CN115267503B

CN115267503B - Automatic chip testing equipment

Info

Publication number: CN115267503B
Application number: CN202210915883.3A
Authority: CN
Inventors: 李伟; 黄忠志
Original assignee: Leishen Technology Shenzhen Co ltd
Current assignee: Leishen Technology Shenzhen Co ltd
Priority date: 2022-08-01
Filing date: 2022-08-01
Publication date: 2023-06-27
Anticipated expiration: 2042-08-01
Also published as: CN115267503A

Abstract

The application relates to automatic chip testing equipment, wherein a hopper stores a to-be-processed clamp preloaded with a to-be-tested chip and stores a to-be-recovered clamp subjected to chip testing; lifting the clamp to be treated in the hopper by the lifting table and lowering the clamp to be recovered into the hopper; the rotary feeding assembly conveys the clamp to be treated on the lifting table to the TEC temperature control table in a rotary mode, and conveys the clamp to be recovered on the TEC temperature control table to the lifting table; the TEC temperature control station detects the working performance of the chip to be tested in a high-temperature environment; the material carrying platform drives the TEC temperature control platform to move between the feeding position and the testing position. Through with the chip pre-loading on the anchor clamps, the three-dimensional space of elevating platform cooperation rotation material loading subassembly and year material platform removes the design, is favorable to realizing anchor clamps from the hopper to the automatic flow that the test was got back to the hopper again, need not manual operation under the normal operating condition, can realize the chip detection fully automatically, can be compatible various different grade chips, has greatly practiced thrift the manpower resources.

Description

Automatic chip testing equipment

Technical Field

The application relates to the field of chip testing in automated production, in particular to automatic chip testing equipment.

Background

For testing of laser chips, especially for full-automatic testing in high temperature heating environments, conventional equipment cannot be completed and requires manual loading and adjustment.

Other chips that require testing under high temperature heating conditions, such as burn-in testing, such as Chip On Chip (COC), have similar problems.

And the human resources are gradually lacking at present, and the robot is imperative.

Disclosure of Invention

Based on this, it is necessary to provide an automatic chip test equipment.

The automatic chip testing equipment comprises a platen assembly, a lifting table, a hopper, a TEC temperature control table, a rotary feeding assembly, a material carrying table, a testing table, a probe table and a cabinet;

the bedplate assembly is fixed on the cabinet, and the lifting platform, the hopper, the rotary feeding assembly, the carrying platform, the test platform and the probe platform are all fixed on the bedplate assembly;

the hopper is arranged adjacent to the lifting table and is used for storing a clamp to be processed for preloaded chips to be tested and a clamp to be recovered for storing the chips after testing;

the lifting platform is used for lifting the clamp to be treated in the hopper and descending the clamp to be recovered into the hopper;

The rotary feeding assembly is used for conveying the clamp to be processed on the lifting table to the TEC temperature control table in a rotary mode and conveying the clamp to be recovered on the TEC temperature control table to the lifting table;

the TEC temperature control table is fixed on the material carrying table and is used for detecting the working performance of the chip to be tested on the clamp to be processed in a high-temperature environment;

the material carrying platform is used for driving the TEC temperature control platform to move between a feeding position and a testing position;

the probe station is used for electrically connecting the chip to be tested on the clamp to be processed of the TEC temperature control station in a contact manner;

the test bench is used for acquiring the detection information of the chip to be tested in the working performance detection.

According to the automatic chip testing equipment, the chips are preloaded on the clamp, the lifting table is matched with the three-dimensional space movement design of the rotary feeding assembly and the loading table, so that the automatic flow of the clamp from the hopper to the test and back to the hopper is realized, manual operation is not needed in a normal running state, the chip detection can be realized fully automatically, and the automatic chip testing equipment can be compatible with various types of chips, particularly optical chips, so that manpower resources are greatly saved, and the technical update of robot replacement is facilitated; most of the functional components are fixed on the bedplate assembly, so that the multifunctional table has the advantages of modularized design, compact volume and relatively small occupied space.

Further, in one of the embodiments, the lift table lifts the jig to be processed in the hopper and lowers the jig to be recovered into the hopper in a stepwise manner.

In one embodiment, the bedplate assembly is provided with a bedplate bottom plate, a first Y-axis portal frame, a first Y-axis cable drag chain and a probe station mounting seat, and a bottom plate window is formed in the bedplate bottom plate;

the first Y motion axis portal frame, the probe station mounting seat, the material carrying table and the test table are all fixed on the bedplate bottom plate;

the first Y motion axis cable drag chain and the rotary feeding assembly are respectively fixed on the first Y motion axis portal frame, and the first Y motion axis cable drag chain is used for installing and protecting cables of the first Y motion axis portal frame and the rotary feeding assembly;

the lifting platform penetrates through the bottom plate window and is fixed on the bedplate bottom plate, and the hopper is arranged on the lifting platform;

the probe station is fixed on the probe station mounting seat.

Further, in one embodiment, a lift table mount of the lift table is fixed to the platen base plate, and a lift drive screw of the lift table passes through the base plate window.

Further, in one embodiment, the lifting platform is provided with a lifting motor, a lifting guide shaft, a lifting driving screw, a lifting platform mounting seat, a lifting platform mounting bracket and a lifting platform jacking seat;

the lifting motor, the lifting guide shaft and the lifting platform mounting seat are all fixed on the lifting platform mounting bracket, and the lifting platform mounting seat is also fixed on the bedplate assembly;

the lifting table jacking seat is fixed on the lifting driving screw rod, and the lifting motor drives the lifting driving screw rod to lift under the guidance of the lifting guide shaft, so that the lifting table jacking seat is driven to lift the clamp to be treated in the hopper and descend the clamp to be recovered into the hopper.

In one embodiment, the hopper is provided with a handle, a bin, a product clamp detection sensor, a bin clamp and a bin bracket;

the bin clamping device is connected with the bin, the bin is fixed on the bin bracket, the bin bracket is fixed on the bedplate assembly or the bedplate bottom plate thereof, and the bin is used for storing a clamp to be processed preloaded with a chip to be tested and a clamp to be recovered after the chip test is completed;

The handle and the product clamp detection sensor are respectively fixed on the bin, and the product clamp detection sensor is used for sensing whether the clamp to be treated to be lifted at the lifting platform and the clamp to be recovered to be lowered are in place.

In one embodiment, the TEC temperature control table is provided with a Wen Tai base, a clamp sensor, a water cooling plate, a TEC temperature control element, a product clamp bearing table and a positioning pin;

the temperature control table base is fixed on the material carrying table, and the clamp sensor, the water cooling plate, the TEC temperature control element and the product clamp carrying table are all arranged on the temperature control table base;

the product clamp bearing table is used for bearing the clamp to be processed, so that the chip to be tested on the clamp to be processed is positioned between the water cooling plate and the TEC temperature control element or the TEC temperature control element is positioned between the water cooling plate and the chip to be tested, and the clamp to be processed is positioned through the positioning pin;

the clamp sensor is used for sensing whether the clamp to be processed is placed correctly.

In one embodiment, the rotary feeding assembly is provided with a first Y motion shaft, a clamping mechanism, a rotary mechanism, an up-and-down motion mechanism, a drag chain groove bracket and a sliding table;

The first Y movement axis is fixed on a first Y movement axis portal frame of the platen assembly, and the sliding table is arranged on the first Y movement axis in a sliding manner;

the drag chain groove support is arranged on the sliding table and is used for being matched with a first Y motion axis cable drag chain of the platen assembly to install and protect a cable of the rotary feeding assembly;

the clamping mechanism is arranged on the rotating mechanism and used for clamping the clamp to be processed on the lifting platform and the clamp to be recovered on the TEC temperature control platform;

the rotating mechanism is arranged on the up-down motion mechanism and is used for realizing 180-degree reciprocating rotation or 360-degree circulating rotation of the clamping mechanism in a rotating manner;

the vertical movement mechanism is arranged on the sliding table and is used for driving the rotating mechanism to move in a vertical movement mode, so that the clamp mechanism is used for conveying the clamp to be treated on the lifting table to the TEC temperature control table and conveying the clamp to be recovered on the TEC temperature control table to the lifting table.

In one embodiment, the material carrying platform comprises a second Y motion axis, a first X motion axis, a lifting motion axis, a selective loading and pressing cylinder, a product clamp detection sensor and a temperature control mounting platform;

The second Y motion shaft is fixed on the platen assembly, the first X motion shaft is fixed on the second Y motion shaft, the lifting motion shaft is fixed on the first X motion shaft, the optional pressing cylinder and the temperature control mounting platform are fixed on the lifting motion shaft, and the second Y motion shaft, the first X motion shaft and the lifting motion shaft are matched together to drive the optional pressing cylinder and the temperature control mounting platform to move in a three-dimensional mode;

the selective installation pressing cylinder is used for clamping and fixing the clamp to be processed, the TEC temperature control table and the product clamp detection sensor are fixed on the temperature control installation platform, and the product clamp detection sensor is used for sensing whether the clamp to be processed is fixed in place.

In one embodiment, the test bench is provided with a test bench mounting base, a second X motion axis, a front-back adjustment micro sliding table, an up-down adjustment micro sliding table and a test sensor mounting bracket;

the test bench installation base is fixed on the platen assembly, the second X motion axis is fixed on the test bench installation base, the front-back adjustment micro-motion sliding table is fixed on the second X motion axis, the up-down adjustment micro-motion sliding table is fixed on the front-back adjustment micro-motion sliding table, and the test inductor installation support is fixed on the up-down adjustment micro-motion sliding table for installing a test inductor.

In one embodiment, the probe station is provided with a probe station base, a microscope assembly and a microscope adjusting sliding table;

the probe station base is fixed on the platen assembly, the probe station base, the microscope assembly and the microscope adjusting sliding table are all arranged on the probe station base, a probe with an adjustable position is arranged on the probe station base, and the microscope adjusting sliding table is used for adjusting the position of the microscope assembly.

In one embodiment, the cabinet is provided with a welding steel frame, a shock pad, an adjustable foot pad and a universal wheel, and a plate body is arranged outside the welding steel frame;

the bedplate assembly is fixed on the welding steel frame, and the shock pad is arranged between the bedplate assembly and the welding steel frame;

the adjustable foot pads and the universal wheels are arranged below the welding steel frame.

In one embodiment, the number of the lifting tables is two, one of the lifting tables drives the clamp to be treated to be in a lifting state, and the other lifting table drives the clamp to be recovered to be in a descending state; and/or the number of the groups of groups,

the number of the material carrying tables is two, one of the material carrying tables is in a detection state, and the other material carrying table is used for loading the clamp to be processed for detection; and/or the number of the groups of groups,

The chip comprises a laser chip and a chip built-in chip; and/or the number of the groups of groups,

the automatic chip testing equipment further comprises a hood, wherein the hood is arranged on the cabinet to form an installation space, and the bedplate assembly, the lifting platform, the hopper, the TEC temperature control platform, the rotary feeding assembly, the material carrying platform, the test platform and the probe platform are all arranged in the installation space.

Further, in one embodiment, the housing is provided with a door, a machine control button area, a machine control and monitoring platform, and a device operation status indicator, wherein the door is used for closing the installation space, and the machine control button area, the machine control and monitoring platform, and the device operation status indicator are respectively connected with a circuit.

Drawings

In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings that are required to be used in the description of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a schematic structural diagram of an embodiment of an automatic chip testing apparatus according to the present application.

Fig. 2 is an enlarged schematic view at a of the embodiment shown in fig. 1.

FIG. 3 is a schematic view of the platen assembly of the embodiment of FIG. 1.

Fig. 4 is a schematic view of the structure of the lifting platform in the embodiment shown in fig. 1.

Fig. 5 is a schematic view of the hopper construction of the embodiment shown in fig. 1.

Fig. 6 is a schematic diagram of a TEC temperature control stand according to the embodiment shown in fig. 1.

Fig. 7 is an exploded view of the embodiment of fig. 6.

Fig. 8 is a schematic structural diagram of a rotary feeding assembly according to the embodiment shown in fig. 1.

Fig. 9 is a schematic view of the loading table of the embodiment shown in fig. 1.

FIG. 10 is a schematic diagram of the test bench according to the embodiment shown in FIG. 1.

FIG. 11 is a schematic view of the structure of the probe station of the embodiment shown in FIG. 1.

Fig. 12 is a schematic diagram of the cabinet structure of the embodiment shown in fig. 1.

Fig. 13 is a schematic view of the hood structure of the embodiment shown in fig. 1.

Reference numerals:

platen assembly 100, elevating platform 200, hopper 300, TEC temperature control platform 400, rotary loading assembly 500, loading platform 600, test platform 700, probe platform 800, cabinet 900, hood 940, and installation space 950;

a platen base 110, a first Y-axis gantry 120, a first Y-axis cable drag chain 130, a probe station mount 140, and a base window 150;

A lifting motor 210, a lifting guide shaft 220, a lifting driving screw 230, a lifting platform mounting seat 240, a lifting platform mounting bracket 250 and a lifting platform lifting seat 260;

handle 310, bin 320, product clamp detection sensor 330, bin clamp 340, bin bracket 350;

a temperature control table base 410, a clamp sensor 420, a water cooling plate 430, TEC temperature control elements 440, a product clamp bearing table 450, and positioning pins 460;

a first Y motion shaft 510, a clamping mechanism 520, a rotating mechanism 530, an up-and-down motion mechanism 540, a drag chain groove bracket 550 and a sliding table 560;

a second Y movement axis 610, a first X movement axis 620, a lifting movement axis 630, an optional hold-down cylinder 640, a product clamp detection sensor 650, a temperature control mounting platform 660;

a test bench mounting base 710, a second X-axis of motion 720, a front-to-back adjustment micro-motion slide table 730, an up-to-down adjustment micro-motion slide table 740, and a test sensor mounting bracket 750;

probe station base 810, probe station 820, microscope assembly 830, microscope adjustment slide 840;

welding a steel frame 910, a shock pad 920, an adjustable foot pad and universal wheels 930, and a plate body 911;

a door 941, a machine operator button area 942, a machine control and monitoring platform 943, and a device operating status indicator 944.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used in the description of the present application for purposes of illustration only and do not represent the only embodiment.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be a direct contact of the first feature with the second feature, or an indirect contact of the first feature with the second feature via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.

Unless defined otherwise, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. The term "and/or" as used in the specification of this application includes any and all combinations of one or more of the associated listed items.

The application discloses automatic chip testing equipment, which comprises a part of structures or all structures of the following embodiments; that is, the chip automatic test equipment includes some or all of the following technical features. In one embodiment of the application, an automatic chip testing device comprises a platen assembly, a lifting platform, a hopper, a TECThermal Electronic Cooler, a semiconductor refrigerator temperature control platform, a rotary feeding assembly, a loading platform, a testing platform, a probe platform and a cabinet; the bedplate assembly is fixed on the cabinet, and the lifting platform, the hopper, the rotary feeding assembly, the carrying platform, the test platform and the probe platform are all fixed on the bedplate assembly; the hopper is arranged adjacent to the lifting table and is used for storing a clamp to be processed for preloaded chips to be tested and a clamp to be recovered for storing the chips after testing; the lifting platform is used for lifting the clamp to be treated in the hopper and descending the clamp to be recovered into the hopper; the rotary feeding assembly is used for conveying the clamp to be processed on the lifting table to the TEC temperature control table in a rotary mode and conveying the clamp to be recovered on the TEC temperature control table to the lifting table; the TEC temperature control table is fixed on the material carrying table and is used for detecting the working performance of the chip to be tested on the clamp to be processed in a high-temperature environment; the material carrying platform is used for driving the TEC temperature control platform to move between a feeding position and a testing position; the probe station is used for electrically connecting the chip to be tested on the clamp to be processed of the TEC temperature control station in a contact manner; the test bench is used for acquiring the detection information of the chip to be tested in the working performance detection. According to the automatic chip testing equipment, the chips are preloaded on the clamp, the lifting table is matched with the three-dimensional space movement design of the rotary feeding assembly and the loading table, so that the automatic flow of the clamp from the hopper to the test and back to the hopper is realized, manual operation is not needed in a normal running state, the chip detection can be realized fully automatically, and the automatic chip testing equipment can be compatible with various types of chips, particularly optical chips, so that manpower resources are greatly saved, and the technical update of robot replacement is facilitated; most of the functional components are fixed on the bedplate assembly, so that the multifunctional table has the advantages of modularized design, compact volume and relatively small occupied space.

In one embodiment, an automatic chip test apparatus is shown in fig. 1 and 2, and comprises a platen assembly 100, a lifting platform 200, a hopper 300, a TEC temperature control platform 400, a rotary loading assembly 500, a loading platform 600, a test platform 700, a probe platform 800 and a cabinet 900; the platen assembly 100 is fixed on the cabinet 900, and the lifting table 200, the hopper 300, the rotary feeding assembly 500, the loading table 600, the test table 700 and the probe table 800 are all fixed on the platen assembly 100; the hopper 300 is disposed adjacent to the lifting table 200, and is used for storing a to-be-processed clamp preloaded with a to-be-tested chip and storing a to-be-recovered clamp after the chip test is completed, where the to-be-processed clamp and the to-be-recovered clamp may be collectively referred to as a clamp, and the to-be-processed clamp is the to-be-processed clamp before the test, and the to-be-recovered clamp is the after the test is completed. The chip to be tested, that is, the chip to be tested, is fixed on the fixture, which may be understood as the fixture in which the chip to be tested is fixed. In one embodiment, the chip includes an optical chip, such as a laser chip, a chip-on-chip, and the like.

The lifting platform 200 is used for lifting the clamp to be processed in the hopper 300 and lowering the clamp to be recovered into the hopper 300; the rotary feeding assembly 500 is configured to rotationally convey the to-be-processed clamp on the lifting platform 200 to the TEC temperature control platform 400 and convey the to-be-recovered clamp on the TEC temperature control platform 400 to the lifting platform 200; the TEC temperature control stand 400 is fixed on the material loading stand 600 and is used for detecting the working performance of the chip to be tested on the clamp to be processed in a high-temperature environment; the loading platform 600 is used for driving the TEC temperature control platform 400 to move between a loading position and a testing position; the probe station 800 is configured to electrically connect the chip to be tested on the fixture to be processed of the TEC temperature control station 400 in a contact manner; the test bench 700 is used for obtaining the detection information of the chip to be tested in the working performance detection. The cooperation of elevating platform, rotatory material loading subassembly and year material platform is the key place of this application chip automatic test equipment has realized three-dimensional space's material and has shifted. It will be appreciated that the associated wiring or cabling may be routed along the trunking on the cabinet 900 or its welded steel frame 910, and that the cables for the mobile mechanism may be protected using a cable tow chain or the like.

In this embodiment, the automatic chip testing apparatus further includes a hood 940, where the hood 940 is covered on the cabinet 900 to form an installation space 950, and the platen assembly 100, the lifting platform 200, the hopper 300, the TEC temperature control platform 400, the rotary feeding assembly 500, the loading platform 600, the test platform 700, and the probe platform 800 are all disposed in the installation space 950. The design is favorable for forming a complete chip automatic test device, has a protection effect on the internal structure, and can also play a role in dust prevention when not in use.

As shown in fig. 3, in one embodiment, the platen assembly 100 is provided with a platen base 110, a first Y-axis gantry 120, a first Y-axis cable drag chain 130, and a probe station mount 140, and a base window 150 is formed in the platen base 110; the first Y-axis gantry 120, the probe station mounting base 140, the loading station 600, and the test station 700 are all fixed on the platen base 110; the first Y motion axis cable drag chain 130 and the rotary feeding assembly 500 are respectively fixed on the first Y motion axis gantry 120, and the first Y motion axis cable drag chain 130 is used for installing and protecting cables of the first Y motion axis gantry 120 and the rotary feeding assembly 500; the lifting platform 200 passes through the bottom plate window 150 and is fixed on the bedplate bottom plate 110, and the hopper 300 is arranged on the lifting platform 200; the probe station 800 is secured to the probe station mount 140. Further, in one embodiment, a lift table mount 240 of the lift table 200 is fixed to the platen base 110, and a lift driving screw 230 of the lift table 200 passes through the base window 150. Further, in one embodiment, the bedplate bottom plate 110 is provided with a counterweight structure or the bedplate bottom plate 110 is provided with weight, so as to prevent vibration during operation. Such a design creates an in-cabinet structure as opposed to a cabinet, which is advantageous for overall assembly and maintenance because a substantial portion is on the bedplate bottom plate 110.

In one embodiment of a particular application, the pallet assembly 100 generally includes a pallet base 110 and a gantry column for carrying the moving structure of the product transport. The bedplate bottom plate 110 is made of marble materials, and the marble materials or the counterweight structure can ensure that the equipment has certain weight, so that the equipment has no shake in the chip test process, and the chip and the probe can be contacted well in the chip test process, thereby ensuring that test signals can be accurately transmitted, and the current and the voltage applied to the chip can be accurate. Wherein the bedplate bottom plate 110 is made of marble, and the bedplate bottom plate 110 is used for assembling and bearing various test components of the chip automatic test equipment. The first Y-axis gantry 120 is mainly used for installing the rotary feeding assembly 500, and the first Y-axis gantry 120 is composed of two columns and a cross beam and is in a gantry structure. The first Y-axis cable drag chain 130 is used for installing the cable of the rotary feeding assembly 500 and the first Y-axis 510, and plays a role of protecting the cable when the cable reciprocates. The probe station mount 140 is used to mount the probe station 800. The floor window 150 is used to mount the lift table 200.

Further, in one embodiment, the lifting platform 200 lifts the jigs to be processed in the hopper 300 and lowers the jigs to be recovered into the hopper 300 in a stepwise manner, so that each of the jigs to be processed is lifted step by step, thereby achieving accurate transportation to the rotary feeding assembly 500. As shown in fig. 4, in one embodiment, the lifting platform 200 is provided with a lifting motor 210, a lifting guide shaft 220, a lifting driving screw 230, a lifting platform mounting seat 240, a lifting platform mounting bracket 250 and a lifting platform lifting seat 260; the lifting motor 210, the lifting guide shaft 220 and the lifting platform mounting seat 240 are all fixed on the lifting platform mounting bracket 250, and the lifting platform mounting seat 240 is also fixed on the bedplate assembly 100 or the bedplate bottom plate 110 thereof; the lifting table lifting seat 260 is fixed on the lifting driving screw 230, and the lifting motor 210 drives the lifting driving screw 230 to lift under the guidance of the lifting guide shaft 220, so as to drive the lifting table lifting seat 260 to lift the to-be-processed clamp in the hopper 300 and lower the to-be-recovered clamp into the hopper 300. In one embodiment, the number of the lifting platforms 200 is two, one of which drives the clamp to be processed to be in a lifting state, and the other of which drives the clamp to be recovered to be in a descending state. The lifting platform and the structure thereof are one of the important settings of the application, on one hand, the clamp to be treated is conveyed, and on the other hand, the clamp to be recovered is treated, so that on the other hand, the lifting platform is beneficial to ensuring the lifting in place, thereby ensuring the accurate picking and placing of the clamp; on the other hand, the test efficiency is improved.

In one embodiment, the lift table 200 is used to lift the product from bottom to top, in a "bullet gate to deliver bullets" manner, for the rotary feeder assembly 500 to grasp the product and product clamp and deliver it to the area to be tested. The lifting platform 200 comprises 2 sets of identical structures and is responsible for realizing a lifting function, wherein lifting is used for taking materials from a to-be-processed clamp of an undetected product, namely a preloaded to-be-tested chip, lowering is used for storing a detected product, namely a to-be-recovered clamp for storing a finished chip test, lifting power source is a stepping motor, and lifting coordination is controlled by a control system. The lifting motor 210 is used to drive and control the lifting of the platform. The lifting guide shaft 220 is used for guiding the lifting table. The lifting driving screw 230 is used for driving the nut through the screw for rotary motion, thereby achieving up-and-down lifting motion. The lift mount 240 is adapted to mount to the platen base plate 110. The lift table mounting bracket 250 is used to assemble the lift table components together. The lifting table lifting seat 260 is used for being installed together with an up-and-down moving component and can move up and down, so that the clamp is pushed to generate lifting movement.

As shown in fig. 5, in one embodiment, the hopper 300 is provided with a handle 310, a bin 320, a product clamp detection sensor 330, a bin clamp 340, and a bin bracket 350; the bin clamp 340 is connected with the bin 320, the bin 320 is fixed on the bin bracket 350, the bin bracket 350 is fixed on the bedplate assembly 100 or the bedplate bottom plate 110 thereof, the bin 320 is used for storing a clamp to be processed preloaded with chips to be tested and a clamp to be recovered after chip testing is completed; the handle 310 and the product clamp detecting sensor 330 are respectively fixed on the bin 320, and the product clamp detecting sensor 330 is used for sensing whether the to-be-processed clamp to be lifted and the to-be-lowered clamp to be recovered at the lifting table 200 are in place. Further, the bin 320 is divided into two areas, including a to-be-tested area for storing the to-be-processed jigs preloaded with the to-be-tested chip and a recycling area for storing the to-be-recycled jigs after the chip test is completed. Typically, the jig to be processed is transferred into the magazine 300 by a conveyor belt, a robot arm, or manually, or the magazine 300 is prepared directly outside the chip automatic test equipment, and is loaded into the chip automatic test equipment by a robot arm or manually. And the lifting platform is matched with the hopper, so that the clamp to be treated can be accurately lifted and the clamp to be recovered can be accurately recovered.

In one embodiment, the magazine 300 is used to store chip products and chip product holders, and both undetected and inspected chip products are stored on the magazine 300, it being understood that the chip products are mounted on holders, which may also be referred to as product holders. Hopper 300 is designed with a handle structure that is easy to pick and place, facilitating loading and unloading of chip products to be tested. The handle 310 is installed in the bin 320, so that the carrying by hand is convenient. The bin 320 is used for stacking storage of product fixtures. The product clamp detection sensor 330 is used to detect whether the product clamp is lifted into position. The bin clamp 340 is used for clamping the bin 320, and preventing the bin 320 from sliding out, so as to ensure the normal operation of the automatic test. The bin bracket 350 is used to store and secure the bin 320.

As shown in fig. 6 and 7, in one embodiment, the TEC temperature control stage 400 is provided with a temperature control stage base 410, a clamp sensor 420, a water cooling plate 430, TEC temperature control elements 440, a product clamp carrying stage 450 and positioning pins 460; the temperature control table base 410 is fixed on the material loading table 600, and the clamp sensor 420, the water cooling plate 430, the TEC temperature control element 440 and the product clamp loading table 450 are all arranged on the temperature control table base 410; the product fixture bearing table 450 is used for bearing the fixture to be processed, so that the chip to be tested on the fixture to be processed is located between the water cooling plate 430 and the TEC temperature control element 440 or the TEC temperature control element 440 is located between the water cooling plate 430 and the chip to be tested, and the fixture to be processed is positioned by the positioning pins 460; the jig sensor 420 is used to sense whether the jig to be processed is placed correctly. Further, the water cooling plate 430 and the TEC temperature control element 440 are integrally disposed to form a temperature control substrate, and a temperature sensor is disposed inside the temperature control substrate. Further, the water cooling plate 430 is disposed at the periphery of the TEC temperature control element 440 or the TEC temperature control element 440 in the temperature control substrate, so as to form a temperature raising and lowering environment inside the TEC temperature control stage 400, and the temperature raising area is limited to the TEC temperature control stage 400, especially the TEC temperature control element 440, so that heat is concentrated without affecting other functional components of the automatic chip testing device. The design is favorable for forming a stable test position by matching with the product clamp, and can realize series of tests under temperature control.

In one embodiment of a specific application, the TEC temperature control console 400 uses a semiconductor refrigeration sheet to realize high-precision temperature control, so as to heat a chip product, and is used for testing the working performance of the product at a high temperature, and the TEC temperature control console 400 uses a copper material, so that the product is quickly heated. The TEC temperature control console 400 is internally provided with a water cooling plate and works in coordination with a water cooling machine to realize the function of fast switching between high temperature and low temperature. Other embodiments may also include the water chiller being secured to the cabinet 900. The temperature control table base 410 is used for installing and bearing various components, and is made of high-strength glass fiber plates, so that an insulating effect is achieved. The clamp sensor 420 is used for sensing whether the clamp to be processed is placed correctly, so that a fool-proof function is realized. The water cooling plate 430 is used for realizing a rapid cooling function by an external water cooling machine. The water cooled plate 430 contacts a copper material such as the TEC temperature control element 440. The TEC temperature control element 440 is also called a semiconductor temperature control element, and is used for controlling the temperature of the test platform, and has a function of rapidly increasing and decreasing the temperature. The product clamp carrying table 450 is used for placing product clamps, and has the functions of heat transfer and heating. The locating pins 460 may be referred to as high precision locating pins for precisely locating the product fixture.

As shown in fig. 8, in one embodiment, the rotary feeding assembly 500 is provided with a first Y motion axis 510, a clamping mechanism 520, a rotary mechanism 530, an up-and-down motion mechanism 540, a drag chain groove bracket 550 and a sliding table 560; the first Y motion axis 510 is fixed on the first Y motion axis gantry 120 of the platen assembly 100, and the sliding table 560 is slidably disposed on the first Y motion axis 510; the drag chain groove bracket 550 is disposed on the sliding table 560, and is configured to be mounted in cooperation with the first Y motion axis cable drag chain 130 of the platen assembly 100 and protect the cable of the rotary feeding assembly 500; the clamping mechanism 520 is disposed on the rotating mechanism 530, and is used for clamping the to-be-processed clamp on the lifting platform 200 and the to-be-recovered clamp on the TEC temperature control platform 400; the rotating mechanism 530 is disposed on the up-down motion mechanism 540, and is configured to implement 180-degree reciprocating rotation or 360-degree cyclic rotation of the material clamping mechanism 520 in a rotating manner; the up-down motion mechanism 540 is disposed on the sliding table 560, and is configured to drive the rotation mechanism 530 to move in an up-down motion manner, so as to convey the to-be-processed clamp on the lifting platform 200 to the TEC temperature control platform 400 and convey the to-be-recovered clamp on the TEC temperature control platform 400 to the lifting platform 200 through the clamping mechanism 520. The rotary feeding assembly is also one of the key designs of the application, and the design is beneficial to conveying the clamp by matching with the lifting table in a small range and a narrow space.

In one embodiment of a specific application, the function of the rotary feeding assembly 500 is to automatically grasp and convey the to-be-processed fixture loaded with the chip to be tested from the hopper to the TEC temperature control console, and the rotary feeding assembly 500 has a function of 180 ° rotation, so that the fixture can be rotated 180 ° to facilitate sequentially detecting products on two sides of the fixture. The first Y movement axis 510, which is composed of a screw and a stepping motor, mainly serves to reciprocate the components in the front-rear direction. The clamping mechanism 520 has the function of clamping and expanding, and drives the air cylinder in a starting mode to achieve the tightness, so as to clamp and clamp the product and complete the conveying function. The rotating mechanism 530 is used for realizing the 180 rotation function of the clamping mechanism, so that products on two sides of the product clamp can be conveniently detected, and the rotation is realized in a mode of driving an air cylinder by compressed air. The up-down motion mechanism 540 is used for realizing the up-down product carrying function, and simulating the carrying action of 'picking up and putting down' in the carrying process, and realizes up-down movement by adopting a compressed air driving cylinder mode. The drag chain groove bracket 550 is assembled with the Y-axis drag chain groove for protecting the reciprocating process of the cable.

As shown in fig. 9, in one embodiment, the loading table 600 includes a second Y-axis of motion 610, a first X-axis of motion 620, a lifting axis of motion 630, an optional hold-down cylinder 640, a product clamp detection sensor 650, and a temperature control mounting platform 660; the second Y motion axis 610 is fixed on the platen assembly 100, the first X motion axis 620 is fixed on the second Y motion axis 610, the lifting motion axis 630 is fixed on the first X motion axis 620, the optional pressing cylinder 640 and the temperature control mounting platform 660 are fixed on the lifting motion axis 630, and the second Y motion axis 610, the first X motion axis 620 and the lifting motion axis 630 cooperate together to drive the optional pressing cylinder 640 and the temperature control mounting platform 660 to move three-dimensionally; the optional pressing cylinder 640 is used for clamping and fixing the clamp to be processed, the TEC temperature control console 400 and the product clamp detection sensor 650 are fixed on the temperature control mounting platform 660, and the product clamp detection sensor 650 is used for sensing whether the clamp to be processed is fixed in place. In one embodiment, the number of the loading tables 600 is two, one of which is in a testing state, and the other of which loads the clamp to be processed for testing. The design is favorable for clamping and loosening the product clamp, realizes position control in two dimensions, can also detect the position of the clamp to be processed, and gives a prompt when the clamp to be processed is out of position so as to avoid damaging the chip to be tested, the clamp to be processed and even the automatic chip testing equipment. And through the three-dimensional space movement design of the lifting platform matched rotary feeding assembly and the carrying platform, the automatic process that the clamp returns to the hopper from the hopper to the test is facilitated, manual operation is not needed under the normal running state, and the chip detection can be realized fully automatically.

In one embodiment, the loading platform 600 is designed with left and right 2 sets, so that uninterrupted testing can be realized, one loading platform 600 is detecting products, and the other loading platform 600 is to be detected and used alternately. The material carrying table 600 drives the TEC temperature control table 400 to realize the left-right up-down movement, and a rotary pressing cylinder is designed for pressing and stabilizing the product clamp. The second Y motion axis 610 is formed by a precision motor and a screw rod, so that the platform can be put down to reciprocate in the Y axis. The first X-axis 620 is formed by a precision motor and a screw, so that the X-axis direction reciprocating motion of the stage can be realized. The lifting motion shaft 630 is composed of a precise motor and a screw rod, and can realize lifting and reciprocating motion of the platform. The optional hold-down cylinder 640 is used to clamp and unclamp the product clamp, and pneumatic is used as the motive power. The product clamp detection sensor 650 is used to detect whether a clamp is placed on the test stand 700. The temperature control mounting platform 660 is used to mount the TEC temperature console 400 or components thereof, such as the console base 410.

As shown in fig. 10, in one embodiment, the test bench 700 is provided with a test bench mounting base 710, a second X-axis of motion 720, a front-back adjustment micro-motion slide 730, a top-bottom adjustment micro-motion slide 740, and a test sensor mounting bracket 750; the test bench mounting base 710 is fixed on the platen assembly 100, the second X movement axis 720 is fixed on the test bench mounting base 710, the front-back adjustment micro-movement sliding table 730 is fixed on the second X movement axis 720, the up-down adjustment micro-movement sliding table 740 is fixed on the front-back adjustment micro-movement sliding table 730, and the test sensor mounting bracket 750 is fixed on the up-down adjustment micro-movement sliding table 740 for mounting a test sensor. Further, the test bench 700 is further provided with the test sensor. The design can accurately regulate and control the position of the test sensor, and ensure the accuracy of the test structure; and the chip detection can be realized fully automatically without manual operation in a normal running state, and various different types of chips, especially optical chips, can be compatible, so that the manpower resources are greatly saved, and the technology update of robot replacement is facilitated.

In one embodiment, the test bench 700 is equipped with a test sensor, such as a spectrum collection sensor and a light emitting diode sensor, for collecting parameters such as a light emitting spectrum and a light emitting power of a chip product, and the test bench 700 can be adjusted automatically or manually back and forth, up and down, and left and right, for accurately aligning the test sensor with a light emitting position of the product. The test station mounting base 710 is used to mount various components of the test station. The second X motion axis 720 is composed of a precision motor and a screw rod, and is used for realizing the X-axis direction reciprocating motion of the test bench, so that the detection of different products can be switched back and forth. The front-back adjusting micro sliding table 730 realizes the front-back direction precise adjustment of the test platform through an automatic or manual sliding table standard component. The up-down adjusting micro sliding table 740 realizes up-down direction precise adjustment through the sliding table. The test inductor mounting bracket 750 is used for mounting a precision detection inductor to realize detection.

As shown in fig. 11, in one embodiment, the probe station 800 is provided with a probe station base 810, a probe seat 820, a microscope assembly 830, and a microscope adjustment slide 840; the probe base 810 is fixed on the platen assembly 100, the probe base 820, the microscope assembly 830 and the microscope adjusting sliding table 840 are all arranged on the probe base 810, the probe base 820 is provided with a probe with an adjustable position, and the microscope adjusting sliding table 840 is used for adjusting the position of the microscope assembly 830. Further, the probe is in elastic conductive contact with the chip to be tested. The design is favorable for accurately detecting and realizing detection of various chip products on one hand, is favorable for protecting the chip to be tested from being damaged in contact to cause misjudgment on the performance of the chip to be tested on the other hand, is favorable for being compatible with detection of various different types of optical chips, realizes the function of detecting the optical chips under a certain working environment by simulating the optical chips, and also can realize the function of fully automatically detecting the optical chips.

In one embodiment, the probe station 800 includes 4 sets of probe holders and a set of electron microscope, and the probe holders can be automatically or manually adjusted in front and back, left and right, up and down directions, so as to adjust the probes to the power-on parts of the chip products, thereby realizing the functions of switching on the current and the voltage of the products. By adjusting the position of the probe station 800, the detection compatible with various chips can be realized, and the detection of various chip products on the market can be greatly satisfied. The probe station base 810 is used to mount the various components of the probe station. The probe seat 820 is composed of a manual sliding table and a probe, and can realize 6-degree-of-freedom adjustment. The microscope assembly 830, i.e., an electron microscope, is used to magnify a product and display it via a display, and the main functions of the electron microscope include: 1, assisting the position adjustment of the probe by amplifying the product; 2, identifying characters of the product, and collecting data; and 3, monitoring the detection process in real time. The microscope adjustment slide 840 allows for 4 degrees of freedom adjustment of the microscope.

As shown in fig. 12, in one embodiment, the cabinet 900 is provided with a welding steel frame 910, a shock pad 920, an adjustable foot pad and a universal wheel 930, and a plate body 911 is disposed outside the welding steel frame 910; the platen assembly 100 is fixed on the welding steel frame 910, and the shock pad 920 is disposed between the platen assembly 100 and the welding steel frame 910; the adjustable foot pads and universal wheels 930 are disposed below the welded steel frame 910; such a design, with most of the functional components fixed to the platen assembly, has the advantages of modular design, compact size, relatively small footprint, and ease of installation onto the weld steelframe 910 of the cabinet 900.

In one embodiment, the cabinet 900 is used to carry the platen assembly and is welded by a steel structure, and the cabinet 900 and the platen assembly 100 are provided with a damping device for isolating an external vibration source and avoiding the problem of poor contact between the probe and the product caused by vibration. The cabinet 900 is used for installing components such as a controller, a power supply, an industrial personal computer, and the like. The welded steel frame 910 is used for bearing and as a mounting frame. The shock pad 920 is used for shock absorption. The adjustable foot pads and universal wheels 930 are used to achieve position movement and adjustment.

As shown in fig. 13, further, in one embodiment, the enclosure 940 is provided with a door 941, a machine control button area 942, a machine control and monitoring platform 943, and a device operation status indicator 944, wherein the door 941 is used to close the installation space 950, and specifically, the door 941 can be flipped up and down to open or close the installation space 950. The machine control button area 942, the machine control and monitor platform 943 and the equipment operation status indicator 944 are respectively connected to circuits, and specific connection modes are omitted herein with reference to conventional control. In one embodiment, the hood 940 is used to protect each functional component, avoid the human interference of each component during operation and the injury to operators during operation of the device, and the hood 940 is provided with an up-down flip cover for operators to perform operations such as feeding and discharging and daily maintenance in the machine.

It should be noted that other embodiments of the present application further include an automatic chip testing device capable of being implemented, where the technical features in the foregoing embodiments are combined with each other.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of the present application is to be determined by the following claims.

Claims

1. The automatic chip testing equipment is characterized by comprising a platen assembly (100), a lifting table (200), a hopper (300), a TEC temperature control table (400), a rotary feeding assembly (500), a loading table (600), a testing table (700), a probe table (800) and a cabinet (900);

The bedplate assembly (100) is fixed on the cabinet (900), and the lifting platform (200), the hopper (300), the rotary feeding assembly (500), the carrying platform (600), the test platform (700) and the probe platform (800) are all fixed on the bedplate assembly (100);

the hopper (300) is arranged adjacent to the lifting table (200) and is used for storing a clamp to be processed for preloading a chip to be tested and a clamp to be recovered for storing the chip tested;

the lifting table (200) is used for lifting the clamp to be treated in the hopper (300) and lowering the clamp to be recovered into the hopper (300);

the rotary feeding assembly (500) is used for conveying the clamp to be processed on the lifting table (200) to the TEC temperature control table (400) in a rotary mode and conveying the clamp to be recovered on the TEC temperature control table (400) to the lifting table (200);

the TEC temperature control table (400) is fixed on the material carrying table (600) and is used for detecting the working performance of the chip to be tested on the clamp to be processed in a high-temperature environment;

the material carrying table (600) is used for driving the TEC temperature control table (400) to move between a feeding position and a testing position;

the probe station (800) is used for electrically connecting the chip to be tested on the clamp to be processed of the TEC temperature control station (400) in a contact manner;

The test bench (700) is used for acquiring detection information of the chip to be tested in the working performance detection;

wherein, the TEC temperature control table (400) is provided with a temperature control table base (410), a clamp sensor (420), a water cooling plate (430), a TEC temperature control element (440), a product clamp bearing table (450) and a positioning pin (460);

the temperature control table base (410) is fixed on the material carrying table (600), and the clamp sensor (420), the water cooling plate (430), the TEC temperature control element (440) and the product clamp carrying table (450) are all arranged on the temperature control table base (410);

the product clamp bearing table (450) is used for bearing the clamp to be processed, so that the chip to be tested on the clamp to be processed is located between the water cooling plate (430) and the TEC temperature control element (440) or the TEC temperature control element (440) is located between the water cooling plate (430) and the chip to be tested, and the clamp to be processed is located through the locating pin (460);

the clamp sensor (420) is used for sensing whether the clamp to be processed is placed correctly or not;

the water cooling plate (430) is arranged at the periphery of the TEC temperature control element (440) and is used for forming a heating and cooling environment inside the TEC temperature control table (400), and the heating area is limited in the TEC temperature control element (440);

The lifting platform (200) is provided with a lifting motor (210), a lifting guide shaft (220), a lifting driving screw (230), a lifting platform mounting seat (240), a lifting platform mounting bracket (250) and a lifting platform lifting seat (260); the lifting motor (210), the lifting guide shaft (220) and the lifting platform mounting seat (240) are all fixed on the lifting platform mounting bracket (250), and the lifting platform mounting seat (240) is also fixed on the bedplate assembly (100); the lifting table lifting seat (260) is fixed on the lifting driving screw (230), and the lifting motor (210) drives the lifting driving screw (230) to lift under the guidance of the lifting guide shaft (220) so as to drive the lifting table lifting seat (260) to lift the clamp to be treated in the hopper (300) and lower the clamp to be recovered into the hopper (300); the number of the lifting tables (200) is two, one of the lifting tables drives the clamp to be treated to be in a lifting state, and the other lifting table drives the clamp to be recovered to be in a descending state;

the number of the carrying tables (600) is two, one carrying tables are in a detection state, and the other carrying tables are used for carrying the clamp to be processed for detection.

2. The automatic chip testing equipment according to claim 1, wherein the platen assembly (100) is provided with a platen base plate (110), a first Y-axis gantry (120), a first Y-axis cable drag chain (130), a probe station mount (140), and a base plate window (150) is formed in the platen base plate (110);

The first Y-axis portal frame (120), the probe station mounting seat (140), the material carrying table (600) and the test table (700) are all fixed on the bedplate bottom plate (110);

the first Y motion axis cable drag chain (130) and the rotary feeding assembly (500) are respectively fixed on the first Y motion axis portal frame (120), and the first Y motion axis cable drag chain (130) is used for installing and protecting cables of the first Y motion axis portal frame (120) and the rotary feeding assembly (500);

the lifting platform (200) penetrates through the bottom plate window (150) and is fixed on the bedplate bottom plate (110), and the hopper (300) is arranged on the lifting platform (200);

the probe station (800) is secured to the probe station mount (140).

3. The automatic chip testing apparatus according to claim 1, wherein the hopper (300) is provided with a handle (310), a bin (320), a product clamp detection sensor (330), a bin clamp (340) and a bin bracket (350);

the bin clamp (340) is connected with the bin (320), the bin (320) is fixed on the bin bracket (350), the bin bracket (350) is fixed on the bedplate assembly (100) or the bedplate bottom plate (110) thereof, the bin (320) is used for storing a clamp to be processed for preloaded chips to be tested and a clamp to be recovered for storing the chips to be tested;

The handle (310) and the product clamp detection sensor (330) are respectively fixed on the bin (320), and the product clamp detection sensor (330) is used for sensing whether the clamp to be treated to be lifted at the lifting table (200) and the clamp to be recovered to be lowered are in place.

4. The automatic chip testing equipment according to claim 1, wherein the water cooling plate (430) and the TEC temperature control element (440) are integrally arranged to form a temperature control substrate, and a temperature sensor is arranged inside the temperature control substrate.

5. The automatic chip testing equipment according to claim 1, wherein the rotary feeding assembly (500) is provided with a first Y motion axis (510), a clamping mechanism (520), a rotary mechanism (530), an up-and-down motion mechanism (540), a drag chain groove bracket (550) and a sliding table (560);

the first Y motion axis (510) is fixed on a first Y motion axis portal frame (120) of the bedplate assembly (100), and the sliding table (560) is arranged on the first Y motion axis (510) in a sliding manner;

the drag chain groove bracket (550) is arranged on the sliding table (560) and is used for being matched with a first Y-axis cable drag chain (130) of the bedplate assembly (100) to be installed and protecting a cable of the rotary feeding assembly (500);

The clamping mechanism (520) is arranged on the rotating mechanism (530) and is used for clamping the clamp to be processed on the lifting platform (200) and the clamp to be recovered on the TEC temperature control platform (400);

the rotating mechanism (530) is arranged on the up-down motion mechanism (540) and is used for realizing 180-degree reciprocating rotation or 360-degree circulating rotation of the material clamping mechanism (520) in a rotating manner;

the up-and-down motion mechanism (540) is arranged on the sliding table (560) and is used for driving the rotating mechanism (530) to move in an up-and-down motion mode, so that the clamp to be processed on the lifting table (200) is conveyed to the TEC temperature control table (400) and the clamp to be recovered on the TEC temperature control table (400) is conveyed to the lifting table (200) through the clamping mechanism (520).

6. The automatic chip testing apparatus of claim 1, wherein the loading table (600) comprises a second Y motion axis (610), a first X motion axis (620), a lifting motion axis (630), an optional hold-down cylinder (640), a product clamp detection sensor (650), and a temperature control mounting platform (660);

the second Y motion shaft (610) is fixed on the platen assembly (100), the first X motion shaft (620) is fixed on the second Y motion shaft (610), the lifting motion shaft (630) is fixed on the first X motion shaft (620), the optional pressing cylinder (640) and the temperature control mounting platform (660) are fixed on the lifting motion shaft (630), and the second Y motion shaft (610), the first X motion shaft (620) and the lifting motion shaft (630) are matched together to drive the optional pressing cylinder (640) and the temperature control mounting platform (660) to move in a three-dimensional mode;

The optional pressing cylinder (640) is used for clamping and fixing the clamp to be processed, the TEC temperature control table (400) and the product clamp detection sensor (650) are fixed on the temperature control mounting platform (660), and the product clamp detection sensor (650) is used for sensing whether the clamp to be processed is fixed in place.

7. The automatic chip testing apparatus according to claim 1, wherein the test bench (700) is provided with a test bench mounting base (710), a second X-axis of motion (720), a front-back adjustment micro-motion slide table (730), an up-down adjustment micro-motion slide table (740), and a test sensor mounting bracket (750);

the test bench mounting base (710) is fixed on the platen assembly (100), the second X movement shaft (720) is fixed on the test bench mounting base (710), the front-back adjustment micro-movement sliding table (730) is fixed on the second X movement shaft (720), the up-down adjustment micro-movement sliding table (740) is fixed on the front-back adjustment micro-movement sliding table (730), and the test inductor mounting bracket (750) is fixed on the up-down adjustment micro-movement sliding table (740) for mounting a test inductor.

8. The automatic chip testing apparatus according to claim 1, wherein the probe stage (800) is provided with a probe stage base (810), a probe stage (820), a microscope assembly (830) and a microscope adjustment slide table (840);

The probe platform base (810) is fixed on the platen assembly (100), the probe seat (820), the microscope assembly (830) and the microscope adjusting sliding table (840) are arranged on the probe platform base (810), a probe with an adjustable position is arranged on the probe seat (820), and the microscope adjusting sliding table (840) is used for adjusting the position of the microscope assembly (830).

9. The automatic chip testing equipment according to claim 1, wherein the cabinet (900) is provided with a welding steel frame (910), a shock pad (920) and adjustable foot pads and universal wheels (930), and a plate body (911) is arranged outside the welding steel frame (910);

the bedplate assembly (100) is fixed on the welding steel frame (910), and the shock pad (920) is arranged between the bedplate assembly (100) and the welding steel frame (910);

the adjustable foot pads and universal wheels (930) are arranged below the welding steel frame (910).

10. The automatic chip test equipment of claim 1, wherein the lift-off stand mount (240) is further secured to a platen base plate (110) of the platen assembly (100).

11. The automatic chip testing apparatus according to any one of claims 1 to 10, wherein the chip includes a laser chip and a chip-on-chip.

12. The automatic chip testing apparatus according to any one of claims 1 to 10, further comprising a hood (940), the hood (940) being covered on the cabinet (900) to form an installation space (950), the platen assembly (100), the lift table (200), the hopper (300), the TEC temperature control table (400), the rotary loading assembly (500), the loading table (600), the test table (700) and the probe table (800) being all provided in the installation space (950).