀释剂之间反应时发生,所述第一和第二反应性稀释剂之间的反应可以在液体分配之后形成热界面的组合物的第一和第二组分混合时发生。
本发明的一个方面是反应性稀释剂不参与聚合物交联反应。此外,稀释剂反应本身不交联,由此稀释剂产物的分子量被限制到稀释剂产物对整个热界面保持硬度降低性能的程度。因此,第一和第二反应性稀释剂被选择为彼此反应,但不进行交联反应。因此第一和第二反应性稀释剂可以被选择为仅形成非交联产物。出于本文的目的,术语“非交联的”是指没有反应物分子与多于两个的其它反应物分子连接,除非其它反应物分子仅与单个反应物分子连接。示例性非交联稀释剂产物如下:
(1)y–x–y
(2)–(–x–y–x–y–x–)–
其中:
x=第一反应性稀释剂,
y=第二反应性稀释剂。
为了控制第一和第二反应性稀释剂的反应性,应考虑反应性稀释剂的“官能度”。术语官能度是指反应物中可聚合基团的数目,其影响聚合物的形成和交联度。单官能分子具有官能度(f)=1,双官能分子具有官能度(f)=2,三官能分子具有官能度(f)=3。在官能度(f=2)的情况下,可形成线性反应产物。具有官能度(f≥3)的反应物可产生支化点和交联产物。单官能反应物(f=1)导致链终止。以下是具有所述官能度的稀释剂反应物的示例性稀释剂反应产物:
x1–y1
x1–y2–x2–y2–x2–y1
其中:
x=第一反应性稀释剂,
y=第二反应性稀释剂,
x1为f=1,
x2为f=2,
x3为f=3。
在一些实施方案中,第一反应物具有1或2的反应性官能度,并且第二反应物:
(i)在第一反应物官能度为1或2的情况下,则具有1或2的反应性官能度;以及
(ii)只有在第一反应物官能度为1的情况下,则具有3或更大的反应性官能度。
在这种官能度限制下,第一和第二反应物是反应性的,以仅形成非交联产物。通过防止第一和第二反应物的交联,稀释剂反应产物尽管具有较大分子量,但能够软化热界面材料。
第一和第二反应性稀释剂可以以适于适当调节粘度以获得预固化可分配性和后固化柔软性的量加入到组合物中。在一些实施方案中,反应性稀释剂可占组合物的约5-50重量%。代表第一和第二反应性稀释剂的示例性反应性稀释剂体系包括环氧树脂/胺、胺/丙烯酸酯、丙烯酸酯/丙烯酸酯加催化剂、硫醇/丙烯酸酯、多元醇/异氰酸酯,和胺/异氰酸酯。预期本领域普通技术人员可从环氧树脂、胺、丙烯酸酯、硫醇、多元醇和异氰酸酯中的一种或多种选择合适稀释剂的反应性组。
用于形成本发明的热界面的组合物优选包括非硅酮可固化树脂,所述非硅酮可固化树脂形成热界面的本体基质。在一些实施方案中,该组合物可包含非硅酮可交联聚合物。在优选的实施方案中,热界面是不含硅酮的,其中在热界面中不包含超过痕量的硅酮。预期各种各样的非硅酮可交联聚合物可用于本发明的组合物中以实现期望的物理特性。示例性交联聚合物体系包括甲硅烷基改性的聚合物(SMP)、环氧树脂/胺,环氧树脂/酸酐、丙烯酸酯和聚氨酯。优选地,交联聚合物是在不与稀释剂反应的情况下形成交联网络的任何非硅酮聚合物。申请人已经发现,SMP材料,例如在美国专利号3,632,557和美国专利申请公开号2004/0127631中描述的那些(其内容整体引入本文)可以特别用于制备本发明的导热界面。应理解,可针对特定性质选择交联聚合物和反应性稀释剂体系的各种组合。交联聚合物和反应性稀释剂的组合实例列于下表1中:
表1
可交联聚合物 | 反应性稀释剂体系 |
甲硅烷基改性的聚合物(SMP) | 环氧树脂/胺 |
甲硅烷基改性的聚合物(SMP) | 胺/丙烯酸酯 |
甲硅烷基改性的聚合物(SMP) | 丙烯酸酯 |
甲硅烷基改性的聚合物(SMP) | 硫醇/丙烯酸酯 |
环氧树脂/酸酐 | 丙烯酸酯 |
环氧树脂/酸酐 | 多元醇/异氰酸酯 |
使用环氧树脂/胺、丙烯酸酯、聚氨酯或硫醇/烯聚合物交联体系的体系可以潜在地与上表1中所列的一些稀释剂共反应,但分子与适当催化剂和/或抑制剂的特定组合是可能的。
为了提高导热界面的热导率,本发明的组合物可包含分散于其中的导热颗粒。所述颗粒可以是既导热又导电的。或者,颗粒可以是导热和电绝缘的。示例性导热颗粒包括氧化铝、氧化硅、三水合铝、氧化锌、石墨、氧化镁、氮化铝、氮化硼、金属颗粒,以及它们的组合。导热颗粒可以具有各种形状和尺寸,并且预期可以采用粒度分布以适合任何特定应用的参数。在一些实施方案中,导热颗粒可具有约0.1-100微米的平均粒度,并且可以以约20-95重量%的浓度存在于导热材料中。
导热颗粒可以以约20-95重量%的负载浓度分散在第一和第二组分中的至少一种中。期望提供足够的导热颗粒,使得由组分混合物形成的导热界面表现出至少1W/m*K的热导率。在一些实施方案中,可交联聚合物和导热填料中的每一种可包含在第一组分和第二组分中的一种或多种中。
用于形成本发明的热界面的组合物优选选择为可固化至小于80Shore00的硬度、更优选至20-70Shore 00的硬度。固化热界面的这种硬度计硬度由所选择的反应性稀释剂、非硅酮可交联聚合物和导热填料的组合以及每种组分的反应性浓度驱动。
在本发明的组合物中可以包括各种另外的组分以实现所需的反应速率和反应物的物理性质以及最终的热界面。示例性添加剂包括交联催化剂、非反应性稀释剂、溶剂、抗氧化剂、表面活性剂、反应促进剂、反应抑制剂、稳定剂、填料及其组合。
图1和图2示意性地示出了用于在表面上形成本发明的热界面的系统和方法。系统10、110包括具有第一反应性稀释剂的第一组分的供应12、112,和具有与第一反应性稀释剂反应的第二反应性稀释剂的第二组分的供应14、114。在所示的实施方案中,在第一和第二组分供应12、112和14、114中的一个或多个中提供非硅酮可固化树脂和导热填料。第一和第二组分通过至少一个孔口分配到表面22、122上,以使第一反应性稀释剂与第二反应性稀释剂反应。在图1所示的系统10中,第一和第二组分通过共用孔口16分配。在图2所示的系统110中,第一和第二组分通过分开的孔口116A、116B分配。表面22可以是电池20的表面或热耦合到电池20。在将第一和第二组分分配到表面22、122上之后,可以通过固化装置30、130固化涂层。示例性固化装置可包括加热炉、紫外(UV)辐射灯、光引发剂等。在一些实施方案中,可固化树脂可以在超过25℃的温度下固化。图1和2的示意图示出了用于将涂覆的电池20、120移动到暴露于固化装置30、130的固化站中的输送机40、140。在优选实施方案中,第一和第二组分可以以液体形式通过至少一个孔口16、116分配。
实施例
第一实施例热界面由以下双组分组合物形成:
第一组分表现出100,000cP的粘度,第二组分表现出200,000cP的粘度,所述粘度是在平行板流变仪上以1s-1的剪切速率测量的。
在混合第一和第二组分后,在25℃下24小时后产生硬度计硬度为50Shore 00且热导率为3.0W/m*K的固化固体。
制备具有以下组成的第二实施例热界面:
在混合第一和第二组分时,获得硬度为55Shore 00的固化固体。
这里已经相当详细地描述了本发明,以便符合专利法,并且向本领域技术人员提供应用新颖原理以及根据需要构造和使用本发明的实施方案所需的信息。然而,应当理解,在不脱离本发明本身的范围的情况下,可以实现各种修改。
Claims (19)
1.一种由双组分组合物形成的热界面,所述双组分组合物包含:
具有反应性官能度为1或2的第一反应物的第一组分,所述第一组分在1s-1和20℃下表现出小于500,000cP的粘度;
具有第二反应物的第二组分,其中:
(i)在所述第一反应物官能度为1或2的情况下,所述第二反应物具有1或2的反应性官能度;以及
(ii)只有在所述第一反应物官能度为1的情况下,所述第二反应物具有3或更大的反应性官能度,
其中所述第二组分在1s-1和20℃下表现出小于500,000cP的粘度;
非硅酮可交联聚合物;和
导热填料;
其中所述第一和第二反应物可彼此反应以形成在1s-1和20℃下具有至少1,000,000cP的粘度的产物,并且其中所述热界面表现出至少1W/m*K的热导率。
2.如权利要求1所述的热界面,其中所述聚合物和所述导热填料中的每一种都包含在所述第一组分和第二组分中的一种或多种中。
3.如权利要求2所述的热界面,其中所述组合物可固化至小于80Shore00的硬度。
4.如权利要求3所述的热界面,其中所述组合物可固化至20-70Shore00的硬度。
5.如权利要求4所述的热界面,其中所述第一和第二反应物都不与所述聚合物反应。
6.如权利要求1所述的热界面,其中所述聚合物在超过25℃的温度下固化。
7.如权利要求1所述的热界面,其中所述聚合物包括甲硅烷基改性的聚合物。
8.如权利要求1所述的热界面,其中所述导热填料选自氧化铝、氮化铝、氧化硅、氧化锌和氮化硼。
9.如权利要求1所述的热界面,其中所述第一反应物和第二反应物选自以下反应性组:环氧树脂、胺、丙烯酸酯、硫醇、多元醇和异氰酸酯。
10.如权利要求1所述的热界面,其不含硅酮。
11.一种电池系统,其包括:
电池;和
热耦合到所述电池的如权利要求1所述的热界面。
12.如权利要求11所述的电池系统,其中所述热界面涂覆在所述电池上。
13.一种在表面上形成热界面的方法,所述方法包括:
(a)提供:
(i)具有粘度小于100cP的第一反应性稀释剂的第一组分;
(ii)具有粘度小于100cP的第二反应性稀释剂的第二组分,所述第一和第二稀释剂彼此反应以形成粘度大于1000cP的非交联产物;
(iii)非硅酮可固化树脂;和
(iv)导热填料;
(b)将所述第一组分和第二组分以及所述树脂和所述填料通过至少一个孔口分配到所述表面上以使所述第一稀释剂与所述第二稀释剂反应;和
(c)固化所述树脂。
14.如权利要求13所述的方法,其中所述热界面表现出至少1.0W/m*K的热导率。
15.如权利要求13所述的方法,其中所述树脂和所述导热填料中的每一种均包含在所述第一组分和第二组分中的一种或多种中。
16.如权利要求15所述的方法,其包括通过第一孔口分配所述第一组分作为第一液体,以及通过第二液体孔口分配所述第二组分作为第二液体。
17.如权利要求16所述的方法,其中所述表面连接到电池或为电池的一部分。
18.如权利要求13所述的方法,其中所述热界面表现出小于80Shore 00的硬度。
19.如权利要求13所述的方法,其包括在超过25℃的温度下固化所述树脂。
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PCT/US2020/065507 WO2021127113A1 (en) | 2019-12-19 | 2020-12-17 | Silicone free thermal interface material with reactive diluent |
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Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4128600A (en) * | 1977-01-14 | 1978-12-05 | General Mills Chemicals, Inc. | Interpenetrating dual cure resin compositions |
US4247578A (en) * | 1977-01-14 | 1981-01-27 | Henkel Corporation | Interpenetrating dual cure resin compositions |
US6060539A (en) * | 1995-07-19 | 2000-05-09 | Raytheon Company | Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives |
EP1167451A1 (en) * | 1999-02-05 | 2002-01-02 | Kaneka Corporation | Curable resin composition |
US20040000712A1 (en) * | 2002-06-28 | 2004-01-01 | Lord Corporation | Interface adhesive |
CN1637092A (zh) * | 2003-12-01 | 2005-07-13 | 拜尔材料科学股份公司 | 具有反应性稀释剂的固态辐射固化基料 |
CN101121878A (zh) * | 2006-08-10 | 2008-02-13 | 国家淀粉及化学投资控股公司 | 导热材料 |
US20080039560A1 (en) * | 2006-08-11 | 2008-02-14 | General Electric Company | Syneretic composition, associated method and article |
CN101351755A (zh) * | 2006-03-28 | 2009-01-21 | 派克汉尼芬公司 | 可分配固化树脂 |
WO2009014684A2 (en) * | 2007-07-23 | 2009-01-29 | The University Of Akron | Synthesis of modified tung oil as a reactive diluent |
JP2009543928A (ja) * | 2006-07-19 | 2009-12-10 | エクソンモービル・ケミカル・パテンツ・インク | 高粘度流体の生成プロセス |
CN101815772A (zh) * | 2007-09-14 | 2010-08-25 | 汉高股份两合公司 | 导热组合物 |
US20110141698A1 (en) * | 2009-12-15 | 2011-06-16 | Industrial Technology Research Institute | Heat spreading structure |
US20130042972A1 (en) * | 2011-08-16 | 2013-02-21 | John Timmerman | Dual Cure Thermally Conductive Adhesive |
US20160168411A1 (en) * | 2014-12-15 | 2016-06-16 | Ppg Industries Ohio, Inc. | Coating compositions, coatings and methods for sound and vibration damping and water resistance |
CN106067452A (zh) * | 2015-04-24 | 2016-11-02 | 天津莱尔德电子材料有限公司 | 在热源与散热结构之间建立热连接的热界面材料及方法 |
CN109912412A (zh) * | 2019-03-06 | 2019-06-21 | 西安交通大学 | 一种非挥发増溶稀释剂及其制备方法和应用 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8119191B2 (en) * | 2003-01-16 | 2012-02-21 | Parker-Hannifin Corporation | Dispensable cured resin |
KR102118366B1 (ko) * | 2017-08-22 | 2020-06-04 | 주식회사 엘지화학 | 방열 소재 디스펜싱 장치의 결정방법 |
US11185832B2 (en) * | 2017-08-22 | 2021-11-30 | Lg Chem, Ltd. | Method for mixing heat-dissipating material |
US11041103B2 (en) * | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
-
2020
- 2020-12-17 JP JP2022537402A patent/JP2023508288A/ja active Pending
- 2020-12-17 KR KR1020227020645A patent/KR20220119031A/ko unknown
- 2020-12-17 CN CN202080088149.3A patent/CN115279825A/zh active Pending
- 2020-12-17 EP EP20902431.4A patent/EP4077516A4/en active Pending
- 2020-12-17 WO PCT/US2020/065507 patent/WO2021127113A1/en unknown
- 2020-12-21 TW TW109145313A patent/TW202132531A/zh unknown
-
2022
- 2022-06-20 US US17/844,232 patent/US20220328902A1/en active Pending
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4247578A (en) * | 1977-01-14 | 1981-01-27 | Henkel Corporation | Interpenetrating dual cure resin compositions |
US4128600A (en) * | 1977-01-14 | 1978-12-05 | General Mills Chemicals, Inc. | Interpenetrating dual cure resin compositions |
US6060539A (en) * | 1995-07-19 | 2000-05-09 | Raytheon Company | Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives |
EP1167451A1 (en) * | 1999-02-05 | 2002-01-02 | Kaneka Corporation | Curable resin composition |
US6737482B1 (en) * | 1999-02-05 | 2004-05-18 | Kaneka Corporation | Curable resin composition |
US20040000712A1 (en) * | 2002-06-28 | 2004-01-01 | Lord Corporation | Interface adhesive |
CN1637092A (zh) * | 2003-12-01 | 2005-07-13 | 拜尔材料科学股份公司 | 具有反应性稀释剂的固态辐射固化基料 |
CN101351755A (zh) * | 2006-03-28 | 2009-01-21 | 派克汉尼芬公司 | 可分配固化树脂 |
JP2009543928A (ja) * | 2006-07-19 | 2009-12-10 | エクソンモービル・ケミカル・パテンツ・インク | 高粘度流体の生成プロセス |
CN101121878A (zh) * | 2006-08-10 | 2008-02-13 | 国家淀粉及化学投资控股公司 | 导热材料 |
US20080039560A1 (en) * | 2006-08-11 | 2008-02-14 | General Electric Company | Syneretic composition, associated method and article |
WO2009014684A2 (en) * | 2007-07-23 | 2009-01-29 | The University Of Akron | Synthesis of modified tung oil as a reactive diluent |
CN101815772A (zh) * | 2007-09-14 | 2010-08-25 | 汉高股份两合公司 | 导热组合物 |
US20110141698A1 (en) * | 2009-12-15 | 2011-06-16 | Industrial Technology Research Institute | Heat spreading structure |
US20130042972A1 (en) * | 2011-08-16 | 2013-02-21 | John Timmerman | Dual Cure Thermally Conductive Adhesive |
US20160168411A1 (en) * | 2014-12-15 | 2016-06-16 | Ppg Industries Ohio, Inc. | Coating compositions, coatings and methods for sound and vibration damping and water resistance |
CN106067452A (zh) * | 2015-04-24 | 2016-11-02 | 天津莱尔德电子材料有限公司 | 在热源与散热结构之间建立热连接的热界面材料及方法 |
CN109912412A (zh) * | 2019-03-06 | 2019-06-21 | 西安交通大学 | 一种非挥发増溶稀释剂及其制备方法和应用 |
Non-Patent Citations (3)
Title |
---|
MUSTAFA ÇAKIR,等: "Investigation of Coating Performance of UV-Curable Hybrid Polymers Containing 1H, 1H, 2H, 2H-Perfluorooctyltriethoxysilane Coated on Aluminum Substrates", 《COATINGS》, vol. 7, no. 3, 2 March 2017 (2017-03-02), pages 37 - 48 * |
徐靖,等: "导热环氧灌封胶的研制", 《粘接》, vol. 31, no. 5, 6 August 2010 (2010-08-06), pages 48 - 50 * |
李钒: "低粘度导热环氧胶粘剂的研究", 《天津职业院校联合学报》, vol. 16, no. 12, 31 December 2014 (2014-12-31), pages 94 - 97 * |
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JP2023508288A (ja) | 2023-03-02 |
WO2021127113A1 (en) | 2021-06-24 |
TW202132531A (zh) | 2021-09-01 |
EP4077516A1 (en) | 2022-10-26 |
KR20220119031A (ko) | 2022-08-26 |
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